JPH07201911A - Tape carrier package - Google Patents

Abstract

PURPOSE:To facilitate a bump bonding operation by arranging and fixing a linear conductor in a bridge state in which the end of each linear conductor passes through a hole and is supported by a carrier tape. CONSTITUTION:A plurality of beam leads (linear conductor 13) provided in a bridge state that beam leads cross a long hole 11 to interconnect a chip mounting part 12 and a carrier tape 10 on the outside thereof are arranged and fixed in parallel to each other. Thereby, since the tip of the end 13a of the beam leads is supported on both sides of the long hole II, the positional accuracy of the smoothing quality, the pitch and the like of the beam leads 13 is kept and advantageous for bump connection. The tip of the end 13a of the beam leads 13 is supported in the carrier tape 10 and sealed with a resist ink layer 16 to prevent the concentration of a current density into the end 13a of the beam leads 13, so that the unusual precipitation may be prevented. Therefore, the bump connection with an electrode is easy and at the same time the separation and the like in the bump connection part are prevented to increase reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package having an improved conductor support structure.

[0002]

2. Description of the Related Art In recent years, tape carrier packages with improved packaging technology have been widely used as semiconductors used in large computers and the like. This tape carrier package is configured as shown in FIGS. 5 and 6, for example. In the figure, reference numeral 1 is a carrier tape, and the carrier tape 1 has device holes 2.2 formed at predetermined intervals. Carrier tape 1
A plurality of beam leads (linear conductors) are arranged and fixed on the upper side in a state where the tip ends thereof are projected into the device hole 2. An electrode of a bare chip IC (IC chip) 4 located in the device hole 2 is connected to the beam lead 3 via a bump 5. A resist ink (insulating layer) 6 is formed on a portion of the beam lead 3 excluding the end portion 3a. Bare chip IC4
Between the carrier tape 1 and the carrier tape 1
A sealing resin 7 is fixed so as to cover the connection between the electrode and the beam lead 3 and to bury the entire area of the device hole 2.

In this tape carrier package, a beam lead 3 is formed on a carrier tape 1 having the device hole 2, a resist ink layer (insulating layer) 6 is formed on the beam lead 3, and the end of the beam lead 3 is formed. It is manufactured by connecting the bare chip IC 5 to the portion 3a via the bump 5 and finally fixing the sealing resin 7.

[0004]

In the tape carrier package, since the beam lead 3 is usually made of a very thin copper foil to form a fine circuit, the device hole 2 of the beam lead 3 is used. Since the strength of the overhanged portion is very weak and is deformed by a simple force, it is difficult to maintain the smoothness of the end portion 3a of the beam lead 3 and the positional accuracy of the pitch, which makes it difficult to perform the bump bonding work. It was happening. Further, the end portion 3a of the beam lead 3 is subjected to a plating treatment for bonding. In this plating treatment, the concentration of the current density at the end portion 3a of the beam lead 3 tends to cause abnormal deposition of the plating layer, and thus the pattern mixing Or, the relative position of each beam lead 3 with respect to the bump 5 is varied, which causes the increase in difficulty of bump connection.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a tape carrier package in which bump bonding work is easy.

[0006]

According to a first aspect of the tape carrier package of the present invention, a plurality of linear conductors are arranged and fixed in parallel on a carrier tape, and an electrode of an IC chip is provided at an end of the plurality of linear conductors. Are connected via bumps, the plurality of linear conductors are covered with an insulating layer, and a resin is fixed between the IC chip and the carrier tape so as to cover the connection portion between the electrodes and the linear conductors. In the tape carrier package, holes are formed in the carrier tape in a direction crossing the ends of the plurality of linear conductors, the ends of the plurality of linear conductors pass through the holes, and the tips are supported by the carrier tape. It was arranged and fixed in a cross-linked state as the means for solving the above problems.

[0007]

According to the tape carrier package of the present invention,
Since the ends of the respective linear conductors are arranged and fixed in a bridged state in which the ends pass through the holes and the ends are supported by the carrier tape, stress is exerted like a beam supporting both ends to exert deformation resistance.
Further, since both ends of the linear conductor are in contact with the carrier tape and electrically insulated, current density concentration at the tip of the linear conductor can be suppressed during plating.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In FIGS. 1 and 2, reference numeral 10 is a carrier tape, and the carrier tape 10 includes:
In the carrier tape 10, chip mounting portions 12 each having a substantially square shape defined by four elongated holes 11 are formed at predetermined intervals. This tip mounting part 1
In No. 2, the long holes 11 are located at the respective side portions of the square, and the long holes 11 separate the carrier tape 10 on the outside of the chip mounting portion 12, and
In the part where the two long holes 11 and 11 where each corner part of the square is adjacent are discontinuous, the chip mounting part 12
Is continuous with the outer carrier tape 10.

