JPH0719972B2 - Copper foil with resin for multilayer printed boards - Google Patents
Copper foil with resin for multilayer printed boardsInfo
- Publication number
- JPH0719972B2 JPH0719972B2 JP61204242A JP20424286A JPH0719972B2 JP H0719972 B2 JPH0719972 B2 JP H0719972B2 JP 61204242 A JP61204242 A JP 61204242A JP 20424286 A JP20424286 A JP 20424286A JP H0719972 B2 JPH0719972 B2 JP H0719972B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper foil
- resin layer
- multilayer printed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔概要〕 本発明の多層プリント板用樹脂付き銅箔は、銅箔のマッ
ト面上に完全硬化樹脂より成る第一樹脂層と半硬化樹脂
より成る第二樹脂層とが積層された構成となっているた
め、層間の絶縁度が良くなり、結果的に薄手の多層プリ
ント板の実現が可能となる。DETAILED DESCRIPTION OF THE INVENTION [Outline] A resin-coated copper foil for a multilayer printed board according to the present invention comprises a matte surface of a copper foil, a first resin layer made of a completely cured resin, and a second resin layer made of a semi-cured resin. Since the layers are laminated, the degree of insulation between layers is improved, and as a result, a thin multilayer printed board can be realized.
本発明は多層プリント板の表面層を構成する樹脂付き銅
箔の改良に係り、特に中間層の回路パターンに対する絶
縁性を向上させた多層プリント板用樹脂付き銅箔に関す
る。The present invention relates to an improvement in a resin-coated copper foil which constitutes a surface layer of a multilayer printed board, and more particularly to a resin-coated copper foil for a multilayer printed board which has improved insulation properties against a circuit pattern of an intermediate layer.
第２図は従来の多層プリント板用樹脂付き銅箔の構成を
模式的に示した側断面図、第３図は多層プリント板の構
成を模式的に示した側断面図である。FIG. 2 is a side sectional view schematically showing the structure of a conventional resin-coated copper foil for a multilayer printed board, and FIG. 3 is a side sectional view schematically showing the structure of a multilayer printed board.
第２図に示すように、多層プリント板用樹脂付き銅箔20
は、銅箔11と樹脂層３とによって構成され、銅箔11のマ
ット面10側に前記樹脂層３が配置された構造になってい
る。As shown in FIG. 2, resin-coated copper foil 20 for multilayer printed board
Is composed of a copper foil 11 and a resin layer 3, and the resin layer 3 is arranged on the mat surface 10 side of the copper foil 11.
以下、第３図を用いて多層プリント板の構成を説明す
る。The structure of the multilayer printed board will be described below with reference to FIG.
第３図に示すように、多層プリント板は、中間層樹脂板
５およびその両面に形成された回路パターン16より成る
中間層15と、これを挟む形で配置されたプリプレグ８
と、さらにその上下に配置された一対の樹脂付き銅箔20
とによって構成され、これらを重ね合わせて上下から押
圧し、所定の温度を加えることによって製品化される。As shown in FIG. 3, the multilayer printed board has an intermediate layer 15 composed of an intermediate resin plate 5 and circuit patterns 16 formed on both surfaces thereof, and a prepreg 8 arranged so as to sandwich the intermediate layer 15.
And a pair of copper foil with resin 20 placed above and below it
It is constituted by and, these are piled up and pressed from above and below, and a predetermined temperature is applied to obtain a product.
なお、これら各部材の接合は、プリプレグ８に含浸させ
てある接着剤の作用によることは周知のとおりである。It is well known that the joining of these members is performed by the action of the adhesive impregnated in the prepreg 8.
第２図，第３図において、Ｔは銅箔11および回路パター
ン16の厚さ（通常約20μｍ）を、ｔは樹脂層３の厚さ
（通常約30μｍ）を、ｋはプリプレグの厚さ（約50μ
ｍ）をそれぞれ示している。2 and 3, T is the thickness of the copper foil 11 and the circuit pattern 16 (usually about 20 μm), t is the thickness of the resin layer 3 (usually about 30 μm), and k is the thickness of the prepreg ( About 50μ
m) are shown respectively.
なお、構成を理解し易いように、第３図の例は中間層15
が１枚だけの場合を示しているが、最近の多層プリント
板は、中間層15の数が数枚から十数枚に及ぶものもあ
る。しかし基本的な構成は同じである。In order to make the structure easy to understand, the example of FIG.
However, there are some recent multilayer printed boards in which the number of the intermediate layers 15 ranges from several sheets to ten or more sheets. However, the basic configuration is the same.
しかしながら、上記従来の樹脂付き銅箔20の銅箔面（マ
ット面）には樹脂材３との接着力を高めるための凹凸、
例えばノジュール（瘤）が設けられており、該樹脂材３
は半硬化樹脂からなっている。However, the copper foil surface (matte surface) of the conventional resin-coated copper foil 20 has irregularities for increasing the adhesive force with the resin material 3,
For example, a nodule is provided, and the resin material 3
Is made of semi-cured resin.
