JPH07185798A - Liquid transfer device and liquid transfer method - Google Patents

Abstract

PURPOSE:To completely peel a member for transfer of a liquid, such as device, from a liquid, such as flux and to improve the yield. CONSTITUTION:This liquid transfer member has a member-for-transfer setting means 10 for setting the member 12 for transfer, a liquid housing means 14 for housing the liquid 20, an operating means 70 for parting the member 12 for transfer from the liquid 20 of the liquid housing means 14 by bringing the member 12 for transfer fixed to the member-for-transfer setting means 10 into contact with the liquid 20 of the liquid housing means 14 and a gas imparting means 90 for introducing gas to the liquid housing means 14 and imparting the gas to the member 12 for transfer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid transfer device and a liquid transfer method for transferring a liquid such as flux onto an object such as a printed circuit board or a flexible circuit board of an electronic device. is there.

[0002]

2. Description of the Related Art Conventionally, when transferring or applying a flux to a solder of a substrate, the flux is applied to the bump (protruding portion) side of a liquid transfer member and to the substrate side without applying the flux. It was applying. However, in the method of applying the flux to the substrate side, the flux is apt to be excessively supplied to the substrate side, so that the method of transferring the flux to the bump has been adopted.

The method of transferring the flux to the bumps is performed as follows. The conventional flux transfer device shown in FIG. 9 has a nozzle 1 and a dish 6. A device 3 which is a member for liquid transfer having bumps 4 is attracted to the nozzle 1 by a suction pressure 2. Further, the flux 6 is applied to the dish 6. Then, the nozzle 1 is replaced with the dish 6
Side down and when the bump 4 is connected to the plate 6, the nozzle 1
The flux 5 was transferred to the bump 4 by the raising operation. After that, the bumps 4 of the device 3 that are adsorbed and fixed to the nozzle 1 are brought into contact with the solder on the substrate to transfer the flux to the solder.

[0004]

However, in this conventional flux transfer method, when the viscosity of the flux 5 is large, the attraction pressure 2 is defeated by the viscosity of the flux 5 and the device 3 is left behind on the plate 6. There was something. Therefore, the peeling of the device 3 from the flux 5 is incomplete, and the yield is poor.

Therefore, the present invention has been made to solve the above problems, and a transfer member for a liquid such as a device can be completely separated from a liquid such as a flux, thereby improving the yield. An object of the present invention is to provide a liquid transfer device and a liquid transfer method that can perform the above.

[0006]

According to the present invention, the above object is a liquid transfer device for transferring a liquid to an object by a transfer member, which is a transfer device for setting the transfer member. Member setting means, liquid containing means for containing the liquid, and the transfer member fixed to the transfer member setting means are brought into contact with the liquid of the liquid containing means to transfer the transfer member to the liquid. This is achieved by a liquid transfer device including an operation means for separating the containing means from the liquid, and a gas applying means for guiding gas to the liquid containing means and applying the gas to the transfer member.

The gas applying means preferably includes a gas supply source and a pipe for guiding the gas from the gas supply source to the liquid containing means and applying the gas to the transfer member. The pipe is preferably provided with a siphon portion. The transfer member is preferably set to be removable from the transfer member setting means.

The liquid is preferably a flux applied to the solder portion of the substrate as the object. The transfer member preferably includes a bump having a protrusion shape for coming into contact with the liquid. The gas is preferably compressed air.

The above object is, in the present invention, a liquid transfer method for transferring a liquid onto an object by a transfer member, wherein the transfer member is added to the liquid in the liquid containing means. A liquid, characterized in that a gas is blown from the liquid containing means side to the transfer member with the liquid when contacting and separating the transfer member with the liquid from the surface of the liquid. This is achieved by the transfer method. The gas is preferably compressed air.

[0010]

According to the above construction, when the transfer member is brought into contact with the liquid containing means side and the transfer member with the liquid is separated from the surface of the liquid, the transfer member with the liquid is attached from the liquid containing means side. A gas is blown to the member. This makes it easier to peel the transfer member from the liquid containing means side.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the examples described below are suitable specific examples of the present invention, and therefore, various technically preferable limitations are given, but the scope of the present invention particularly limits the present invention in the following description. Unless otherwise stated, the present invention is not limited to these modes.

1 and 2 are a front view and a perspective view showing a preferred embodiment of the liquid transfer device of the present invention. 1 and 2, a flux transfer device as a liquid transfer device includes a nozzle 10, a device 12, a plate 14, a suction means 40, a vertical operation means 70, and a compressed air application means 90.
And have.

First, the device 12 is a transfer member for applying a flux 20 as a liquid and transferring or applying it to a solder portion of a substrate as an object. This device 12 is preferably rectangular and its dimensions are, for example, 2 mm × 2 mm square to 20 mm.
A size of × 20 mm square is possible. In this example, the dimensions of device 12 are preferably 16 mm x 16
mm square.

