JP3469095B2 - Ultrasonic probe manufacturing method - Google Patents

Ultrasonic probe manufacturing method

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Publication number
JP3469095B2
JP3469095B2 JP22109098A JP22109098A JP3469095B2 JP 3469095 B2 JP3469095 B2 JP 3469095B2 JP 22109098 A JP22109098 A JP 22109098A JP 22109098 A JP22109098 A JP 22109098A JP 3469095 B2 JP3469095 B2 JP 3469095B2
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JP
Japan
Prior art keywords
flexible substrate
flexible
piezoelectric
signal lines
abc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP22109098A
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Japanese (ja)
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JP2000037385A (en
Inventor
義弘 田原
孝 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Priority to JP22109098A priority Critical patent/JP3469095B2/en
Publication of JP2000037385A publication Critical patent/JP2000037385A/en
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Publication of JP3469095B2 publication Critical patent/JP3469095B2/en
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  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Description

【発明の詳細な説明】 【0001】 【産業上の利用分野】本発明は超音波探触子の製造方法
を利用分野とし、特に幅方向に配列した圧電素子を長さ
方向にも分割してなる所謂短軸分割による配列型超音波
探触子(配列型探触子とする)の製造方法に関する。 【0002】 【従来の技術】(発明の背景)配列型探触子は、圧電素
子を幅方向に並べて長軸方向をリニア及びセクタ等の電
子走査により駆動され、医用の超音波送受波部として有
用される。近年では、圧電素子の長さ方向を分割して、
短軸方向の長さ(圧電素子の長さ)を変え、被検体(生
体)の表面からの焦点深度を制御し、効率的な診断を可
能とする、所謂1.5D(Dimention)の配列型探触子
(1.5D探触子とする)が注目を浴びている(参照:
実開平7−25699号公報) 【0003】(従来技術の一例)第5図及び第6図は、
この種の一従来例を説明する1.5D探触子の図であ
る。第5図は1.5D探触子の平面図、第6図は側断面
図である。1.5D探触子は、例えば3つの圧電エレメ
ント1(abc)からなる圧電素子1を長軸方向に並べ
てなる。通常では、バッキング材2上に圧電素子1を固
着し、さらに前面に音響整合層3を形成する。そして、
フレキシブル基板4(abc)により各圧電エレメント
1(abc)の電極5(ab)中の裏面側5bを導出す
る。なお、バッキング材2は圧電素子1の背面側からの
超音波を減衰させ、音響整合層3は超音波の送受波効率
を高める。 【0004】このようなものでは、例えば第7図に示し
たように圧電板6に3枚の独立したフレキシブル基板7
(abc)を両端側と中央部に接続する(フレキ一体圧
電板8とする)。各フレキシブル基板7(abc)は複
数の信号線路9が平行して形成され、一端側には共通線
路部10が露出する。そして、共通線路部10が圧電板
6に接続される。次に、フレキ一体圧電板8をバッキン
グ材2上に固着する。バッキング材2は中央に貫通孔1
1を有する。そして、フレキ一体圧電板8の両端側のフ
レキシブル基板7(bc)がバッキング材の両側に延出
し、中央部のフレキシブル基板7aが貫通孔11に挿入
して延出する。 【0005】次に、圧電板上から複数の信号線路9間を
切断して、長軸方向に圧電素子1を配列する。なお、バ
ッキング材2に到達する切れ目を設けて共通線路部10
をも切断する。そして、短軸方向の各フレキシブル基板
7(abc)間を切断して各圧電素子1を、圧電エレメ
ント1(abc)に分割して形成される。これにより、
各圧電エレメント1(abc)電極4bがフレキシブル
基板7(abc)の信号線路9によって外部に導出され
る。 【0006】このようなものでは、圧電素子1を短軸方
向に3つに分割したので、例えば中央の圧電エレメント
1aのみを駆動すると焦点深度を小さくして生体の表面
近傍を診断できる。また、中央と両側の圧電エレメント
1(abc)を電気的に共通接続して駆動すると、焦点
深度を大きくして生体の深部を診断できる。 【0007】 【発明か解決しようとする課題】(従来技術の問題点)
しかしながら、上記構成の1.5D探触子では、独立し
た複数のフレキシブル基板7(abc)を圧電板6に接
続して形成するので、各フレキシブル基板7(abc)
間の相互の信号線路を高精度に位置合わせすることが困
難であった。なお、中央部に窓を設けた図示しないフレ
キシブル基板により、圧電板6の両端側から電極を導出
した場合でも中央部には独立したフレキシブル基板を接
続しなければならないので、同様に位置合わせが困難で
あった。そして、位置ずれがあった場合、極端には例え
ば信号線路を切断して断線させたりして、不良品にして
しまう問題があった。 【0008】(発明の目的)本発明は、独立した複数の
フレキシブル基板相互間における信号線路間の位置精度
を高めて作業性を良好にし、高信頼性とした短軸分割に
よる配列型探触子を提供することを目的とする。 【0009】 【課題を解決するための手段】本発明は、露出部を一端
に有する多数の信号線路が形成された複数の独立フレキ
シブル基板と、前記独立フレキシブル基板の両端側を接
続する連結部と、前記複数の独立したフレキシブル基板
間に存するスリットとからなり、前記複数の独立基板の
多数の信号線路を直線上に一致させてなる一体型フレキ
シブル基板を用いて形成したことを基本的な解決手段と
する。以下、本発明の一実施例を説明する。 【0010】 【実施例】第1図は本発明の一実施例を説明する超音波
探触子の図である。なお、前従来例図と同一部分には同
番号を付与してその説明は簡略する。1.5D探触子
は、前述同様に、3つの圧電エレメント1(abc)か
らなる圧電素子1を長軸方向に並べて形成される(前第
5図参照)。そして、この実施例では、一体型フレキシ
ブル基板12を圧電板6を一方の主面に接続してなる。
一体型フレキシブル基板12は3つの独立したフレキシ
ブル基板13(abc)からなる。そして、スリット1
4(ab)となる間隙を設けて、連結部15(ab)に
より両端側を接続される。これらは、図示しない積層構
造とした一枚のフレキシブル基板から一体的に形成され
る。 【0011】各フレキシブル基板14(abc)は、多
数の信号線路9を有して一端側に露出部9aを有する。
そして、各フレキシブル基板14(abc)相互間の各
信号線路9は直線上に一致して予め形成される。例えば
直線上に信号線路9を形成した後にスリット14により
分断してもよいし、スリット14を設けた後に直線上に
形成してもよい。中央のフレキシブル基板の幅は中央の
圧電エレメント1aの長さに相当し、スリット14(a
b)の幅は両側の圧電エレメント1(bc)から電極露
出部9aを差し引いた長さに相当する。 【0012】一体型フレキシブル基板12は電極露出部
9aを圧電板6の一方の主面の電極5bに例えば半田に
より接合する。そして、第2図に示したように圧電板6
の両端側を(矢印AーA’)を切り落として連結部15
(ab)を切除する。次に、フレキシブル基板13(a
bc)を電極露出部9bの境界部分から圧電板6の主面
に対して垂直方向に折り曲げる。そして、前述したよう
に、中央部に貫通孔11を有するバッキング材2にフレ
キ一体圧電板8を固着する(前第7図参照)。 【0013】最後に、圧電板6上からバッキング材2に
達する切れ目を設けて、各信号線路9間を切断して圧電
板6を圧電素子1に分割する(第3図)。そして、各フ
レキシブル基板13(abc)の間(前第2図の矢印B
ーB’)を切断して、各圧電素子1を圧電エレメント1
(abc)に分割する(前第6図参照)。なお、前面に
は、図示しない音響整合層及び音響レンズ等が設けられ
る。そして、フレキシブル基板13(abc)は、別途
のフレキシブル基板やケーブルに接続して筐体に収納さ
れる。 【0014】このような構成であれば、複数のフレキシ
ブル基板13(abc)を複数のスリット14(ab)
により分割して連結部15(ab)により一体化した一
体型フレキシブル基板12を使用するので、信号線路9
の位置合わせを要することなく切断できるので、作業性
を向上する。そして、信号線路9の断線もなく品質を向
上できる。 【0015】 【他の事項】上記実施例では、圧電素子1を3分割して
