JPH07222743A - Ultrasonic wave probe - Google Patents

Abstract

PURPOSE:To provide an ultrasonic wave probe which contributes to the miniatur ization of the ultrasonic wave probe and the improvement of manufacturing yield by facilitating the connection of a vibrator to a signal line from a device main body. CONSTITUTION:This probe is constituted in such a way that an arranging type vibrator 3 on which a large number of ultrasonic vibrators 2 each formed with a bending part 2a formed in strip-like shape and having a bend on at least one terminal part in a longitudinal direction side bending backward are arranged, an electrode layer 2b formed on the outside plane of each bending part, and a microconnector 6 provided with a signal line 5 for driving an ultrasonic vibrator 2 are provided, and the electrode layer 2b is electrically connected to the signal line 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe having an array type ultrasonic vibrator and a method for wiring the ultrasonic vibrator, and more particularly to an ultrasonic probe having a characteristic shape of the ultrasonic vibrator.

[0002]

2. Description of the Related Art An ultrasonic probe used in an ultrasonic diagnostic apparatus has an array-type vibrator section formed by arranging a large number of ultrasonic vibrators made of piezoelectric elements. In this ultrasonic probe, each ultrasonic transducer is independently driven by a drive signal from a drive processing circuit of the apparatus main body to transmit an ultrasonic signal into the living body and perform scanning such as sector scanning.

By the way, since each transducer of the array type transducer needs to be driven independently, it is individually wired to the drive processing circuit. In the wiring between the vibrator and the drive processing circuit, it is difficult to directly connect the drive processing circuit and the vibrator with a cable because there are many vibrators and the structure is fine. Therefore, wiring is generally performed using a flexible printed circuit board (hereinafter, referred to as FPC) in which conductor patterns are formed in accordance with the intervals of the vibrators.

A wiring structure using this FPC is shown in FIG.

According to FIG. 5, the vibrators 20a formed in strips are linearly arranged to form the arrayed vibrator 20. Further, in each transducer 20a, a surface (hereinafter, backing material 21) that faces the front surface from a surface on the ultrasonic signal emission side (hereinafter, referred to as front surface) through a side surface on the longitudinal direction side (hereinafter, simply referred to as side surface). The electrode layer 20b (the positive electrode layer 20b ₁ and the negative electrode layer 20b ₂ ) is formed over the surface to which is bonded (hereinafter, referred to as the back surface). Then, the conductor pattern 23 of the FPC 22 formed corresponding to the pitch of the vibrators 20a is conductively connected to a part of the positive electrode layer 20b ₁ formed on the back surface. Wiring is performed by connecting the conductor pattern 23 to a drive processing circuit (not shown).
Note that the part of the back side of the negative electrode layer 20b _2, 'is connected, the wiring member 22' wiring member 22 for grounding is connected to ground (GND).

Further, instead of the FPC, a micro connector having a signal line in a groove having an interval corresponding to the array interval of the vibrators is used, and the signal line of the micro connector is connected to the electrode layer on the side surface of the vibrator. Then, it has been considered to perform wiring. Here, an example of the wiring structure by this micro connector is shown in FIG.

Grooves 24a corresponding to the pitch of the vibrators 20a are formed in the microconnector 24 in advance, and the signal lines 25 including the conducting portions 25a and the covering members 25b are inserted into the grooves 24a. In addition, a through hole 24b is formed for each groove 24a in the portion of the signal line 25 where the conducting portion 25a is installed. The through hole 24b is formed by using an anisotropic etching technique of silicon (Si). The end of the signal line 25 in the direction opposite to the side of the through hole 24b is connected to the drive processing circuit of the apparatus body (not shown).

The micro connector 24 is arranged so that the positive electrode layer 20b ₁ formed on the side surface of each vibrator 20a and the through hole 24b face each other, and the electrode layer 20b and the signal line 25 are connected to each other. The conducting portion 25a is collectively connected by reflow or the like via the through hole 24b.
Incidentally, it is connected as shown in FIG. 6, the wiring member 22 'for grounding the negative electrode layer 20b ₂ formed on the side surfaces of each transducer 20a.

[0009]

In recent years, development of a so-called intracavity scanning type ultrasonic probe in which an ultrasonic probe is inserted into a body cavity to scan an ultrasonic signal has been actively pursued.

