JPH07226301A - Resistor - Google Patents

Abstract

PURPOSE:To manufacture a metal thin film resistor of high resistance value by a method wherein a pattern is formed on both surfaces of a substrate and they are coupled by a recessed type terminal. CONSTITUTION:A ceramic substrate is used as an electrically insulated substrate. A nickrome resistance thin film 2 and an electrode thin film 3 are coated on both surfaces of the substrate 1 by a magnetron sputtering method, and the above-mentioned thin films 2 and 3 are formed into patterns using a phtoetching method. Then, after a heat treatment is conducted on the pattern-formed substrate 1 at 300 to 400 deg.C for one hour, it is cut by a dicer. A recessed type lead frame 4 is inserted into an electrode pad, surface is adjusted by trimming using a laser beam, an encopsvlation 6 is provided and a resistor is completed. As a result, the resistance value of about twice of the conventional resistance value can be obtained without changing the external shape of the resistor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor used in electronic circuits.

[0002]

2. Description of the Related Art Conventionally, a resistor using a nichrome or tantalum-based metal thin film has been manufactured by forming a pattern on one surface of a substrate.

[0003]

In the conventional manufacturing method, the upper limit of the resistance value is limited by the effective area of the pattern.

[0004]

[Means for Solving the Problems] By forming a pattern on both sides of a substrate and connecting them with concave terminals, it is possible to use about twice the area of the same shape. It has become possible to increase the value to about twice that of the conventional value.

[0005]

Example 1 In this example, an electrically insulating substrate was 50 mm × 60 mm and had a thickness of 0. A 635 mm ceramic substrate was used. Nichrome-based resistance thin films and electrode thin films were deposited on both surfaces of the substrate by magnetron sputtering, and the thin films were patterned by photoetching as shown in FIGS. 1 (2) and (3). Then, the patterned substrate was heat-treated at 300 to 400 ° C. for 1 hour or more, and then cut with a dicer as shown in FIG. Figure 2-
1) is the front surface and 2-2) is the back surface. Then insert the concave lead frame (4) into the electrode pad and solder (5)
After attaching and trimming the surface with laser light to adjust the resistance value, the exterior (6) was applied to complete the product as shown in FIG.
The specifications of this product are 2MΩ between pins 1 and 3 and accuracy ± 0.1%.

[0006]

Second Embodiment This embodiment is an application of the first embodiment to a network resistor. As in Example 1, a ceramic substrate having a size of 50 mm × 60 mm and a thickness of 0.635 mm was used as an insulating substrate, and a nichrome-based resistance thin film and electrode thin film were deposited on both surfaces of the substrate by magnetron sputtering, and the thin film was photoetched. The pattern was formed by the method. Next, the patterned substrate was heat-treated and then cut with a dicer as shown in FIG. 4-1) is the front surface and 4-2) is the back surface. Next, insert a concave lead frame (4) into the electrode pad and attach solder (5).
After trimming the surface with laser light and adjusting the resistance value, the exterior (6) was applied to complete the process as shown in FIG. The specifications of this product are 2MΩ between pins 1 to 3 and 4 to 6 and accuracy ± 0.1.
%.

[0007]

According to the present invention, it is possible to obtain a resistance value about twice that of the conventional one without changing the outer shape of the product.

[0008]

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the structure of a film.

FIG. 2 is a top view showing a pattern configuration of a metal thin film single resistor.

FIG. 3 is an overall view showing a thin film single resistor manufactured by the manufacturing method of the present invention.

FIG. 4 is a top view showing a pattern configuration of a metal thin film network resistor.

FIG. 5 is an overall view showing a thin film network resistor manufactured by the manufacturing method of the present invention.

[Explanation of symbols]

 1: Ceramic substrate 2: Nichrome resistance film 3: Electrode film 4: Recessed lead frame 5: Solder 6: Exterior

Claims (1)

[Claims] 1. A metal thin film resistor capable of producing a high resistance value by forming a pattern on both surfaces of a substrate and connecting them with concave terminals.