3個の圧電エレメント1(abc)を得る場合について
述べたが、4個以上に分割する場合でも同様にできる。
例えば5個の圧電エレメントに分割する場合には、第4
図に示したように、両端側を除く中央側のフレキシブル
基板13(abc)の間に切れ目16(ab)を設けて
中央の圧電エレメントの幅に合わせ、両側のフレキシブ
ル基板13(bd)間及び13(ce)間には前述した
ようなスリット14(ab)を設ければよい。なお、図
中の一点鎖線は圧電板6である。矢印AーA’は圧電板
6の切除部であり、同BーB’は圧電板6の短軸方向の
切断線である。長軸方向は前述のようにバッキング材2
に到達する切れ目16を設けて信号線路9間が切断され
る。 【0016】また、フレキ一体化圧電板8は中央に貫通
孔11を有するバッキング材2に固着するとしたが、例
えば各フレキシブル基板13(abc)を圧電板6に対
して垂直方向にして型枠に保持し、樹脂等を流し込んで
固化させて形成してもよい。また両側のフレキシブル基
板13(bc)は長さを大きくできるが、中央のフレキ
シブル基板13aには圧電エレメント1aの長さを最大
とする制約がある。したがって、この場合には他のフレ
キシブル基板等を接続して延出すればよい。 【0017】また、フレキシブル基板13(abc)の
一端を露出して電極露出部9aとしたが、これらを従来
例で示したような共通線路部として圧電板6の切断時に
これを同時に切断してもよい。また、長軸方向を切断し
た後に短軸方向を分割したが、短軸方向を切断した後に
長軸方向を分割してもよい。 【0018】さらに、1.5D探触子として説明した
が、本発明は基本的には二次元上に配列した圧電板エレ
メントの電極導出方法に係わり、いわゆる二次元上に走
査するマトリクス探触子にも適用できる。以上のよう
に、本発明は種々の変更が可能であり、要は短軸方向に
圧電板素子を分割する場合に複数のフレキシブル基板を
一体化して形成するものは、本発明の技術的範囲に基本
的に属する。 【0019】 【発明の効果】本発明は、露出部を一端に有する多数の
信号線路が形成された複数の独立フレキシブル基板と、
前記独立フレキシブル基板の両端側を接続する連結部
と、前記複数の独立フレキシブル基板間に存するスリッ
トとからなり、前記複数の独立基板の多数の信号線路を
直線上に一致させてなる一体型フレキシブル基板を用い
て形成したので、フレキシブル基板相互間における信号
線路間の位置精度を高めて作業性を良好にし、高信頼性
としたマトリクス探触子を含む短軸分割による配列型探
触子を提供できる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field of use of a method for manufacturing an ultrasonic probe, and more particularly, to a method of manufacturing a piezoelectric element arranged in a width direction in a length direction. Also, the present invention relates to a method of manufacturing an array type ultrasonic probe (referred to as an array type probe) by so-called short axis division. (Background of the Invention) An array-type probe is configured by arranging piezoelectric elements in a width direction and driving a long axis direction by electronic scanning such as linear and sector, and as a medical ultrasonic wave transmitting / receiving section. Be useful. In recent years, the length direction of the piezoelectric element has been divided,
The so-called 1.5D (Dimention) array type that changes the length in the short axis direction (length of the piezoelectric element), controls the depth of focus from the surface of the subject (living body), and enables efficient diagnosis A probe (referred to as a 1.5D probe) is receiving attention (see:
(Example of the prior art) FIG. 5 and FIG.
It is a figure of a 1.5D probe explaining one conventional example of this kind. FIG. 5 is a plan view of the 1.5D probe, and FIG. 6 is a side sectional view. The 1.5D probe includes, for example, piezoelectric elements 1 including three piezoelectric elements 1 (abc) arranged in the longitudinal direction. Usually, the piezoelectric element 1 is fixed on the backing material 2 and the acoustic matching layer 3 is formed on the front surface. And
The back side 5b of the electrode 5 (ab) of each piezoelectric element 1 (abc) is led out by the flexible substrate 4 (abc). The backing material 2 attenuates the ultrasonic waves from the back side of the piezoelectric element 1, and the acoustic matching layer 3 increases the transmission and reception efficiency of the ultrasonic waves. In such a device, for example, as shown in FIG. 7, three independent flexible substrates 7 are provided on a piezoelectric plate 6.
(Abc) is connected to both ends and the center (to be a flexible integrated piezoelectric plate 8). Each flexible substrate 7 (abc) has a plurality of signal lines 9 formed in parallel, and a common line portion 10 is exposed at one end. Then, the common line section 10 is connected to the piezoelectric plate 6. Next, the flexible integrated piezoelectric plate 8 is fixed on the backing material 2. The backing material 2 has a through hole 1 in the center.
One. Then, the flexible substrates 7 (bc) at both ends of the flexible integrated piezoelectric plate 8 extend to both sides of the backing material, and the central flexible substrate 7 a is inserted into the through hole 11 and extended. Next, the plurality of signal lines 9 are cut from above the piezoelectric plate, and the piezoelectric elements 1 are arranged in the longitudinal direction. It should be noted that a break reaching the backing material 2 is provided so that the common line portion 10 is formed.
Also cut. Then, each piezoelectric element 1 is divided into the piezoelectric elements 1 (abc) by cutting between the flexible substrates 7 (abc) in the short axis direction. This allows
