JPH0718448U - Caps for sealing electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an inexpensive and highly effective electronic component sealing cap that has corrosion resistance and impact resistance, enhances reliability after sealing an electronic component. A cap 2 for sealing an electronic component 7 mounted on an electronic component mounting board 1, the cap 2
The base material 10 is formed of an aluminum plate having anodized films formed on both surfaces thereof. The anodic oxide coating on the surface of the cap 2 has a cap for sealing electronic parts, which is subjected to an organic substance sealing treatment with a resin or a paint, or a hydrated sealing treatment after dyeing or a metal sealing treatment. 2 has a convex portion 3 formed in a portion corresponding to the electronic component 7.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a cap for sealing electronic components mounted on a board.

[0002]

[Prior art]

 This type of electronic component sealing cap is fixed to the electronic component mounting substrate with the electronic components mounted on the substrate covered, so that the electronic components on the substrate can be protected from external moisture or shock. It is used for the purpose of protection.

As a conventional cap for sealing electronic parts, there is a cap in which a concave portion 23 is formed by a metal mold or the like as seen in the ceramic cap 22 shown in FIG. This is designed so that when the electronic component 27 on the substrate 21 is covered, the electronic component 27, the bonding wire 28 and the cap 22 do not come into contact with each other and cause a defect such as a disconnection or a short circuit. . Further, as shown in FIG. 5, there is also the simplest flat plate-shaped cap 22, and in this case, the electronic component 27 is adhered and fixed via the dam member 29 integrally joined on the substrate 21. It is used for the purpose of sealing.

However, in these conventional ceramic caps 22, the cap itself is expensive. In addition, when this product is integrated with the substrate 21 made of an organic resin material after being joined, there is a large difference in the linear expansion coefficient between the cap 22 and the substrate 21, which makes it easy to separate due to thermal history. Had. Further, in the case of the flat plate-shaped cap 22, the dam member 29 must be attached to the substrate 21 in order to prevent the cap 22 from directly contacting the electronic component 27, which complicates the structure of the substrate. It had the drawback of high costs.

[0005]

[Problems to be solved]

 The present invention aims to solve the above-mentioned problems, has sufficient corrosion resistance and impact resistance required for the electronic component sealing cap itself, and enhances the reliability of the electronic component after sealing. The aim is to provide a cap for sealing electronic components that is inexpensive and has high mounting efficiency.

[0006]

[Means for solving the problem]

 The present invention is a cap for encapsulating electronic components mounted on a substrate, the base material of which is composed of an aluminum plate having anodized films formed on both sides thereof, and the surface of the cap. The anodic oxide coating on the side has a sealing surface structure that has been subjected to an organic material sealing treatment with a resin or paint, or after being dyed, and then subjected to a hydration sealing treatment or a metal sealing treatment, and this cap is used for the electronic component In the cap for sealing electronic parts, which is characterized in that a convex portion is formed in a portion corresponding to.

[0007]

[Action and effect]

 First, in this cap 2, since the convex portion 3 is provided in a portion corresponding to the electronic component mounting portion of the substrate 1, the electronic component 7 mounted on the substrate 1 does not come into contact with the cap 2. . That is, the cap 2 does not interfere with the electronic component 7 on the substrate 1. Further, by using aluminum as the base material 10 of the cap, the cap 2 is easy to process and inexpensive. Further, by providing the convex portion 3, when the cap 2 is fixed to the substrate 1, it is not necessary to fix the dam member 9 in advance.

Further, since the cap 2 is processed by using an aluminum plate, its adhesive surface can be freely taken. In the present invention, the method of coloring and sealing on the surface side is organic resin sealing with resin or paint, or other sealing after dyeing (for example, hydration sealing). Or a metal sealing treatment) to form a cap for sealing electronic components, so a cap with sufficient corrosion resistance and impact resistance required for this type of electronic component sealing cap itself should be used. Obtainable. Further, since the back surface side of the cap 2 which is the bonding surface with the electronic component mounting substrate 1 is left as it is with the base of the anodized film 11 being used, the anodized film 11 with a uniform thickness can be directly applied. By forming the adhesive layer 6, the adhesiveness with the substrate 1 is good and the mounting efficiency can be improved.

It should be noted that only the anodic oxide coating 11 on the front surface side of the cap 2 is colored and sealed, and a part or the front surface of the anodic oxide coating 11 on the back surface which is not colored and sealed. If the adhesive layer 6 made of an organic resin material is formed with a substantially uniform thickness, the appearance can be finished beautifully.

As described above, according to the present invention, it is possible to enhance the reliability of the electronic components after they are sealed, and to improve the reliability of the electronic components after they are sealed. Caps can be provided.

[0011]

【Example】

 Embodiment 1 Next, an embodiment of the present invention will be described in more detail with reference to FIGS. 1 to 3 and 6. FIG. 1 shows a state in which a cap 2 for sealing an electronic component according to the present invention is adhesively fixed to a substrate 1 for mounting an electronic component. Further, FIG. 3 shows a sectional view corresponding to FIG.

That is, the cap 2 has a convex portion 3 formed by, for example, drawing at a portion corresponding to the electronic component mounting portion of the substrate 1, and the bonding surface of the electronic component mounting substrate 1 is surrounded by the convex portion 3. It has a shape including a planar fixing portion 4 extending in the direction, and covers the electronic component 7 mounted on the substrate 1 and is adhesively fixed. The cap 2 targeted by the present invention has the shape shown in FIG. That is, it has the above-mentioned convex portion 3 and the plane fixing portion 4, and integrally has the fitting portion 5 that can be fitted to the side surface of the electronic component mounting board 1.

