JPH0722478U - Heat seal connector - Google Patents

Abstract

(57) [Summary] (Corrected) [Purpose] Pitch of connecting terminals is in the 0.3 mm range, 0.2 m
Provided is a heat-seal connector which does not reduce the insulation between conductive patterns due to the outflow of conductive fine particles and does not reduce the particle density on the conductive patterns even when connecting by m so-called low-pitch heat-seal connectors. A base film 1, a conductive pattern 2 formed on at least one surface of the base film 1, and an insulating pattern 7 formed between the conductive patterns 2 and having substantially the same height as the conductive pattern 2 are at least connected. And an anisotropic conductive adhesive layer 5 formed on the conductive pattern 2 in contact with the electrode terminals of the electric circuit board.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to electrodes between electrode terminals of various electric circuit boards, such as liquid crystal displays (LCD), electroluminescence (EL), light emitting diodes (LED), electrochromic displays (ECD), and plasma displays (PDP). The present invention relates to a heat-seal connector used for connecting terminals to each other or to the electrode terminals of a circuit board on which the driving part is mounted, or between electrode terminals of the circuit board.

[0002]

[Prior art]

 Conventionally, the heat seal connector has been used for connecting a display body such as LCD, EL, LED, ECD, PDP and the like to a hard printed circuit board (PCB) or a flexible printed circuit board (FPC), or a connection between PCB and FPC. Has been. As this heat-seal connector, as shown in FIG. 3, a desired conductive pattern 2 is formed on a flexible insulating base film 1 by a conductive paste, and conductive fine particles 3 are applied on top of it to form an insulating adhesive 4. It is generally known that the anisotropic conductive adhesive layer 5 is dispersed and blended therein (see JP-B-55-38073 and JP-B-58-56996).

[0003]

[Problems to be solved by the device]

 However, with the recent miniaturization and refinement of electrical and electronic equipment, the connection terminals that come into contact with the electrode terminals of the electric circuit board to be connected using the heat seal connector, especially in the conductive pattern of the heat seal connector. The required pitch has been reduced to 0.3 mm and 0.2 mm. In such a case, unless special insulation treatment is applied between the adjacent connection terminals or the conductive lines that make up the conductive pattern, the conductive fine particles may be separated between the conductive patterns due to the flow of the insulating adhesive during the heat seal. In addition to the risk of defective insulation between conductive patterns, the particle density on the connection terminals was reduced, causing poor contact. The present invention does not reduce the insulation between the conductive patterns due to the outflow of conductive fine particles even when connecting with a so-called low-pitch heat seal connector having a connection terminal pitch of 0.3 mm, 0.2 mm or less. An object of the present invention is to provide a heat seal connector that does not reduce the particle density on the conductive pattern.

[0004]

[Means for Solving the Problems]

 The present inventor has completed the present invention as a result of various studies, paying attention to the fact that the conductive fine particles can be prevented from flowing out between the conductive patterns by eliminating the protrusions of the conductive patterns in the heat seal connector. Is a base film, a conductive pattern formed on at least one surface of the base film, and an insulating layer formed between the conductive patterns so as to be almost the same height (90 to 110% of the height of the conductive line). A heat-sealing connector is characterized in that it comprises an edge pattern and at least an anisotropic conductive adhesive layer formed on a conductive pattern in contact with an electrode terminal of an electric circuit board to be connected.

The structure of the heat-seal connector of the present invention will be described below with reference to the drawings. As shown in FIG. 1, a conductive pattern 2 is formed on a base film 1, and an insulating resin agent 6 is filled in a gap between adjacent conductive patterns 2 so as to have the same height as the conductive pattern. And an anisotropic conductive adhesive layer 5 made of an insulating adhesive 4 containing conductive fine particles 3 is provided thereon (on the conductive pattern and the insulating pattern).

The base film of the heat-seal connector of the present invention includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polycarbonate, polyphenyl sulfide, poly-1.4-cyclohexane dimethylene terephthalate, polyacrylate. A polymer film (including a laminate) having a heat resistance of 10 to 50 μm and having one or two or more kinds selected from liquid crystal polymers and the like is used.

A conductive paste is printed on the base film by a known method such as screen printing or gravure printing to form a desired conductive pattern. After drying this conductive pattern, the insulating resin agent is applied to fill the gap between adjacent conductive patterns to the same height as the conductive patterns to form an insulating pattern, and conductive fine particles flow out during heat sealing. This prevents the insulation between the conductive patterns from decreasing.

Examples of such an insulating resin agent include photosensitive resin such as UV curable resin and EB curable resin, electron beam curable resin, and chemically curable resin such as epoxy, urethane and melamine. If used, there is an advantage in the process that after the application, UV irradiation is performed from the base film side to cure the resin filling the space between the conductive patterns, and the uncured resin on the conductive patterns can be removed with a solvent.