Each piezoelectric element 1 (abc) electrode 4b is led out to the outside by the signal line 9 of the flexible substrate 7 (abc). In such a device, since the piezoelectric element 1 is divided into three in the short axis direction, for example, when only the central piezoelectric element 1a is driven, the depth of focus can be reduced to diagnose the vicinity of the surface of the living body. In addition, if the piezoelectric elements 1 (abc) on the center and both sides are electrically connected in common and driven, the depth of focus can be increased to diagnose a deep part of a living body. [0007] (Problems of the prior art)
However, in the 1.5D probe having the above-described configuration, a plurality of independent flexible substrates 7 (abc) are formed by connecting to the piezoelectric plate 6, so that each flexible substrate 7 (abc)
It has been difficult to accurately align the mutual signal lines between them. Even when the electrodes are led out from both ends of the piezoelectric plate 6 by a flexible substrate (not shown) having a window at the center, an independent flexible substrate must be connected to the center, so that the alignment is similarly difficult. Met. When there is a positional deviation, there is a problem that, for example, the signal line is extremely cut and disconnected to make a defective product. The object of the present invention is to provide an array-type probe with improved short axis division which improves the workability by improving the positional accuracy between signal lines between a plurality of independent flexible substrates and improves reliability. The purpose is to provide. According to the present invention, there are provided a plurality of independent flexible substrates on which a plurality of signal lines each having an exposed portion at one end are formed, and a connecting portion for connecting both ends of the independent flexible substrate. The basic solution is to form an integrated flexible substrate comprising a slit existing between the plurality of independent flexible substrates and a plurality of signal lines of the plurality of independent substrates aligned in a straight line. And Hereinafter, an embodiment of the present invention will be described. FIG. 1 is a diagram of an ultrasonic probe for explaining an embodiment of the present invention. The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified. As described above, the 1.5D probe is formed by arranging piezoelectric elements 1 including three piezoelectric elements 1 (abc) in the longitudinal direction (see FIG. 5). In this embodiment, the integrated flexible substrate 12 is formed by connecting the piezoelectric plate 6 to one main surface.
The integrated flexible substrate 12 is composed of three independent flexible substrates 13 (abc). And slit 1
A gap of 4 (ab) is provided, and both ends are connected by the connecting portion 15 (ab). These are integrally formed from a single flexible substrate having a laminated structure (not shown). Each flexible substrate 14 (abc) has a number of signal lines 9 and an exposed portion 9a at one end.
The signal lines 9 between the flexible substrates 14 (abc) are formed in advance so as to coincide with each other on a straight line. For example, the signal line 9 may be formed on a straight line and then divided by the slit 14, or may be formed on the straight line after the slit 14 is provided. The width of the central flexible substrate corresponds to the length of the central piezoelectric element 1a, and the slit 14 (a
The width b) corresponds to the length obtained by subtracting the electrode exposed portions 9a from the piezoelectric elements 1 (bc) on both sides. In the integrated flexible substrate 12, the electrode exposed portion 9a is joined to the electrode 5b on one main surface of the piezoelectric plate 6 by, for example, soldering. Then, as shown in FIG.
Cut off both ends (arrows AA ') of the connecting portion 15
(Ab) is excised. Next, the flexible substrate 13 (a
