JPH0717889B2 - Conductive adhesive - Google Patents
Conductive adhesiveInfo
- Publication number
- JPH0717889B2 JPH0717889B2 JP61223713A JP22371386A JPH0717889B2 JP H0717889 B2 JPH0717889 B2 JP H0717889B2 JP 61223713 A JP61223713 A JP 61223713A JP 22371386 A JP22371386 A JP 22371386A JP H0717889 B2 JPH0717889 B2 JP H0717889B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- epoxy resin
- hydrazine
- present
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、金属との接着性、導電性に優れた可使時間の
長い導電性接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a conductive adhesive having a long pot life, which has excellent adhesiveness to metals and conductivity.
（従来の技術） 導電性接着剤は半導体部品分野の接着、例えば金属電極
からのリード線の取り出し、金属端子と部品の接着等に
使用されている。(Prior Art) Conductive adhesives are used for bonding in the field of semiconductor parts, for example, taking out lead wires from metal electrodes, bonding metal terminals and parts, and the like.
しかし、これらの接着剤が密閉状態で使用されると、一
液性の場合は、使用されている溶剤のため高温加熱時に
発泡したり、クラックを発生したりして、有効な導電性
と接着強度を示さないという問題があった。また硬化後
のヒートサイクルにより金属との接着界面でハガレを生
じて、導電性がなくなるという欠点があった。そのため
溶剤を含まない二液性の導電性接着剤が広く使用されて
いるが、これらは二液混合後の可使時間が短く、極めて
作業性が悪いという欠点がある。このような理由で、こ
れらの問題点を解決した一液性の導電性接着剤の開発が
強く要望されていた。However, when these adhesives are used in a sealed state, if they are one-part type, they may foam or crack when heated at high temperature due to the solvent used, resulting in effective conductivity and adhesion. There was a problem that it did not show strength. Further, the heat cycle after curing causes peeling at the adhesive interface with the metal, resulting in the loss of conductivity. Therefore, two-component conductive adhesives containing no solvent are widely used, but these have the drawback that the pot life after mixing the two liquids is short and the workability is extremely poor. For these reasons, there has been a strong demand for the development of a one-component conductive adhesive that solves these problems.
（発明が解決しようとする問題点） 本発明は、上記の問題点および欠点を解消するためにな
されたもので、金属との接着性、特に高温における接着
性を有するとともに、導電性に優れ、可使時間が長く、
作業性のよい、一液性の導電性接着剤を提供しようとす
るものである。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above problems and drawbacks, and has adhesiveness to a metal, particularly adhesiveness at high temperature, and excellent conductivity. Long pot life,
It is intended to provide a one-component conductive adhesive having good workability.
［発明の構成］ （問題点を解決する手段と作用） 本発明は、上記の目的を達成しようと鋭意研究を重ねた
結果、後述する組成のものが、金属との接着性、導電性
に優れ、また可使時間が長く、作業性もよいことを見い
だし、本発明を完成したものである。即ち本発明は、カ
ルボン酸無水物系硬化剤を含むエポキシ樹脂、ノルボネ
ン環を有する化合物、ヒドラジンの活性水素を置換した
ヒドラジン誘導体若しくはそのアダクツであるヒドラジ
ン系硬化促進剤および導電性充填剤を含むことを特徴と
する一液性の導電性接着剤である。[Structure of the Invention] (Means and Actions for Solving Problems) As a result of earnest studies to achieve the above object, the present invention has a composition described below, which has excellent adhesiveness to metal and conductivity. Moreover, they have found that the pot life is long and the workability is good, and the present invention has been completed. That is, the present invention comprises an epoxy resin containing a carboxylic acid anhydride-based curing agent, a compound having a norbornene ring, a hydrazine derivative substituted with active hydrogen of hydrazine or its adduct, a hydrazine-based curing accelerator and a conductive filler. Is a one-component conductive adhesive.
