JPH0722759A - Hot press - Google Patents

Abstract

PURPOSE:To mold a high density and high quality multilayer board at low cost by changing pressure on a multilayer board material from preliminary pressure to higher adhering pressure based upon detected results of viscosity of prepreg adhesive resin and changing atmosphere from vacuum to high pressure. CONSTITUTION:A hydraulic plumbing 17 from a hydraulic system 16 is connected with a head side port 3a of a main hydraulic cylinder 3 and a hydraulic plumbing 19 from the hydraulic system 16 is connected to a rod side port 3b of the main hydraulic cylinder 3. As the result of it, pressured oil is supplied to the head side and the rod side of the main hydraulic cylinder 3. A pressure sensor 18 is installed at the mid way of a hydraulic plumbing 17 and the pressure to compress the multilayer board material 38 generated by main hydraulic cylinder 3 is detected by the pressure sensor 18, and the result is fed to an arithmetic part 32 of the control board 28. Finding softening and fluidizing point of multilayer board adhesive resin detecting a status change of pressuring measures during preliminary pressuring and heating, high density and high quality multilayer boards are manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot press used for manufacturing a multi-layer substrate, and more particularly to a hot press suitable for molding a high-density, high-quality multi-layer substrate at low cost.

[0002]

2. Description of the Related Art Multilayer substrates are generally manufactured as follows. That is, a printed circuit board on which a predetermined circuit pattern is printed, and a predetermined number of prepregs in which a cross base material is impregnated with an adhesive resin are laminated, and a material for a multilayer substrate composed of these laminated printed circuit boards and prepregs is formed. Heat and pressurize with a hot plate. Then, the adhesive resin reaches the minimum viscosity from the softened and fluidized state at the same time as the temperature rises, and then becomes a stable curing state as the chemical reaction progresses. As a result, the plurality of printed circuit boards are bonded and integrated with each other by the adhesive resin of the prepreg, and a multilayer board is manufactured.

In order to increase the density of the above-mentioned multilayer substrate, it is necessary to prevent oxidation of the joint portion and remove voids between layers of the multilayer substrate. Therefore, it has been proposed to perform the hot press work in a high vacuum. For example, Japanese Patent Laid-Open No. 62-156931
In the publication, the material of the multilayer substrate is covered with a film or sheet, the inside of the film or sheet is decompressed, and then the material of the multilayer substrate is heated and pressed by a hot plate.
Also, after using a high-pressure container called an autoclave to cover the material of the multi-layer substrate with a film or sheet and depressurizing the inside of the film or sheet, the multi-layer substrate material is subjected to the above-mentioned high pressure. As a method of heating and pressurizing with N ₂ gas or CO ₂ gas in a container, there are JP-A-61-43543 and JP-A-61-43565. Furthermore, JP-A-3-
No. 128195, a heat plate for heating the material of the multilayer substrate and upper and lower bolsters for pressing the material of the multilayer substrate through the heat plate uniformly apply heat and pressure to the material of the multilayer substrate. A space between the upper and lower bolsters is surrounded by a sealing means, and the inside of the sealing means is in a vacuum (decompression) atmosphere until the adhesive resin of the prepreg is softened and flows, and a high pressure (air pressure is added) atmosphere in the curing stage from the flow of the adhesive resin. By
It has been introduced that the pressure distribution at the time of bonding the materials of the multilayer substrate is made uniform.

[0004]

The time for changing the vacuum atmosphere to the high-pressure atmosphere in the above-mentioned step of adhering the materials for the multilayer substrate is when the adhesive resin of the prepreg softens and flows (the viscosity of the adhesive resin of the prepreg is the minimum viscosity). Is the best). If the switching time is advanced, voids are likely to occur. Further, even if there are no visible voids, heat resistance and peel strength are reduced. On the other hand, if the switching time is delayed, the thickness of the peripheral portion of the multilayer substrate formed by the adhesive resin flowing out around the material of the multilayer substrate becomes thinner than the center, and the uniform thickness of the above-mentioned third prior art pneumatic pressure press is essentially uniform. The merit of molding is reduced. Further, if the switching time is delayed, the solvent or gas in the cured resin is attracted, which causes the generation of voids.

