JP2545097Y2 - Heat seal connector with separator - Google Patents
Heat seal connector with separatorInfo
- Publication number
- JP2545097Y2 JP2545097Y2 JP1992007777U JP777792U JP2545097Y2 JP 2545097 Y2 JP2545097 Y2 JP 2545097Y2 JP 1992007777 U JP1992007777 U JP 1992007777U JP 777792 U JP777792 U JP 777792U JP 2545097 Y2 JP2545097 Y2 JP 2545097Y2
- Authority
- JP
- Japan
- Prior art keywords
- separator
- heat seal
- seal connector
- heat
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】[Detailed description of the invention]
【0001】[0001]
【産業上の利用分野】本考案は、電気回路間等を接続す
るセパレ−タ付きヒ−トシ−ルコネクタ−に関し、特
に、液晶ディスプレイ(LCD)、エレクトロルミネッ
センス(EL)、プラズマディスプレイ(PDP)、発
光ダイオ−ド(LED)、エレクトロクロミックディス
プレイ(ECD)等の表示パネルと硬質プリント配線板
(PCB)又はフレキシブルプリント基板(FPC)、
PCBとPCB、FPCとFPC、PCBとFPC等の
接続に用いられるセパレ−タ−付きヒ−トシ−ルコネク
タ−に関するものである。INVENTION The present invention relates to, be connected between the electrical circuit and the like
In particular, the present invention relates to a heat seal connector with a separator , particularly a liquid crystal display (LCD), electroluminescence (EL), plasma display (PDP), light emitting diode (LED), electrochromic display (ECD), and the like. Display panel and rigid printed wiring board (PCB) or flexible printed circuit board (FPC),
The present invention relates to a heat seal connector with a separator used for connection between PCB and PCB, between FPC and FPC, between PCB and FPC, and the like.
【0002】[0002]
【従来の技術】従来のヒ−トシ−ルコネクタ−の少なく
とも基板と接続すべき接続部には、通常、接続する直前
までは、そのハンドリング性、接続面の汚れ防止等の対
策として、保護基材のみからなるセパレ−タ−を導電パ
タ−ン及び異方導電接着手段を設けた面に添付して接続
部を保護しており、この保護基材のみからなるセパレ−
タ−は使用時に剥離除去される。このセパレ−タ−は、
ただ単にヒ−トシ−ルコネクタ−の面に静電気による力
で添わせたものか、あるいはヒ−トシ−ルコネクタ−を
構成している接着剤層自体が有するタック性により単に
保持されたものが知られている。セパレ−タ−には、離
型性を有するものが用いられ、特に後者の場合には、ヒ
−トシ−ルコネクタ−を構成している接着剤に対して離
型性の良いものが用いられている。2. Description of the Related Art At least a connection portion of a conventional heat seal connector to be connected to a substrate is usually provided with a protective substrate as a measure for its handling and preventing contamination of the connection surface until immediately before connection. A separator consisting only of material is attached to the surface provided with the conductive pattern and the anisotropic conductive bonding means and connected.
Parts and protect, separator consisting of only the protective substrate -
The tar is peeled off when used. This separator is
Simply apply a force due to static electricity to the heat seal connector surface.
In Sowase was or not, or non - city - Le connector - the
It is known that the adhesive layer itself is simply retained by the tackiness of the adhesive layer itself . Separator - data -, the ones used with releasability, particularly in the case of the latter, human
An adhesive having good releasability with respect to the adhesive constituting the seal connector is used.