bc) is bent in a direction perpendicular to the main surface of the piezoelectric plate 6 from the boundary portion of the electrode exposed portion 9b. Then, as described above, the flexible integrated piezoelectric plate 8 is fixed to the backing material 2 having the through hole 11 at the center (see FIG. 7). Finally, a cut is made to reach the backing material 2 from above the piezoelectric plate 6, and the signal lines 9 are cut to divide the piezoelectric plate 6 into the piezoelectric elements 1 (FIG. 3). Then, between the flexible substrates 13 (abc) (arrow B in FIG. 2).
-B '), and each piezoelectric element 1 is
(Abc) (see FIG. 6). An acoustic matching layer, an acoustic lens, and the like (not shown) are provided on the front surface. Then, the flexible board 13 (abc) is connected to a separate flexible board or cable and stored in the housing. With such a configuration, the plurality of flexible substrates 13 (abc) are connected to the plurality of slits 14 (ab)
Is used, and the integrated flexible substrate 12 integrated by the connecting portion 15 (ab) is used.
Can be cut without the need for alignment, thereby improving workability. And the quality can be improved without disconnection of the signal line 9. In the above embodiment, the case where the piezoelectric element 1 is divided into three to obtain three piezoelectric elements 1 (abc) has been described. However, the same can be applied to the case where the piezoelectric element 1 is divided into four or more.
For example, when dividing into five piezoelectric elements,
As shown in the drawing, a cut 16 (ab) is provided between the flexible substrates 13 (abc) on the central side excluding both end sides to match the width of the central piezoelectric element, and between the flexible substrates 13 (bd) on both sides and The slit 14 (ab) described above may be provided between 13 (ce). The dashed line in the figure is the piezoelectric plate 6. Arrows AA ′ are cut portions of the piezoelectric plate 6, and arrows BB ′ are cutting lines of the piezoelectric plate 6 in the short axis direction. The backing material 2 is in the long axis direction as described above.
Is provided, and the signal line 9 is cut off. Although the flexible integrated piezoelectric plate 8 is fixed to the backing material 2 having a through hole 11 in the center, for example, each flexible substrate 13 (abc) is perpendicular to the piezoelectric plate 6 and is mounted on a mold. It may be formed by holding and solidifying by pouring a resin or the like. The length of the flexible substrates 13 (bc) on both sides can be increased, but the central flexible substrate 13a has a restriction that the length of the piezoelectric element 1a is maximized. Therefore, in this case, another flexible substrate or the like may be connected and extended. Further, one end of the flexible substrate 13 (abc) is exposed to form an electrode exposed portion 9a, which is formed as a common line portion as shown in the conventional example and cut simultaneously when the piezoelectric plate 6 is cut. Is also good. Although the short axis direction is divided after cutting the long axis direction, the long axis direction may be divided after cutting the short axis direction. Further, although the invention has been described as a 1.5D probe, the present invention basically relates to a method for leading out electrodes of piezoelectric plate elements arranged two-dimensionally, and a so-called two-dimensionally scanned matrix probe. Also applicable to As described above, the present invention can be modified in various ways. In short, when the piezoelectric plate element is divided in the short axis direction, a plurality of flexible substrates that are integrally formed are within the technical scope of the present invention. Basically belong. According to the present invention, there are provided a plurality of independent flexible substrates on which a plurality of signal lines each having an exposed portion at one end are formed;
An integrated flexible substrate comprising a connecting portion connecting both ends of the independent flexible substrate, and a slit existing between the plurality of independent flexible substrates, wherein a large number of signal lines of the plurality of independent substrates are aligned in a straight line; Since it is formed by using, the position accuracy between the signal lines between the flexible substrates is improved to improve the workability, and it is possible to provide an array type probe by short axis division including a matrix probe which is highly reliable. .