Further, the softening and flowing timing of the adhesive resin of the multi-layer substrate during the adhering process depends on the insertion amount of the multi-layer substrate material between the hot plates,
It depends on the viscosity characteristics of the adhesive resin, the heating rate of the heat plate, the heat capacity of the jig plate and auxiliary materials, etc., and the temperature rise differs due to the heat transfer difference between the part near the heat plate and the part far from the heat plate. There is a difference in the softening flow timing described above. In particular, when the amount of material of the multi-layer substrate to be inserted between the hot plates is large, the above-mentioned deviation of the softening / flowing time becomes large, and as a countermeasure, generally, several cushion papers are put on the hot plate side. The temperature difference between the materials of the inserted multi-layer substrate is shortened by adjusting the temperature rising rate of the press body. As described above, it is difficult and often wrong to estimate the time when the viscosity of the adhesive resin becomes the minimum viscosity.

However, although the conventional bonding work of the material of the multi-layered substrate takes into consideration such things to some extent, the working conditions are decided based on the experience and intuition of the operator, so that the quality of the molded multi-layered substrate varies. It was great. Further, the variation in quality causes the cost of the molded multilayer substrate to be high.

An object of the present invention is to provide a hot press suitable for molding a high-density, high-quality multilayer substrate at low cost.

[0008]

Means for Solving the Problems The hot press of the present invention which achieves the above-mentioned object is characterized by means for detecting that the viscosity of the adhesive resin of the prepreg has reached the minimum viscosity, and the detection result of the means. Based on the above, when the pressure applied to the material of the multi-layer substrate by the pressurizing means is switched from the preliminary pressure to the bonding pressure whose pressure is higher than the pre-pressure, a means for switching the atmosphere of the material of the multi-layer substrate from the vacuum state to the high pressure state is provided almost at the same time. There is something.

Further, according to the present invention, as means for detecting that the viscosity of the adhesive resin of the multi-layer substrate has reached the minimum viscosity, it is detected that the moving acceleration in the pressurizing means of the material of the multi-layer substrate has become maximum. One is that which detects that the relief amount in the pressure control valve of the pressurizing means has become the minimum, and one that detects that the control current in the pressure control valve of the pressurizing means has become the maximum. , Or a combination thereof.

[0010]

According to the present invention, with the above structure, the state of the pressurizing means that occurs during pre-pressurization and heating is not estimated by experience or experiments when the viscosity of the adhesive resin of the multilayer substrate reaches the minimum viscosity. By catching, the softening pour point of the adhesive resin of the multilayer substrate is found. As a result, compared to the conventional technology that determines the working conditions based on the experience and intuition of the operator, the quality of the molded multi-layer board is small, and high-density, high-quality multi-layer board can be manufactured at low cost. You can

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the hot press of the present invention will be described below with reference to the accompanying drawings. In the figure, 1 is a floor. A frame 2 is installed on this floor 1,
A main hydraulic cylinder 3 is installed at the center of the lower portion of the frame 2. A lower bolster 5 is attached to an upper end of a piston 4 of the main hydraulic cylinder 3, and the lower bolster 5 is guided by a plurality of guide rails 6 fixed to a frame 2 so as to be able to move up and down. The main hydraulic cylinder 3 and the piston 4 constitute a main hydraulic ram.

An upper bolster 7 is arranged at an upper position of the frame 2 facing the lower bolster 5. A lower heating plate 9 is attached to the upper surface of the lower bolster 5 via a heat insulating plate 8A, and a cylindrical body receiving ring 10 is attached to the periphery (side surface) of the lower bolster 5. Similarly, an upper heating plate 11 is attached to the lower surface of the upper bolster 7 via a heat insulating plate 8B, and a cylindrical body guide 12 is attached to the periphery (side surface) of the upper bolster 7. The cylindrical body receiving ring 10 and the cylindrical body guide 12 are provided with sealing means 22 and 23, respectively.