What is important in the ultrasonic probe of the body cavity scanning type is high frequency and miniaturization of the probe itself. With the increase in frequency and the miniaturization of the probe itself, the length of the transducer in the array direction (hereinafter referred to as width) and the length of the side surface in the radial direction (hereinafter simply referred to as thickness)
Tends to be as thin as possible.

However, when the width of the vibrator becomes thin,
It is necessary to manufacture an FPC having a conductive wire pattern corresponding to the thin width, but when the width reaches a thinness of 100 μm or less, it is difficult to manufacture an FPC corresponding to a thinner width. .

When the width and thickness of the vibrator become thin,
Accordingly, the area of the side surface of the vibrator, that is, the area of the electrode layer formed on the vibrator becomes smaller. As a result, the difficulty in connecting the electrode layer to the signal line from the main body of the device using a micro connector or FPC has increased.

Further, the FPC 22 is connected to the electrode layer 20b formed on the back surface of the vibrator 20a as shown in FIG.
Further, when the backing material 21 is bonded to the vibrator 20a, it is ideal that the stepped portion due to the thickness of the FPC 22 and the stepped portion previously formed on the backing material 21 are engaged with each other. However, if the center shift occurs between the FPC 22 and the backing material 21, the step portion 22a due to the thickness of the FPC 22 and the step portion of the backing material 21 overlap, which causes a problem that accurate alignment cannot be performed. Was there.

The various problems in wiring the vibrator and the main body of the device as described above have caused a deterioration in manufacturing yield, and have been a serious problem in promoting higher frequencies and miniaturization of the probe.

The present invention has been made in view of the above-mentioned circumstances, and facilitates connection between the vibrator and the signal line from the apparatus main body, which contributes to downsizing of the ultrasonic probe and improvement of manufacturing yield. It is an object of the invention to provide an ultrasonic probe.

[0016]

In order to achieve the above object, the ultrasonic probe according to claim 1 is formed in a strip shape, and at least one end portion in the longitudinal direction thereof is bent toward the back side to form a bent portion. An array-type transducer unit in which a large number of the formed ultrasonic transducers are arranged, an electrode layer formed on an outer surface of each of the bent portions, and a wiring mechanism having a signal line for driving the ultrasonic transducer, The electrode layer and the signal line are conductively connected to each other.

Particularly, in the ultrasonic probe according to the second aspect, the electrode layer is formed on the outer side surface of the bent portion.

Further, particularly, in the ultrasonic probe according to the third aspect, the electrode layer is formed on the outer bottom surface on the back side of the bent portion.

Further, in the ultrasonic probe according to claim 4, the wiring mechanism is configured by inserting the signal line into a groove formed at an interval corresponding to an array interval of the ultrasonic transducers. Is.

Further, in order to achieve the above object, a fifth aspect of the present invention is provided.
In the ultrasonic probe 1 described above, an array type transducer section in which a large number of ultrasonic transducers formed in the shape of a strip and having bending portions formed by bending both ends of the longitudinal direction side to the back side are arranged, A signal line for driving the ultrasonic transducer is inserted inside an electrode layer formed on the outer bottom surface on the back side of the bent portion and a groove formed at an interval corresponding to the array interval of the ultrasonic transducers. The micro connector is provided, the electrode layer and the signal line are conductively connected to each other, and a cavity for acoustic absorption is formed on the back surface side of the array type vibrator section.

[0021]

According to the ultrasonic probe of the present invention, at least one end portion in the longitudinal direction of the strip-shaped ultrasonic transducer, which is a constituent element of the array type transducer portion, is bent to the back side. Bent and bent portions are formed. An electrode layer is formed on, for example, the outer surface of the bent portion. That is, since the bent portion of the surface (front surface) on the ultrasonic wave emission side of the ultrasonic transducer directly becomes the outer surface on the longitudinal direction side, and the electrode layer is formed on this outer surface, a normal ultrasonic transducer The area is larger than that of the electrode layer formed on the side surface of. Therefore, it is possible to vibrate using an FPC or a wiring mechanism such as a micro connector configured by inserting a signal line for driving an ultrasonic transducer inside a groove formed at an interval corresponding to the arrangement interval of the ultrasonic transducers. When wiring the child and the device main body, the signal line can be easily connected to the electrode layer of the vibrator.