このため、積層時において中間層15との間に介在される
プリプレグ８が１枚だけの場合、加圧・加熱によって前
記ノジュール（瘤）が樹脂層３及びプリプレグ８を突き
破って対応する中間層15の回路パターン16と接触し、銅
箔とショートする恐れがあるので、層間の絶縁が保証で
きないことがあり、現在はプリプレグ８を２枚使用する
のが常識となっている。しかし各層間にプリプレグ８を
２枚宛使用すると、積層数が多い場合は多層プリント板
の総厚さが大きくなってしまう。Therefore, when only one prepreg 8 is interposed between the prepreg 8 and the intermediate layer 15 at the time of stacking, the nodules (bumps) pierce the resin layer 3 and the prepreg 8 by pressurization and heating, and the corresponding intermediate layer 15 is pressed. Since there is a risk of contact with the circuit pattern 16 and short-circuiting with the copper foil, insulation between layers may not be guaranteed, and it is now common knowledge to use two prepregs 8. However, if two prepregs 8 are used between the layers, the total thickness of the multilayer printed board becomes large when the number of layers is large.
本発明の樹脂付き銅箔は、マット面に形成された樹脂層
が、銅箔と直接接合する完全硬化樹脂からなる第一樹脂
層と、該第一樹脂層に積層される半硬化樹脂からなる第
二樹脂層とによって構成されている。In the resin-coated copper foil of the present invention, the resin layer formed on the matte surface is composed of a first resin layer made of a completely cured resin that is directly bonded to the copper foil, and a semi-cured resin laminated on the first resin layer. And a second resin layer.
このように構成された樹脂付き銅箔では、マット面に形
成された二層構成の樹脂層の内の加熱硬化処理により完
全に硬化した第１樹脂層が、対応する配線回路と接触シ
ョートする銅箔のマット面の凹凸に対するバリア（防
壁）として作用し、該第１樹脂層よりも低い温度で乾燥
させて半硬化状にした第２樹脂層は、その後の加熱積層
時に溶融硬化してプリプレグとの接着を助成しているの
で、従来の樹脂付き銅箔に比べて絶縁度が格段に良くな
り、層間に一枚のプリプレグを配置するだけで、充分な
絶縁性と積層接着性が得られる。In the resin-coated copper foil thus configured, the first resin layer of the two-layer resin layer formed on the matte surface, which has been completely cured by the heat curing treatment, is a copper layer that contacts and short-circuits with the corresponding wiring circuit. The second resin layer, which acts as a barrier (wall) against irregularities on the matte surface of the foil and is dried at a temperature lower than that of the first resin layer to be semi-cured, is melt-cured during subsequent heat lamination to form a prepreg. Since the adhesion is promoted, the degree of insulation is remarkably improved as compared with the conventional resin-coated copper foil, and sufficient insulation and lamination adhesion can be obtained only by disposing one prepreg between the layers.
以下本発明の実施例図に基づいて詳細に説明する。 Hereinafter, a detailed description will be given based on an embodiment of the present invention.
第１図は本発明の一実施例を模式的に示した側断面図で
あるが、前記第２図，第３図と同一部分には同一符号を
付している。FIG. 1 is a side sectional view schematically showing an embodiment of the present invention, in which the same parts as those in FIGS. 2 and 3 are designated by the same reference numerals.
第１図に示すように、本発明の多層プリント板用の樹脂
付き銅箔20は、銅箔11のマット面10側に設けられた樹脂
層３が、第一樹脂層3aおよび第二樹脂層3bより成る２層
構成になっている。そして銅箔11と直接接合する第一樹
脂層3aは完全硬化樹脂で構成され、その上に積層される
第二樹脂層3bは半硬化樹脂で構成されている。As shown in FIG. 1, in the resin-coated copper foil 20 for a multilayer printed board of the present invention, the resin layer 3 provided on the mat surface 10 side of the copper foil 11 includes a first resin layer 3a and a second resin layer. It has a two-layer structure consisting of 3b. The first resin layer 3a directly bonded to the copper foil 11 is made of a completely cured resin, and the second resin layer 3b laminated thereon is made of a semi-cured resin.
なお、半硬化樹脂とは、塗布した樹脂材を乾燥固体化し
た状態のものであって、加熱すると溶融する。また、こ
の乾燥固体化した半硬化樹脂材を更に加熱溶融により硬
化させる硬化処理を施すことで再度加熱しても溶融する
ことのない完全硬化樹脂を得ることができる。The semi-cured resin is a state in which the applied resin material is dried and solidified, and melts when heated. Further, by subjecting the dried and solidified semi-cured resin material to a curing treatment in which the semi-cured resin material is further cured by heating and melting, it is possible to obtain a completely cured resin that does not melt even when heated again.