As shown in FIG. 4, the lower heating plate 9 and the upper heating plate 11 have a supply hose 14 and a return hose 15 for the heat medium such as steam and a passage 47 inside. On the other hand, as shown in FIG. 1, the heat medium is supplied to the heat medium passages 47 of the lower heating plate 9 and the upper heating plate 11 from the heating / cooling source 13 constituting the heating / cooling means through the heating medium supply hoses 14. The heat is exchanged in the heat medium passage 47 and returned to the heating / cooling source 13 through the heat medium return hose 15.

Returning to FIG. 1, the head side port 3a of the main hydraulic cylinder 3 is connected to a hydraulic pipe 17 from a hydraulic device 16, and the rod side port 3b of the main hydraulic cylinder 3 is connected. A hydraulic pipe 19 from the hydraulic device 16 is connected, and as a result, pressure oil is supplied to the head side and the rod side of the main hydraulic cylinder 3. A pressure sensor 18 is provided in the middle of the hydraulic pipe 17, and the pressure (hereinafter referred to as an adhesive pressure) when pressurizing the material 38 of the multilayer substrate by the main hydraulic cylinder 3 is detected by the pressure sensor-18. Then, the result is sent to the arithmetic unit 32 of the control panel 29 described later.

The hydraulic device 16 is, as shown in FIG.
In the oil tank 39, an oil pump 40, a switching valve 41, press rising / falling speed control valves 42A, 42B, check valves 43A, 4
3B, a switching valve 44, an electromagnetic proportional relief valve 45, and a relief flow meter 46.

A tubular body 20 is arranged on the outer periphery of a tubular body guide 12 attached around the upper bolster 7. The cylindrical body 20 is attached to an elevating means 21 provided on the lower bolster 5 so as to be able to move up and down. The cylindrical body receiving ring 1
The sealed space 20S is formed inside the cylindrical body 20 by the cooperation of 0 and the cylindrical body guide 12 and the sealing means 22 and 23. The inside of the sealed space 20S is in communication with the exhaust unit 24 and the gas supply unit 26 via the exhaust passage 25 and the gas pipe 27. As a result, the sealed space 20S is evacuated to a vacuum (reduced pressure) state by exhausting the internal atmosphere through the exhaust passage 25 by the exhaust means 24, or the gas is supplied by the gas supply means 26 through the gas pipe 27. It is in a high pressure (pressurized) state. The exhaust passage 2
A pressure sensor 28 is connected to the gas pipe 5 and the gas pipe 27, and the pressure in the sealed space 20S is measured by the pressure sensor 28.
And the result is measured by the operation unit 30 of the control panel 29 described later.
Is configured to be sent to.

An acceleration sensor 37 for detecting the displacement acceleration of the lower bolster 5 is mounted between the lower portion of the lower bolster 5 and the frame 2, and the acceleration sensor 37 detects the moving acceleration of the piston 4 of the main hydraulic ram. The detected value is sent to the arithmetic unit 31 of the control panel 29 which will be described later.

In the figure, 29 is a control panel. The control panel 29 controls the heating / cooling source 13, the hydraulic device 16, the exhaust means 24, and the gas supply means 26, and includes arithmetic units 30, 31, 32, a pressurization control valve (the electromagnetic proportional relief). Control current measuring unit 33 of valve 45), process condition setting unit 34, operation unit 35, and air pressure addition command unit 36
It is composed of. The operation unit 35 is connected to the heating / cooling source 13, the switching valves 41 and 44 of the hydraulic device 16, the exhaust means 2.
4. The control current measuring unit 33 is connected to the gas supply unit 26, the electromagnetic proportional relief valve 45 is connected, and the air pressure addition command unit 36 is connected to the relief flow rate detector 46.