【図面の簡単な説明】 【図1】本発明の一実施例を説明する1.5D探触子の
製造過程の分解斜視図である。 【図2】本発明の一実施例を説明する1.5D探触子の
製造過程の平面図である。 【図3】本発明の一実施例を説明する1.5D探触子の
製造過程の一部破断の正面図である。 【図4】本発明の他の実施例を説明する一体化フレキシ
ブル基板の図である。 【図5】従来例を説明する1.5D探触子の模式的な平
面図である。 【図6】従来例を説明する1.5D探触子の側断面図で
ある。 【図7】 従来例を説明する1.5D探触
子の製造過程における分解斜視図である。 【符号の説明】 1 圧電素子、2 バッキング材、3 音響整合層、
4、7、13 フレキシブル基板、5 電極、6 圧電
板、8 フレキ一体圧電板、9 信号線路、10共通線
路部、11 貫通孔、12 一体型フレキシブル基板、
14 スリット、15 連結部、16 切れ目
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view illustrating a manufacturing process of a 1.5D probe for explaining one embodiment of the present invention. FIG. 2 is a plan view illustrating a manufacturing process of a 1.5D probe for explaining one embodiment of the present invention. FIG. 3 is a partially broken front view of a manufacturing process of a 1.5D probe for explaining one embodiment of the present invention. FIG. 4 is a diagram of an integrated flexible substrate illustrating another embodiment of the present invention. FIG. 5 is a schematic plan view of a 1.5D probe explaining a conventional example. FIG. 6 is a side sectional view of a 1.5D probe explaining a conventional example. FIG. 7 is an exploded perspective view illustrating a conventional example in a manufacturing process of a 1.5D probe. [Description of Signs] 1 piezoelectric element, 2 backing material, 3 acoustic matching layer,
4, 7, 13 flexible substrate, 5 electrodes, 6 piezoelectric plate, 8 flexible integrated piezoelectric plate, 9 signal line, 10 common line portion, 11 through hole, 12 integrated flexible substrate,
14 slits, 15 joints, 16 cuts

