JPH0721591A - Method for cutting optical recording medium - Google Patents

Abstract

PURPOSE:To reduce the strain of a substrate generated in cutting, to precisely cut the medium even when a highly elastic resin is used for the substrate and to minimize the generation of burrs by applying a reinforcing material on the part of the medium to be cut and then cutting the medium. CONSTITUTION:A material transmissible to recording and reproducing lights, e.g. a polycarbonate plastic, is used for a transparent substrate 21, a rugged pattern having track grooves 22 is formed to furnish a rugged pattern, and then the optical recording layer 23 is formed with a metallic material of a cyanine, etc. The substrate 21 coated with the optical recording layer 23 is joined to a protective substrate 25 through an appropriate spacer 24. A material, which is not deformed, e.g. warped or waved, even if integrated with the substrate 21 and used, is used for the protective substrate 25. An adhesive not causing both joined substrates 21 and 25 to melt with the heat in cutting to shift from each other and consequently to bring about nonuniform thickness and not generating a gas, etc., in cutting is preferably used as the adhesive to join the spacer 24 to the transparent substrate 21 and protective substrate 25.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical recording medium, and more particularly to a method for cutting an optical recording medium for optically recording and reproducing information from a medium member.

[0002]

2. Description of the Related Art Conventionally, magnetic materials such as magnetic tapes and magnetic disks, and various semiconductor memories have been mainly used for recording various information. Magnetic memory like this,
The semiconductor memory has an advantage that information can be written and read easily, but on the other hand, there are problems that the contents of information are easily tampered with and high-density recording cannot be performed.

In order to solve such a problem, an optical information recording method using an optical recording medium has been proposed as a means for efficiently handling a wide variety of information, and an optical information recording carrier, a recording / reproducing method therefor, has been proposed. A recording / reproducing device has been proposed.

Such an optical recording medium as an information recording carrier generally uses laser light to volatilize a part of the optical recording layer on the information recording carrier, cause a change in reflectance, or deform. Then, the information is recorded or reproduced by the difference between the optical reflectance and the transmittance.

In this case, after writing information on the optical recording layer,
So-called DRAW (Direct Read After Wright), which does not require development processing and can be read directly after writing
Since it is a medium, high-density recording is possible, and additional writing is possible, it is extremely effective as an information recording / storing medium.

FIG. 3 is a schematic sectional view of a general optical recording medium. In the figure, 21 is a transparent substrate, 22 is a track groove portion, 23 is an optical recording layer, 24 is a spacer / adhesive layer, and 25 is a protective substrate. In FIG. 3, recording / reproducing of information is performed by optically writing and reading through the transparent substrate 21 and the track groove portion 22. At that time, tracking can be performed by utilizing the phase difference of the laser light by utilizing the fine unevenness of the track groove portion.

In order to perform recording / reproducing with high density, the above-mentioned optical card is formed with a predetermined pattern at the time of molding the substrate, and the position for recording / reproducing is adjusted. In the conventional optical card manufacturing method, the injection method,
It was a general method to mold the substrate in a single sheet by a method such as a compression method. On the other hand, if the substrate is molded by a method of forming a large number of large-sized patterns, there is an advantage that the process of molding the substrate, which requires a long time, can be simplified.

However, when a substrate is formed by this large-format multifaceted system, there is a problem that a step of cutting the outer shape of each pattern is required and the outside of each preformat pattern is distorted. It has come to require cutting so that it is not left behind.

Conventionally used cutting methods include a punching method and a cutter method, but distortion is easily left in the pattern. Further, with a resin having a large elasticity such as polycarbonate (hereinafter referred to as PC), the resin is repelled and it is difficult to accurately cut. Also, burrs are likely to occur during cutting,
Since it is difficult to normally perform recording and reproduction on a medium having burrs, it is necessary to remove burrs with sandpaper or the like.

[0010]

SUMMARY OF THE INVENTION It is an object of the present invention to prevent distortion outside the preformat pattern when the optical recording medium is cut. That is, when cutting the medium, by applying a reinforcing substance to the cut portion and then cutting and peeling the reinforcing substance as necessary, the distortion of the substrate generated at the time of cutting is small, and a resin with a large elasticity of the substrate is used. Even when used, it can be cut accurately,
It is an object of the present invention to provide a substrate cutting method capable of suppressing burr generation as much as possible.

[0011]

The above object can be achieved by the present invention as described below. That is, in a method of cutting an optical recording medium from a medium member, there is provided a method of cutting an optical recording medium, which comprises cutting after reinforcing the end portion of the medium in advance, and a method of cutting from the medium member.
A method of cutting an optical recording medium, which is a push-cut method, and a method of reinforcing the edge portion of the medium is a method of cutting an optical recording medium, which is a method of applying an adhesive.

