JPH07202106A - Semiconductor device and its manufacturing device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device which can increase as much as possible the size of a semiconductor chip in a package of preset outer dimensions. CONSTITUTION:There is a height difference between a first parting surface 19 of a lead terminal 4 of a package for a semiconductor chip and a second parting surface 18 of a die pad lifting lead 7 supporting the die pad. A parting line 20 connecting the first parting surface 19 to the second parting surface 18 is provided where a lead terminal does not protrude on the side of the package other than corner ridge lines.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a structure of a package for housing a chip and a semiconductor manufacturing apparatus used for manufacturing the package.

[0002]

13 is a partially broken perspective view showing an example of a conventional semiconductor device, and FIG. 14 is a sectional view taken along the line AA of FIG. As shown in FIG. 13, in the conventional semiconductor device 1A,
A semiconductor chip 2 is mounted on a rectangular die pad 3 having die pad suspension leads 7 connected to two opposite sides, and a plurality of electrodes 9 (see FIG. 15) formed on the upper surface of the semiconductor chip 2 and a rectangle The inner leads 4a, which are the inner portions of the plurality of lead terminals 4 arranged on the opposite side surfaces of the die pad 3, are separately connected by connection wires 5 made of gold wire or the like, and the die pad 3 having the semiconductor chip 2 mounted thereon is formed. It is formed by placing it in a mold (not shown) and then pouring a molten insulating resin into the mold to seal the semiconductor chip 2 and the inner leads 4a with resin.

By the way, as shown in FIG. 15, when the inner leads 4a and the die pad 3 are arranged on the same plane, the connection wires 5 connecting the electrodes 9 of the semiconductor chip 2 and the inner leads 4a are connected to each other. Since it is easy to make contact with the upper edge of the above and short-circuit (see B part in FIG. 15),
As shown by a broken line in FIG. 15, a height difference is provided between the inner lead 4a and the die pad 3 to widen the space between the connection wire 5 and the upper edge portion of the semiconductor chip 2 and the connection wire 5 and the semiconductor chip 2. I try to prevent short circuit with. That is, the suspension leads 7 that support the die pad 3
Is bent near the die pad 3 to form a submerged portion 7a, and the die pad 3 is submerged below the inner lead 4a and arranged below.

Incidentally, such a bent submerged portion 7a is usually formed by press working or the like.
Since the submerged portion 7a of the inner lead 4a made of a metal foil is locally mechanically stretched, its mechanical strength is reduced. Therefore, when the die pad 3 on which the semiconductor chip 2 is mounted is arranged in the mold and the die pad 3 is supported by the pair of suspension leads 7 extending from both sides thereof, the mold is filled with the sealing resin. At this time, the die pad 3 is likely to move up and down, rotate about the pair of suspension leads 7 or be twisted due to uneven pressure applied by the sealing resin.

[0005]

Recently, semiconductor devices, especially semiconductor devices for memories, have become smaller and more highly integrated, and it has become necessary for the package 8 to accommodate a larger chip. The external dimensions of the package 8 are standardized and predetermined to a predetermined dimension.

In the conventional semiconductor device 1A, the submerged portion 7a of the suspension lead 7 is provided inside the package 8, and the submerged portion 7a of the suspension lead 7 alone is about 0.7 mm on one side.
Since the above area is required, the thickness of the resin of the package 8 (the distance between the side surface of the semiconductor chip 2 and the outer surface of the package 8) of which the outer dimensions are standardized and determined in advance is reduced to reduce the chip size. Even if an attempt is made to increase the size, there is a problem in that the chip size cannot be expanded as desired due to the restriction of the submerged portion 7a of the suspension lead 7.

Further, when the die pad suspension leads 7 are not submerged, a short circuit is liable to occur between the connection wire 5 and the semiconductor chip 2 as described above, and the suspension leads 7 form one side of the die pad 3. In the case where a plurality of the lead wires are exposed, the inner lead 4a cannot be arranged in the portion sandwiched by the suspension leads 7, and wire bonding to that portion cannot be performed.