【0003】[0003]
【考案が解決しようとする課題】しかし、保護基材のみ
からなるセパレ−タ−を用いたセパレ−タ−付きヒ−ト
シ−ルコネクタ−においては、理由は不明だが、セパレ
−タ−をヒ−トシ−ルコネクタ−に合わせる以前または
合わせた後の保管輸送中にヒ−トシ−ルコネクタ−の接
続部とセパレ−タ−との間隙にチリやホコリ等の異物の
附着が起こりやすく、これが原因と思われる電気回路と
接続したときの導通不良やリ−クが生じたり、また、接
続初期においては正常に導通しても、使用中に水分が浸
入してマイグレ−ション電食が比較的起こりやすいとい
う不都合が回避できなかった。[Problem to be solved by the invention] However, only the protective base material
Heater with a separator using a separator consisting of
Sheet - Le connectors - in, for unknown reasons, separator - data - the heat - city - Le connector - heat Fit before or during storage transportation after the suit - city - Le Connector - contact the
Connection portion and separator - data - gap tends to occur Fuchaku of foreign matter such as dust and dirt and, conduction failure spear when this is connected to an electrical circuit may be causing - phrase or occur, also in connection early However, even if the electric conduction was normal, the inconvenience that migration intrusion was relatively likely to occur due to infiltration of water during use could not be avoided.
【0004】本考案の課題は、上記のような従来の欠点
を効果的に解決し、特にヒ−トシ−ルコネクタ−の接続
部と被接続基板の接続端子との接続の際に異物の付着が
無い状態で接続できるセパレ−タ−付きヒ−トシ−ルコ
ネクタ−を提供することにある。The object of the present invention is to effectively solve the above-mentioned drawbacks of the prior art, and particularly to the connection of a heat seal connector.
It is an object of the present invention to provide a heat seal connector with a separator which can be connected without any foreign matter adhered when connecting the unit and the connection terminal of the connection substrate .
【0005】[0005]
【課題を解決するための手段】本考案者は、ヒ−トシ−
ルコネクタ−とセパレ−タ−との界面への異物の付着防
方法を種々検討し、たとえ接続部に異物が付着したとし
ても、これを取り除けば良いことに着目し、そのような
方法、材料等について種々の試作検討を重ねた結果、工
業的に極めて望ましいセパレ−タ−付きヒ−トシ−ルコ
ネクタ−を見出した。すなわち、本考案は、使用に際し
てセパレ−タ−が剥離されるセパレ−タ−付きヒ−トシ
−ルコネクタ−であって、(イ)絶縁性の可撓性ベ−ス
フィルム上に導電パタ−ンが形成され、前記導電パタ−
ン上の少なくとも被接続基板との接続部に異方導電接着
手段が形成されたヒ−トシ−ルコネクタ−のヒ−トシ−
ル面に、(ロ)保護基材と、この保護基材の片面に設け
られた粘着層とからなるセパレ−タ−を、(ハ)前記粘
着層を介して貼着したセパレ−タ−付きヒ−トシ−ルコ
ネクタ−からなり、前記セパレ−タ−の粘着層の粘着力
は、ヒ−トシ−ル面に対するよりも保護基材に対する方
が強く、かつ前記異方導電接着手段の有するそれよりも
強いことを特徴とするセパレ−タ−付きヒ−トシ−ルコ
ネクタ−を提供する。Means for Solving the Problems The present inventor has set forth a heath sheet.
Various methods of preventing foreign matter from adhering to the interface between the connector and the separator are examined.Even if foreign matter adheres to the connection part, attention should be paid to the fact that this should be removed. As a result of studying various prototypes of such methods and materials ,
Highly industrially desirable heat shield with separator
Nectar was found . That is, the present invention is in use
With a separator from which the separator is peeled off
- A, (b) an insulating flexible base - - Le connector conductive pattern on a scan film - down is formed, the conductive patterns -
Heat at least the connecting portion between the connection substrate is anisotropic conductive adhesive means is formed on the emission - city - Le connectors - arsenide - city -
(B) Protective substrate and one side of this protective substrate
( C) a heat shield with a separator, wherein the separator comprising the adhesive layer provided is adhered through the adhesive layer.
And the adhesive strength of the adhesive layer of the separator.
Is better for the protective substrate than for the heat seal surface
Is stronger, and more than that of the anisotropic conductive bonding means
A heat seal connector with a separator characterized by being strong .