Beam leads (linear conductors) provided on the carrier tape 10 in a bridging state for connecting the chip mounting portion 12 and the carrier tape 10 on the outside thereof across the elongated hole 11. A plurality of 13 are arranged and fixed in parallel. The end 13 of the beam lead 13
In a, the electrodes of the bare chip IC (IC chip) 14 located in the chip mounting portion 12 are connected via bumps 15. The elongated hole 11 of the beam lead 13
The area other than the area facing the resist ink layer (insulating layer)
It is covered by 16 layers. The bare chip IC 1 is provided between the bare chip IC 14 and the carrier tape 10.
A sealing resin 17 is fixed so as to cover the connecting portion between the electrode 4 and the beam lead 13 and to fill the entire area of the elongated hole 11.

As a method of manufacturing this tape carrier package, a beam lead 13 is formed on the carrier tape 10 having the elongated hole 11 and a resist is applied to a portion other than a region of the end portion 13a of the beam lead 13 facing the elongated hole 11. The ink layer 16 is formed, and the bare chip IC 14 is connected to the end 13a of the beam lead 13 via the bump 15. Finally, the sealing resin 17 is fixed to seal the entire bump connecting portion. In this manufacturing method, the end portion 13a of the beam lead 13 is plated with gold or the like.

The operation and effect of this embodiment will be described below. According to the tape carrier package, since the ends of the end portions 13a of the beam leads 13 are supported on both sides of the elongated hole 11, the smoothness of the beam leads 13 and positional accuracy such as pitch are maintained, which is advantageous for bump connection. Is.
When the beam lead 13 is plated, the tip of the end portion 13 a of the beam lead 13 is the carrier tape 1.
It is supported by 0 and is sealed with the resist ink layer 16 to prevent current density from concentrating on the end portion 13a of the beam lead 13 and prevent abnormal deposition of the plating layer. The variation in thickness and strength is small, and the bump connection between the beam lead 13 and the electrode of the bare chip IC 14 is easy, and the variation in the strength of the pressing force applied from each beam lead 13 to the electrode of the bare chip IC 14 is small, and the bump connection portion The peeling is prevented and the reliability is improved. In addition, as shown in FIG. 2, the bare chip IC 14 is supported by the chip mounting portion 12 and is stably fixed by a small amount of the sealing resin 17, so that the sealing height of the sealing resin 17 is suppressed and the package size is reduced. Moreover, since the opening is not large like the conventional device hole 2, the exudation of the sealing resin is suppressed when the connection between the beam lead 13 and the electrode of the bare chip IC 14 is sealed. You can

The elongated hole 11 may have a shape other than that shown in FIGS.

3 and 4 are views showing another embodiment of the present invention. In the embodiment shown in these figures, the solid pattern 18 is formed on the chip mounting portion 13 of the carrier tape 10.
Is formed and the solid pattern 18 is connected to a plurality of ground leads 19 of GND level. Solid pattern 1
A resist ink layer 16 is formed on the upper surface side of 8. According to this tape carrier package, it is possible to provide a high-quality product with stable electric characteristics due to the presence of the ground plane formed of the solid pattern 18. The solid pattern 18 can also be used as a power supply pattern such as VDD.

[0014]

As described above, according to the tape carrier package of the first aspect, since the ends of the linear conductors are supported by the carrier tape, the smoothness of the linear conductors, the position of pitch, etc. The accuracy is maintained, it is advantageous for bump connection, and when sealing the connection between the linear conductor and the electrode of the IC chip, the opening of the carrier tape is not large like the conventional device hole, so the IC It is possible to obtain an excellent effect that the sealing height of the chip is suppressed, which is advantageous for downsizing of the package, and the leakage of the sealing resin is suppressed. Further, since the tip of the linear conductor is supported by the carrier tape, the concentration of the current density at the tip of the linear conductor is prevented when the linear conductor is plated, and abnormal deposition of the plated layer is suppressed. Therefore, there is little variation in the tip shape of the linear conductor, which is advantageous for bump connection between the linear conductor and the electrode of the IC chip, and variation in the strength of the pressing force of each linear conductor to the electrode of the IC chip is reduced. Bump connection area reliability is improved.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a tape carrier package of the present invention.

FIG. 2 is a side sectional view showing the tape carrier package.

FIG. 3 is a bottom view showing an embodiment in which a solid pattern is provided on the tape carrier package.

FIG. 4 is a side sectional view showing an embodiment in which a solid pattern is provided on the tape carrier package.

FIG. 5 is a plan view showing a conventional tape carrier package.

FIG. 6 is a side sectional view showing a conventional tape carrier package.

[Explanation of symbols]

 10 Carrier Tape 11 Long Hole (Hole) 13 Beam Lead (Linear Conductor) 14 Bare Chip IC (IC Chip) 15 Bump 16 Resist Ink (Insulating Layer) 17 Sealing Resin 19 Beam Lead (Linear Conductor)

Claims (1)

[Claims] 1. A plurality of linear conductors are arranged and fixed in parallel on a carrier tape, and electrodes of an IC chip are connected to end portions of the plurality of linear conductors via bumps. A tape carrier package in which an insulating layer is covered with a resin, and a resin is fixed between the IC chip and the carrier tape so as to cover a connecting portion between the electrodes and the linear conductors. A hole is formed in a direction crossing the end of the conductor, and the ends of the plurality of linear conductors are arranged and fixed in a bridged state in which the ends pass through the holes and the tips are supported by the carrier tape. Tape carrier package.