本発明に用いるエポキシ樹脂としては、ビスフェノール
Ａ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、
フェノールノボラック型エポキシ樹脂、クレゾールノボ
ラック型エポキシ樹脂、脂環式エポキシ樹脂、含複素環
エポキシ樹脂、水添ビスフェノールＡ型エポキシ樹脂、
脂肪族エポキシ樹脂、芳香族、脂肪族もしくは脂環式の
カルボン酸とエピクロルヒドリンとの反応によって得ら
れるエポキシ樹脂、スピロ環含有エポキシ樹脂等が挙げ
られる。市販品の例としては、シェル化学社製の商品名
“エピコート"807,827,828,834,1001,1004、チバガイギ
ー社製の商品名“アラルダイド"CY−175,182,183、ダウ
ケミカル社製の商品名“DEN"431,438、同じく“DER"33
2、ダイセル化学工業製の商品名“セロキサイド"2021、
旭電化工業社製の商品名“アデカレジン"EP4080等があ
る。これらのエポキシ樹脂は単独又は２種以上混合して
使用する。The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin,
Phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, hydrogenated bisphenol A type epoxy resin,
Examples thereof include an aliphatic epoxy resin, an epoxy resin obtained by reacting an aromatic, aliphatic or alicyclic carboxylic acid with epichlorohydrin, and a spiro ring-containing epoxy resin. As examples of commercially available products, trade name "Epicote" 807,827,828,834,1001,1004 manufactured by Shell Chemical Co., trade name "Araldide" CY-175,182,183 manufactured by Ciba Geigy, trade name "DEN" 431,438 manufactured by Dow Chemical Co., and " DER "33
2, Daicel Chemical Industries' product name "Celoxide" 2021,
Asahi Denka Kogyo Co., Ltd.'s product name "ADEKA RESIN" EP4080 and so on. These epoxy resins are used alone or in combination of two or more.
エポキシ樹脂の硬化剤として用いるカルボン酸無水物酸
無水物としては、無水フタル酸、無水テトラヒドロフタ
ル酸、無水3,6−エンドメチレンテトラヒドロフタル
酸、無水ヘキサヒドロフタル酸、無水コハク酸、無水ア
ジピン酸、無水マレイン酸、ピロメリット酸二無水物等
が挙げられ、これらは単独又は２種以上混合して使用す
る。Carboxylic acid anhydrides used as curing agents for epoxy resins include phthalic anhydride, tetrahydrophthalic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, and adipic anhydride. , Maleic anhydride, pyromellitic dianhydride, etc., and these may be used alone or in admixture of two or more.
本発明に用いるノルボネン環を有する化合物としては、
石油樹脂等があり、石油のC5〜C9留分から得られる汎用
の樹脂である。具体的な市販品としては、セロキサイド
4000（ダイセル化学社製、商品名）、ダッキロール1000
（住友化学工業社製、商品名）、クイントン1500,1000,
1300（日本ゼオン社製、商品名）等が挙げられ、これら
は単独又は２種以上混合して用いる。Examples of the compound having a norbornene ring used in the present invention include
There are petroleum resins and the like, which are general-purpose resins obtained from the C 5 to C 9 fraction of petroleum. Specific commercially available products include celoxide
4000 (manufactured by Daicel Chemical Industries, Ltd.), Dakki Roll 1000
(Sumitomo Chemical Co., Ltd., trade name), Quinton 1500,1000,
1300 (manufactured by Nippon Zeon Co., Ltd.) and the like are used, and these are used alone or in combination of two or more kinds.
本発明に用いるヒドラジン系硬化促進剤は、ヒドラジン
の活性水素を置換したヒドラジン誘導体若しくはそのア
ダクツであって、例えば味の素社製“アミキュア”シリ
ーズのPN−23,MY−24,BADH,CTDH等が挙げられ、これら
は単独又は２種以上混合して用いる。これらの硬化促進
剤は導電性接着剤の可使時間を長くし、適度な硬化スピ
ードを得るのに有効である。なお、普通ヒドラジン系硬
化促進剤として製品化されているもののなかには、ヒド
ラジドが含まれていると理解される。The hydrazine-based curing accelerator used in the present invention is a hydrazine derivative substituted with active hydrogen of hydrazine or an adduct thereof, and examples thereof include PN-23, MY-24, BADH, CTDH and the like of "Amicure" series manufactured by Ajinomoto Co., Inc. These are used alone or in combination of two or more. These curing accelerators are effective in prolonging the pot life of the conductive adhesive and obtaining an appropriate curing speed. In addition, it is understood that hydrazides are included in the products usually produced as hydrazine-based curing accelerators.
本発明に用いる導電性充填剤としては、粉末状の金属、
例えば銀、金、銅、ニッケル、アルミニウム、スズ等、
また表面に金属層を有する粉末、例えば表面にスズ層を
有する銅粉末、ニッケル層を有するプラスチック粉末等
が挙げられ、これらは単独又は２種以上混合して使用す
る。これらの導電性充填剤は、平均粒径が30μｍ以下で
あることが好ましい。平均粒径が30μｍを超えると、高
密度の充填が不可能になってペースト状にならず、また
塗布性能が低下し好ましくない。The conductive filler used in the present invention, powder metal,
For example, silver, gold, copper, nickel, aluminum, tin, etc.