FIGS. 16 and 17 show the above problems when a plurality of suspension leads 7 are projected from one side of the die pad 3. That is, FIG. 16 shows a conventional semiconductor device 1A.
FIG. 1 is a plan view of a lead frame used in manufacturing the
7 is a diagram in the middle of the process of assembling the lead frame shown in FIG. 16, and is a plan view showing a state in which the semiconductor chip 2 is bonded onto the die pad 3 by soldering or the like and then wire bonding is performed with the connection wire 5. . As is clear from these figures, since the inner lead 4a cannot enter the area surrounded by the two suspension leads 7, the length of the connecting wire 5 connecting the electrode 9 on the semiconductor chip 2 and the inner lead 4a Since c becomes longer than other connecting wires and exceeds the standard value of the connecting wire length, it becomes impossible to assemble.

The plurality of suspension leads 7 of the die pad 3 are pulled out from one side of the die pad 3 in order to suppress displacement of the die pad 3 during resin sealing. By the way,
When one suspension lead 7 is provided on each of the two opposite sides of the die pad 3, particularly when the sealing resin is injected into the mold in the resin sealing step, uneven pressure due to the injection resin is applied. Is added to the die pad 3, the die pad 3 supported by the two suspension leads 7 moves up and down, and it is easy to rotate around the suspension leads 7, and the quality and reliability of the semiconductor device 1A as a product are improved. May decrease.

Therefore, the present invention has been made in order to solve the above-mentioned problems of the conventional example, and a semiconductor device and a semiconductor device capable of increasing the size of a semiconductor chip incorporated in a package having a predetermined external dimension as much as possible. It is intended to provide a manufacturing method thereof.

[0011]

According to another aspect of the present invention, there is provided a semiconductor device comprising: a first parting surface of a lead terminal of a package containing a chip; and a second parting surface of a die pad suspension lead supporting a die pad. In a semiconductor device having a height difference between them, a parting line connecting the first parting surface and the second parting surface does not have a lead terminal on a side surface of the package other than a corner ridge of the package. It was provided in the part.

In a semiconductor device according to a second aspect of the present invention, a part of the package where the lead terminals are not exposed has a parting surface of a first lead frame having the lead terminals and a second lead frame having the die pad. Traces of the abutting portions of the first and second molds are formed so as to connect with the parting surface of.

In a semiconductor device according to a third aspect of the present invention, traces of the abutting portions of the first and second molds connecting the parting surface of the first lead frame and the parting surface of the second lead frame, The lead terminals are arranged within 0.3 mm from the side surface of the extending package.

In a semiconductor device according to a fourth aspect of the present invention, the parting surface of the second lead frame having the die pad is provided on the chip mounting surface of the second lead frame.

In the semiconductor device according to the fifth aspect of the present invention, the parting surface of the first lead frame having the lead terminals is provided on the chip side surface of the first lead frame.

A semiconductor device according to a sixth aspect of the present invention is a semiconductor manufacturing device for resin-sealing a chip of a semiconductor device having a height difference between a lead terminal and a die pad suspension lead, wherein the chip is housed. First mold to do and its first
A second mold which is attached to the mold and forms a hollow portion for filling with resin, and a first mating surface corresponding to the lead terminals of the semiconductor device of the first and second molds; There is a step with a second mating surface corresponding to the die pad suspension lead of the semiconductor device, and the lead terminal is arranged at a butting portion of the first and second molds connecting the first and second mating surfaces. It was set up in a non-position.

[0017]

In the semiconductor device according to the invention of claim 1, a larger semiconductor chip can be accommodated in a package of the same size, and the thickness of the sealing resin between the semiconductor chip and the outer surface of the package is increased. be able to.

According to another aspect of the semiconductor device of the present invention,
By providing a taper on the outer surface of the package to make it easier to remove the intermediate product of the semiconductor device after resin sealing from the upper mold and the lower mold, the work of extracting the intermediate product from the mold is simplified. Work efficiency can be improved.

According to another aspect of the semiconductor device of the present invention,
It is possible to insert the die pad into the package (resin) area formed by the part where the upper die partially enters the lower die, and the die pad and the length of the chip are increased accordingly. be able to.