【0006】本考案のセパレ−タ−付きヒ−トシ−ルコ
ネクタ−に用いられるセパレ−タ−は、保護基材とこの
片面に設けられた粘着層とからなり、ヒ−トシ−ル時に
はヒ−トシ−ルコネクタ−から剥離されるものである。
このセパレ−タ−に用いられる保護基材は、従来からの
ものを使用することができるが、ハンドリング性(剛直
性)を考慮すれば、保護基材の厚さは20μm以上、好
ましくは50μm以上のものが有利に用いられる。保護
基材の材質は、特に限定されないが、例えば、紙、布、
合成紙、高分子フィルム等が実用的である。その中で保
護基材のカット時にチリやホコリ等の発生量を抑制する
ためには、合成紙及び高分子フィルムが好ましい。[0006] The present invention of separator - data - with heat - tosylate - le co <br/> connector - used separator - data - is composed of a pressure-sensitive adhesive layer provided on one surface of the protective substrate Toko, heat - At the time of sealing
Non - tosylate - Le Connectors - Ru Monodea being peeled from.
The separator - data - protecting groups used in the material, can be used those conventionally, considering the handleability (rigid), the thickness of the protective substrate is 20μm or more, preferably at least 50μm Are advantageously used. The material of the protective substrate is not particularly limited, for example, paper, cloth,
Synthetic paper, polymer film and the like are practical. Coercive in its
Reduces the amount of dust and dirt generated when cutting protective substrates
For this purpose , synthetic paper and polymer films are preferred.
【0007】また、保護基材の片面に設けられる粘着層
としては、例えば、天然ゴム系及びクロロプレンゴム、
ニトリルゴム、アクリルゴム、スチレン−ブタジエン−
スチレンブロック共重合体、スチレン−エチレン−ブチ
レン−スチレンブロック共重合体及びスチレン−イソブ
チレン−スチレンブロック共重合体等の合成ゴム系のも
の等が好ましく用いられる。[0007] As the adhesive layer is provided et the one surface of the protective substrate, e.g., natural rubber and chloroprene rubber,
Nitrile rubber, acrylic rubber, styrene-butadiene-
Synthetic rubbers such as styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer and styrene-isobutylene-styrene block copolymer are preferably used.
【0008】この粘着層は、粘着力が大きすぎても小さ
すぎても好ましくなく、例えば、ヒ−トシ−ルコネクタ
−を構成する異方導電接着手段の粘着力よりも強く、且
つヒ−トシ−ルコネクタ−に対する剥離強度が、例え
ば、常温においては100g/cm以下であることが必
要である。この剥離強度は、好ましくは、30g/cm
以下、より好ましくは、2〜10g/cmである。粘着
力が弱すぎると異物を除去することができず、また強す
ぎるとヒ−トシ−ルコネクタ−からの剥離が困難とな
り、剥離する際にヒ−トシ−ルコネクタ−が折れて、断
線してしまいやすいからである。[0008] It is not preferable that the adhesive layer has an adhesive force that is too large or too small. For example, the adhesive layer is stronger than the adhesive force of the anisotropic conductive bonding means constituting the heat seal connector and has a higher heat resistance. - Le connector - peel strength to the, for example
At room temperature, it must be 100 g / cm or less.
It is important. The peel strength is preferably 30 g / cm
Hereinafter, it is more preferably 2 to 10 g / cm. If the adhesive force is too weak, foreign substances cannot be removed, and if it is too strong, peeling from the heat seal connector becomes difficult, and the heat seal connector breaks and breaks when peeling. Because it is easy to be.
【0009】この粘着層は、粘着剤成分をスクリ−ン印
刷やグラビア印刷等の印刷手段を利用し、あるいはナイ
フコ−タ−、バ−コ−タ−等のコ−ティング手段、ディ
ッピング等の方法によって保護基材の片面に形成するこ
とにより得られるが、上記ゴム系粘着剤層付きの市販フ
ィルムを用いてもよい。The pressure-sensitive adhesive layer is formed by applying printing means such as screen printing or gravure printing to the pressure-sensitive adhesive component, coating means such as knife coater or bar coater, or dipping method. Ru obtained by forming on one surface of the protective substrate by, but may be a commercially available film with the rubber-based pressure-sensitive adhesive layer.