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) A61B 8/00 H04R 17/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) A61B 8/00 H04R 17/00

Claims (1)

(57)【特許請求の範囲】 【請求項1】両主面に電極の形成された圧電板に多数の
信号線路を有するフレキシブル基板を接続し、前記信号
線路間及び前記フレキシブル基板間を前記圧電板上から
切断して前記圧電板を多数の圧電エレメントに分割し、
前記圧電エレメントを二次元上に並べてなる超音波探触
の製造方法において、 電極露出部を一端に有する多数の信号線路が形成された
独立した3個以上の複数のフレキシブル基板と、前記複
数のフレキシブル基板の両端側を接続する連結部と、前
記複数のフレキシブル基板間に存するスリットとからな
り、前記複数のフレキシブル基板の多数の信号線路を直
線上に一致させてなる一体型フレキシブル基板を具備
し、 前記圧電板の一方の主面に前記一体型フレキシブル基板
の電極露出部を接続した後、前記フレキシブル基板の信
号線路間及び前記フレキシブル基板間を分割してなる超
音波探触子の製造方法
(57) Claims: 1. A flexible board having a large number of signal lines is connected to a piezoelectric plate having electrodes formed on both main surfaces, and the piezoelectric board is connected between the signal lines and between the flexible boards. Cutting from the plate and dividing the piezoelectric plate into a number of piezoelectric elements,
In the method of manufacturing an ultrasonic probe in which the piezoelectric elements are arranged two-dimensionally, three or more independent flexible substrates formed with a large number of signal lines having an electrode exposed portion at one end; An integrated flexible substrate comprising a connecting portion for connecting both ends of the flexible substrate and a slit existing between the plurality of flexible substrates, wherein a number of signal lines of the plurality of flexible substrates are aligned in a straight line. the after connecting the electrode exposed portion of the integrated flexible substrate on one principal surface of the piezoelectric plate, the manufacturing method of an ultrasonic probe formed by dividing the inter and between the flexible substrate signal lines of the flexible substrate .
JP22109098A 1998-07-21 1998-07-21 Ultrasonic probe manufacturing method Expired - Fee Related JP3469095B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22109098A JP3469095B2 (en) 1998-07-21 1998-07-21 Ultrasonic probe manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22109098A JP3469095B2 (en) 1998-07-21 1998-07-21 Ultrasonic probe manufacturing method

Publications (2)

Publication Number Publication Date
JP2000037385A JP2000037385A (en) 2000-02-08
JP3469095B2 true JP3469095B2 (en) 2003-11-25

Family

ID=16761343

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Also Published As

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