JPH07221169A - Substrate containing cassette - Google Patents

Abstract

PURPOSE:To obtain the title substrate containing cassette capable of cutting down the part numbers comprising said cassette and the manufacturing cost thereof. CONSTITUTION:Trenches 2 for containing wafers 3 at a specific intervals are formed in the sidewall of the cassette main body 1 while a data card containing trench 7 is formed inside the side-wall of the cassette main body 1 in parallel with the trenches 2 containing the wafers 3 so that both ends of data card 6 may be inserted into the data card containing trench 7 to be held in the cassette main body 1. Accordingly, any holding jig to hold the data card 6 can be eliminated thereby enabling the part numbers comprising the title substrate containing cassette to be cut down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cassette for accommodating substrates such as wafers used for manufacturing semiconductor devices.

[0002]

2. Description of the Related Art A conventional substrate storing cassette is disclosed in, for example, Japanese Patent Publication No. 5-63017. FIG. 5 is a perspective view of a conventional substrate storing cassette, and FIG. 6 is VI-V of FIG.
It is sectional drawing in the I line. In the figure, 1 is a cassette body made of a resin material such as polypropylene, 2 is a groove formed on the inner surface of the cassette body 1 at regular intervals, and 3 is a wafer which is a substrate on which a semiconductor device or the like is manufactured. The edge portion 3 is inserted into the groove 2 and stored in the cassette body 1. 4 is a holder formed along the vertical direction on the outer surface of the cassette body 1 and having a groove 5 inside thereof, 6
Is an information card such as an IC card (integrated circuit card) or a magnetic card in which information for tracking the manufacturing process (sequence) and quality history corresponding to the lot of the wafer 3 is recorded. It engages with the groove 5 and is inserted and held in the holder 4.

The conventional substrate storage cassette is constructed as described above, and in the semiconductor device manufacturing line, the wafer 3 and the information card 6 are stored and held in the cassette body 1 and transported. Then, the wafer 3 is set in the processing or processing apparatus while being stored in the substrate storage cassette, sequentially taken out from the substrate storage cassette, processed or processed, and then returned to the cassette again. On the other hand, the information card 6 represents the content of the manufacturing process of the wafer 3, and is handled in correspondence with the wafer 3. Therefore, when the processing of the wafer 3 is completed, the data in the information card 6 is updated while the information card 6 is stored and held in the substrate storage cassette.

When the cassette for storing the substrate is to be replaced with another cassette for storing the substrate, the information card 6 is once taken out and stored in another place. Then, the wafer 3 is taken out from the substrate storage cassette, and after sequentially processed or processed, it is sequentially transferred to another cassette. After all the wafers 3 are stored in the new cassette, the information card 6 is inserted into the holder 4 of the new cassette for storing the substrate, and the data is updated.

The above-mentioned conventional substrate storing cassette is manufactured as follows. First, the cassette body 1
Further, individual molds for the holder 4 are formed, and melted polypropylene is poured into the mold to be solidified to form the cassette 1 and the holder 4, and then the holder 4 is adhered to the cassette body 1 to store the substrate. For cassette is completed.

[0006]

However, in the conventional cassette for storing substrates, the cassette 1 and the holder 4 are provided.
Since the and are manufactured individually, the number of parts is increased, which causes a problem of high cost.

The present invention has been made to solve the above problems, and an object of the present invention is to obtain a substrate storing cassette which can be manufactured at low cost by reducing the number of parts.

[0008]

In the cassette for storing a substrate of the present invention, an information card on which a substrate manufacturing process is recorded is formed inside a side wall of the cassette in a cassette body in which the substrate is stored. It is characterized in that it is detachably held by being sandwiched by the groove.

In the substrate storage cassette of the second invention, in the substrate storage cassette of the first invention, the information card is formed by inclining the end surface of the information card and the groove forming surface by a predetermined angle. It is characterized in that it is held in a state of being in line contact with the groove forming surface.

[0010]

In the substrate storing cassette of the first invention,
A groove is formed directly inside the side wall of the cassette body, and the information card is held in the cassette body by inserting the edge of the information card into the groove.

Further, in the substrate storing cassette of the second invention, the information card is held in line contact with the groove forming surface by inclining the end surface of the information card and the groove forming surface with each other by a predetermined angle. As a result, the contact area between the information card and the cassette body can be kept small, and the generation of dust and the like due to friction can be suppressed.

[0012]

【Example】

Example 1. A substrate storage cassette according to an embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view of a substrate storing cassette according to an embodiment of the present invention.
Is a cross-sectional view taken along the line II-II in FIG. 1, and FIG. 3 is a front view of the substrate storing cassette.