Next, the operation of the hot press of the present invention will be described. First, as shown in FIG. 2, the elevating means 21 is operated to raise the tubular body 20 to the upper limit position, and the material 38 of the multilayer substrate is inserted between the upper heating plate 11 and the lower heating plate 9 and is moved downward. The heating plate 9 is positioned and stacked on the upper surface. Then, as shown in FIG. 1, the elevating means 21 is operated to lower the cylindrical body 20. Next, the switching valve 41 of the hydraulic device 16 is switched to the 41B side so that the lower bolster 5 does not rise due to negative pressure during vacuum exhaust, and the high pressure oil from the oil pump 40 is passed through the hydraulic pipe 19 to the rod side port. Supply to the rod-side chamber of the main hydraulic cylinder 3 from the gate 3b, and as shown in FIG.
2 and the lower sealing means 23 form a sealed space 20S inside the cylindrical body 20. Subsequently, in order to prevent oxidation of the joint portion and remove interlayer voids, the exhaust means 24 is operated to exhaust the atmosphere in the sealed space 20S, and the pressure is reduced to 5 to 50 Torr. When a predetermined vacuum is obtained, the switching valve 41 is switched to 41A to discharge the high-pressure oil in the rod-side chamber of the main hydraulic cylinder 3 from the rod-side port 3b, and the high-pressure oil from the oil pump 40 to the high-pressure pipe. It is supplied from the head side port 3a to the head side chamber of the main hydraulic cylinder 3 via 17, and the lower bolster 5 is raised, and uniform heat transfer pressurization is applied to the material 38 of the multilayer substrate by the upper heating plate 9 and the lower heating plate 11. For this purpose, the material 38 of the multilayer substrate is pre-pressurized with a surface pressure of about 1 to 5 kgf / cm ² and preheated to about 130 ° C.

When the temperature and pressure are maintained for 5 to 30 minutes, the adhesive resin is softened and becomes fluid. When the adhesive resin has fluidized and reached the minimum viscosity, the inside of the tubular body 20 is returned from a predetermined depressurized state to atmospheric pressure, and the material 38 of the multilayer substrate is set to 5 to 30 k.
The adhesion process is performed by applying a surface pressure of gf / cm ² .

In the above-mentioned bonding step, when the viscosity of the adhesive resin of the multi-layer substrate becomes the minimum viscosity, since the pressure is applied with a constant pressure, the acceleration of closing between the upper and lower bolsters 5 and 7 due to the adhesive resin outflow phenomenon. Maximum, maximum relief current of the pressure control valve (electromagnetic proportional relief valve) that controls the pressure between the upper and lower bolsters 5 and 7, or maximum control current of the pressure control valve (electromagnetic proportional relief valve). Becomes

As a result, when the adhesive resin is softened to reach the minimum viscosity or the minimum viscosity is reached, as shown in FIG. 6, the lower bolster 5 and the acceleration sensor 37 attached to the frame 2 are operated. The detected value (a) is fetched from the calculation unit 31 of the control panel 29 to the air pressure addition command unit 36 to calculate the maximum acceleration arrival time, or the electromagnetic proportional relief valve 4
The detection value (a) of the relief flow rate detector 46 of No. 5 is controlled by the control panel 2
The time when the relief amount becomes the minimum is obtained by taking in the air pressure addition command unit 36 of No. 9 or the electromagnetic relief valve 4
The measured value (c) of the control current measuring unit 33 of No. 5 is taken into the air pressure addition commanding unit 36 and the time at which the maximum current is reached is obtained. In this way, each sensor (acceleration sensor 37, release
The flow rate detector 46 or the control current measuring unit 33) is used as a means for detecting that the viscosity of the adhesive resin has become the minimum. It is sufficient to use the detection result of one of these sensors, but when used in combination, it is possible to reliably detect that the viscosity of the adhesive resin has become the minimum.

Almost at the same time when the above-described adhesive pressure operation is started, a predetermined nitrogen or air pressure is supplied from the gas supply means 26 to the sealed space 20S to prevent the adhesive pressure around the material 38 of the multilayer substrate from decreasing. . The supply pressure and the supply time vary depending on the adhesive resin and the adhesive pressure, but are generally 3 to 10 kgf / cm ² , and the time is 30 to 60 minutes.

When the adhesive pressure decreases due to the reaction force of the air pressure, the pressure sensor 28 detects the air pressure, and the control panel 29
The calculation unit 30 performs a correction calculation so as to pressurize with the command value from the process condition setting unit 34, and outputs the pressurization command value to the electromagnetic proportional relief valve 45. When the necessary heating and gas pressurization are completed, the heating and cooling source 1 is attached to the lower heating plate 9 and the upper heating plate 11.
A cooling medium is supplied from 3 to cool the multilayer substrate 38. When the temperature of the multi-layer substrate 38 becomes almost room temperature, the pressurization by the main hydraulic cylinder 3 is completed, the lower bolster 5 is lowered to the lower limit position, and the tubular body 20 is raised to the upper limit position as shown in FIG. The work is completed.

As described above, in the hot press of the present invention in this embodiment, the time when the viscosity of the adhesive resin of the multi-layer substrate becomes the minimum viscosity is not estimated from experience or experiments, but the heating that occurs during pre-pressurization and heating is performed. By catching the state change of the pressure means, the softening pour point of the adhesive resin of the multilayer substrate is found. As a result, compared to the conventional technology in which the working conditions are determined based on the experience and intuition of the operator, the quality of the molded multilayer substrate is small, and a high-density, high-quality multilayer substrate can be manufactured at low cost. it can.

In the above embodiment, the multi-layer substrate material 38 is inserted between the upper and lower heating plates 9 and 11, but one or more intermediate heating plates are provided between the upper and lower heating plates 9 and 11. Inserting the material 38 of the multi-layer substrate between each hot plate, in one treatment,
The present invention can also be implemented by hot pressing to manufacture a plurality of multilayer substrates. This is the same amount of multi-layer board material 3 between each hot plate.
This is because 8 is inserted, the amount of heat supplied to each hot plate is made equal, and the press is exercised under the same conditions. Also,
The material 38 of the multilayer substrate may be inserted between the upper and lower heat plates 9 and 11 while being placed on the jig plate having good thermal conductivity, and heating and pressurization may be performed.

[0027]

As described above, according to the hot press of the present invention, it is possible to always switch to the air pressure applied state with the optimum value, there is no interlayer void, the plate thickness deviation of the substrate is small, and the finishing accuracy is high. High-density multilayer substrates can be produced with high yield. Further, since high quality substrates can be produced with high yield, cost reduction of the multilayer substrate is achieved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a hot press of the present invention, showing a sealed state by a cylindrical body.

2 is a cross-sectional view showing a state in which a tubular body of the hot press shown in FIG. 1 is opened.

3 is a cross-sectional view showing a pressed state of the hot press shown in FIG.

FIG. 4 is a cross-sectional view of essential parts of the hot plate taken along the line XX of FIG. 1.

5 is a diagram showing a main circuit of a hydraulic device of the hot press shown in FIG.

FIG. 6 is an explanatory diagram showing the relationship between the viscosity of the prepreg and the operation phenomenon of each part of the press.

[Explanation of symbols]