【0010】本考案に用いられるヒ−トシ−ルコネクタ
−は、従来から知られたもの、例えば、ポリイミドやポ
リエステル等の絶縁性フィルム上に導電パタ−ンを印刷
したり、Cu等の金属箔を貼合せた後、エッチングする
方法等により導電パタ−ンを形成させ、その導電パタ−
ンの少なくとも被接続基板との接続部分上に異方導電接
着手段が形成されたものが挙げられるが、この異方導電
接着手段は、例えば、導電パタ−ンを形成すべき導電ペ
−スト(絶縁性マトリックスに微細な導電性粒子を添加
したもの)中に粒径5〜100μmの導電性粒子をさら
に混合分散させて、これで導電パタ−ンを形成すること
によって導電性粒子を導電パタ−ン上に露出させ、この
導電パタ−ンの上に熱接着性接着剤を印刷等の方法で形
成して異方導電接着手段としたものや、導電ペ−スト中
に粒径5〜100μmの導電性粒子を混ぜることなく導
電ペ−ストにより導電パタ−ンを印刷し、この導電パタ
−ンの接続部とすべき部位に熱接着性接着剤中に平均粒
径5〜100μmの導電性粒子を均一に分散させた異方
導電性接着剤を印刷、転写等の方法により導電パタ−ン
上に形成させたものとすることもできる。The heat seal connector used in the present invention is a known heat seal connector, for example, a conductive pattern is printed on an insulating film such as polyimide or polyester, or a metal foil such as Cu. After bonding, a conductive pattern is formed by an etching method or the like, and the conductive pattern is formed.
Although those anisotropic conductive adhesive means on the connection part between at least the connected board emissions are formed are mentioned, this anisotropic conductive adhesive means, for example, conductive patterns - Shirubedenpe to form the down - strike ( Add fine conductive particles to insulating matrix
Further conductive particles having a particle size 5~100μm to the ones) in
By mixing dispersed, this conductive pattern - conductive particles electrically conductive pattern by forming a down - exposed on emissions, the
An anisotropic conductive bonding means in which a heat bonding adhesive is formed on a conductive pattern by printing or the like ,
Without mixing conductive particles with a particle size of 5 to 100 μm
A conductive pattern is printed by an electric paste, and the conductive pattern is printed.
Anisotropic conductive adhesive in which conductive particles having an average particle size of 5 to 100 μm are uniformly dispersed in a heat-adhesive adhesive at a portion to be a connection portion of a conductive pattern by a method such as printing and transferring. It can also be formed on a surface.
【0011】なお、これらのうちヒ−トシ−ルコネクタ
−の異方導電接着手段は、前記したセパレ−タ−を剥離
した際、セパレ−タ−との界面に異物が付着していたと
してもセパレ−タ−側に異物が付着するようにするため
に常温でタック性を示さないものであることが好まし
く、例えばガラスに常温20kg/cm2 で圧着した場
合の剥離強度は、10g/cm以下であることが望まし
く、かつセパレ−タ−を構成する粘着層の粘着力よりも
弱いことが必要である。[0011] Among these heat - city - Le connectors - anisotropic conductive adhesive means, said the separator - upon peeling a separator - - data data - and foreign matter adhered to the surface of the < In order to prevent foreign matter from adhering to the separator even when
It is preferable that the material does not exhibit tackiness at room temperature. For example, the peel strength when pressure-bonded to glass at room temperature of 20 kg / cm 2 is desirably 10 g / cm or less.
And more than the adhesive strength of the adhesive layer constituting the separator.
We need to be weak .