Further, in particular, according to the ultrasonic probe of the third aspect, since the electrode layer is formed on the outer bottom surface on the back side of the bent portion (hereinafter, simply referred to as the outer bottom surface), the backing material is ultrasonic wave. It can be arranged in a space formed by the back surface of the vibrator and the inner side surface of the bent portion. Therefore, even if a signal line by a wiring mechanism such as an FPC is connected to the outer bottom surface of the vibrator, the backing material is easily disposed because the arrangement portion of the backing material and the connection portion of the signal line are different. it can.

Further, according to the ultrasonic probe of the fifth aspect, both ends in the longitudinal direction of the strip-shaped ultrasonic transducer, which is a constituent element of the array type transducer section, are bent toward the back side. A bent portion is formed, and an electrode layer is further formed on the outer bottom surface of the bent portion. Then, by the micro connector configured by inserting the ultrasonic transducer driving signal line into the groove formed at the interval corresponding to the array interval of the ultrasonic transducer, the signal line and the both ends of the transducer are connected. The formed bent portion is electrically connected to the electrode layer.

At this time, a cavity is formed by the back surface of the array type vibrator portion, the inner side surface of the bent portion, and the micro connector. That is, the ultrasonic probe of this configuration has a so-called air bag structure in which the air inside the cavity substitutes for the conventional acoustic absorbing backing material.

[0025]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

(First Embodiment) A first embodiment is shown in FIGS. 1 and 2A and 2B. This ultrasonic probe 1
An array type vibrator 3 is formed by linearly arranging a large number of ultrasonic vibrators 2.

The ultrasonic transducer 2 is formed in a strip shape, and both ends thereof are bent to the back side by about 90 degrees to form a bent portion 2.
a is formed. In addition, the ultrasonic transducer 2 is formed from the outer side surface on the longitudinal side of the bent portion 2a through the outer bottom surface and the inner side surface.
The positive electrode layer 2b ₁ is formed over the back surface of the above, and the negative electrode layer 2b ₂ is formed on the radiation side surface of the ultrasonic transducer 2 (hereinafter referred to as the front surface). Further, a backing material 4 that is in contact with the back surface of the ultrasonic transducer body 2 and the inner side surface of the bent portion 2a and absorbs unnecessary sound waves radiated to the back surface side is provided. An acoustic matching layer (not shown) is formed on the front surface of the ultrasonic transducer 2 as needed.

On the other hand, the ultrasonic probe 1 is provided with a micro connector 6 for connecting the signal line 5 from the apparatus main body. The micro connector 6 forms the wiring mechanism of the present invention.

In the micro connector 6, grooves 6a corresponding to the shape of the signal lines 5 are formed at the same intervals as the array intervals of the vibrators 2.
Is formed, and the signal line 5 is inserted in the groove 6a. In addition, a through hole 6b is formed in the groove 6a so as to correspond to a portion where the conducting portion 5a of the signal line 5 (where the conductor is exposed by removing the covering member 5b) is installed. A land is formed in the through hole 6b, and the inside of the through hole 6b is also covered with a conductor.

The micro connector 6 is shown in FIG.
As shown in (b), the through hole 6b is arranged so as to face the positive electrode layer 2b ₁ formed on the bent portion 2a of each vibrator 2, and the signal line 5 is provided through this through hole 6b.
The conductive portion 5a and the electrode layer 2b ₁ are conductively connected by reflowing or the like, so that wiring between the ultrasonic probe 1 and the apparatus main body is made.

According to this embodiment, both ends of the ultrasonic transducer 2 on the longitudinal side are bent to form a bent portion 2a, and the electrode layer 2b (positive electrode) is formed on the outer surface of the bent portion 2a. Layer 2b ₁ ) has been formed. In other words, since the bent portion of the front surface of the ultrasonic transducer directly becomes the outer surface on the longitudinal direction side and the electrode layer is formed on this outer surface, the electrode layer formed on the side surface of the normal ultrasonic transducer is Compared to the area. Therefore, even when the micro connector 6 is arranged so that the through hole 6b and the electrode layer 2b are opposed to each other, the area of the electrode layer 2b is large, so that there is a margin for the alignment and the actual connection is easy. Can be done Therefore, the manufacturing yield of the ultrasonic probe can be improved.

