JPS5594075U - - Google Patents
Info
- Publication number
- JPS5594075U JPS5594075U JP18178378U JP18178378U JPS5594075U JP S5594075 U JPS5594075 U JP S5594075U JP 18178378 U JP18178378 U JP 18178378U JP 18178378 U JP18178378 U JP 18178378U JP S5594075 U JPS5594075 U JP S5594075U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18178378U JPS5594075U (en) | 1978-12-23 | 1978-12-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18178378U JPS5594075U (en) | 1978-12-23 | 1978-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5594075U true JPS5594075U (en) | 1980-06-30 |
Family
ID=29193458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18178378U Pending JPS5594075U (en) | 1978-12-23 | 1978-12-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5594075U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6358997A (en) * | 1986-08-29 | 1988-03-14 | 富士通株式会社 | Copper foil with resin for multilayer printed board |
KR100502179B1 (en) * | 2002-02-25 | 2005-08-08 | 스마트알앤씨 주식회사 | Preparation of Metal Clad Laminate for Printed Circuit Board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS525547A (en) * | 1975-07-02 | 1977-01-17 | Hitachi Ltd | Method of exciting a path for conveying light |
-
1978
- 1978-12-23 JP JP18178378U patent/JPS5594075U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS525547A (en) * | 1975-07-02 | 1977-01-17 | Hitachi Ltd | Method of exciting a path for conveying light |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6358997A (en) * | 1986-08-29 | 1988-03-14 | 富士通株式会社 | Copper foil with resin for multilayer printed board |
KR100502179B1 (en) * | 2002-02-25 | 2005-08-08 | 스마트알앤씨 주식회사 | Preparation of Metal Clad Laminate for Printed Circuit Board |