The above-mentioned known printing method, roll coating, bar coating, knife coating, spray coating or spin coating is used to apply such an insulating resin agent, but it is almost the same as the conductive pattern. In order to secure the height and control the coating thickness to be constant, either roll or bar coating is preferable.

An anisotropic conductive adhesive layer is provided on the connection terminal of the heat-seal connector which comes into contact with the electrode terminal of the electric circuit board to be connected next, which is formed by the above-mentioned known printing method or coating. Alternatively, an anisotropic conductive film or an anisotropic conductive film may be used during connection to achieve the object of the present invention. However, it is desirable that these adhesive components have higher melt viscosities at the same temperature than the above-mentioned insulating resin agent. This is because, if they are the same or lower, the insulating resin agent tends to flow during heat sealing, and the conductive fine particles may be buried in the insulating pattern to cause insulation failure. However, this does not apply to the case where an appropriate flow prevention means (a weir is separately provided on the outermost side of the line) is applied.

[0011]

[Action]

 As shown in FIG. 2, an electric circuit board 11 having electrode terminals 9 having the same pitch as the connection terminals 8 of the heat seal connector of the present invention formed on a substrate 10 is overlaid on the heat seal connector of the present invention, and the connection terminals are connected. When 8 and the electrode terminal 9 are opposed to each other and heat-sealed, the insulating adhesive 4 has a high melt viscosity or is blocked, so that the conductive fine particles 3 therein do not flow out and the conductive pattern 2 The insulation between them is not impaired, and the contact resistance between the connection terminal 8 and the electrode terminal 9 can be reduced, and good electrical continuity can be maintained.

[0012]

【Example】

 Silver paste “DW-250-H-5” (manufactured by Toyobo Co., Ltd.) was used on a base film made of a polyethylene terephthalate film having a thickness of 25 μm, and a density of 0. A 25 mm pitch conductive pattern was formed by screen printing. At this time, the thickness of the conductive pattern was set to 12 μm after the solvent was removed and dried. Then, UV curable epoxy resin "Amicon UV-900" (manufactured by Grace Japan) was applied to the entire surface of the base film on which the conductive pattern was formed by a bar coater so that the cured film had a thickness of 12 µm. UV light with a wavelength of 365 nm is irradiated from the side for 15 seconds to cure only the resin between the conductive patterns, xylene is sprayed from the opposite side, and the uncured resin on the conductive pattern is dried and removed together with xylene to form an insulating pattern. did. Then, an anisotropic conductive adhesive “RGD-203D” (manufactured by Shin-Etsu Polymer Co., Ltd.) layer was formed on this layer by screen printing so that the thickness after drying after removing the solvent would be 15 μm, and the number of conductive patterns was 300. This was sized so that the length of the conductive pattern was 25 mm, and the heat-sealing connector of the present invention was obtained.

[0013]

[Comparative example]

 A heat seal connector similar to that of the example was manufactured except that the insulating pattern was not formed. 1000 sets of PCBs having electrode terminals of 0.25 mm pitch were connected to each other with the heat seal connector produced in the examples and comparative examples, and the initial resistance was measured. At this time, in the total number of lines of 300,000, the insulation failure between the conductive patterns and the contact failure between the connection terminal and the electrode terminal were both 0% in the examples, whereas in the comparative example, they were 0%. It was confirmed to be 0.92% and 1.13%.

[0014]

[Effect of device]

 As described above, when the heat seal connector of the present invention is used, conductive fine particles do not flow out between the conductive patterns and cause insulation failure even in the case of electrode terminals of a fine pitch electric / electronic circuit board. Therefore, high electrical continuity reliability can be obtained. Further, since the insulating pattern is fixed between the conductive patterns, there is an advantage that there is no possibility of causing a defect such as migration of the conductive patterns.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a heat seal connector of the present invention.

FIG. 2 is a vertical cross-sectional view when the connection terminal of the heat seal connector of the present invention is bonded to the electrode terminal of the electric circuit board.

FIG. 3 is a vertical sectional view of a conventional heat seal connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base film 2 ... Conductive pattern 3 ... Conductive fine particles 4 ... Insulating adhesive 5 ... Anisotropic conductive adhesive layer 6 ... Insulating resin agent 7 ... Insulating pattern 8 ... Connection terminal 9 ... Electrode terminal 10 ... Substrate 11 ... Electric circuit board

Claims (1)

[Scope of utility model registration request] 1. A base film, a conductive pattern formed on at least one side of the base film, an insulating pattern formed between the conductive patterns at substantially the same height as the conductive pattern, and at least an electrical connection. A heat-seal connector comprising an anisotropic conductive adhesive layer formed on a conductive pattern in contact with an electrode terminal of a circuit board.