【0012】ヒ−トシ−ルコネクタ−とセパレ−タ−の
貼着は、ヒ−トシ−ルコネクタ−の所定寸法へのカット
前に行うのがよいが、またカット後に行うこともでき
る。更に、本考案におけるセパレ−タ−は、この片面が
粘着性を有するので、その保護基材の適宜箇所にスリッ
トを設けたり、ヒ−トシ−ルコネクタ−の水平投影面寸
法よりも大きい大きさのセパレ−タ−をヒ−トシ−ルコ
ネクタ−に貼着することにより使用時に剥離しやすいも
のとすることもできる。このようにしたものは、一対の
被接続電気回路基板を別々に接続する場合、一方の回路
基板をヒ−トシ−ル接続した後にヒ−トシ−ルコネクタ
−の他方の回路基板に対応する部分のセパレ−タ−のみ
を剥がして他方の回路基板とヒ−トシ−ル接続するよう
にすれば、一方の回路基板へのヒ−トシ−ル接続後であ
って他方の回路基板との接続前であっても、他方の回路
基板の接続部に異物が付着するのを防止することができ
る。[0012] The heat seal connector and the separator
The sticking is preferably performed before the heat seal connector is cut to a predetermined size, but may be performed after the cut. Further, since the separator in the present invention has an adhesive property on one side thereof, a slit may be provided at an appropriate portion of the protective base material, or the horizontal projection surface dimension of the heat seal connector may be reduced. separator of even larger size - data - the heat - Toshi - Turkey
Connectors - also easily peeled off at the time of use by sticking to
It can also be as. This is a pair of
When connecting the connected electric circuit boards separately, one circuit
The substrate heat - city - heat after Le connection - tosylate - Le Connector - the other part corresponding to the circuit board of the separator - data - only peel off the <br/> other circuit board and heat - city - Le connection So that after the heat seal connection to one circuit board
Therefore, even before connecting to the other circuit board, the other circuit
Foreign object in the connection portion of the substrate can be prevented from adhering.
【0013】次に、添付図面により本考案を更に詳細に
説明する。図1は、本考案のセパレ−タ−付きヒ−トシ
−ルコネクタ−の一例の模式的平面図である。図2は、
そのA−A線による断面図である。図3は、図1のB−
B線による断面図である。なお、図1においては、セパ
レ−タ−及びレジストは透視されたものとして特に示さ
れていない。図において、絶縁性の可撓性ベ−スフィル
ム1の表面に多数の平行な導電パタ−ン2が形成され、
回路基板と接続される該多数の導電パタ−ンの両端部領
域には、多数の導電粒子3を分散含有する異方導電接着
手段4が形成されている。また、ヒ−トシ−ルコネクタ
−の導電パタ−ンの端部を除く中央部領域には、レジス
ト層5が設けられている。Next, the present invention will be described in more detail with reference to the accompanying drawings. FIG. 1 is a schematic plan view of an example of a heat seal connector with a separator according to the present invention. FIG.
It is sectional drawing by the AA line. FIG. 3 is a sectional view of FIG.
It is sectional drawing by the B line. In FIG. 1, the separator and the resist are not particularly shown as being seen through. In the figure, a large number of parallel conductive patterns 2 are formed on the surface of an insulating flexible base film 1,
Anisotropic conductive adhesive containing a large number of conductive particles 3 dispersed therein is provided at both end regions of the multiple conductive patterns connected to the circuit board.
Means 4 are formed. A resist layer 5 is provided in a central region excluding the end of the conductive pattern of the heat seal connector.
【0014】他方、プラスチックフィルム製保護基材6
の片面にゴム系粘着層7が形成されたセパレ−タ−8
は、上記ヒ−トシ−ルコネクタ−の全面にゴム系粘着層
7を介して貼着され、使用に際して除去される。そのセ
パレ−タ−8には、剥離を容易にするためにスリット9
が形成されている。このセパレ−タ−付きヒ−トシ−ル
コネクタ−は、使用に際して保護基材6とゴム系粘着層
7とからなるセパレ−タ−8が剥ぎ取られる。On the other hand, a plastic film protective substrate 6
8 having a rubber adhesive layer 7 formed on one side of
Is a rubber-based adhesive layer on the entire surface of the heat seal connector.
7 and removed during use. The separator 8 has slits 9 to facilitate peeling.
Are formed. The heat seal connector with the separator is used when the protective base 6 and the rubber-based adhesive layer are used.
7 consists of Metropolitan separator - data - 8 is stripped.