According to another aspect of the semiconductor device of the present invention,
As compared with the case where the parting surface of the second lead frame is provided on the side opposite to the chip mounting surface of the second lead frame, the horizontal distance of the sealing resin from the chip or die pad to the package surface becomes large, The reliability is also improved accordingly.

According to the semiconductor device of the invention of claim 5,
Compared with the case where the parting surface of the first lead frame is provided so as to match the surface of the first lead frame opposite to the chip side, the level of the sealing resin from the chip or die pad to the package surface is horizontal. The distance is increased and the reliability is improved accordingly.

In the semiconductor manufacturing apparatus according to the invention of claim 6, a larger semiconductor chip can be accommodated in a package of the same size, and the thickness of the sealing resin between the semiconductor chip and the outer surface of the package is increased. It is possible to manufacture a semiconductor device having excellent package reliability. Further, when the first die and the second die are combined and clamped, the first mating surface and the second mating surface are separated from each other. By abutting the first mold and the second mold in the step portion to be connected, the positioning of both can be performed very easily,
The mold clamping work can be simplified and productivity can be improved.

[0023]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In the following description, the same or corresponding members in the drawings are designated by the same reference numerals.

Example 1. FIG. 1 is a sectional view of an intermediate product of a semiconductor device in a manufacturing process of the semiconductor device according to the first embodiment of the present invention, and FIG. 2 is a sectional view of the semiconductor device according to the first embodiment after the manufacture is completed.

In FIG. 1, a semiconductor chip 2 mounted on a substantially rectangular die pad 3 is resin-sealed in a resin package 8 of a semiconductor device 1 according to this embodiment, and two die pads 3 are opposed to each other. A plurality of suspension leads 7 respectively extend from the sides, and in the portions of these suspension leads 7 protruding from the outer surface of the package 8 to the outside thereof, a submerged portion 7a for sinking the die pad 3 formed by bending by pressing or the like is formed. Are arranged. By cutting the suspension leads 7 of the package 8 thus formed along the outer surface of the package 8, the semiconductor device 1 as shown in FIG. 2 is finally completed.

FIG. 3 shows a die pad 3 having a semiconductor chip 2 mounted on a die for manufacturing the semiconductor device 1 shown in FIG.
4 is a partial plan view showing a state in which a first lead frame 10 having an inner lead 4a and a second lead frame 11 having a plurality of inner leads 4a are installed, FIG. 4 is a sectional view taken along line CC of FIG. 3, and FIG. 3 is a sectional view taken along line DD of FIG.

As is apparent from FIGS. 4 and 5, the lower mold 16 as the first mold is the first cavity for resin encapsulation that defines the outer shape of substantially the upper half of the semiconductor device 1 to be manufactured. 16a and a plurality of first cavity 16a provided at both ends in the longitudinal direction (only one end is shown in the drawing) and formed corresponding to the shape of the suspension lead 7 including the submerged portion 7a of the first lead frame 10. It has a positioning recess 16c provided with the hanging lead housing groove 16b, and an outer frame housing recess 16d formed at the tip of the positioning recess 16c and corresponding to the outer frame portion 10a of the first lead frame 10.

The upper die 17 as the second die defines the outer shape of the lower half of the semiconductor device 1 to be manufactured at a position corresponding to the first cavity 16a of the lower die 16. A second cavity 17a that forms a resin-sealing hollow portion in cooperation with one cavity 16a, and both longitudinal ends of the second cavity 17a (only one end is shown in the drawing).
In the first lead frame 10, the suspension lead 7 is formed in a shape corresponding to the shape of the suspension lead 7 and is fitted into the corresponding positioning recess 16 a of the lower die 16 to form the suspension lead 7.
Positioning projection 1 that presses the hanging lead into the lead receiving groove 16b
7b, and an outer frame housing recess 17c formed at the tip of the positioning protrusion 17b and corresponding to the outer frame portion 11a of the second lead frame 11. A plurality of lead terminal accommodating grooves 17 d for accommodating the plurality of lead terminals 4 of the second lead frame 11 are formed on the lower surface of the upper mold 17.