Further, a powder having a metal layer on the surface, for example, a copper powder having a tin layer on the surface, a plastic powder having a nickel layer, and the like can be mentioned, and these are used alone or in combination of two or more kinds. These conductive fillers preferably have an average particle size of 30 μm or less. If the average particle size exceeds 30 μm, high-density filling becomes impossible and a paste form is not obtained, and the coating performance deteriorates, which is not preferable.
前述した硬化剤を含むエポキシ樹脂、ノルボネン環を有
する化合物、硬化促進剤からなる樹脂成分を結合剤と
し、導電性充填剤と混合される。導電性充填剤の配合割
合は、重量比で結合剤／導電性充填剤＝30/70〜10/90で
あることが好ましい。導電性充填剤の配合量が70重量部
未満では満足な導電性が得られず、また90重量部を超え
ると作業性や接着性が低下し好ましくない。A resin component composed of the above-mentioned epoxy resin containing a curing agent, a compound having a norbornene ring, and a curing accelerator is used as a binder and mixed with a conductive filler. The mixing ratio of the conductive filler is preferably binder / conductive filler = 30/70 to 10/90 by weight. If the content of the conductive filler is less than 70 parts by weight, satisfactory conductivity cannot be obtained, and if it exceeds 90 parts by weight, workability and adhesiveness are deteriorated, which is not preferable.
本発明の導電性接着剤は、前述した結合剤と導電性充填
剤を配合するが、本発明の目的に反しない限り、必要に
応じて種々の他の成分、例えばチクソ剤、消泡剤、レベ
リング剤、顔料等を添加配合することができる。こうし
て得られた導電性接着剤は、電気部品半導体素子、集積
回路等の接着に使用することができる。The conductive adhesive of the present invention contains the binder and the conductive filler described above, but unless necessary for the purpose of the present invention, various other components, such as a thixotropic agent and a defoaming agent, if necessary. A leveling agent, a pigment and the like can be added and blended. The conductive adhesive thus obtained can be used for bonding electrical component semiconductor elements, integrated circuits and the like.
（実施例） 次に本発明を実施例によって説明するが、本発明はこれ
らの実施例によって限定されるものではない。(Examples) Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples.
実施例 １ エポン828（シェル化学社製、エポキシ樹脂商品名）10
g、セロキサイド4000（ダイセル化学工業社製、ノルボ
ネン環を有する化合物の商品名）2.5g、硬化剤の無水ヘ
キサヒドロフタル酸12.5gおよび硬化促進剤としてMY−2
4（味の素社製、商品名）0.63gを配合し、３本ロールで
３回均一に混練して一液性の導電性接着剤を製造した。Example 1 Epon 828 (manufactured by Shell Chemical Co., Ltd., epoxy resin trade name) 10
g, Celoxide 400 (trade name of a compound having a norbornene ring manufactured by Daicel Chemical Industries, Ltd.) 2.5 g, hexahydrophthalic anhydride 12.5 g as a curing agent, and MY-2 as a curing accelerator.
0.63 g of 4 (manufactured by Ajinomoto Co., Inc.) was blended and kneaded uniformly with a three-roll mill three times to produce a one-component conductive adhesive.
実施例 ２〜３ 第１表に示した組成によって実施例１と同様に均一に混
練して導電性接着剤を調製した。Examples 2-3 A conductive adhesive was prepared by uniformly kneading the composition shown in Table 1 in the same manner as in Example 1.
比較例 １〜２ 第１表に示した組成によって実施例１と同様に均一に混
練して導電性接着剤を調製した。Comparative Examples 1-2 A conductive adhesive was prepared by uniformly kneading the composition shown in Table 1 in the same manner as in Example 1.
実施例１〜３および比較例１〜２で製造した導電性接着
剤について、導電性、接着力、硬化後の発泡性、接着破
壊面の状態、可使時間について試験を行ったので、その
結果を第１表に示した。本発明の導電性接着剤は高温に
於ける接着力に優れ、硬化後の発泡もなく、可使時間が
ながく、導電性に優れており、本発明の硬化が確認され
た。The conductive adhesives produced in Examples 1 to 3 and Comparative Examples 1 to 2 were tested for conductivity, adhesive strength, foamability after curing, adhesive fracture surface state, and pot life. Is shown in Table 1. The conductive adhesive of the present invention was excellent in adhesive strength at high temperatures, had no foaming after curing, had a short pot life, and was excellent in conductivity, confirming the curing of the present invention.
［発明の効果］ 以上の説明および第１表から明らかなように、本発明の
導電性接着剤は金属との接着性が特に高温時において優
れ、発泡することがなく、可使時間が長く、作業性のよ
い、しかも導電性に優れたものである。従ってディスペ
ンサー、スクリーン印刷等の方法によって塗布可能であ
るとともに、各種電極の取り出しや金属と部品の接着に
好適なものである。 [Effects of the Invention] As is clear from the above description and Table 1, the conductive adhesive of the present invention has excellent adhesiveness to a metal, particularly at high temperature, does not foam, has a long pot life, It has good workability and excellent conductivity. Therefore, it can be applied by a method such as a dispenser or screen printing, and is suitable for taking out various electrodes and adhering metal and parts.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−21173（ＪＰ，Ａ) 特開 昭60−1221（ＪＰ，Ａ) 特開 昭50−80335（ＪＰ，Ａ) 特開 昭50−80333（ＪＰ，Ａ) 特開 昭58−134136（ＪＰ，Ａ) 特開 昭51−109037（ＪＰ，Ａ) 特開 昭50−23500（ＪＰ，Ａ) 垣内弘編「新エポキシ樹脂」昭晃堂（昭 60−５−10）Ｐ．239−241 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 61-21173 (JP, A) JP 60-1221 (JP, A) JP 50-80335 (JP, A) JP 50- 80333 (JP, A) JP 58-134136 (JP, A) JP 51-109037 (JP, A) JP 50-23500 (JP, A) Kakiuchi Hiroshi "New Epoxy Resin" Shokodo (Sho 60-5-10) P. 239-241
Claims (2)
樹脂、ノルボネン環を有する化合物、ヒドラジンの活性
水素を置換したヒドラジン誘導体若しくはそのアダクツ
であるヒドラジン系硬化促進剤および導電性充填剤を含
むことを特徴とする一液性の導電性接着剤。1. An epoxy resin containing a carboxylic anhydride curing agent, a compound having a norbornene ring, a hydrazine derivative in which active hydrogen of hydrazine is substituted, or a hydrazine curing accelerator which is an adduct thereof and a conductive filler. A one-component conductive adhesive characterized by:
層を有する粉末である特許請求の範囲第１項記載の導電
性接着剤。2. The conductive adhesive according to claim 1, wherein the conductive filler is a metal powder and a powder having a metal layer on the surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61223713A JPH0717889B2 (en) | 1986-09-24 | 1986-09-24 | Conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61223713A JPH0717889B2 (en) | 1986-09-24 | 1986-09-24 | Conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6381185A JPS6381185A (en) | 1988-04-12 |
| JPH0717889B2 true JPH0717889B2 (en) | 1995-03-01 |
Family
ID=16802499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61223713A Expired - Lifetime JPH0717889B2 (en) | 1986-09-24 | 1986-09-24 | Conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717889B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3526183B2 (en) * | 1997-09-18 | 2004-05-10 | 住友ベークライト株式会社 | Conductive resin paste and semiconductor device manufactured using the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5023500A (en) * | 1973-07-03 | 1975-03-13 | ||
| JPS5545595B2 (en) * | 1973-11-20 | 1980-11-18 | ||
| JPS5080333A (en) * | 1973-11-20 | 1975-06-30 | ||
| JPS51109037A (en) * | 1975-03-19 | 1976-09-27 | Seitetsu Kagaku Co Ltd | SETSUCHAKUSEIJUSHISOSEIBUTSU |
| US4485200A (en) * | 1982-02-03 | 1984-11-27 | National Starch And Chemical Corporation | Neoprene latex contact adhesives |
| JPS601221A (en) * | 1983-06-17 | 1985-01-07 | Sumitomo Bakelite Co Ltd | Electroconductive resin paste |
| US4557860A (en) * | 1984-07-06 | 1985-12-10 | Stauffer Chemical Company | Solventless, polyimide-modified epoxy composition |
-
1986
- 1986-09-24 JP JP61223713A patent/JPH0717889B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
| 垣内弘編「新エポキシ樹脂」昭晃堂（昭６０−５−１０）Ｐ．２３９−２４１ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6381185A (en) | 1988-04-12 |
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