Although the micro connector is used as the wiring mechanism in the present embodiment, the present invention is not limited to this. For example, an F having a conductor pattern which is a signal line is used.
Other wiring mechanism such as a PC may be used.

(Second Embodiment) Second Embodiment FIGS. 3 to 4
Shown in. In the ultrasonic probe 1a shown in FIG. 3, bent portions 7a are formed at both ends of the ultrasonic transducer 7 as in the first embodiment. In addition, the positive electrode layer 7b ₁ extends from the back surface of the ultrasonic transducer 7 to the outer bottom surface through the inner side surface of the bent portion 7a.
Further, a negative electrode layer 7b ₂ is formed from the front surface of the ultrasonic transducer 7 through the outer surface of the bent portion 7a to the outer bottom surface on the back surface side. An acoustic matching layer (not shown) is formed on the front surface of the ultrasonic transducer 7 as needed.

Then, in the micro-connector 8 as a wiring mechanism, similar to the first embodiment, grooves 8a corresponding to the shape of the signal lines 9 are formed at the same intervals as the arrangement intervals of the vibrators 7, and the grooves 8a are formed. The signal line 9 is inserted therein. Also,
In the groove 8a, the conducting portion 9a of the signal line 9 (core wire 9a ₁ ,
A through hole 8b is formed corresponding to a portion where the shielded wire (for GND) 9a ₂ ; where the conductor portion is exposed by peeling off the covering member 9b, the insulator 9c and the like).
A land 8c is formed in this through hole 8b,
The inside of the through hole 8b is also covered with a conductor.

The micro connector 8 is substantially parallel to the longitudinal direction of the vibrator 7 so that the through hole 8b faces the electrode layer 7b formed on the outer bottom surface of the bent portion 7a of each vibrator 7. It is arranged in. And through hole 8
The conductive portion 9a (core wire 9a ₁ , shield wire 9a ₂ ) of the signal line 9 and the electrode layer 7b are conductively connected by reflowing or the like via the b and the land 8c, whereby the ultrasonic probe 1a
And the device main body and GND are wired.

Further, the back surface of the ultrasonic transducer 7 and the bent portion 7a
A cavity 10 is formed between the inner surface of the micro connector 8 and the surface of the micro connector 8 on the ultrasonic transducer 7 side. A backing material 11 is arranged in the cavity 10. In addition,
As shown in FIG. 4, without using this backing material 11,
A so-called airbag structure in which the air (air) 12 in the back surface portion 10 is used instead of the backing material may be used.

According to this embodiment, the ultrasonic transducer 7 is formed in a strip shape, and both ends on the longitudinal side thereof are bent to form a bent portion 7a, and the bent bottom portion 7a has an outer bottom surface. The electrode layer 7b is formed. Since the microconnector 8 is disposed so as to face the electrode layer 7b and be substantially parallel to the longitudinal direction of the vibrator 7, the ultrasonic connector 7, the bent portion 7a, and the microconnector 8 form a cavity. 9 can be formed. That is, even when the electrode layer 7b of the vibrator 7 and the signal line 9 in the micro connector 8 are connected, the backing material 11 can be easily disposed in the cavity 10.

Further, the air 12 existing in the cavity 10
An airbag structure in which the backing material 11 is used instead of the backing material 11 can be easily realized.

Therefore, according to this structure, the above-mentioned micro connector 8 or F is provided on the outer bottom surface of the bent portion 7a of the vibrator 7.
Even if the signal line by the wiring mechanism such as PC is connected, the backing material 11 can be easily arranged in the cavity 10. Therefore, the positional deviation between the wiring mechanism such as the FPC and the backing material 11 which has occurred conventionally can be prevented. This can be prevented, and the manufacturing yield can be increased.

Further, in this configuration, the micro connector 8
Are arranged substantially parallel to the longitudinal direction of the vibrator 7,
Compared with the case where the micro connector 8 is arranged on the outer side surface of the vibrator 7 in the longitudinal direction, the micro connector 8
The thickness of the array type vibrator is reduced by the length of. Therefore, a smaller ultrasonic probe can be provided.