In FIGS. 4 and 5, reference numeral 18 designates the first and second lead frames 10 and 11 as an upper mold 17 and a lower mold 1.
6 is a mating surface of the positioning convex portion 17b and the positioning concave portion 16c, which is a die pad parting surface as a second parting surface on the same plane as the upper surface of the die pad 3, and 19 is the first and second leads. Frame, 1
Inner lead parting surface as a first parting surface on the same plane as the lower surface of the inner lead 4a when 0 and 11 are sandwiched by the upper mold 17 and the lower mold 16, and 20 is the die pad parting surface 18 A parting line connecting the inner lead parting surface 19 with the upper die 17
And the lower die 16 are engaged with each other.

Next, with reference to FIGS. 3 to 5, a method of manufacturing the semiconductor device 1 according to this embodiment will be described. First, although not shown, a rectangular die pad 3 on which the semiconductor chip 2 is mounted and extending from opposite short sides of the rectangular die pad 3 and bent in the middle to have a stepped portion 7 with a step.
The inner lead 4 is provided on the first lead frame 10 including a plurality of (two pairs in the illustrated example) suspension leads 7 having a.
a and a plurality of lead terminals 4 having outer leads 4b
The second lead frame 11 provided with is superposed at a predetermined position. That is, the outer frame portion 11a of the second lead frame 11 is superposed at a predetermined position on the outer frame portion 10a of the first lead frame 10, and the plurality of electrodes 9 on the upper surface of the semiconductor chip 2 and the lead terminals 4 corresponding thereto are formed. Are electrically connected by wire bonding using a connecting wire 5 such as a gold wire. The first and second lead frames 10 and 11 assembled in this manner are installed so that the die pad 3 on which the semiconductor chip 2 is mounted is located at a predetermined position in the cavity 16a formed in the lower mold 16. That is, the outer frame 10a of the first lead frame 10 is arranged in the outer frame accommodating recess 16d, and the die pad suspension lead 7 of the first lead frame 10 is arranged in the corresponding suspension lead accommodating groove on the upper surface of the lower mold 16. It is placed in 16b.

Next, the upper die 17 is placed on the lower die 16. That is, the outer frame accommodating concave portion 16d and the lead terminal accommodating groove 17d of the upper mold 17 are fitted to the outer frame portion 10a of the second lead frame 11 and the corresponding lead terminal 4, respectively, and the positioning convex portion of the upper mold 17 is formed. 17b is a corresponding positioning recess 16c of the lower mold 16.
To fit.

In this way, the upper die 17 and the lower die 1
After the mold 6 is clamped, the molten sealing resin is injected into the mold and cured. At this time, the submerged portion 7a of the suspension lead 7 supporting the die pad 3 on which the semiconductor chip 2 is mounted is arranged outside the cavities 17a, 16a of the upper mold 17 and the lower mold 16, that is, the submerged portion 7a is located below. Mold 1
6 is held in the hanging lead housing groove 16b of the upper die 17 and is held by the positioning convex portion 17b of the upper die 17, and the die pad 3 is hung so that the strength (rigidity) is not reduced by press molding or the like like the sinking portion 7a. Since it is firmly supported by the lead 7, the die pad 3 is displaced (displaced in the vertical direction, etc.) even when non-uniform pressure is applied to the die pad 3 by the injected resin during injection of the molten resin. The probability is greatly reduced.

After the molten resin injected into the mold is cured, the upper mold 17 is removed from the lower mold 16, the resin-sealed package 8 is taken out from the lower mold 16, and the unnecessary die pad is hung. The semiconductor device 1 is completed by cutting the part of the lead 7 that extends outside from the outer surface of the package 8 and separating the lead terminal 4 from the outer frame portion 11a of the second lead frame 11 at an appropriate position.

As is clear from the above, in this embodiment,
Since the submerged portion 7a of the suspension lead 7 is arranged outside the cavities 17a and 16a of the upper and lower molds 17 and 16,
The semiconductor chip 2 can be arranged in the portion occupied by the submerged portion 7a of the suspension lead 7, which can contribute to an increase in the chip size of the semiconductor device 1 in which the outer dimensions of the package 8 are defined in advance. .