以下本発明の樹脂付き銅箔の製造手順の一実施例を説明
する。An example of the procedure for producing the resin-coated copper foil of the present invention will be described below.
．先ず銅箔（古川サーキットフォイル社製）11上に第
一樹脂層（完全硬化樹脂層）を形成させるための樹脂
材、例えば、 エピコート1001（エポキシ樹脂） 100部 ジシアンジアミン（DICY） ５部 ベンジルジメチルアミン（BDMA） 0.1部 を予め混合しメチルエチルケトン（MEK）やアセトン等
の溶剤に溶解してなる樹脂組成物を塗布する。塗布量は
形成された樹脂層3aの厚さが約15μｍとなるように調節
する。． First, a resin material for forming a first resin layer (completely cured resin layer) on a copper foil (Furukawa Circuit Foil Co., Ltd.) 11, for example, Epicoat 1001 (epoxy resin) 100 parts Dicyandiamine (DICY) 5 parts Benzyl A resin composition prepared by previously mixing 0.1 part of dimethylamine (BDMA) and dissolving it in a solvent such as methyl ethyl ketone (MEK) or acetone is applied. The coating amount is adjusted so that the formed resin layer 3a has a thickness of about 15 μm.
．これを150℃で数分間加熱して乾燥した後、その樹
脂材を更に170℃で20〜30分間加熱溶融して該樹脂材を
完全に硬化させる。この工程によって銅箔11上に完全硬
化された第一樹脂層3aが形成される。． This is heated at 150 ° C. for several minutes and dried, and then the resin material is further heated and melted at 170 ° C. for 20 to 30 minutes to completely cure the resin material. By this step, the completely cured first resin layer 3a is formed on the copper foil 11.
．次にその第一樹脂層3a上に第二樹脂層（半硬化樹脂
層）を形成させるための樹脂材、即ち、前記第一樹脂層
3aの形成に用いた樹脂組成物と同様な樹脂組成物を塗布
する。塗布量は第二樹脂層3bの厚さが約15μｍとなるよ
うに調節される。． Next, a resin material for forming a second resin layer (semi-cured resin layer) on the first resin layer 3a, that is, the first resin layer
A resin composition similar to the resin composition used to form 3a is applied. The coating amount is adjusted so that the thickness of the second resin layer 3b is about 15 μm.
．そして塗布した樹脂材を150℃で数分間加熱して乾
燥固体化した半硬化状態の第二樹脂層3bを形成させる。． Then, the applied resin material is heated at 150 ° C. for several minutes to form a dried and solidified second resin layer 3b in a semi-cured state.
なお、前記完全硬化状の樹脂層3aおよび半硬化状の樹脂
層3bを形成させるための樹脂材としては、前記した樹脂
組成物の他に例えば、 エピコート1001（エポキシ樹脂） 100部 無水ピロメリット酸 20部 ベンジルジメチルアミン（BDMA） 0.1部 を予め混合しメチルエチルケトン（MEK）やアセトン等
の溶剤に溶解してなる樹脂組成物を用いるようにしても
よい。The resin material for forming the completely hardened resin layer 3a and the semi-hardened resin layer 3b may be, for example, Epicoat 1001 (epoxy resin) 100 parts pyromellitic dianhydride in addition to the resin composition described above. 20 parts Benzyldimethylamine (BDMA) 0.1 parts may be mixed in advance and dissolved in a solvent such as methyl ethyl ketone (MEK) or acetone to use a resin composition.
また、第一樹脂層3aと第二樹脂層3bの形成には、別々の
樹脂材を使用するようにしても良いし、上記実施例のよ
うにどちらも同一の樹脂材を用いて加熱処理温度と処理
時間とを変化させるようにしてもよい。Further, different resin materials may be used for forming the first resin layer 3a and the second resin layer 3b, and the same resin material may be used for both of the heat treatment temperatures as in the above embodiment. And the processing time may be changed.
図中、t1は第一樹脂層3aの厚さを、t2は第二樹脂層3bの
厚さをそれぞれ示しており、本例の場合はt1およびt2共
に約15μｍになっているので、樹脂層３の合計厚さは前
記第２図の従来例に示した樹脂層の厚さｔと同じく、30
μｍである。In the figure, t 1 indicates the thickness of the first resin layer 3a and t 2 indicates the thickness of the second resin layer 3b. In this example, both t 1 and t 2 are about 15 μm. Therefore, the total thickness of the resin layer 3 is equal to the thickness t of the resin layer shown in the conventional example of FIG.
μm.