In the first and second embodiments, both ends of the ultrasonic transducer are bent to the back side by about 90 degrees to form the bent portion, but the present invention is not limited to this. The bending angle may be such an angle that the area of the bent portion on the front surface of the ultrasonic transducer becomes large and there is no hindrance when connecting the signal line.

[0042]

As described above, according to the ultrasonic probe of the first and second aspects, the ultrasonic transducer is formed in a strip shape, and at least one end on the longitudinal side thereof is bent to form a bent portion. Since the electrode layer is formed and the electrode layer is formed on the outer side surface of the bent portion, the area of the electrode layer becomes wider than in the conventional case. As a result, even if the thickness of the transducer is reduced, the signal line provided in the wiring mechanism such as the microconnector can be easily connected to the transducer, which enables further miniaturization of the ultrasonic probe. Also, the manufacturing yield is improved.

Further, according to the ultrasonic probe of the third aspect, the ultrasonic vibrator is formed in a strip shape, and at least one end portion on the longitudinal direction side is bent to form a bent portion,
Since the electrode layer was formed on the outer bottom surface on the back side of the bent portion,
The backing material can be arranged in contact with the back surface of the ultrasonic transducer and the bent portion. Therefore, the backing material can be easily arranged even if the vibrator is connected to the signal line by a wiring mechanism such as an FPC, so that the manufacturing yield is improved.

Furthermore, according to the ultrasonic probe of the fifth aspect, since the cavity for acoustic absorption can be formed by the back surface of the array type transducer section, the inner side surface of the bent section, and the micro connector. It is possible to easily realize an ultrasonic probe having an air bag structure that has a simple manufacturing process and high performance.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of an ultrasonic probe according to a first embodiment of the present invention.

2A is a top view of FIG. 1, and FIG. 2B is FIG.
II-II arrow sectional view in FIG.

FIG. 3 is a sectional view showing a schematic configuration of an ultrasonic probe according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a schematic configuration of an ultrasonic probe having an airbag structure.

FIG. 5 is a perspective view showing a schematic configuration of an ultrasonic probe using an FPC as a conventional wiring mechanism.

FIG. 6 is a diagram showing a state in which a signal line is connected to an ultrasonic transducer by using a micro connector as a wiring mechanism.

[Explanation of symbols]

1 ultrasonic probe 1a ultrasonic probe 2 ultrasonic transducer 2a both end portions 2b electrode layer 2b ₁ positive electrode layer 2b ₂ negative electrode layer 3 array type vibrator 4 backing material 5 signal lines 5a conducting portion 5b covering 6 Micro Connector 6a Groove 6b Through hole 7 Ultrasonic transducer 7a Both ends 7b Electrode layer 8 Micro connector 8a Groove 8b Through hole 8c Land 9 Signal line 9a Conducting part 9a ₁ Core wire 9a ₂ Shield wire 9b Covering member 9c Insulator 10 Cavity 11 Backing Material 12 Air

Claims (5)

[Claims] 1. An array-type transducer section in which a large number of ultrasonic transducers are arranged in the shape of a strip, and at least one end on the longitudinal side is bent to the back side to form a bent section, and each of the bent sections. An ultrasonic wave characterized by comprising: an electrode layer formed on the outer surface of the portion; and a wiring mechanism having a signal line for driving the ultrasonic transducer, wherein the electrode layer and the signal line are conductively connected. probe. 2. The ultrasonic probe according to claim 1, wherein the electrode layer is formed on an outer surface of the bent portion. 3. The ultrasonic probe according to claim 1, wherein the electrode layer is formed on an outer bottom surface on the back side of the bent portion. 4. The super connector according to claim 1, wherein the wiring mechanism is a micro connector configured by inserting the signal line into a groove formed at an interval corresponding to an array interval of the ultrasonic transducers. Sonic probe. 5. An array type transducer section in which a large number of ultrasonic transducers are arranged in a strip shape, and both ends of the longitudinal direction side thereof are bent to the back side to form a bent section, and each of the bent sections. A micro connector configured by inserting the signal line for driving the ultrasonic transducer into the electrode layer formed on the outer bottom surface on the back side of the and the groove formed at an interval corresponding to the array interval of the ultrasonic transducers. An ultrasonic probe, comprising: a conductive layer between the electrode layer and the signal line, and a cavity for acoustic absorption formed on the back side of the array-type transducer section.