The present invention will be described in detail below. 1 and 2 are schematic views showing one embodiment of a cutting step of the optical recording medium of the present invention. As shown in FIG. 1, the method of cutting an optical recording medium of the present invention comprises forming a pre-format pattern, forming a recording layer, and forming a transparent substrate 1 bonded to a protective substrate through a spacer, Cut with a cutter.

As the reinforcing substance which can be used in the present invention, an adhesive can be mentioned. Specific examples include, but are not limited to, the following. (1) Thermosetting resin type: Epoxy resin type; Aika Seamless EF (Aika Kogyo).

Phenolic resin type; cash register top PL-2312, PL
-2640 (Gorei Chemical Industry Co., Ltd.), Cemedine SGA (Cemedine Company). (2) Thermoplastic resin: Polyvinyl acetate type; Esdyne 5100 (Sekisui Chemical Co., Ltd.),
Iodozor V-1010 (Kanebo NSC).

Polyamide type; Clan Better A-1100 (Kurashiki Spinning Co., Ltd.). (3) Rubber type: Silicon rubber type; TSE-322RTV, 382RTV, 370RTV (Toshiba Silicone), polyurethane rubber type: DB1910 (Diabond Industry), Evergrip 8300 (Sale Chilney). (4) Composite type: rubber / phenolic type, epoxy / nylon type.

It is possible to select any of the various adhesives described above, but it is important to select it depending on the compatibility with the substrate, the hardness of the adhesive, the ease of processing after cutting the substrate, and the like.

Examples of the method for applying the adhesive include a spray, a roll coater, a micro dispenser, a two-liquid metering and mixing application device, a hot melt applicator, and a screen printing device, but are not limited thereto. Absent.

As shown in FIG. 3, the transparent substrate 21 used for the substrates 1 bonded together in the present invention can be made of any material as long as it is transparent to recording / reproducing light. Polycarbonate (PC), polystyrene (PSt), polymethylmethacrylate (PM
Plastics such as MA), polyethylene terephthalate (PET), nylon, polyvinyl chloride (PVC), and polymethylpentene (PMP) can be used.

In the method of manufacturing the optical recording medium of the present invention,
The transparent substrate 21 can be used not only in the single-wafer processing as shown in FIG. 2, but also in the large plate multi-sided individual picking method or the continuous sheet type process in the same manner as the single-wafer processing. The thickness of the transparent substrate 21 can be freely selected according to need, but is preferably 1.2.
It is 0 ± 0.05 mm. Track grooves 22 are formed on the transparent substrate 21. Any method such as an injection method, a compression method, an injection compression method, an ultraviolet curable resin method (2P), a calendar roll molding method or the like can be used as long as the track groove portion 22 can be made uneven.

After the concavo-convex pattern is formed, the optical recording layer 23 is formed. As the material to be used, if it is a material generally used for optical recording such as cyanine-based, naphthoquinone-based, polymethine-based organic materials, phthalocyanine-based organic metal-based materials, tellurium, bismuth-based metal-based materials, etc. Any material can be used. Recording layer 2
As the manufacturing method of 3, any method can be used as long as it is a commonly used film forming method.
A dry method such as vacuum deposition or a wet method such as spin coating or a roll coater can be used.

The transparent substrate 21 on which the recording layer 23 is formed is
It is bonded to the protective substrate 25 via a suitable spacer 24. As the protective substrate 25, any material can be used as long as it does not cause deformation such as warping or waviness even when it is used integrally with the transparent substrate 21, but, for example, it can be freely selected from plastic, paper and the like. can do. The protective substrate 25 may be made of the same material as the transparent substrate 21 or a different material. Similar to the transparent substrate 21, the protective substrate 25 may be used in the form of a sheet, a large plate multi-sided sheet, or a continuous sheet. The thickness of the protective substrate 25 can be freely selected depending on the structure of the optical recording medium. A preferable thickness is the same as the transparent substrate 21 or thinner than the transparent substrate 21.

The spacer 24 used in the present invention can be freely selected in any form and material as long as it can be bonded to the transparent substrate 21 and the protective substrate 25. For example, it is possible to use a plastic rod-like form, an adhesive agent mixed with plastic beads, and use it instead of the spacer.

Any adhesive such as a thermoplastic adhesive, a thermosetting adhesive, a reactive adhesive or a pressure sensitive adhesive may be used as an adhesive for joining the spacer 24 to the transparent substrate 21 and the protective substrate 25. You can A preferable adhesive is an adhesive that does not generate gas or the like at the time of cutting by melting the bonded substrates by heating at the time of cutting to cause positional deviation or uneven thickness.

Examples of the cutting method which can be used in the present invention include a guillotine cutter, a press cutter, a cutter and a laser beam. In this case 0.5
It is necessary to secure a cutting margin of 1.0 mm.

[0025]

EXAMPLES The present invention will now be described in more detail with reference to examples, but the present invention is not limited thereto.