The device 12 includes a plurality of bump-shaped bumps 1.
Eight. The solder bump 18 has a height of about 50 μm and a size (diameter) of 100 μm, for example. A plurality of bumps 18 in the form of protrusions are provided on the outer peripheral portion of the device 12, for example, at a pitch of about 150 μm, for example, 40.
0 are lined up.

The nozzle 10 shown in FIGS. 1 and 2 is a transfer member setting means for removably adsorbing the device 12. The nozzle 10 is preferably a prism.
For example, the dimensions are 15 mm × 15 mm square. At the center of the nozzle 10, a passage 1 for suctioning the device 12 is provided.
6 is formed. The passage 16 is provided with a hole 16a, the diameter of which is, for example, 1 mm. Suction means 4
0 includes a passage 16 for suction, and the passage 16 for suction
Through the above, the device 12 described above can be removably adsorbed. The vertical operation means 70 moves the nozzle 10 to the arrow X
The moving operation is performed in the direction (vertical direction).

The plate 14 shown in FIG. 1 and FIG.
It is a disk-shaped liquid storage means for storing 0. The flux 20 contained in the dish 14 has a thickness of, for example, about 50 μm, and is applied or contained on the dish 14.

As shown in FIGS. 1 and 3, the compressed air supply means 90 as the gas supply means is a compressed air supply source 26.
And a pipe 22. The pipe 22, which is also called a passage for blowing compressed air, includes a compressed air supply source 26 and a dish 14.
The hole 14a for air blowing provided in the above is connected. The diameter of the compressed air blowing hole 14a is, for example, 1 mm. In the middle of the pipe 22, it is preferable to use FIG.
As shown in FIG. 3, it has a siphon portion 24, which is connected to a compressed air supply source 26.

If the siphon portion 24 is not provided in this manner, the flux 20 in the dish 14 will flow into the pipe 22 for discharging compressed air, which causes a problem. Therefore, as shown in FIG. 3, it is preferable to prevent the flux 20 from flowing backward into the pipe 22 by passing the pipe 22 once above the liquid surface 30 of the flux 20 in the flux tray 14. .

Further, as shown in FIG. 4, the height h of the plate 14 is
By keeping 2 higher than the height h1 of the liquid surface 30 of the flux 20, the liquid surface 30 of the flux 20 due to the return of the flux 20 when the compressed air is discharged from the hole 14a.
It is possible to cope with the height change. That is, the flux 20 does not overflow from the plate 14.

Next, an operation example of transferring the flux 20 to the bumps 18 of the device 12 will be described with reference to the flow chart of FIG. First, the device 12, which is also called a chip shown in FIGS. 1 and 2, is applied to the lower surface of the nozzle 10 to draw the suction means 40.
Is operated to suck and fix the device 12 to the surface of the nozzle 10 by suction or negative pressure through the suction passage 16.

Next, by operating the up-down operation means 70, the nozzle 10 is lowered to the tray 14 side in the arrow X direction together with the device 12 adsorbed on the nozzle 10 (step ST1).

Whether or not the bumps 18 of the device 12 have come into contact with the dish 14 or the flux 20 in the dish 14 is determined by detecting it with a contact detector (not shown) (step S).
T2). When the bumps 18 of the device 12 come into contact with the dish 14 or the flux 20 in the dish 14, the operation of the vertical operation means 70 of FIG. 2 is stopped and the lowering of the nozzle 10 is stopped (step ST3).

Then, compressed air is introduced into the dish 14 through the pipe 22 and the hole 14a (step ST4), and the vertical operating means 70 of FIG. 2 is operated to raise the nozzle 10 in the arrow X direction. At this time, the compressed air is, for example, 10 4 P
It is introduced at a pressure of a. By such an operation, even if the flux 20 having a high viscosity is used, the device 12 in close contact with the flux 20 can be completely peeled off by the air pressure from the compressed air supply source 26.

Then, the device 12 thus peeled off is brought into contact with a solder portion of a substrate (not shown) such as a printed circuit board, whereby the device 1
An appropriate amount of flux can be transferred or applied from the bump 2 to the solder portion.

Another Embodiment Next, another embodiment of the liquid transfer device of the present invention will be described with reference to FIGS. First, refer to FIG. 6 and FIG. In the embodiment of FIGS. 6 and 7, the compressed air imparting means 90 different from the compressed air imparting means 90 as the gas imparting means of FIGS. 1 and 2 is provided. The compressed air applying unit 190 includes a pipe 122 and a compressed air supply source 126. The pipe 122 is connected to a siphon portion 119 provided outside the dish 114.

Siphon portion 119 having a reduced volume
Is connected to a compressed air supply source 126 via a pipe 122. Siphon part 11 with such a small volume
9 is provided to reduce the backflow volume of the flux 20. As a result, the compressed air, also called air, is transferred to the dish 11
When discharging through the hole 114a of No. 4, the pipe 122
It is possible to minimize the amount of the flux 20 that has flowed back into the flux tray 114 and minimize the change in the height of the liquid surface 30.

Next, referring to FIG. In the embodiment of FIG. 8, the height around the plate 214 is set to the liquid level 3 of the flux 20.
The height is equal to 0, and the overflowed flux 20 is collected in the surrounding accommodating portion 250 so as to correspond to the return of the flux 20 when the compressed air is discharged through the hole 214a, and the flux is generated by the operation of the pump 80. 20 for dish 21
I am trying to put it back within 4. This allows flux 2
The height of the liquid surface 30 of 0 can be made constant. In addition,
The hole 214a is connected to the compressed air supply source of the compressed air applying means via a pipe.

As described above, in the embodiment of the present invention, the device has a nozzle for adsorbing the device, the thin plates of the flux are arranged at opposite positions, and the plates have air outlets. In this way, by opening a hole for compressed air introduction in the center of the flux tray, when pulling up after the device contacts the flux tray,
The device can facilitate peeling of the flux tray. The device could be completely stripped from the flux, yielding 100% yield. The amount of flux applied to the plate can be increased, and the transfer amount of flux can be increased. Lower the sensitivity of the contact detector that detects when the bump is pressed against the plate,
Even if the pushing amount is slightly increased, the cost of the contact detector can be reduced.

The present invention is not limited to the above embodiment. For example, the nozzles in FIGS. 1 and 2 are not limited to the prismatic type, and other shapes can be adopted. Also,
The plate is not limited to a disc shape, and other shapes can be adopted. Although the compressed air is supplied to the dish by the compressed air applying means, the present invention is not limited to this, and, for example, other types of gas may be supplied to the dish or discharged. Further, instead of moving the nozzle side, the dish side may be moved with respect to the nozzle. The liquid transfer device and liquid transfer method of the present invention can also be applied to transfer or apply a liquid of a type other than a flux.

[0030]

As described above, according to the present invention, the liquid transfer member such as the device can be completely separated from the liquid such as the flux, and the yield can be improved.

[Brief description of drawings]

FIG. 1 is a front view showing a preferred embodiment of a liquid transfer device of the present invention.

FIG. 2 is a perspective view showing a preferred embodiment of the liquid transfer device of the present invention.

3 is a diagram showing the flux tray and the like shown in FIG.

FIG. 4 is a diagram showing the height of the flux tray shown in FIG. 2 and the liquid surface of the flux.

FIG. 5 is a diagram showing an operation example of the embodiment.

FIG. 6 is a sectional view showing a plate and the like showing another preferred embodiment of the liquid transfer device of the present invention.

7 is a perspective view of the dish of FIG.

FIG. 8 is a sectional view showing a plate and the like showing still another preferred embodiment of the liquid transfer device of the present invention.

FIG. 9 is a diagram showing a conventional flux transfer device.

[Explanation of symbols]

10 Nozzle (Means for Setting Transfer Member) 12 Device (Member for Transfer) 14 Dish (Liquid Storage Means) 16 Suction Passage 18 Bump 20 Flux (Liquid) 22 Piping 26 Compressed Air Supply Source (Gas Supply Source) 40 Suction Means 70 Vertical operation means (operation means) 90 Compressed air applying means (gas applying means)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B05D 7/00 H 7717-4D H01L 21/321 H05K 3/34 503 B 7128-4E

Claims (9)

[Claims] 1. A liquid transfer device for transferring a liquid to an object by a transfer member, comprising: a transfer member setting means for setting the transfer member; and a liquid containing means for containing the liquid. An operation means for bringing the transfer member fixed to the transfer member setting means into contact with the liquid of the liquid storage means to separate the transfer member from the liquid of the liquid storage means; A liquid transfer device comprising: a gas supply unit that guides gas to the storage unit and supplies the transfer member with the gas. 2. The liquid according to claim 1, wherein the gas applying means includes a gas supply source and a pipe for guiding the gas from the gas supply source to the liquid containing means and applying the gas to the transfer member. Transfer device. 3. The liquid transfer device according to claim 2, wherein the pipe is provided with a siphon portion. 4. The liquid transfer apparatus according to claim 1, wherein the transfer member is set to be attachable to and detachable from the transfer member setting means. 5. The liquid transfer device according to claim 1, wherein the liquid is a flux applied to a solder portion of a substrate as the object. 6. The liquid transfer device according to claim 1, wherein the transfer member includes a bump having a projection shape for coming into contact with the liquid. 7. The liquid transfer apparatus according to claim 1, wherein the gas is compressed air. 8. A liquid transfer method for transferring a liquid to an object by a transfer member, wherein the transfer member is brought into contact with the liquid in a liquid storage means to attach the liquid. A liquid transfer method, wherein when the transfer member is separated from the surface of the liquid, a gas is blown from the liquid containing means side to the transfer member with the liquid. 9. The liquid transfer method according to claim 8, wherein the gas is compressed air.