JPH07226427A - Semiconductor testing apparatus - Google Patents

Abstract

PURPOSE:To simplify a constitution in a contact apparatus where lead terminals of a semiconductor package is electrically connected at the time of characteristic test. CONSTITUTION:A plurality of electrodes 24 are arranged at the surface of a ceramic substrate 23 corresponding to lead terminals of a semiconductor package to be electrically tested. Each electrode 24 is provided with a stepped portion. Each lead terminal of the positioned semiconductor package is placed in contact with the electrode 24 on the ceramic substrate 23. In this case, good contact can be realized by removing oxide films adhering to the lead terminal with the stepped portion on the electrode 24.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device used for electrical inspection of a semiconductor device, for example, and is used as a contact device to which lead terminals of a semiconductor package are electrically connected during a characteristic test. It is a thing.

[0002]

2. Description of the Related Art Conventionally, socket type contact devices have been most frequently used in, for example, semiconductor package characteristic tests. FIG. 4 shows an example of a socket type contact device.

That is, the conventional contact device has, for example, a guide member 2 for guiding the package portion 1a of the semiconductor package 1 and a plurality of guide members 2 arranged around the guide member 2 at the same pitch as the lead terminals 1b of the semiconductor package 1. The leaf spring 3 and the plate spring 3 are fixed by the resin 4.

Then, the semiconductor package 1 held by the upper guide 5 by suction is lowered along the guide member 2 to position the semiconductor package 1 as shown in FIG. 5A, for example. The lead terminal 1b and the leaf spring 3 are brought into contact with each other.

At this time, the leaf spring 3 sinks due to the bending, and as shown in FIG. 5B, for example, the oxide film attached to the surface of the lead terminal 1b is scraped off. In this way, the lead terminals 1b of the semiconductor package 1 are surely brought into contact with the leaf springs 3 of the contact device, whereby the characteristic test of the semiconductor package 1 is performed.

However, the contact device of the above-mentioned system has the following problems as the development of the semiconductor package 1 progresses. For example, in recent semiconductor packages 1, the number of pins of lead terminals 1b has been increased and the pitch thereof has been narrowed in accordance with higher integration and the like, and accordingly there is a drawback that the structure of the contact device becomes complicated. It was

That is, the increase in the number of pins and the reduction in pitch of the lead terminals 1b lead to an increase in the number of leaf springs 3 and a decrease in the mutual pitch, which complicates the assembly of the contact device.

As the lead terminals 1b become narrower in pitch, the mutual spacing of the leaf springs 3 decreases, but the reduction of the mutual spacing of the leaf springs 3 narrows the width of the leaf springs 3 and increases the strength. It will cause a significant decrease.

Moreover, the narrow pitch of the lead terminals 1b is
Since higher positioning accuracy is required, as shown in FIG. 6, for example, when the positioning is not successful, the lead terminal 1b is likely to be deformed.

Further, since the above-mentioned contact device uses a mold for forming the resin 4, the contact device prepared for each type of the semiconductor package 1 to be subjected to the characteristic test is manufactured (assembled). It was necessary to prepare a dedicated mold for this, and the development of this mold required cost and time.

[0011]

As described above, conventionally, there have been problems that the structure is apt to be complicated and the cost is relatively high due to the increase in the number of pins of the semiconductor package and the narrowing of the pitch. Therefore, an object of the present invention is to provide a semiconductor inspection device that can be simplified in structure, has high versatility, and is inexpensive.

[0012]

In order to achieve the above object, in a semiconductor inspection apparatus of the present invention, an electrode to which a lead terminal of a semiconductor device to be inspected is electrically connected is a substrate in an inspection. It is arranged on top.

In the semiconductor inspection apparatus of the present invention, which is used for electrical inspection of a semiconductor device, a substrate on which the semiconductor device is mounted and a lead terminal of the semiconductor device on the surface of the substrate are provided. And a plurality of electrodes which are arranged with a step for removing the oxide film attached to the semiconductor device and which are individually brought into contact with the lead terminals of the semiconductor device at the time of mounting.

[0014]

According to the present invention, since the semiconductor device can be contacted by the electrode arranged on the substrate by the above means, it is possible to provide a structure suitable for increasing the number of pins and narrowing the pitch. is there.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a contact device according to the present invention. That is, the contact device used for the characteristic test of the semiconductor package includes, for example, an upper base (shown in a partially cutaway state) 10 and a lower base 20.

A plurality of holes 11 for positioning with the lower base 20 are formed in the upper base 10, and a semiconductor package (not shown) to be subjected to a characteristic test is adsorbed or the like at a substantially central portion thereof by means of suction or the like. A tube mounting hole 12 for holding is formed.

Further, the upper base 10 is provided with a holding portion 13 for holding a semiconductor package sucked through the tube mounting hole 12, and a contact plate is provided at the tip of the lead holding portion of the holding portion 13. 14 is attached.

The contact plate 14 is for applying a uniform force to each of the lead terminals of the semiconductor package at the time of contact, and is made of urethane rubber, for example.

A guide pin 21 for positioning is provided on the lower base 20, and the guide pin 21 is used for the upper base 1.
By being inserted into the positioning hole 0 of 0, accurate positioning is performed.

The lower base 20 has, for example, a base 2
A ceramic substrate 23 fixed on the substrate 2 is arranged. On the surface of the ceramic substrate 23, a plurality of electrodes 24 to which the lead terminals of the semiconductor package are individually electrically connected (contacted) are arranged.