Further, as shown in FIGS. 4 and 5, the parting line 20 connecting the die pad parting surface 18 and the inner lead parting surface 19 is not provided along the corner ridge of the package 8, but the side surface of the package 8 is not formed. In particular, by providing it on the side surface where the outer lead 4b is not exposed, the intermediate product of the semiconductor device 1 after resin sealing is processed by the upper mold 17
Also, it becomes possible to provide a taper (side surfaces are angled) for facilitating extraction from the lower mold 16.

The parting line 20 connecting the die pad parting surface 18 and the inner lead parting surface 19 is provided along the corner ridgeline of the package 8 and the side surface of the package 8 is tapered by the upper mold. It is impossible because 17 and the lower die 16 are caught.

FIG. 8 is a side view of the semiconductor device 1 of FIG. 6 viewed from the direction of arrow G, FIG. 9 is a sectional view taken along the line j--j of FIG. 8, and FIG. 10 is a semiconductor device in which the present invention is not implemented (conventional). 10 is a sectional view similar to FIG. 9 of FIG. In these figures, h is the distance from the parting line 20 connecting the parting surface 19 of the inner lead 4a and the die pad parting surface 18 and the outer side surface of the package 8, and k is the die pad 3 required in the assembly process.
Is the distance from the end of the package to the outer side surface of the package 8. Usually, k is about 0.6 mm, and the minimum required resin thickness from the end of the die pad 3 to the outer side surface of the package 8 (0.
2 mm + α), and by setting h to 0.3 mm or more, as shown in FIG. 9, a package formed by the positioning protrusions 17b in which a part of the upper mold 17 is inserted into the lower mold 16. It is possible to insert the die pad 3 into the 8 (resin) area as well, and the die pad 3 can be inserted correspondingly.
The length of can be increased.

FIG. 11 is a side sectional view seen from the direction H in FIG. In this figure, the external dimensions of the package 8 are defined by standardization, and therefore the length L3 in the longitudinal direction of the package 8 is also predetermined, and is formed by the positioning convex portion 17b of the upper die 17 (see FIG. 6). A die pad parting surface 18 that passes through the intersection of the surface to be mounted and the die pad suspension lead 7 is provided on the chip mounting surface of the die pad suspension lead 7. As shown by the chain double-dashed line in FIG. 11, compared to the case where the die pad parting surface 18 is provided on the side opposite to the chip mounting surface of the die pad suspension lead 7,
The horizontal distance of the sealing resin from the semiconductor chip 22 or the die pad 3 to the package surface is increased by m, and the reliability is improved accordingly.

FIG. 12 is a side sectional view as seen from the direction of arrow G in FIG. In FIG. 12, the inner lead parting surface 19 is provided so as to coincide with the lower surface of the inner lead 4a. In this case, since the width W of the package 8 is defined by the standardization of the package 8, the inner lead parting surface 19 is provided so as to match the upper surface of the inner lead 4a, as shown by the chain double-dashed line in FIG. Compared with the case, the horizontal distance of the sealing resin from the semiconductor chip 22 or the die pad 3 to the package surface is p.
However, the reliability is improved accordingly.

Example 2. When the parting line 20 connecting the die pad parting surface 18 and the inner lead parting surface 19 is provided along the corner ridge of the package 8, the corner ridge, that is, the corner of the package 8 is rounded. Although it was impossible to give (make R or chamfer), it is possible in the present invention.

FIG. 7 is a partial perspective view showing a semiconductor device 1B according to an embodiment in which the corner ridgelines (corners) of the package 8 are rounded as described above. Although not shown, in this embodiment, the die pad suspension leads extend from the four corners of the die pad having a substantially rectangular plane, and are arranged in the vicinity of the four side surfaces of the rectangular semiconductor chip mounted on the die pad. , A plurality of lead terminals 4 are arranged so as to face each side surface and have a step with respect to the die pad suspension lead, and in this state, the lead terminals 4 are arranged in a mold similar to the mold described above, The semiconductor device 1B which is sealed and is partially shown in FIG. 7 is manufactured. In this embodiment, the positioning protrusions of the upper mold and the positioning recesses of the lower mold are provided at the four corners of the cavity having a substantially rectangular planar shape, and are aligned with the lower mold of the planar rectangular upper mold. Inner lead housing grooves are formed on the surface corresponding to the respective side surfaces. Except for such points, the mold used in this embodiment has substantially the same structure as the mold of the first embodiment.