In the figure, 1 to 5 and 6 are the same as those explained in the conventional substrate storing cassette. In this embodiment, an information card 6 using an IC card will be explained. . Further, 6a is an information display unit provided on the front surface of the information card 6. Reference numeral 7 denotes an information card storage groove formed inside the side wall of the cassette body 1 and provided in parallel with the groove 2 in which the wafer 3 is stored. By inserting both ends of the information card 6 into the information card storage groove 7, An information card 6 is stored in the cassette body 1. Also,
The dotted line in FIGS. 1 and 3 shows the shape of the information card storage groove 7, and is narrow at the bottom of the cassette body 1 so that the information card 6 does not fall out of the cassette body 1.

The substrate storing cassette thus configured is used in the manufacturing process of the wafer process like the conventional one, and when one process of the manufacturing process is completed, the inside of the information card storing groove 7 of the cassette body 1 is completed. While the information card 6 is stored in the computer, the information on the information display section 6a of the information card 6 is updated by optical communication from the computer through the controller.

Further, even when the cassette is replaced with another substrate storage cassette, the information card 6 is moved together with the wafer 3 to a new substrate storage cassette and the information on the information card 6 is updated as in the conventional case.

The substrate storing cassette constructed as described above is manufactured as follows. Wafer 3
The melted resin material such as polypropylene is poured into the mold of the cassette body 1 in which the reverse shape of the groove 2 for storing the information and the information card storage groove 7 is formed and solidified. After that, the mold is removed, and the substrate storage cassette is completed.

In the substrate storing cassette of the present invention, by forming the information card storing groove 7 inside the side wall of the cassette body 1, the side plate portion in the conventional substrate storing cassette is utilized. , Cassette body 1
Since the information card 6 can be stored and held therein, the cassette body 1 can be downsized as compared with the conventional structure in which the holder 4 is formed outside the cassette body 1.

Further, in the substrate storing cassette of the present invention, the information card storing groove 7 is formed directly inside the side wall of the cassette body 1, and the holder 4 is not required unlike the conventional substrate storing cassette. Since the number of parts constituting the substrate storing cassette is reduced, the manufacturing is facilitated and the manufacturing cost can be suppressed.

The mold for manufacturing the substrate storing cassette according to the present invention can be used by processing the portion which becomes the information card storing groove 7 in the mold of the conventional substrate storing cassette.

Further, in the conventional substrate storing cassette, since the holder 4 for storing the information card 6 is attached to the outside, it is necessary to thin the edge portion of the information card 6 in order to reduce the protrusion thereof. However, in the substrate storing cassette of the present invention, since the information card 6 is stored inside the cassette body 1, there is no need for it, and the information card 6 can be made into a simple shape. Therefore, the information card 6 can be manufactured at low cost. You can

Example 2. FIG. 4 is a partial cross-sectional view of a substrate storage cassette according to another embodiment of the present invention. The difference between this embodiment and the first embodiment is the shape of the information card storage groove 7, and the information card 6 When the card is inserted into the information card storage groove 7, the formation surface of the information card storage groove 7 and the information card 6
Is a point having a triangular groove shape so as to make line contact.

In the substrate storing cassette thus constructed, the same effects as those described in the first embodiment can be obtained, and the information card 6 and the cassette body 1 are held in line contact with each other. Since the contact surface between the information card 6 and the cassette body 1 can be made extremely small, it is possible to suppress generation of fine particle dust due to friction caused by inserting and removing the information card.

In the above embodiment, the wafer 3 for manufacturing the semiconductor device is described.
Needless to say, the present invention can be applied not only to the wafer 3 but also to a cassette that accommodates substrates such as magnetic disks and optical disks.

[0024]

In the substrate accommodating cassette of the present invention, since the groove is formed directly inside the side wall of the cassette body so that the information card can be held, there is no need to separately form a holder unlike the conventional one. Since the number of parts is reduced, the substrate storing cassette can be manufactured at low cost.

Further, in the substrate storing cassette of the second invention, since the information card is held in line contact with the surface on which the groove to be inserted is formed, the contact area between the information card and the groove to be inserted is held. Has the effect of reducing the amount of dust generated when the information card is inserted and removed.

[Brief description of drawings]

FIG. 1 is a perspective view of a substrate storage cassette that is an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a front view of a substrate storage cassette that is an embodiment of the present invention.

FIG. 4 is a sectional view of a substrate storage cassette that is another embodiment of the present invention.

FIG. 5 is a perspective view of a conventional substrate storage cassette.

6 is a sectional view taken along line VI-VI of FIG.

[Explanation of symbols]

 1 cassette body 3 wafer 6 information card 7 information card storage groove

Claims (2)

[Claims] 1. A substrate housing cassette in which an information card on which a manufacturing process of the substrate is recorded is detachably held in a cassette body in which a substrate is housed, and an edge portion of the information card is the cassette body. A substrate storage cassette, which is held by being sandwiched by a groove formed inside the side wall of the substrate. 2. The information card is held in line contact with the groove forming surface by inclining the end surface of the information card and the groove forming surface with each other at a predetermined angle. The substrate storage cassette according to claim 1.