During the characteristic test, the holding portion 1 of the upper base 10 is attached to each electrode 24 on the ceramic substrate 23.
Each of the lead terminals of the semiconductor package held by 3 is pressed via the contact plate 14. As a result, the semiconductor package is electrically connected to an inspection device (not shown), and a predetermined inspection is performed.

FIG. 2 shows the above-mentioned ceramic substrate 23 taken out. The ceramic substrate 23 has a flat surface, and a plurality of electrodes 24 are provided around the ceramic substrate 23 so as to correspond to the width of the lead terminals and the mutual pitch of the semiconductor packages to be subjected to the characteristic test. .

The ceramic substrate 23 can be easily obtained by, for example, arranging electrode materials at respective electrode forming positions on a substrate material (here, ceramic) and simultaneously sintering.

As described above, by adopting the substrate system in which the electrodes 24 are integrally formed on the ceramic substrate 23 for the contact with the semiconductor package, it is possible to easily cope with the increase in the number of pins and the reduction in the pitch. Become.

Therefore, compared with the conventional socket system,
The structure and assembly can be greatly simplified,
Stable contact is possible by preventing deformation of the lead terminals.

On the other hand, each electrode 24 on the ceramic substrate 23
Is provided with a step for removing the oxide film attached to the surface of the lead terminal of the semiconductor package.

FIG. 3 shows an example of the structure of the electrode 24 described above. That is, a step is formed on the electrode 24 by forming an infinite number of hemispherical protrusions 25 as shown in FIG.

Alternatively, for example, as shown in FIG. 2B, a step is provided by forming a large number of grooves 26 having a triangular cross section. Alternatively, for example, as shown in FIG. 7C, a step is provided by forming a plurality of grooves 27 in the vertical and horizontal directions.

Any of the steps on the electrode 24 can be easily formed by using a well-known etching technique. In the contact device having such a structure, first, the semiconductor package is sucked and held by the holding portion 13 of the upper base 10, and the tips of the respective lead terminals are brought into contact with the contact plate 14 of the holding portion 13. At this time, for example, the positioning of the semiconductor package with respect to the ceramic substrate 23 is performed using an optical means (not shown).

After that, by gradually lowering the upper base 10, the guide pin 21 of the lower base 20 is inserted into the positioning hole 11 of the upper base 10, and the upper base 10 and the lower base 20 are accurately aligned. Positioning is performed.

Further, when the upper base 10 is lowered, each lead terminal of the semiconductor package and each electrode 24 on the ceramic substrate 23 are individually brought into contact with each other. Then, at the time of the contact, each of the lead terminals is pressed against each of the electrodes 24 by the contact plate 14, whereby the oxide film attached to the lead terminals is removed by the step on the electrode 24, and a good contact is obtained. Done.

As described above, the semiconductor package can be contacted by the electrodes arranged on the ceramic substrate. That is, the electrodes are arranged on the ceramic substrate, and the lead terminals of the semiconductor package are electrically connected using the electrodes on the ceramic substrate. As a result, instead of the conventional socket method, it is possible to adopt a board method in which electrodes to which lead terminals of a semiconductor package are electrically connected are arranged on a ceramic board, which is suitable for increasing the number of pins and narrowing the pitch. It is possible to have a different structure. Therefore, the structure can be simplified, and the lead terminals can be prevented from being deformed due to a decrease in strength or a positioning error. can do.

Moreover, since the mold is not required for the assembly, the cost and time required for the development of the mold are unnecessary, and the structure can be inexpensively constructed. In addition, although the case where ceramic is used for the substrate has been described in the above embodiment, the present invention is not limited to this, and glass epoxy, for example, may be used as the substrate.

In this case, the electrodes may be patterned by a printing technique, for example. Of course, various modifications can be made without departing from the scope of the invention.

[0035]

As described above in detail, according to the present invention, it is possible to provide a semiconductor inspection device which can be simplified in structure, has high versatility, and is inexpensive.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a contact device according to an embodiment of the present invention.

FIG. 2 is a perspective view schematically showing the structure of a ceramic substrate used for the contact device.

FIG. 3 is a configuration diagram similarly showing an example of electrodes arranged on a ceramic substrate.

FIG. 4 is a side sectional view of a contact device shown for explaining the related art and its problems.

FIG. 5 is a diagram for explaining the electrical connection between the lead terminal of the semiconductor package and the leaf spring of the contact device.

FIG. 6 is a diagram for explaining the deformation of the lead terminal due to a positioning error.

[Explanation of symbols]

10 ... Upper base, 20 ... Lower base, 23 ... Ceramic substrate, 24 ... Electrode, 25 ... Protrusion, 26, 27 ... Groove.

Claims (5)

[Claims] 1. A semiconductor inspecting device, wherein electrodes for electrically connecting lead terminals of a semiconductor device to be inspected are arranged on a substrate during inspection. 2. The electrode provided on the substrate is provided with a step for removing an oxide film attached to a lead terminal of the semiconductor device to be inspected. The semiconductor inspection device described. 3. The electrode arranged on the substrate is provided with a protrusion for removing an oxide film attached to a lead terminal of the semiconductor device to be inspected. The semiconductor inspection device described. 4. An electrode arranged on the substrate is provided with a groove for removing an oxide film attached to a lead terminal of the semiconductor device to be inspected. The semiconductor inspection device described. 5. A semiconductor inspection device used for electrical inspection of a semiconductor device, wherein a substrate on which the semiconductor device is mounted and an oxide film attached to a lead terminal of the semiconductor device on a surface of the substrate are removed. Arranged with a step of
A semiconductor inspecting device, comprising: a plurality of electrodes that individually contact the lead terminals of the semiconductor device when mounted.