このように、本発明の樹脂付き銅箔20を使用した多層プ
リント板は、層間に配置されるプリプレグ８の使用数が
一枚であっても良好な絶縁性が得られるため、積層枚数
の多い多層プリント板の場合は、総厚さを大幅に縮小で
きる。As described above, in the multilayer printed board using the resin-coated copper foil 20 of the present invention, good insulation can be obtained even if the number of the prepregs 8 arranged between the layers is one, and thus the number of laminated layers is large. In the case of a multilayer printed board, the total thickness can be significantly reduced.
本発明の多層プリント板用樹脂付き銅箔は、完全硬化樹
脂層がバリア（防壁）として作用する構成であるため、
層間の絶縁度を従来に比べて格段に向上でき、これによ
って多層プリント板の薄型化が可能となる。Since the resin-coated copper foil for a multilayer printed board of the present invention has a configuration in which the completely cured resin layer acts as a barrier (wall),
The degree of insulation between layers can be significantly improved as compared with the conventional one, which allows the multilayer printed board to be thinned.
第１図は本発明の一実施例を模式的に示した側断面図、 第２図は従来の多層プリント板用樹脂付き銅箔の構成を
模式的に示した側断面図、第３図は多層プリント板の構
成を模式的に示した側断面図である。 図中、３は樹脂層、3aは第一樹脂層、3bは第二樹脂層、
５は中間層樹脂板、８はプリプレグ、10はマット面、11
は銅箔、15は中間層、16は回路パターン、20は樹脂付き
銅箔、Ｔは銅箔の厚さ、ｋはプリプレグの厚さ、t1は第
一樹脂層の厚さ、t2は第二樹脂層の厚さ、をそれぞれ示
す。FIG. 1 is a side sectional view schematically showing an embodiment of the present invention, FIG. 2 is a side sectional view schematically showing the structure of a conventional resin-coated copper foil for a multilayer printed board, and FIG. It is a sectional side view which showed typically the structure of a multilayer printed board. In the figure, 3 is a resin layer, 3a is a first resin layer, 3b is a second resin layer,
5 is an intermediate layer resin plate, 8 is a prepreg, 10 is a matte surface, 11
Is a copper foil, 15 is an intermediate layer, 16 is a circuit pattern, 20 is a resin-coated copper foil, T is the thickness of the copper foil, k is the thickness of the prepreg, t 1 is the thickness of the first resin layer, and t 2 is The thickness of the second resin layer is shown respectively.
Claims (1)
成る多層プリント板用樹脂付き銅箔（20）の構成におい
て、 上記樹脂層（３）が、マット面（10）と直接接合する完
全硬化樹脂からなる第一樹脂層（3a）と、該第一樹脂層
（3a）に積層される半硬化樹脂からなる第二樹脂層（3
b）とによって構成されてなることを特徴とする多層プ
リント板用樹脂付き銅箔。1. A structure of a resin-coated copper foil (20) for a multilayer printed board, comprising a resin layer (3) on the mat surface (10) side, wherein the resin layer (3) is a mat surface (10). A first resin layer (3a) made of a completely cured resin that is directly bonded to the second resin layer (3a) made of a semi-cured resin laminated on the first resin layer (3a).
b) A resin-coated copper foil for a multilayer printed board, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61204242A JPH0719972B2 (en) | 1986-08-29 | 1986-08-29 | Copper foil with resin for multilayer printed boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61204242A JPH0719972B2 (en) | 1986-08-29 | 1986-08-29 | Copper foil with resin for multilayer printed boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6358997A JPS6358997A (en) | 1988-03-14 |
| JPH0719972B2 true JPH0719972B2 (en) | 1995-03-06 |
Family
ID=16487202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61204242A Expired - Fee Related JPH0719972B2 (en) | 1986-08-29 | 1986-08-29 | Copper foil with resin for multilayer printed boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719972B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0376296A (en) * | 1989-08-18 | 1991-04-02 | Tanaka Kikinzoku Kogyo Kk | Multilayer printed wiring board |
| US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
| WO1997002728A1 (en) * | 1995-07-04 | 1997-01-23 | Mitsui Mining & Smelting Co., Ltd. | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| US10751976B2 (en) | 2016-01-26 | 2020-08-25 | Panasonic Intellectual Property Management Co., Ltd. | Resin-clad metal foil and flexible printed wiring board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538771A (en) * | 1976-07-12 | 1978-01-26 | Fujitsu Ltd | Multilayer printed board |
| JPS5583294A (en) * | 1978-12-20 | 1980-06-23 | Fujitsu Ltd | Method of fabricating multilayer printed board |
| JPS5594075U (en) * | 1978-12-23 | 1980-06-30 | ||
| JPS56108292A (en) * | 1980-01-31 | 1981-08-27 | Mitsubishi Gas Chemical Co | Method of manufacturing copperrlined laminated plate |
-
1986
- 1986-08-29 JP JP61204242A patent/JPH0719972B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6358997A (en) | 1988-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |