JPH0779097A - Mounting of electronic component - Google Patents

Abstract

PURPOSE:To prevent the unit work time from being influenced by the time required for measuring the height of an electronic component mounted on a printed board and to make it possible to set the XY-table movable time long by measuring the height and transmitting the data to the electronic component mounting equipment. CONSTITUTION:A height measuring equipment is constituted of a rotary disc section 1, sensor 2-5, and a printed board 6. Each of the sensors 2-5 is provided with eight photodetectors and laser light is applied to the printed board from the center of the sensors. In a substrate transfer process (#1), the height of an electronic component mounted on the printed board is measured. In a process (#2), the data about the height measured by the height measuring equipment is transmitted to an electronic component mounting equipment. In a process (#3), the up and down timing of a suction nozzle and the XY table moving time are calculated based on the transmitted data about the height. In a process (#4), mounting in conducted on a basis of the calculation result.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine.

[0002]

2. Description of the Related Art A mounting method of a conventional electronic component mounting machine will be described with reference to FIGS.

FIG. 5 shows a part for supplying, picking up, and mounting components in an electronic component mounting machine. Reference numeral 16 is a rotary table, 17 is a head, 18 is a suction nozzle, 19 is an electronic component supply means, 20 is an electronic component supply unit, 21 is a printed circuit board, and 22 is an XY table.

A plurality of vertically movable heads 17 are mounted on the circumference of the rotary table 16, and a suction nozzle 18 for sucking an electronic component is provided at the tip of each head. A plurality of electronic component supply means 19 and a component supply unit 20 for supplying electronic components to the suction nozzles at the rear of the rotary table.
Is provided.

The printed circuit board 21 on which electronic components are to be mounted is fixed to the XY table 22, and the XY table is moved to position and mount the suction nozzle at a predetermined position on the printed circuit board.

By the way, the vertical movement (intermittent movement) of the suction nozzle 18 is given by a cam. FIG. 6 is a timing chart showing the intermittence (index), the raising / lowering operation of the suction nozzle, and the movement of the XY table during one rotation of the cam.

In about half of one rotation of the cam, the suction nozzle is moved up and down, the electronic components are suctioned, and the rotary table is rotated. At the same time, the XY table moves to position the suction nozzle at the mounting position. In the latter half part, the suction nozzle descends to mount the electronic component. When the mounting operation ends, the suction nozzle rises, the XY table moves again, one cycle is completed, and the same movement is repeated thereafter.

The above-mentioned intermittence (index) is set during the period in which the suction nozzle G is elevated or before and after the period.

Further, the movable period of the XY table is set based on the lifting operation of the suction nozzle. Ie X
As shown in FIG. 7, the end of the movable period of the Y table is the distance H between the tip of the suction nozzle and the upper surface of the printed circuit board.
₃ is set when the suction nozzle descends until the height of the sucked electronic component and the height of the mounted electronic component of the maximum height dimension and the maximum warp amount of the printed circuit board become equal, and the XY table moves. As shown in FIG. 8, the starting point of the possible period is that the distance H ₄ between the tip of the suction nozzle and the upper surface of the printed circuit board is equal to the sum of the height of the mounted electronic component having the maximum height dimension and the maximum warp amount of the printed circuit board. It is set at the time when the suction nozzle rises to the position.

[0010]

When the movable period of the XY table is set as described above, when there is no electronic component having the maximum height dimension on the printed circuit board in the vicinity of the mounting position, it is indicated by 28 in FIG. As such, the suction nozzle and the mounted electronic components do not interfere with each other. In such a case, it can be said that the XY table can actually be moved, and the movement period is set to be short.

When the XY table has to move a long distance, the moving period does not fall within the movable period, and the lifting and lowering operation of the suction nozzle is slowed down.
It is necessary to move the XY table, and after the movement is completed, lower the suction nozzle to perform a process called timing control for mounting. Therefore, there is a problem that the tact time is delayed and the mounting efficiency is reduced.

[0012]

In order to solve the above problems, in the electronic component mounting method of the present invention, in order to measure the height of the mounted electronic components on the printed circuit board in the substrate transfer process of the electronic component mounting machine. Is installed, the data obtained from the measuring device is transmitted to the electronic component mounter, and the lifting timing of the suction nozzle is calculated from the height data of the mounted electronic components near the mounting position, and the XY table can be moved. Set the period.

[0013]

[Function] In the board transfer process of the electronic component mounter, the height of the mounted electronic component on the printed circuit board is measured and the data is transmitted to the electronic component mounter, so the time required for height measurement is tact time. It has no effect. Moreover, since the movable period of the XY table is determined based on the height of the mounted electronic components near the mounting position, the movable period can be set longer than in the past.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An outline of an embodiment of the present invention will be described with reference to FIG. In step # 1, the height of the mounted electronic component on the printed circuit board is measured in the board transfer process. In # 2, the height data measured by the measuring device is transmitted to the electronic component mounter. In step # 3, the vertical movement timing of the suction nozzle and the XY table movement period are calculated based on the transmitted height data. In # 4, the mounting operation is performed based on the calculation result.