Example 1 As shown in FIGS. 1, 2, and 4, a PC sheet having a thickness of 0.4 mm has a pitch of 12 μm, a groove width of 3 μm, and a groove depth of 0.3 μm.
20 stripe-shaped guide grooves (5 × 4) were heat-transferred using a stamper type (compression method) to obtain a transparent substrate 21. The following structural formula (I) is formed on this substrate.

[0027]

[Chemical 1] And a polymethine dye represented by the following structural formula (II)

[0028]

[Chemical 2] The stabilizer represented by (3) was mixed at a ratio of 3: 1, dissolved in a solvent of diacetone alcohol, and coated with a gravure roll coater to a thickness of about 0.1 μm. Next, an ultraviolet curable silicone rubber (trade name: TUV6000: made by Toshiba Silicone) is applied only in the recording area of the recording layer to a thickness of about 10 μm, and then is irradiated with ultraviolet rays to be cured, and the temperature diffusion coefficient is 4.3 × 10.
The recording auxiliary layer 11 having a hardness of ^-4 cm ² / S and a hardness of 25 was formed.

On the other hand, ethylene-vinyl acetate hot melt adhesive (trade name: EVAFLEX-EV210: manufactured by Mitsui DuPont)
Alumina beads with a particle size of 20 μm (trade name: CB-A20S: Showa Titanium) mixed in a weight ratio of 1: 1 are formed into a sheet with a thickness of 50 μm and function as a recording suppression layer and an adhesive layer. Created a sheet. Then, the transparent substrate 21 and the protective substrate (PC
A plate and a thickness of 0.3 mm) were thermocompression bonded to prepare an optical recording member in which the hot melt adhesive sheet covered the recording layer outside the recording area.

Further, a polyurethane adhesive Unipon 5000 (manufactured by Sanyo Kasei Co., Ltd.) was applied to the end portions of the bonded substrates. Further, the outer shape was cut with a guillotine cutter. The cutting speed is 1m / for both non-intersection and intersection
In minutes, it was cut so as to intersect at the outer periphery of the cutting line. Further, the adhesive remaining on the edge of the card was washed with water.

As a result of measuring the completed optical card, the deviation of the guard outer shape with respect to the die shape showed a good value of 0.1 mm at the maximum, and no burr was generated on the outer peripheral portion of the substrate. Also, the dynamic balance is good,
There was no adverse effect on regeneration.

Comparative Example 1 An optical recording medium was prepared by using the same material and method as in Example 1,
Using the same guillotine cutter as in Example 1, the outer shape was cut. The cutting speed was the same as in Example 1, and the cutting line speed was 1 m / min at both the non-intersection portion and the intersection portion, and the cutting was performed so as to intersect at the outer peripheral portion of the cutting line. As a result of measuring the completed optical card, the outer shape of the guard had a recess of 0.1 mm with respect to the mold shape. Occurrence of burrs was recognized at the intersection, and the surface accuracy of the outer peripheral portion was unevenness of ± 40 μm. Also, the dynamic balance was poor, and recording / reproduction was difficult.

[0033]

According to the present invention, when the optical recording medium is cut, the cut portion of the medium is coated with the reinforcing substance in advance and then cut, and the reinforcing substance is peeled off if necessary. Can be cut accurately even when a resin with large elasticity is used for the substrate,
Further, there is provided a substrate cutting method capable of suppressing the occurrence of burrs as much as possible. Therefore, a wide variety of information can be handled efficiently, which is a very effective method for securing a recording / storing medium for information.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing chamfering of a master cut in the method of the present invention.

FIG. 2 is a schematic plan view of single-wafer cutting of a master that is cut in the method of the present invention.

FIG. 3 is a general cross-sectional view of a general optical recording medium.

FIG. 4 is a schematic view showing an optical card according to an embodiment. (A) is a sectional view in a direction parallel to the track groove portion of the optical card.
(B) shows a plan view of the optical card. (C) shows a cross-sectional view in a direction crossing the track groove of the optical card.

[Explanation of symbols]

 1 Laminated substrates 2 Patterns on a substrate 3 Cutting lines 5 Crossing points of cutting lines 7,8 Starting and ending points of cutting 9 Recording layer 10 Adhesive layer 11 Recording auxiliary layer 12 Recording suppression layer 13 Optical card 14 Tracking track 15 Information recording Track 21 Transparent substrate 22 Track groove 23 Optical recording medium 24 Spacer 25 Protective substrate

Claims (3)

[Claims] 1. A method for cutting an optical recording medium, which comprises cutting an optical recording medium after reinforcing an end portion of the medium in advance and then cutting the optical recording medium. 2. The method of cutting an optical recording medium according to claim 1, wherein the method of cutting from the medium member is a push-cut method. 3. The method of cutting an optical recording medium according to claim 1, wherein the method of reinforcing the edge portion of the medium is by applying an adhesive.