As shown in FIG. 7, in this embodiment, the outer leads 4 are provided from the respective side surfaces of the flat rectangular package 8.
b is extended, and the die pad suspension leads 7 are arranged at the corners of the package 8 (that is, the portions on the side surface of the package where the lead terminals 4 are not exposed), and the corners of the package 8 are rounded at these portions. It is formed in a marked state or a chamfered state.

By rounding the corners of the package 8 in this way, it is possible to effectively prevent damage to the corners of the package, which are easily damaged by a slight impact, and to prevent the commercial value of the package from being impaired. You can

[0044]

As described above, according to the semiconductor device of the first aspect, the first parting surface of the lead terminal of the package housing the chip and the second parting surface of the die pad suspension lead supporting the die pad are provided. In a semiconductor device having a height difference between the first parting surface and the second parting surface,
Since the parting line connecting the parting surface is provided on the part of the side surface of the package other than the corner ridge of the package where the lead terminals are not exposed, it is possible to accommodate a larger semiconductor chip in the same size package. In addition, the thickness of the sealing resin between the semiconductor chip and the outer surface of the package can be increased, and a semiconductor device with excellent package reliability can be obtained.

According to the semiconductor device of the second aspect, the parting surface of the first lead frame provided with the lead terminals and the second lead frame provided with the die pad are provided in the portion of the package where the lead terminals are not exposed. Since the traces of the abutting portions of the first and second molds are formed so as to connect with the parting surface, it becomes easy to extract the intermediate product of the semiconductor device after resin sealing from the upper mold and the lower mold. By providing the taper on the outer surface of the package, there is an effect that the work of extracting the intermediate product from the mold can be simplified and the work efficiency can be improved.

According to the semiconductor device of claim 3, the first
The traces of the abutting portions of the first and second molds that connect the parting surface of the lead frame and the parting surface of the second lead frame are located within 0.3 mm from the side surface of the package from which the lead terminals extend. Since it is arranged, the die pad can be made to enter the package (resin) area formed by the part where the upper die partially enters the lower die, and the die pad can be extended by that amount. There is an effect that the length can be increased.

According to the semiconductor device of the fourth aspect, since the parting surface of the second lead frame having the die pad is provided on the surface of the second lead frame on which the chip is mounted, the second lead frame is provided. The horizontal distance of the sealing resin from the chip or die pad to the package surface becomes larger than that in the case where the parting surface of the second lead frame is provided on the side opposite to the chip mounting surface.
There is an effect of improving reliability accordingly.

According to the semiconductor device of the fifth aspect, the parting surface of the first lead frame provided with the lead terminals is provided on the chip side surface of the first lead frame. The parting surface is the first
The horizontal distance of the encapsulation resin from the chip or die pad to the package surface is larger than when it is provided so as to match the surface of the lead frame opposite to the chip side, and the reliability is correspondingly improved. Has the effect of

According to a sixth aspect of the semiconductor device, there is provided a semiconductor manufacturing device for resin-sealing a chip of a semiconductor device having a height difference between a lead terminal and a die pad suspension lead, and the chip is accommodated. A first mold; and a second mold which is attached to the first mold and forms a hollow portion for filling a resin, the lead terminals of the semiconductor device of the first and second molds. And a second mating surface corresponding to the die pad suspension lead of the semiconductor device has a step, and the first and second molds are butted to connect the first and second mating surfaces. Since the portion is provided at a position where the lead terminals are not arranged, a larger semiconductor chip can be accommodated in a package of the same size.
The thickness of the sealing resin between the semiconductor chip and the outer surface of the package can be increased, and a semiconductor device with excellent package reliability can be manufactured. Furthermore, when the first die and the second die are combined and clamped,
By abutting the first mold and the second mold at the step portion connecting the first mating surface and the second mating surface, the positioning of both can be performed very easily, and the mold clamping work can be simplified. It contributes to the improvement of productivity.