【0015】[0015]
【作用】本考案のセパレ−タ−付きヒ−トシ−ルコネク
タ−は、ヒ−トシ−ル接続時にセパレ−タ−を剥離して
使用するため、ヒ−トシ−ルコネクタ−の接続部に異物
が付着することがなく、たとえ何らかの原因でセパレ−
タ−とヒ−トシ−ルコネクタ−との界面に異物が付着し
たとしても、これを容易に、完全に取り除くことがで
き、接続の際において、接続部への異物混入が高度に防
止される。The heat seal connector with a separator according to the present invention is used by peeling off the separator when connecting the heat seal. Foreign matter
Does not adhere, even if the separation
Foreign matter adheres to the interface between the heater and heat seal connector.
Even if this is the case, it can be easily and completely removed, and at the time of connection, contamination of the connection portion with foreign matter is highly prevented.
【0016】[0016]
【実施例】厚さ25μmのポリエステルフィルムの片面
に銀ペ−ストをスクリ−ン印刷することにより導体幅
0.15mm、導体ピッチ0.3mm、長さ40mmの
導電パタ−ンを形成した。導電パタ−ンの両端部に接続
部の幅が各5mmとなるように、ポリエステル系熱接着
性接着剤中に平均粒径25μmのAuメッキNi粒子7
容量部を混合分散した異方導電性接着剤を平均厚さ25
μmとなるようにスクリ−ン印刷にて形成して異方導電
接着手段とした。次に、導電パタ−ンの露出している部
分全体を覆うようにポリエステル系レジストインクをス
クリ−ン印刷にて設け、ヒ−トシ−ルコネクタ−とし
た。このヒ−トシ−ルコネクタ−のヒ−トシ−ル面に前
記ポリエステル系熱接着性接着剤に対し3g/cmの粘
着力を有する粘着層を片面に設けた厚さ125μmの合
成紙を当該粘着層を介して貼着した後、導電パタ−ン4
0mm、ライン本数242本、接続部幅両端各5mmと
なるようにサイジングし、本考案になるセパレ−タ−付
きヒ−トシ−ルコネクタ−を得た。EXAMPLE A conductive pattern having a conductor width of 0.15 mm, a conductor pitch of 0.3 mm and a length of 40 mm was formed by screen printing a silver paste on one side of a polyester film having a thickness of 25 μm. Au-plated Ni particles having an average particle size of 25 μm in a polyester-based heat-adhesive so that the width of each connection portion is 5 mm at each end of the conductive pattern.
Anisotropic conductive adhesive mixed and dispersed in a capacity part is coated with an average thickness of 25.
Formed by screen printing to a thickness of μm and anisotropically conductive
Adhesion means was used. Next, a polyester-based resist ink is provided by screen printing so as to cover the entire exposed portion of the conductive pattern to form a heat seal connector.
Was. The heat - city - Le connectors - arsenide - city - the synthetic paper having a thickness of 125μm that an adhesive layer provided on one side with respect to the polyester-based heat-adhesive glue in Le surface having an adhesive strength of 3 g / cm adhesive After sticking through the layer , the conductive pattern 4
The heat seal connector with a separator according to the present invention was obtained by sizing so as to be 0 mm, the number of lines was 242, and both ends of the connection portion were 5 mm each.
【0017】なお、前記異方導電性接着剤をガラスに常
温で20kg/cm2 の圧力で押しつけたが粘着性は示
さなかった。また、2週間善良に保管された本考案のセ
パレ−タ−付きヒ−トシ−ルコネクタ−を用いてドット
マトリックスLCDのコモン電極とドライバ−IC付き
PCBを接続したところ、500台中、接続部の異物に
よるリ−ク、断線やその他の不具合は認められなかっ
た。比較例として本実施例中セパレ−タ−に粘着層を持
たない合成紙を用いたほかは同様の構成、製造方法によ
りなるセパレ−タ−付きヒ−トシ−ルコネクタ−を作製
し、実施例と同様にしてその評価を行ったところ、50
0台中16台に接続部にの異物によると見られるリ−
ク、断線が見られ、表示不良となった。The anisotropic conductive adhesive was pressed against glass at room temperature at a pressure of 20 kg / cm 2 , but showed no tackiness. When the common electrode of the dot matrix LCD and the PCB with the driver IC were connected using the heat seal connector with the separator of the present invention stored in good condition for two weeks , 500 No leakage, disconnection, or other problems due to foreign matter in the connection portion were found. In the present embodiment as a comparative example separator - data - to no adhesive layer synthetic paper other same components with, made by the process separator - data - with heat - city - Le connectors - a work made <br / Then, when the evaluation was performed in the same manner as in the example, 50
Li found with the 0 Taichung 16 units due to foreign matter in the connection part -
H and disconnection were observed, resulting in display failure.
【0018】更に、初期において表示不良に無かった実
施例500台、比較例484台について60℃95%R
H、24時間の環境試験を行ったところ、実施例500
台は正常に表示したが、比較例484台中7台に表示不
良が発生した。この表示不良の原因を調べたところ、接
続部位のLCDのITO電極が電食を起こし、断線して
いることがわかり、その遠因はヒ−トシ−ルコネクタ−
に付着した異物であることがわかった。Further, at 500 ° C. and 95% R at 500 ° C. in Example and 484 in Comparative Example, which were initially free from display defects.
H, an environmental test was performed for 24 hours.
The display was normal, but display failure occurred in 7 out of the 484 comparative examples . Examination of the cause of the display defect, LCD ITO electrode of the connection portion-position cause electrolytic corrosion, see that is disconnected, the remote cause is heat - city - Le Connectors -
The particles were found to be foreign substances attached to the surface .
【0019】[0019]
【考案の効果】本考案のセパレ−タ−付きヒ−トシ−ル
コネクタ−は、異物がセパレ−タ−付きヒ−トシ−ルコ
ネクタ−の接続界面に侵入するおそれがなく、また、た
とえ侵入したとしてもこれをセパレ−タ−剥離する際に
セパレ−タ−に粘着して異物を除去する機能を有するこ
とから、回路基板等との接続時に異物による不都合の発
生がなく、その結果、接続時の歩留まりが向上するだけ
でなく、潜在的な不良の発生をも抑えることができるの
で信頼性の高い電気回路間の接続構造が提供される。The heat seal connector with a separator according to the present invention is a heat seal connector with a separator.
There is no risk of intrusion into the connection interface of the connector, and
Even if it invades, when it is separated by a separator
Since it has a function of removing foreign matter by adhering to the separator, there is no inconvenience caused by foreign matter at the time of connection with a circuit board or the like . As a result, not only the yield at the time of connection is improved, but also potential Since the occurrence of defects can be suppressed, a highly reliable connection structure between electric circuits is provided.
【図1】本考案のセパレ−タ−付きヒ−トシ−ルコネク
タ−の一例のレジスト層、セパレ−タ−層を除いた模式
的平面図である。FIG. 1 is a schematic plan view of an example of a heat seal connector with a separator according to the present invention, excluding a resist layer and a separator layer.
【図2】図1のA−A線によるレジスト層、セパレ−タ
−層をつけ加えた断面図である。FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 to which a resist layer and a separator layer are added.
【図3】図1のB−B線によるレジスト層、セパレ−タ
−層をつけ加えた断面図である。FIG. 3 is a cross-sectional view taken along line BB of FIG. 1 to which a resist layer and a separator layer have been added.