The bonding surface of the cap 2 to the electronic component mounting substrate 1 is as shown in FIG. That is, an insulating layer which is an anodized film 11 is formed on both sides of the electronic component sealing cap 2, and the anodized film 11 on the front surface side is subjected to an organic substance sealing treatment with a resin or paint, or dyed. After that, a cap for sealing electronic parts that has been subjected to hydration sealing treatment or metal sealing treatment is applied.

On the other hand, the anodic oxide coating 11 on the back side is not subjected to any treatment, and the adhesive layer 6 for contacting the substrate 1 is directly formed on the anodic oxide coating 11 on the back side. Is. When the cap 2 is adhesively fixed to the electronic component mounting substrate 1, the adhesive layer 6 also penetrates into the fine holes 12 of the anodic oxide film 11 of the cap 2 to form a strong adhesive state. Can be formed.

Second Embodiment Next, a specific example of the present invention will be described for the cap shown in the first embodiment. First, an aluminum plate was used as the base material 10 for the cap, and this aluminum plate was drawn to form the convex portion 3. This substrate 10 was anodized with sulfuric acid to form an anodized film 11 on both sides. Next, a masking tape (not shown) for sealing treatment is attached to the adhesive surface (back surface) of the base material 10 with the electronic component mounting substrate 1, and then the substrate is immersed in an aqueous solution in which a black dye is dissolved. 10 was immersed and the anodic oxide coating 11 on the surface was dyed.

After that, the anodic oxide coating 11 on the surface was sealed by immersing the base material 10 in an aqueous metal salt solution containing nickel acetate as a main component, and then the masking tape was peeled off. Next, an adhesive material (which will become the adhesive layer 6) is applied to the back surface with a uniform thickness and dried or brought into a B-stage state. 1 was fixed by adhesion.

Example 3 An aluminum plate was used as the base material 10 of the cap 2, and the convex portion 3 was formed by subjecting the center portion of the aluminum plate to drawing processing. Further, a bending process is performed according to the shape of the electronic component mounting board 1 to form a fitting portion 5 that can be fitted to the electronic component mounting board 1, and the electronic component sealing cap 2 shown in FIG. And the shape. This base material 10 was treated with alumite sulfate to form an anodized film 11 on both surfaces.

Then, the black paint 13 was applied only to the front surface side of the base material 10 and dried, and an organic substance sealing treatment was performed. Then, the adhesive (the adhesive layer 6) was applied to the surface (rear surface side) to be bonded to the electronic component mounting substrate 1 with a uniform thickness, and dried or brought into a B-stage state. The cap 2 was adhesively fixed to the electronic component mounting substrate 1 as shown in FIG. As shown in the above embodiment, in the cap 2, since the convex portion 3 is formed in the portion corresponding to the electronic component, the cap 2 can be directly fixed to the substrate 1 and has a simple structure. A semiconductor device can be provided.

Further, only the anodic oxide coating 11 on the front surface side of the cap 2 is colored and sealed (organic material sealing treatment), and the front side of the back surface which is not colored and sealed is treated. The adhesive layer 6 is formed on the anodic oxide coating 11 with a substantially uniform thickness. Therefore, the surface side of the cap 2 has an aesthetic appearance, is not easily scratched or soiled, and has excellent corrosion resistance and impact resistance. In addition, in this example, the color tone is black, so the black body radiation also provides excellent heat dissipation.

Further, on the back surface side of the cap 2, the adhesion of the electronic component mounting substrate 1 can be maintained because the base of the anodized film 11 is utilized. However, the maintainability of the adhesive layer 6 can be improved, and the adhesive fixing to the electronic component mounting board 1 can be made stronger and more durable. Further, in the case where the adhesive layer 6 is previously formed on the back surface side of the electronic component cap 2 as described above, the workability in the actual adhesive fixing can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component sealing cap according to the present invention.

FIG. 2 is a perspective view of an electronic component sealing cap according to the present invention.

FIG. 3 is a sectional view corresponding to FIG.

FIG. 4 is a sectional view showing a conventional electronic component sealing cap.

FIG. 5 is a sectional view showing a conventional electronic component sealing cap.

FIG. 6 is an enlarged cross-sectional view showing a state in which an electronic component sealing cap is adhesively fixed to an electronic component mounting substrate.

[Explanation of symbols]

 1. ． ． Substrate for mounting electronic components, 2. ． ． Electronic component sealing cap, 3. ． ． Convex portion, 4. ． ． Plane fixed part, 5. ． ． Fitting part, 6. ． ． Adhesive layer, 7. ． ． Electronic components, 8. ． ． Bonding wire, 10. ． ． Base material, 11. ． ． Anodized film, 12. ． ． Micropores, 29. ． ． Weir member,

Claims (1)

[Scope of utility model registration request] 1. A cap for sealing electronic components mounted on a substrate, wherein a base material of the cap is composed of an aluminum plate having anodized films formed on both surfaces thereof, and a surface of the cap. The anodic oxide coating on the side has a sealing surface structure that is subjected to an organic substance sealing treatment with a resin or a paint, or after being dyed, and then subjected to a hydration sealing treatment or a metal sealing treatment, and this cap is applied to the electronic component. A cap for encapsulating an electronic component, characterized in that a convex portion is formed in a corresponding portion.