1 ... Floor, 2 ... Frame, 3 ... Main hydraulic cylinder, 3a
... head side port, 3b ... rod side port, 4 ... piston, 5 ... lower bolster, 6 ... guide rail, 7 ... upper bolster, 8A and 8B ... heat insulating plate, 9 ... lower hot plate, 11 ... upper hot plate, 12 ... Cylinder guide, 13 ... Heating / cooling source, 14 ... Heat medium supply hose, 15 ... Heat medium return hose, 16 ... Hydraulic device, 17 ... Hydraulic piping, 18 ... Pressure sensor, 19 ... Hydraulic piping, 20 ... Cylindrical body, 20S ... Sealed space, 21 ... Lifting means, 22 ... Sealing means, 23 ... Sealing means, 24 ... Exhaust means, 25 ... Exhaust passage, 26 ... Gas supply means, 27 ... Gas piping, 28 ... Pressure sensor, 29 ... Control Board, 30 ... Calculation section, 31 ... Calculation section, 32 ... Calculation section, 33 ... Control current measurement section, 34 ... Process condition setting section, 35 ... Operation section, 36 ...
Air pressure addition command unit, 37 ... Acceleration sensor, 38 ... Multilayer substrate material, 39 ... Oil tank, 40 ... Oil pump, 41 ...
Switching valve, 42A and 42B ... Press rising / falling speed adjusting valve, 43A and 43B ... Check valve, 44 ... Switching valve, 4
5 ... Electromagnetic proportional relief valve, 46 ... Relief flow detector.

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[Procedure amendment]

[Submission date] September 22, 1994

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 2

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 4

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

Further, according to the present invention, as means for detecting that the viscosity of the adhesive resin of the multi-layer substrate has reached the minimum viscosity, it is detected that the moving speed of the pressurizing means of the material of the multi-layer substrate is maximum. One is that which detects that the relief amount in the pressure control valve of the pressurizing means has become the minimum, and one that detects that the control current in the pressure control valve of the pressurizing means has become the maximum. , Or a combination thereof.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction content]

A speed sensor 37 for detecting the displacement speed of the lower bolster 5 is provided between the lower portion of the lower bolster 5 and the frame 2.
Is installed and the piston 4 of the main hydraulic ram moves.
The speed is detected by the speed sensor 37, and the measured value obtained as a result is sent to the arithmetic unit 31 of the control panel 29 described later.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction content]

In the above-mentioned bonding step, in the state where the viscosity of the adhesive resin of the multilayer substrate is the minimum viscosity, since the pressure is applied at a constant pressure, the moving speed at which the upper and lower bolsters 5 and 7 are closed due to the adhesive resin outflow phenomenon. Is the maximum, the relief amount of the pressure control valve (electromagnetic proportional relief valve) that controls the pressure between the upper and lower bolsters 5 and 7 is the minimum, or the control current of the pressure control valve (electromagnetic proportional relief valve) is It will be the maximum.

[Procedure correction 6]

[Document name to be amended] Statement

[Name of item to be corrected] 0022

[Correction method] Change

[Correction content]

As a result, the time when the adhesive resin is softened and reaches the minimum viscosity or when the minimum viscosity is reached is as shown in FIG. 6 when the speeds attached to the lower bolster 5 and the frame 2 are set.
The detection value (a) of the degree sensor 37 is used as the calculation unit 3 of the control panel 29.
Top by calculation is taken from 1 to pneumatic additional command unit 36
The maximum release time is calculated, or the detected value (a) of the relief flow rate detector 46 of the electromagnetic proportional relief valve 45 is taken into the air pressure addition command unit 36 of the control panel 29, and the relief amount is minimized by calculation. Or the value measured by the control current measuring unit 33 of the electromagnetic relief valve 45 is taken into the air pressure addition command unit 36, and the time at which the maximum current is reached is calculated. In this way, each sensor ( speed sensor 37, relief flow rate detector 46, or control current measuring unit 33) is used as a means for detecting that the viscosity of the adhesive resin has become the minimum. It is sufficient to use the detection result of one of these sensors, but when used in combination, it is possible to reliably detect that the viscosity of the adhesive resin has become the minimum.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] Explanation of code

[Correction method] Change

[Correction content]

[Explanation of symbols] 1 ... Floor, 2 ... Frame, 3 ... Main hydraulic cylinder, 3a
... head side port, 3b ... rod side port, 4 ... piston, 5 ... lower bolster, 6 ... guide rail, 7 ... upper bolster, 8A and 8B ... heat insulating plate, 9 ... lower hot plate, 11 ... upper hot plate, 12 ... Cylinder guide, 13 ... Heating / cooling source, 14 ... Heat medium supply hose, 15 ... Heat medium return hose, 16 ... Hydraulic device, 17 ... Hydraulic piping, 18 ... Pressure sensor, 19 ... Hydraulic piping, 20 ... Cylindrical body, 20S ... Sealed space, 21 ... Lifting means, 22 ... Sealing means, 23 ... Sealing means, 24 ... Exhaust means, 25 ... Exhaust passage, 26 ... Gas supply means, 27 ... Gas piping, 28 ... Pressure sensor, 29 ... Control Board, 30 ... Calculation section, 31 ... Calculation section, 32 ... Calculation section, 33 ... Control current measurement section, 34 ... Process condition setting section, 35 ... Operation section, 36 ...
Air pressure addition command unit, 37 ... Speed sensor , 38 ... Multilayer substrate material, 39 ... Oil tank, 40 ... Oil pump, 41 ... Changeover valve, 42A and 42B ... Press up / down speed adjusting valve,
43A and 43B ... Check valve, 44 ... Switching valve, 45 ...
Electromagnetic proportional relief valve, 46 ... relief flow detector.

[Procedure Amendment 8]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 6

[Correction method] Change

[Correction content]

[Figure 6]

Front Page Continuation (72) Kenichi Takahashi 5-2, Koyodai, Ryugasaki, Ibaraki Hitachi Techno Engineering Co., Ltd. Research & Development Laboratory (72) Masami Iwakura 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Inside the factory (72) Inventor Ryo Kato 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Factory

Claims (5)

[Claims] 1. An upper and lower bolsters which are vertically opposed to each other, upper and lower heat plates which are respectively provided to oppose the upper and lower bolsters, a means for sealing between the upper and lower bolsters, and the upper and lower bolsters. A means for moving at least one of the bolsters to the other to pressurize between the upper and lower hot plates, a means for heating and cooling the hot plates, and a vacuum and high pressure in the space formed by the sealing means. A hot press for producing a multi-layer substrate by inserting a material of a multi-layer substrate obtained by laminating a printed circuit board and an adhesive resin between the upper and lower hot plates and heating and pressing under vacuum and high pressure conditions. In, the means for detecting that the viscosity of the adhesive resin of the material of the multilayer substrate has reached the minimum viscosity, and applying to the material of the multilayer substrate by the pressurizing means between the hot plates based on the detection result of the detecting means. Pressure Hot press pressure than the preliminary pressure from 備圧 force, characterized by comprising means for switching to a high pressure atmosphere of substantially simultaneously the multilayer substrate material when switching to the adhesion pressure of the large vacuum state, the. 2. The hot press according to claim 1, wherein the means for detecting that the viscosity of the adhesive resin of the material of the multi-layer substrate has reached the minimum viscosity is the moving acceleration in the pressing means of the material of the multi-layer substrate. That the maximum release is detected, that the release amount in the pressure control valve of the pressurizing means is minimum, and that the control current in the pressure control valve of the pressurizing means is maximum To detect,
At least one of them is a hot press. 3. The hot press according to claim 1, wherein the means for pressurizing the material of the multilayer substrate between the upper and lower hot plates is such that at least one of the upper and lower bolsters is moved with respect to the other. A hot press, comprising: a main hydraulic ram for pressurizing the main hydraulic ram; and an electromagnetic proportional relief valve for controlling pressure of the main hydraulic ram by relief of pressure oil. 4. The hot press according to claim 3, wherein as a means for detecting that the viscosity of the adhesive resin of the material of the multilayer substrate has reached the minimum viscosity, the movement acceleration in the main hydraulic ram is maximum. At least one of the one that detects that the relief amount in the electromagnetic proportional relief valve is minimized, and the one that detects the maximum control current in the electromagnetic proportional relief valve. Hot press characterized by being. 5. The hot press according to claim 1, 2 or 3 or 4, wherein at least one intermediate hot plate is provided between the upper and lower hot plates, and a material for a multilayer substrate is inserted between the hot plates. A hot press characterized by being configured to obtain.