[Brief description of drawings]

FIG. 1 is a sectional view of an intermediate product in the middle of an assembly process step of a semiconductor device according to a first embodiment of the present invention.

2 is a cross-sectional view of an intermediate product of the semiconductor device of FIG. 1 after completion.

FIG. 3 is a partial plan view showing a state where the first and second lead frames are assembled and arranged in a lower mold.

4 is a cross-sectional view taken along the line CC of FIG.

5 is a cross-sectional view taken along the line DD of FIG.

FIG. 6 is a partial perspective view of the semiconductor device of FIG.

FIG. 7 is a partial perspective view of a semiconductor device according to a second embodiment of the present invention.

8 is a side view seen from the direction of arrow G in FIG.

9 is a cross-sectional view taken along the line jj of FIG.

10 is a sectional view of a conventional semiconductor device similar to FIG.

11 is a partial side view of the semiconductor device of FIG. 6 viewed from the direction of arrow H. FIG.

12 is a partial side view of the semiconductor device of FIG. 6 viewed from the direction of arrow G. FIG.

FIG. 13 is a partially cutaway perspective view of a conventional semiconductor device.

14 is a cross-sectional view taken along the line AA of FIG.

15 is a partially enlarged side view in which a part of the semiconductor device of FIG. 13 is enlarged.

FIG. 16 is a plan view showing an example of a conventional semiconductor device manufacturing process.

FIG. 17 is a plan view showing another example of the conventional semiconductor device manufacturing process.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Chip 3 Die pad 4 Lead terminal 7 Die pad suspension lead 8 Package 16 Lower mold as a first mold 17 Upper mold as a second mold 18 Die pad parting surface as a second parting surface 19th 1 Inner lead parting surface as parting surface 20 Parting line

[Procedure amendment]

[Submission date] March 7, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 6

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Fig. 4

[Correction method] Change

[Correction content]

[Figure 4]

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoto Ueda 997 Miyoshi, Nishigoshi-cho, Kikuchi-gun, Kumamoto Mitsubishi Electric Corporation Kumamoto Factory

Claims (6)

[Claims] 1. A semiconductor device in which there is a height difference between a first parting surface of a lead terminal of a package accommodating a chip and a second parting surface of a die pad suspension lead supporting a die pad. A semiconductor device, wherein a parting line connecting the surface and the second parting surface is provided on a portion of the side surface of the package other than a corner ridge of the package where the lead terminal is not exposed. 2. A parting surface of the first lead frame having the lead terminals and a parting surface of the second lead frame having the die pads are connected to a portion of the package where the lead terminals are not exposed. The semiconductor device according to claim 1, wherein traces of the abutting portions of the first and second molds are formed. 3. A package side surface from which the lead terminal extends, the traces of the abutting portions of the first and second molds connecting the parting surface of the first lead frame and the parting surface of the second lead frame. 3. The semiconductor device according to claim 2, wherein the semiconductor device is arranged within 0.3 mm from. 4. The parting surface of the second lead frame having the die pad is formed on the parting surface of the second lead frame.
The device is provided on the surface on which the chip is mounted.
The semiconductor device described. 5. The semiconductor device according to claim 2, wherein a parting surface of the first lead frame having the lead terminals is provided on a chip side surface of the first lead frame. 6. A semiconductor manufacturing apparatus for resin-sealing a chip of a semiconductor device having a height difference between a lead terminal and a die pad suspension lead, the first mold containing the chip, and the first mold. A second die which is attached to the first die and forms a hollow portion for filling the resin, and a first mating surface corresponding to the lead terminals of the semiconductor device of the first and second dies; And a second mating surface corresponding to the die pad suspension lead of the semiconductor device has a step, and the lead terminal is arranged at a butting portion of the first and second molds connecting the first and second mating surfaces. A semiconductor manufacturing apparatus, which is provided at a position not provided.