Hereinafter, referring to FIGS.
1 to # 4 will be described. FIG. 2 shows a height measuring device for the mounted components on the printed circuit board in the substrate carrying step of this embodiment. Reference numeral 1 is a rotating disk portion, 2 to 5 are sensors, 6 is a printed circuit board, and 7 to 10 are loci of the sensors 2 to 5, respectively. Each sensor is provided with eight light receiving elements, and the printed circuit board is irradiated with laser light from the center of the sensor. The disk rotating unit scans the entire surface of the printed circuit board as shown in the figure, and captures the laser reflected light by the light receiving element to measure the height of the mounted electronic component on the printed circuit board.

Next, the measured height data is digitized and transmitted to the electronic component mounter. Inside the electronic component mounter, the electronic component with the maximum height is obtained from the data near the mounting position.

FIG. 3 shows the positional relationship between the suction nozzle and the maximum height electronic component near the mounting position selected by the above method. Reference numeral 11 is a suction nozzle, 12 is a printed circuit board, 13 is an electronic component that is sucked by the suction nozzle and mounted on the printed circuit board, 14 is an already mounted electronic component, and 15 is an electronic component having a maximum height dimension on the printed circuit board.

When the height of the electronic component sucked by the suction nozzle is t, the height of the component near the mounting position selected by the above method is H ₁ , and when the sucked electronic component is mounted on the printed board. the lifting stroke of the suction nozzle and H _st. In addition, the h-axis is defined in the printed board direction, with the origin at the tip of the suction nozzle in the ascending limit.

FIG. 4 shows the cam rotation angle and the lifting / lowering operation of the suction nozzle.
And XY table interlock timing chart
It is Rotation angle of the cam that drives the suction nozzle 11
Is θ ₁The suction nozzle starts descending at₂Descends at
Reached stroke end, θ₃Start rising at_Four
At the time of, it shall return to the ascending limit.

Even if the XY table is moved after the suction nozzle starts descending until it descends by a predetermined amount, there is no fear that the electronic components attracted by the suction nozzle interfere with the electronic components mounted on the printed circuit board. Absent. At the cam rotation angle thereafter, the two interfere with each other, and therefore it is necessary to prohibit the movement of the XY table. Assuming that the cam rotation angle at the start point of the movement prohibition period (referred to as interlock) of the XY table is θ _ON , h at this time is h = H _st −H ₁ −δ. Here, δ is the maximum warp amount of the printed circuit board.
This is h _ON .

After mounting the electronic parts, after the suction nozzle starts to move up, it is necessary to interlock the movement of the XY table while the suction nozzle moves up to a predetermined position. After reaching that position, the suction nozzle 11 and the printed circuit board are moved thereafter. There is no risk of interference with the electronic components above. Assuming that the cam rotation angle at the end point of the interlock at this time is θ _OFF , h at this time is h = H _st − (H ₁ −t) −δ. This is h _OFF .

When the rotation angle of the cam corresponding to h _ON and h _OFF is calculated, θ _ON and θ _OFF are calculated, and the interlock period of the XY table is determined.

As described above, in the mounting method of the present invention, the suction nozzle draws a movement locus as shown by 29 in FIG.

[0024]

As compared with the conventional method, the interlock period can be shortened and the movable period of the XY table is extended, so that the mounting efficiency of electronic parts is improved.

Further, since the movable period of the XY table becomes longer, the number of times of timing control is reduced.

Since the height of the mounted electronic components on the printed circuit board is measured in the board conveying step, the time required for the measurement does not affect the tact time.

[Brief description of drawings]

FIG. 1 is a flowchart showing an electronic component mounting method of the present invention.

FIG. 2 is a perspective view of a height measuring device for mounted electronic components according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a positional relationship between a suction nozzle and mounted electronic components on a printed circuit board.

FIG. 4 is a timing chart of an up / down operation of the suction nozzle and an interlock of an XY table according to the present invention.

FIG. 5 is a perspective view of a conventional electronic component mounter.

FIG. 6 is a timing chart of an up / down operation of a conventional suction nozzle and an interlock of an XY table

FIG. 7 is an explanatory diagram showing the relationship between the height of an electronic component already mounted on the electronic component mounter and a suction nozzle (at the time of component suction).

FIG. 8 is an explanatory diagram showing the relationship between the height of the electronic component mounted on the electronic component mounter and the suction nozzle.

FIG. 9 is an explanatory view of a nozzle movement trajectory of a conventional electronic component mounting method and an electronic component mounting method of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 rotating disk part 2-5 sensor 3,12,21,26 printed circuit board 11,18 adsorption nozzle 13 electronic component 14,25 mounted electronic component 16 rotary table 17 head 19 electronic component supply means 20 electronic component supply device 22 XY table 23 Suction Nozzle 24 Adsorbed Electronic Component 27 Mounted Electronic Component in the Vicinity of Mounting Position 28 Movement Trajectory of Adsorption Nozzle Tip in Conventional Electronic Component Mounting Method 29 Movement Trajectory of Adsorption Nozzle Tip in Electronic Component Mounting Method of the Invention

Claims (1)

[Claims] 1. A measuring step for measuring the height of a mounted component and a height and position data obtained from the measuring step in a board transfer step of an electronic part mounter for mounting an electronic part at a predetermined position on a printed circuit board. An electronic component including a step of transmitting to the electronic component mounter, a step of calculating the movable period of the XY table based on the transmitted data in the electronic component mounter, and a step of performing a mounting operation based on the calculation result. How to implement.