1…可撓性ベ−スフィルム 2…導電パタ−ン 3…導電性粒子 4…異方導電接着手段 5…レジスト層 6…保護基材 7…粘着層 8…セパレ−タ−層 9…スリット DESCRIPTION OF SYMBOLS 1 ... Flexible base film 2 ... Conductive pattern 3 ... Conductive particles 4 ... Anisotropic conductive bondingmeans 5 ... resist layer 6 ...protectionBase material 7 ... Adhesive layer 8 ... Separator layer 9 ... Slit
Claims (1)
セパレ−タ−付きヒ−トシ−ルコネクタ−であって、
(イ)絶縁性の可撓性ベ−スフィルム上に導電パタ−ン
が形成され、前記導電パタ−ン上の少なくとも被接続基
板との接続部に異方導電接着手段が形成されたヒ−トシ
−ルコネクタ−のヒ−トシ−ル面に、(ロ)保護基材
と、この保護基材の片面に設けられた粘着層とからなる
セパレ−タ−を、(ハ)前記粘着層を介して貼着したセ
パレ−タ−付きヒ−トシ−ルコネクタ−からなり、前記
セパレ−タ−の粘着層の粘着力は、ヒ−トシ−ル面に対
するよりも保護基材に対する方が強く、かつ前記異方導
電接着手段の有するそれよりも強いことを特徴とするセ
パレ−タ−付きヒ−トシ−ルコネクタ−。1. Separator is peeled off during use
A heat seal connector with a separator ,
(A) A heat conductive pattern in which a conductive pattern is formed on an insulating flexible base film, and an anisotropic conductive bonding means is formed on at least a connection portion of the conductive pattern with a substrate to be connected. (B) Protective substrate on the heat seal surface of the seal connector
If, separator consists of a pressure-sensitive adhesive layer provided on one surface of the protective substrate - data - were adhered via the adhesive layer (c) Se
It consists of a heat seal connector with a pallet.
The adhesive strength of the adhesive layer of the separator is higher than that of the heat seal surface.
Stronger against the protective substrate than the
A heat seal connector with a separator, which is stronger than that of the electroadhesive means .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992007777U JP2545097Y2 (en) | 1992-01-27 | 1992-01-27 | Heat seal connector with separator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992007777U JP2545097Y2 (en) | 1992-01-27 | 1992-01-27 | Heat seal connector with separator |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0561964U JPH0561964U (en) | 1993-08-13 |
JP2545097Y2 true JP2545097Y2 (en) | 1997-08-25 |
Family
ID=11675111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1992007777U Expired - Lifetime JP2545097Y2 (en) | 1992-01-27 | 1992-01-27 | Heat seal connector with separator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2545097Y2 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6333513U (en) * | 1986-08-20 | 1988-03-04 | ||
JPH0770252B2 (en) * | 1988-01-28 | 1995-07-31 | 信越ポリマー株式会社 | Thermal adhesive flexible wiring member |
-
1992
- 1992-01-27 JP JP1992007777U patent/JP2545097Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0561964U (en) | 1993-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5317438A (en) | Liquid crystal display device and method of producing the same having an improved connection between a flexible film substrate and a drive circuit substrate | |
WO2003008134A2 (en) | Surface protection film | |
JPH0878075A (en) | Connection structure of fine electrode and inspection method for electronic part having fine electrode | |
JP2545097Y2 (en) | Heat seal connector with separator | |
JPH02877B2 (en) | ||
JP2644717B2 (en) | Sheet-shaped anisotropic conductive adhesive | |
CN209778722U (en) | protective film for high-temperature laminating process of flexible circuit board and base material using same | |
JPH0311061B2 (en) | ||
JP2828851B2 (en) | How to repair electronic components | |
JP3157344B2 (en) | Method for manufacturing conductive sheet and display device | |
KR100686781B1 (en) | Anisotropic conductive film included antistatic layer | |
JPH0773921A (en) | Connecting member | |
KR100528084B1 (en) | Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method | |
JP2595140Y2 (en) | Adhesive film for bonding electronic components | |
JP3429135B2 (en) | Adhesive layer laminate, display device using the same, and method of manufacturing the same | |
JP3561542B2 (en) | Anisotropic conductive adhesive and display device | |
KR20070031525A (en) | Anisotropic conductive film, manufacturing method thereof and its usage | |
CN210348149U (en) | Anti-static LCM | |
JP2009158833A (en) | Connection structure for flexible printed wiring board | |
JP4835548B2 (en) | Rolled body having an adhesive layer | |
CN118725760A (en) | Black double-sided antistatic silica gel protective film and preparation method thereof | |
JP2505751Y2 (en) | Bending resistant thermocompression bonding member | |
JPH0722478U (en) | Heat seal connector | |
JP2000047244A (en) | Liquid crystal device and its production | |
JP3192549B2 (en) | Heat seal connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |