JPH0719488B2 - Method for producing copper plated fine pitch heat seal connector member based on copper vapor deposition film - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a liquid crystal display tube, an ECD,
A desired length, lateral width and conductive path spacing width for mechanically and electrically connecting the electrode portion of an electronic element such as a solar cell and the printed circuit board terminal portion to the respective terminal portions facing each other. The present invention relates to a method for producing a copper-plated fine pitch heat seal connector member based on a copper vapor deposition film having

[0002]

2. Description of the Related Art As a conventional method for manufacturing a fine pitch heat seal connector of this type, a heat conductive seal paint is applied onto a flexible insulating film and a heat seal connector pattern is applied by screw printing. Then, it is heated and dried to form a conductive circuit, and the insulating thermocompression-bonding suspension paint is applied over the entire surface of the conductive circuit formed by this and the surrounding film portion by screen printing, and then heated and dried. Then, a thermocompression bonding layer is formed on the uppermost layer and then cut into a desired width and size.

Another method is to manufacture a heat seal connector having a copper foil layer of 15 to 35 μm on a flexible insulating film. In this method, a flexible insulating film to be the first base film and a copper thin film are bonded together using a thermosetting adhesive, and a conductive suspension paint is used on this base film to form a heat seal connector. The pattern is applied by screw printing, heated and dried. Next, the exposed copper portion on the film is removed by etching, washed with water and dried. The insulating thermocompression-bonding suspension coating is applied over the entire surface of the conductive circuit thus formed and the surrounding film by screen printing, heated and dried to form the thermocompression-bonded layer on the uppermost layer, and the desired length is obtained. Cut into width and dimensions.

[0004]

A conductive circuit is formed on the flexible insulating film by the conventional method, and a conductive circuit is formed by using the insulating thermocompression suspension coating. However, the method of manufacturing a fine pitch heat seal connector by forming the above-described method has a problem in that a stable low electric resistance value cannot be obtained and electrical reliability is lacking. Further, according to the method for manufacturing the heat seal connector having the copper foil layer of 15 to 35 μm on the flexible insulating film, there remains a problem to improve the adhesion between the flexible insulating film and the copper film layer.

Therefore, it is an object of the present invention to provide a method of manufacturing a fine pitch heat seal connector member which is superior in quality and reliability to the conventional fine pitch heat seal connector.

[0006]

The first method of the present invention, which has achieved the above object, is, as shown in the drawings, electronic elements such as liquid crystal display tubes, ECDs, electrode portions of solar cells and printed circuits. Copper-plated fine pitch based on a copper-deposited film having a desired length lateral width and a conductive path interval width for mechanically and electrically connecting the substrate portion to each terminal portion opposed thereto In the method for manufacturing a heat seal connector member, (A) a flexible insulating film, for example, a film of copper on the surface of a film of polyester, polyimide, aramid, or polycarbonate
Evaporate to a thickness of 0.1 to 0.5 μm, deposit a copper film on the deposited copper surface to a thickness of 1.0 to 10.0 μm by electrolytic copper plating, and then surface-treat it. Drying at a temperature of ~ 100 ° C,
(B) On the surface of the copper film obtained in the step (A), (a)
Graphite powder with a particle size of 0.1 to 60 μm, silver powder and particle size of 0.1 μm
10 to 60% by weight of conductive fine powder consisting of one or more of the following carbon black powders, and (b) one or more of chloroprene rubber, chlorosulfonated rubber, polyurethane resin and polyester resin An organic solvent comprising 5 to 30% by weight of a rubber-based or thermoplastic resin-based binder and one or more of (c) dimethylformamide, diacetone alcohol, isophorone, diethylcarbitol, butylcarbitol and turpentine oil 30 ~ 50% by weight
And (d) graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, nickel-plated copper powder, gold-plated nickel powder, gold-plated with a grain size of 1.0-50.0 μm. 5 to 70% by weight of conductive fine powder made of one or more of tin beads, nickel beads, and gold-plated resin beads, such as phenol beads, carbon beads, styrene beads, and glass beads. Apparent specific gravity of 0.9 mixed with (a + b + c + d)
~ 2.3, viscosity 300 ~ 12000 poise of conductive anisotropic suspension paint, electronic elements such as liquid crystal display tube, ECD, electrode parts of solar cells and printed circuit board terminal part,
A vertical striped strip heat seal connector pattern having a desired length and width and a width of each conductive path for mechanically and electrically connecting to the respective terminal portions facing each other is applied by screen printing. , Heating and drying, and (C) the exposed copper portion on the film provided with the heat seal connector pattern is removed by pattern etching using ferric chloride and hydrochloric acid, and then washed with water to remove the enching solution. Thoroughly wash the film and keep the film at 40 ℃ to 100 ℃
And the step (D) of the above step (A + B +
The desired vertical striped striped pattern formed by depositing the conductive anisotropic coating layer on the copper surface, which is formed in C), and the entire remaining exposed film portion around it.
(I) 5 to 30% by weight of powder composed of one or more of titanium oxide, talc, hydrated alumina and colloidal silica
And (ii) chloroprene synthetic rubber, polyester resin,
20-60 wt% of a thermoplastic resin binder comprising one or more of ethylene vinyl acetate copolymer resin and polymethylmethacrylate resin, and (iii) isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene and 10 to 70% by weight of an organic solvent consisting of one or more of diethylcarbitol, and (iv) a tackifier consisting of one or two of a terpene resin and an aliphatic hydrocarbon resin 0.1 to 20% by weight. And (i + ii + iii + iv) were dissolved and uniformly dispersed to give an apparent specific gravity of 0.8 to 1.4 and a viscosity of 15
0-5000 poise of the insulating thermocompression-bonding suspension coating is applied to the entire surface by screen printing and heat-drying to form a thermocompression-bonding layer on the uppermost layer, and (E) the above-mentioned step (A + B + C +).
And (d) forming a film having a thermocompression bonding layer on the uppermost layer and having a desired conductive circuit pattern on the lower layer thereof into a desired length and width.

In the above step (A), when the plating thickness of the copper coating deposited on the surface of the vapor-deposited copper by electroplating is less than 1.0 μm, the electric resistance value is high and the allowable current amount is small, while when it is thicker than 10 μm. The reliability of folding endurance decreases. If the drying temperature is lower than 40 ° C, the drying will be insufficient, and if it is higher than 100 ° C, the copper surface will be significantly oxidized and discolored.
It shall be in the range of 40 to 100 ℃.

In the above step (B), if the conductive fine powder of (a) is less than 10% by weight, the conductivity will be insufficient and the electric resistance will be too high, and if it exceeds 60% by weight, the adhesion of the coating film will be poor. It becomes worse and the folding endurance is also reduced. 5% by weight of (b) binder
If it is less than 60% by weight, the folding resistance is lowered and the adhesion of the coating film is lowered, and if it exceeds 30% by weight, the electric resistance is increased, which is not preferable. When the organic solvent (c) is less than 30% by weight, the printability is deteriorated and the drying becomes extremely fast, while when it is more than 50% by weight, the printability is deteriorated, which is not preferable. If the particle size of the conductive fine particles of (d) is less than 1.0 μm, it is difficult to obtain on the market and the cost becomes high, while if it is larger than 50.0 μm, it is difficult to obtain a uniform coating film and the electric resistance value becomes unstable. . If the content of the conductive fine powder is less than 5% by weight, the conductivity is insufficient, and if it is more than 70% by weight, the coating film becomes brittle and the folding durability is deteriorated, which is not preferable.

In the step (D), if the amount of the powder of (i) is less than 5% by weight, the coating thickness is not satisfied, while
If the content is more than 10% by weight, the adhesive force of the resulting coating composition is reduced and the printing leveling property is reduced. If the blending amount of the thermoplastic resin binder (ii) is less than 20% by weight, the adhesive force of the coating material will be reduced, and if it exceeds 60% by weight, the printed coating film thickness will be reduced and the adhesive force will also be reduced. If the compounding amount of the organic solvent (iii) is less than 10% by weight, printing cannot be performed and drying is too fast, which is not preferable, and if it exceeds 70% by weight, the adhesive force is lowered, which is not preferable.

In the second method of the present invention, (a) a flexible insulating film such as polyester, polyimide, aramid or polycarbonate film having a thickness of 0.1 to 0.5 μm is used.
Copper is vapor-deposited on m, and a copper film of 1.0 to 10.0 μm is deposited and surface-treated on this copper-deposited copper surface by electrolytic copper plating, and then the plating solution is thoroughly washed off with water and the film is cooled to 40 to 100 ° C. And (b) silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, nickel having a grain size of 1.0 to 50.0 μm on the copper film obtained in the above step (a). Conductive fine powder made of one or more of glass or copper powder plated and then gold-plated, gold-plated nickel powder, gold-plated tin powder, and nickel-plated and further gold-plated resin bead powder Photoetchin containing 1 to 40% by weight as a main component of a photosensitive acrylic polymer resin and acrylic ester used as a photoresist or a photosensitive epoxy polymer resin Gresist ink 60
Apparent specific gravity of ~ 99 wt% mixed and evenly dispersed
Apply a photo-etching resist paint with conductivity of 0.9 to 2.0 and grain size of 0.1 to 1000 poise to a thickness of 5 to 30 μm, and dry at a temperature of 20 to 70 ° C for 10 minutes to 12 hours. And (c) the coating and drying step (b)
An ultraviolet exposure step of placing a negative film on which a vertical striped strip pattern having a desired dimension is drawn on the coated surface, and performing ultraviolet exposure to cure the desired pattern portion, (d)
The uncured portion of the conductive photo-etching resist coating film that has undergone the ultraviolet exposure step (c) is washed away with a weak alkaline aqueous solution to remove, dried at a temperature of 30 to 120 ° C., and cured photo-etching. A step of forming a pattern on a desired portion coated with a resist coating film, and (e) all exposed copper portions on the film after the step (d) are removed by etching, and then the etching solution is thoroughly washed off with water. , A step of drying the film at a temperature of 40 to 100 ° C., and (f) a desired photo-etching resist layer formed in the above step (a + b + c + d + e) and left on the surface of the copper film, which is left as deposited. Use an insulating thermocompression suspension paint with an apparent specific gravity of 0.8 to 1.4 and a viscosity of 150 to 5000 poise over the entire pattern and the remaining exposed film. Then, the whole surface is applied by screen printing, and heat-dried to form a thermocompression-bonding layer on the uppermost layer, and (g) the thermocompression-bonding layer is formed on the uppermost layer formed in the above step (a + b + c + d + e + f) A step of cutting a copper vapor deposition film having a desired conductive circuit pattern into desired length and width dimensions.

In the step (b), if the conductive fine powder constituting the photoetching resist coating is less than 1% by weight and the photoetching resist ink is more than 99% by weight, the conductivity is insufficient, while the conductive fine powder is 40% by weight
More, 60% by weight photo-etching resist ink
When the amount is less than the above, it has an adverse effect on photocuring by exposure. The photo-etching resist coating is coated with a thickness of 5 to 30 μm. If the coating thickness is less than 5 μm, the performance of bending and bending of the coating decreases, and if it exceeds 30 μm, it is hard to be exposed to ultraviolet rays and the development is difficult. This is because it cannot be done satisfactorily.

The heat seal connector member obtained by the method of the present invention has a thermocompression bonding layer at one end of a copper vapor deposition film, an electrode portion of an electronic element such as a liquid crystal display tube, an ECD, a solar cell and a printed circuit board terminal. Part of the connector film, and the thermocompression-bonding layer at the other end is brought into contact with each of the terminal parts facing each other, and both end parts of one side of the connector film are heated at a temperature of 100 to 200 ° C and a pressure of 10 to 70 kg / cm ² . They can be thermocompression bonded and heat-sealed integrally. If the heating temperature is lower than 100 ° C., it does not come into contact, and if it is higher than 200 ° C., the thermocompression-bonding suspension paint is decomposed, and the flexible film shrinks, so it is preferably in the range of 100 to 200 ° C. the pressure did not adhere is less than 10kg / cm ^2, 70kg /
If it is larger than cm ² , the conductive circuit may break, so 10-70 kg /
It is preferably cm ² .

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an enlarged view of a heat seal connector member according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II '. Reference numeral 1 is a flexible insulating film, 2 is a copper coating layer (copper vapor deposition layer + copper plating layer), 3 is a conductive anisotropic circuit, and 4 is an insulating thermocompression bonding layer. Further, FIG. 3 shows a cross section of a main part of the heat seal connector member after thermocompression bonding, and FIG. 4 shows an example of use of the heat seal connector member. 5 is various displays, 6 is a printed circuit board, 7
Is the heat seal connector member, 8 is the electrode portion of the liquid crystal display tube, and 9 is the end portion of the printed circuit board. Hereinafter, the present invention will be described with reference to Examples. Example 1 (1. By screen printing method) A 25 μm thick polyester film was coated with copper to a thickness of 0.5 μm.
m After depositing a copper film of 1.0 to 1.5 μm on the copper surface of the vapor-deposited copper vapor-deposited film in an electrolytic copper sulfate plating bath, applying rust-prevention treatment, then washing with water and removing water with an air blower And dried in a far infrared dryer at 85 ° C. for 2 minutes (step A).

On the copper surface of the copper vapor-deposited film having the copper coating deposited thereon, (a) 30% by weight of graphite powder having a particle size of 0.1-60 μm, 5% by weight of carbon black having a particle size of 0.1 μm or less, (b)
Polyurethane resin 20% by weight, (C) Isophorone 20% by weight, Dimethylformamide 5% by weight, (D) Particle size 20-30
Mixed with 20% by weight of glass bead powder, which was plated with μm nickel and further plated with gold (a + b + c + d)
Dissolved and uniformly dispersed, apparent specific gravity 1.4, viscosity 6500
A desired pattern was applied by screen printing using Poise's conductive anisotropic suspension paint, and heated and dried in a far-infrared oven at 115 ° C (step B).

The copper vapor-deposited film that has undergone the printing / drying process (B) is added to 1 L of water to 100 mL of ferric chloride solution, 1 to 0.5 mL.
Then, the exposed copper portion was completely removed by etching, and then the etching solution was thoroughly washed with water and dried in warm air at 100 ° C. for 2 minutes (step C).

Formed in the above step (A + B + C),
The insulative thermocompression suspension paint was applied over the desired conductive circuit pattern consisting of the conductive anisotropic paint layer and the copper coating layer and the remaining exposed film around it. The composition of this paint is titanium oxide 10% by weight, chloroprene synthetic rubber 45
Wt%, xylene 25 wt%, methyl isobutyl ketone 10
% Of isophorone and 2.5% by weight of terpene resin, and had an apparent specific gravity of 1.0 and a viscosity of 500 poises. It was dried by heating to form a thermocompression bonding layer (step D).

Next, the heat-sealed connector film thus formed was cut into desired lengths and dimensions (step E).

Thus, a copper plated fine pitch heat seal connector member based on the copper vapor deposition film was obtained. The thermocompression-bonding layer at one end of the connector film of the obtained member was brought into contact with the electrodes of the liquid crystal display tube, and the thermocompression-bonding layer at the other end was brought into contact with the printed circuit board terminal portion, and both end portions of the one surface of the connector film were contacted. Were thermocompressed at a heating temperature of 180 ° C. and a pressure of 45 kg / cm ² to integrate them. In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

Example 2 (2. By Photo Etching Method) A copper film was formed on a copper surface of a copper vapor-deposited film obtained by vapor-depositing copper on a polyester having a thickness of 25 μm by a thickness of 0.3 μm in an electrolytic copper sulfate plating bath. 1.0 to 1.5 μm is deposited, anticorrosion treatment is performed, then the plating solution is washed off with water, the water is well removed with an air blower, and then dried in a far infrared dryer at 85 ° C for 2 minutes. (Step a).

5% by weight of glass bead powder in which the copper surface of the copper-deposited film on which the copper coating is deposited is nickel-plated with a grain size of 10 to 15 μm and further gold-plated, 5% by weight of a photocurable acrylic resin for photoresist. Ink stock solution prepared by blending 25% by weight of polymer resin, 10% by weight of acrylic ester photopolymerization initiator, 40% by weight of ethyl cellosolve acetate, 20% by weight of toluene, 3% by weight of xylene and 2% by weight of methyl ethyl ketone, that is, photoresist ink 95
The above resin bead powder was added to and mixed with the weight% of the mixture, and a photoetching resist conductive paint having an apparent specific gravity of 0.9 and a particle size of 15 poise that was uniformly dispersed was coated to a thickness of 20 μm, and the temperature was 70 ° C. for 2 hours. Dried (step b).

A negative film having a negative pattern of a desired pattern is placed on the surface of the resist coated on the dried copper film, vacuum-contacted and exposed to ultraviolet light (45 mJ / cm ² ), and the pattern portion is ultraviolet-cured. (Step c).

Photoetching resist on the copper film which has been exposed to ultraviolet rays The portion of the conductive coating which is not ultraviolet-cured (the portion other than the pattern) is developed and removed with a weak alkaline aqueous solution, washed thoroughly with water, and then blown with air. The water on the copper film was blown off and dried at a temperature of 60 ° C for 60 minutes (step d).

All the portions of the copper-deposited film where the copper was directly exposed on the surface were removed by etching, after which the etchant was thoroughly washed off with water and dried in warm air at 140 ° C. for 1 minute (step e). .

An insulative thermocompression suspension paint is applied over the entire desired pattern in which the above-mentioned UV-cured photo-etching resist layer is left deposited on the surface and the remaining exposed film portion around it. Then, a thermocompression bonding layer was formed. The composition of this paint is 20% by weight of hydrated alumina,
Ethylene-vinyl acetate copolymer resin 40% by weight, toluene
It was 10% by weight, 5% by weight of methyl isobutyl ketone, 10% by weight of isophorone, and 15% by weight of terpene resin, and had an apparent specific gravity of 1.3 and a viscosity of 1000 poises (step f).

Next, the substrate film thus formed with the thermocompression bonding layer was cut into a desired length and width (step g).

Thus, a copper plated fine pitch heat seal connector member based on the copper vapor deposition film was obtained. The thermocompression-bonded layer on one end of the connector film of this connector member is attached to the liquid crystal display tube electrode terminal (pitch 0.3 mm)
, And the thermocompression bonding layer at the other end was brought into contact with the printed circuit board terminal portion, and both ends of one surface of the connector film were thermocompression bonded at a heating temperature of 160 ° C. and a pressure of 40 kg / cm ² to be integrated with each other. In practical use, the above-mentioned members have sufficiently satisfactory results in terms of electrical and mechanical connections, and the remarkable effects of the present invention have been confirmed.

Example 3 (1. by screen printing method) A polyester film having a thickness of 25 μm and copper having a thickness of 0.3 μm
m On the copper surface of the vapor-deposited copper vapor-deposited film, deposit a copper film of 2.5 to 3.5 μm in an electrolytic copper sulfate plating bath, perform rust-prevention treatment, then wash with water and sufficiently remove water with an air blower. Then, it was dried in a far infrared dryer at 110 ° C. for 5 minutes.

On the copper surface of the copper vapor-deposited film having the copper coating deposited thereon, (a) 40% by weight of graphite powder having a particle size of 0.1 to 60 μm, (b) 20% by weight of chlorosulfonated rubber, and (c) 15% by weight of isophorone. %, Diacetone alcohol 5% by weight,
(D) Mix 20% by weight of styrene resin bead powder that is nickel-plated with a particle size of 10 to 15 μm and further gold-plated (a + b + c + d), and dissolve and evenly disperse it to give an apparent specific gravity of 1.2 and viscosity. Apply a desired pattern by screen printing using 5000 poise of conductive anisotropic suspension paint,
It was heated and dried in a far-infrared oven at 120 ° C (process B).

The copper vapor-deposited film that has undergone the printing / drying step (B) is treated with the same mixed solution of ferric chloride solution and hydrochloric acid as in Example 1 to remove all exposed copper portions by etching. Rinse the etchant well with the water,
It was dried in warm air of 0 ° C. for 3 minutes (step C).

Formed in the step (A + B + C),
The insulative thermocompression suspension paint was applied over the desired conductive circuit pattern consisting of the conductive anisotropic paint layer and the copper coating layer and the remaining exposed film around it. The composition of this paint is (i) titanium oxide 10% by weight, (ii) chloroprene synthetic rubber 45% by weight, (iii) xylene 25% by weight, methyl isobutyl ketone 10% by weight, isophorone 7.5% by weight,
(iv) Consists of 2.5% by weight of terpene resin (i + ii + iii
+ Iv), the apparent specific gravity was 1.0, and the viscosity was 700 poise.
It was dried by heating to form a thermocompression bonding layer (step D).

In the subsequent steps, a copper plated fine pitch heat seal connector member based on a copper vapor deposition film was obtained in the same manner as in Example 1, and the same thermocompression bonding was performed. In the case of practical use, the same satisfactory results as in Example 1 were obtained in electrical and mechanical connection, and the remarkable effect of the present invention was confirmed.

Example 4 (1. By screen printing method) A polyester film having a thickness of 38 μm and copper having a thickness of 0.5 μm
m On the copper surface of the vapor-deposited copper vapor-deposited film, deposit a copper film of 5 μm in an electrolytic copper sulfate plating bath, perform rust-prevention treatment, then rinse off the plating solution etc. well with water and dry with an air blower. After being sufficiently cut, it was dried in a far infrared dryer at 120 ° C. for 5 minutes (step A). (

On the copper surface of the copper vapor-deposited film having the copper coating deposited thereon, (a) 45% by weight of silver powder having a grain size of 0.1 to 60 μm,
10% by weight of graphite powder having a particle size of 0.1 to 60 μm, (B) 7% by weight of chloroprene rubber, (C) 10% by weight of isophorone, 8% by weight of diacetone alcohol, (D) 20% by weight of gold-plated nickel powder having a particle size of 20 to 30 μm And mixed (I + B + C +
D) Dissolved and evenly dispersed apparent specific gravity of 1.7, particle size
A desired pattern was applied by screen printing using a conductive anisotropic suspension paint of 8000 poise, and heated and dried in a far-infrared oven at 100 ° C (step B).

The copper vapor-deposited film that has undergone the printing / drying step (B) is treated with the same mixed solution as in Example 1 to remove all exposed portions by etching, and then rinsed with water to remove the etching solution. Wash off and wash in warm air at 120 ° C for 3
Dry for minutes (step C).

Formed in the step (A + B + C),
The insulative thermocompression suspension paint was applied over the desired conductive circuit pattern consisting of the conductive anisotropic paint layer and the copper coating layer and the remaining exposed film around it. The composition of this paint is (i) talc 5% by weight, (ii) polyethylmethacrylate resin 60% by weight, (iii) toluene 10% by weight, diacetone alcohol 10% by weight, methyl isobutyl ketone.
It had an apparent specific gravity of 1.4 and a viscosity of 500 poise. It was dried by heating to form a thermocompression bonding layer (step D).

In the subsequent steps, a copper-plated fine pitch heat seal connector member based on a copper vapor deposition film was obtained by substantially the same method as in Example 2, and the same thermocompression bonding was performed. In the case of practical use, the same satisfactory results as in Example 1 were obtained in electrical and mechanical connection, and the remarkable effect of the present invention was confirmed.

Example 5 (1. By screen printing method) A copper film was formed on a copper surface of a copper vapor-deposited film obtained by vapor-depositing copper on a polyimide film having a thickness of 25 μm to a thickness of 0.3 μm in an electrolytic copper sulfate plating bath. 3.0 to 5.0 μm was deposited, treated with rust, washed with water, drained with an air blower, and then dried in a far infrared dryer at 85 ° C. for 3 minutes (step A).

On the copper surface of the copper vapor-deposited film having the copper coating deposited thereon, (a) 30% by weight of graphite powder having a particle size of 0.1 to 60 μm, 5% by weight of carbon black of 0.1 μm or less, (b)
Chloroprene rubber 20% by weight, (C) isophorone 20% by weight, dimethylformamide 5% by weight, (D) particle size 5 to 15
Conductive anisotropy with apparent specific gravity of 1.6 and viscosity of 5500 vise mixed with 20% by weight of polystyrene bead powder plated with μm nickel and gold plated further (a + b + c + d) A desired pattern was applied by screen printing using a suspension paint, and heated and dried in a far-infrared oven at 100 ° C (step B).

The copper vapor-deposited film that has undergone the printing / drying step (B) is added to 1 liter of water in an amount of 100 ml of ferric chloride solution, 1.0
It was treated with a mixed solution containing ~ 0.5 ml of hydrochloric acid to remove all exposed copper parts by etching, and then the etchant was thoroughly rinsed with water and dried in warm air at 80 ° C for 2 minutes (step C).

Formed in the step (A + B + C),
The insulative thermocompression suspension paint was applied over the desired conductive circuit pattern consisting of the conductive anisotropic paint layer and the copper coating layer and the remaining exposed film around it. The composition of this coating is 40% by weight of nitrile rubber / modified phenolic resin,
Isophorone 30% by weight, xylene 20% by weight, titanium oxide 10
It had an apparent specific gravity of 1.2 and a viscosity of 650 poise. It was dried by heating to form a thermocompression bonding layer (step D).

Next, the heat-sealed connector film thus formed was cut into desired lengths and dimensions (step E).

Thus, a copper plated fine pitch heat seal connector member based on the copper vapor deposition film was obtained. The thermocompression-bonding layer at one end of the connector film of the obtained member was brought into contact with the electrodes of the liquid crystal display tube, and the thermocompression-bonding layer at the other end was brought into contact with the printed circuit board terminal portion, and both end portions of the one surface of the connector film were contacted. Were thermocompression-bonded at a heating temperature of 185 ° C. and a pressure of 40 kg / cm ² to integrate them. In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

Example 6 (1. By Screen Printing Method) A copper film was formed on a copper surface of a copper vapor-deposited film in which copper was vapor-deposited on an aramid film having a thickness of 16 μm to a thickness of 0.3 μm with an electrolytic copper sulfate plating bath. 2.0 ~ 3.0 μm deposited, rustproofed, washed with water and drained with an air blower,
It was dried in a far infrared dryer at 85 ° C. for 3 minutes (step A).

On the copper surface of the copper vapor-deposited film having the copper coating deposited thereon, (a) 30% by weight of graphite powder having a particle size of 0.1 to 60 μm, 5% by weight of carbon black of 0.1 μm or less, (b)
Chloroprene rubber 20% by weight, (C) isophorone 20% by weight, dimethylformamide 5% by weight, (D) particle size 10 to 20
Mixed with 20% by weight of phenol resin powder, which was plated with μm nickel and further plated with gold (a + b + c +
D) Apparent specific gravity of 1.8 after dissolution and uniform dispersion, particle size
A desired pattern was applied by screen printing using a conductive anisotropic suspension paint of 7800 poise, and dried by heating in a far infrared oven at 110 ° C (step B).

The copper vapor-deposited film that has undergone the printing / drying process (B) is added to 1 liter of water with 100 ml of ferric chloride solution, 1.0
It was treated with a mixed solution containing ~ 0.5 ml hydrochloric acid to remove all exposed copper parts by etching, and then rinsed with water to thoroughly wash away the etching solution, and dried in warm air at 100 ° C for 1 minute (step C).

Formed in the step (A + B + C),
The insulating thermocompression suspension material was applied over the conductive anisotropic paint layer, the desired conductive circuit pattern consisting of the copper coating layer, and the remaining exposed film around it. The composition of this paint is: epoxy resin 35% by weight, methyl ethyl ketone 25% by weight, xylene 25% by weight, isophorone 10% by weight,
Consists of 10% by weight of leosin, apparent specific gravity 1.4, viscosity 400
It was a poise. It was dried by heating to form a thermocompression bonding layer (step D).

Next, the heat-sealed connector film thus formed was cut into desired lengths and dimensions (step E).

The copper plated fine pitch heat seal connector member based on the copper vapor deposition film thus obtained was thermocompression bonded in the same manner as in Example 6, and the heating temperature was 175 ° C.
The pressure was 35 kg / cm ² , and they were integrated for 20 seconds. In practical use, satisfactory results were obtained electrically and mechanically, and the remarkable effect of the present invention was recognized.

Example 7 (2. By Photo Etching Method) A polyimide film having a thickness of 25 μm and copper having a thickness of 0.5 μm
On the copper surface of the vapor-deposited copper vapor-deposited film, deposit a copper film of 1.0 to 2.0 μm in an electrolytic copper sulfate plating bath, perform anticorrosion treatment, and then rinse with water to thoroughly wash off the plating solution, etc., and use an air blower. After removing water well, it was dried in a far infrared dryer at 80 ° C. for 3 minutes (step a).

On the copper surface side of the copper vapor deposition film on which the copper coating is deposited, 3% by weight of nickel powder having a grain size of 5 to 20 μm and further gold plating, 3% by weight of a photocurable acrylic polymer for photoresists are used. Ink stock solution prepared by blending 25% by weight of resin, 10% by weight of acrylic ester photopolymerization initiator, 40% by weight of ethyl cellosolve acetate, 20% by weight of toluene, 5% by weight of xylene and 2% by weight of methyl ethyl ketone, that is, photoresist ink 97 3% by weight of conductive filler was added to and mixed by weight, and a photoetching resist conductive paint with an apparent specific gravity of 1.1 and a viscosity of 30 poise that was evenly dispersed was coated to a thickness of 10 μm, and the temperature was 60 ° C at 80 ° C. Dry for minutes (step b).

A negative film on which a negative of a desired pattern is drawn is placed on the resist-coated surface of the dried copper film, which is vacuum-contacted and exposed to ultraviolet rays (30 mJ / cm ² ) to cure the pattern portion with ultraviolet rays. (Step c). Photo-etching resist on the copper film that has been exposed to UV light The part of the conductive paint that is not UV-cured (the part other than the pattern) is developed and removed with a weak alkaline aqueous solution, rinsed well, and then on the copper film with an air blower. Water was blown off, and it was dried at a temperature of 80 ° C. for 60 minutes (step d).

All parts of the copper-deposited film where the copper was directly exposed on the surface were removed by etching, and then the etching solution was thoroughly washed off with water and dried in warm air at 120 ° C. for 1 minute (step e). .

An insulating thermocompression suspension paint is applied over the entire desired pattern in which the above-mentioned UV-cured photo-etching resist layer is left deposited on the surface and the remaining exposed film portion around it. Then, a thermocompression bonding layer was formed. The composition of this paint is 40% by weight of nitrile rubber special synthetic resin, 20% by weight of phenolic resin powder, and toluene.
The content was 10% by weight, 10% by weight of isophorone, 5% by weight of methyl isobutyl ketone, 15% by weight of isocyanate, an apparent specific gravity of 1.2 and a viscosity of 750 poise (step f).

Next, the heat seal connector film having the thermocompression bonding layer thus formed was cut into desired lengths and widths (step g). Thus, a copper plated fine pitch heat seal connector member based on the copper vapor deposition film was obtained.

This connector member was thermocompression bonded in the same manner as in Example 6 (heating temperature 180 ° C., pressure 40 kg / cm ² , 20 seconds) and integrated into each. In practical use, the above-mentioned members were sufficiently satisfactory in terms of electrical and mechanical connections, and the remarkable effects of the present invention were recognized.

[0056]

The fine pitch heat seal connector member having the copper coating layer based on the copper vapor deposition layer of the present invention is a conventional fine pitch heat seal connector member having a conductive suspension on a flexible insulating film. A stable low electric resistance value is obtained by having a copper film layer under the conductive circuit composed of the conductive anisotropic suspension paint, while it is composed of the conductive circuit composed of the paint and the insulating thermocompression bonding layer. can get.
As a result, the electrical reliability becomes higher than that of the conventional fine-pitch heat seal connector, and a better and more reliable effect can be seen due to the fine pitch correspondence.

Further, the heat seal connector member of the present invention has a copper foil layer of 15 to 35 μm on a conventional flexible insulating film.
The heat seal connector member having a base film having a three-layer structure having a binder layer between the film and the copper foil layer has a two-layer structure in which the copper film layer is immediately adhered to the flexible insulating film. Since it is a base film, the adhesiveness between the flexible insulating film and the copper film is remarkably excellent, and the heat seal connector can be made thinner.

Thus, the heat seal connector member obtained by the present invention can be widely used in electric and electronic equipment, word processors, watches, cameras and the like.

[Brief description of drawings]

FIG. 1 is an enlarged schematic front view showing a heat seal connector member of an embodiment of the present invention.

FIG. 2 is an enlarged schematic cross-sectional view taken along the line II-II ′ of FIG.

FIG. 3 is a schematic cross-sectional view showing an enlarged main part of the heat seal connector member according to the present invention after thermocompression bonding.

FIG. 4 is a perspective view showing a usage example of the heat seal connector member according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flexible insulating film 2 Copper film layer (copper vapor deposition layer + copper plating layer) 3 Conductive anisotropic circuit 4 Insulation thermocompression bonding layer 5 Various displays 6 Printed circuit board 7 Heat seal connector member according to an embodiment of the present invention 8 Electrode part of liquid crystal display tube 9 Printed circuit board terminal part

Claims (2)

[Claims] 1. A copper-plated fine pitch heat seal based on a copper vapor-deposited film for mechanically and electrically connecting an electrode portion of an electronic element and a printed circuit board portion to respective terminal portions facing each other. When manufacturing the connector member, (A) a copper film having a thickness of 0.1 to 0.5 is formed on the surface of the flexible insulating film.
of the copper film obtained in the step (B) and the step (A) in which the copper film is deposited and surface-treated to a thickness of 1.0 to 10.0 μm by electrolytic copper plating on the copper surface of the copper vapor deposition film. (A) Graphite powder with a particle size of 0.1 to 60 μm, silver powder and particle size on the surface.
10 to 60% by weight of conductive fine powder consisting of one or more kinds of carbon black powder of 0.1 μm or less, and (b) one or more kinds of chloroprene rubber, chlorosulfonated rubber, polyurethane resin and polyester resin 5 to 30% by weight of a rubber-type and thermoplastic resin-type binder consisting of (C) dimethylformamide, diacetone alcohol,
Organic solvent consisting of one or more of isophorone, diethyl carbitol, butyl carbitol and turpentine oil.
30 to 50% by weight, (d) graphite powder with a particle size of 1.0 to 50.0 μm, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, nickel-plated copper powder with gold plating, Conductive fine powder consisting of one or more of gold-plated nickel powder, gold-plated tin powder, and resin-bead powder plated with nickel and then gold-plated 5
70% by weight was mixed (I + B + C + D) to be dissolved and uniformly dispersed, using an electrically conductive anisotropic suspension paint with an apparent specific gravity of 0.9 to 2.3 and a viscosity of 300 to 12000 poises A vertical striped strip-shaped heat having a desired length, a lateral width, and a width between conductive paths for mechanically and electrically connecting the electrode portion and the printed circuit board terminal portion to respective terminal portions facing each other. A step of applying a seal connector pattern by screen printing, heating and drying, and (C) pattern-exposing the exposed copper portion on the film having the heat seal connector pattern using ferric chloride and hydrochloric acid. The step of removing, then thoroughly washing off the enching solution by washing with water, and drying the film at a temperature of 40 ° C to 100 ° C, and (D) the conductive paint layer formed in the step (A + B + C) on the copper surface. (I) one or two of titanium oxide, talc, hydrated alumina and colloidal silica over the entire desired striped striped pattern left on the surface and the remaining exposed film portion around it. 5 to 30% by weight of powder composed of the above, (ii) chloroprene synthetic rubber,
Thermoplastic resin binder comprising one or more of polyester resin, ethylene-vinyl acetate copolymer resin and polymethylmethacrylate resin, or thermosetting resin binder comprising one or more of phenol resin and epoxy resin. 20-60% by weight of the agent, (iii) 10-70% by weight of an organic solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene and diethyl carbitol, and (iv) terpene 0.1 to 20% by weight of a tackifier consisting of one or two of a resin and an aliphatic hydrocarbon resin are mixed (i + ii + iii + iv), dissolved and uniformly dispersed to give an apparent specific gravity of 0.8 to 1.4 and a viscosity of 15
In the process of applying the whole surface by screen printing using an insulating thermocompression-bonding suspension paint of 0 to 5000 poise, and drying by heating to form the thermocompression-bonding layer on the uppermost layer, (E) In the process (A + B + C + D) Forming a thermocompression-bonded layer as an uppermost layer and cutting a film having a desired conductive circuit pattern as an underlying layer into desired length and width dimensions; Method for manufacturing plated fine pitch heat seal connector member. 2. A flexible insulating film having a thickness of 0.1 to
Copper is vapor-deposited to 0.5 μm, and a copper film of 1.0 to 10.0 μm is deposited and surface-treated on this vapor-deposited copper surface by electrolytic copper plating, and then the plating solution is thoroughly washed off with water to remove the film at 40 to 100 ° C. Grain size 1. on the surface of the copper film obtained in the step of drying at temperature and (b) step (a).
0 to 50.0 μm silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, nickel-plated glass or copper powder, gold-plated nickel powder, gold-plated tin powder, nickel-plated One of the resin bead powders which is further gold plated
1 to 40% by weight of conductive fine powder composed of two or more kinds,
Photosensitive acrylic polymer resin and acrylic ester used as a photoresist, or 60 to 99% by weight of a photo-etching resist ink containing a photosensitive epoxy polymer resin as a main component, and an apparent specific gravity of 0.9 evenly dispersed. ~ 2.0, grain size 0.1 ~ 1000 Poise conductive photo-etching resist paint with a thickness of 5 ~
Coat to 30 μm and keep at a temperature of 20 to 70 ℃ for 10 to 12 minutes.
A coating / drying step of time-drying, and (c) a negative film on which a striped stripe pattern of a desired size is drawn is placed on the coating surface that has undergone the coating / drying step (b), and exposed to ultraviolet light. And an ultraviolet exposure step of curing a desired pattern portion, and (d) an uncured portion of the conductive photoetching resist coating film which has completed the ultraviolet exposure step (c) is washed away with a weak alkaline aqueous solution to remove it. , A step of forming a pattern of a desired portion on which a cured photo-etching resist coating film is applied by drying at a temperature of 30 to 120 ° C., and (e) exposed copper on the film which has finished the step (d). All the parts are removed by etching, and then the etching solution is thoroughly washed off with water, and the film is dried at a temperature of 40 to 100 ° C., and (f) is formed in the step (a + b + c + d + e),
A desired pattern left by depositing the UV-cured photo-etching resist layer on the copper film surface, and the entire remaining exposed film portion around it, an apparent specific gravity of 0.8 to 1.4 and a viscosity of 150 to 5000 poise. A step of applying an insulating thermocompression-bonding suspension paint on the entire surface by screen printing and heating and drying to form a thermocompression-bonding layer on the uppermost layer; and (g) the uppermost layer formed in the step (a + b + c + d + e + f). 2. A copper-deposited film having a thermocompression-bonding layer and a copper-deposited film having a desired conductive circuit pattern as an underlying layer is cut into desired length and width dimensions. A method for manufacturing a copper-plated fine-pitch heat seal connector member used as a base.