JP2000207942A - Aerotropic conductive adhesive - Google Patents
Aerotropic conductive adhesiveInfo
- Publication number
- JP2000207942A JP2000207942A JP362999A JP362999A JP2000207942A JP 2000207942 A JP2000207942 A JP 2000207942A JP 362999 A JP362999 A JP 362999A JP 362999 A JP362999 A JP 362999A JP 2000207942 A JP2000207942 A JP 2000207942A
- Authority
- JP
- Japan
- Prior art keywords
- gold plating
- conductive adhesive
- adhesive
- conductive particles
- conductive particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Insulated Conductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、バンプ付きチップ
をＩＴＯ（インジウム・チン・オキサイド）回路付き基
板にフリップチップ接続するために用いて好適なペース
ト状異方性導電接着剤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste-like anisotropic conductive adhesive suitable for connecting a chip with bumps to a substrate with an ITO (indium tin oxide) circuit by flip chip bonding.
【０００２】[0002]
【従来の技術】半導体チップなど電子部品を回路基板な
ど電子機器の所定部位へ接着するための接着剤として、
多くの異方性導電接着剤が提案されている。この種の接
着剤には導電粒子を含まれているが、近時、回路の高密
度化に伴い、隣接回路間の絶縁性の確保が困難になって
きた。2. Description of the Related Art As an adhesive for bonding an electronic component such as a semiconductor chip to a predetermined portion of an electronic device such as a circuit board,
Many anisotropic conductive adhesives have been proposed. Although this type of adhesive contains conductive particles, it has recently become difficult to secure insulation between adjacent circuits with the increase in circuit density.
【０００３】なお、従来、この種の接着剤に含まれる導
電粒子としては、金属粉末や表面がめっきされたポリマ
ー粒子が使用されており、ＩＴＯ基板への接着用として
多くはＮｉ粒子などが使用されてきた。Conventionally, as the conductive particles contained in this type of adhesive, metal powder or polymer particles having a plated surface has been used, and Ni particles are often used for bonding to an ITO substrate. It has been.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、Ｎｉ粒
子を使用した異方性導電接着剤の場合、基板がＩＴＯ回
路付きガラス基板の場合には、低抵抗の接続抵抗値が得
られないという問題が生じていた。However, in the case of an anisotropic conductive adhesive using Ni particles, if the substrate is a glass substrate with an ITO circuit, there is a problem that a low resistance connection resistance cannot be obtained. Had occurred.
【０００５】本発明は、従来の異方性導電接着剤におけ
る上記の問題点を解決するためになされたもので、電子
部品の被接着基板が特にＩＴＯ回路付きガラス基板であ
る場合にも十分に低い接続抵抗値が得られる異方性導電
接着剤を提供しようとするものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the conventional anisotropic conductive adhesive, and is sufficiently applicable to a case where a substrate to be bonded to an electronic component is a glass substrate with an ITO circuit. An object of the present invention is to provide an anisotropic conductive adhesive capable of obtaining a low connection resistance value.
【０００６】[0006]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、Ｎｉ導電粒子の
表面を金めっきにより被覆することにより、上記の目的
が達成されることを見いだし、本発明を完成したもので
ある。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventor has found that the above object can be achieved by coating the surface of Ni conductive particles with gold plating. The present invention has been completed.
【０００７】すなわち、本発明は、（Ａ）エポキシ樹
脂、（Ｂ）硬化剤および（Ｃ）導電粒子を必須成分と
し、（Ｃ）導電粒子が、粒子表面を金めっきで被覆した
Ｎｉ導電粒子であることを特徴とする異方性導電接着剤
である。また、該Ｎｉ導電粒子表面を被覆する金めっき
の膜厚が、０．００１μｍ〜１μｍの範囲であることを
を特徴とする異方性導電接着剤である。That is, the present invention comprises (A) an epoxy resin, (B) a curing agent and (C) conductive particles as essential components, and (C) the conductive particles are Ni conductive particles whose surface is coated with gold plating. It is an anisotropic conductive adhesive. Also, the anisotropic conductive adhesive is characterized in that the thickness of the gold plating covering the surface of the Ni conductive particles is in the range of 0.001 μm to 1 μm.
【０００８】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【０００９】本発明に用いる（Ａ）エポキシ樹脂として
は、１分子中に２個以上のエポキシ基を有する多価エポ
キシ樹脂であれば、一般に用いられているエポキシ樹脂
が使用可能である。具体的なものとしては、例えば、フ
ェノールノボラックやクレゾールノボラック等のノボラ
ック樹脂、ビスフェノールＡ、ビスフェノールＦ、レゾ
ルシン、ビスヒドロキシジフェニルエーテル等の多価フ
ェノール類、エチレングリコール、ネオペンチルグリコ
ール、グリセリン、トリメチロールプロパン、ポリプロ
ピレングリコール等の多価アルコール類、エチレンジア
ミン、トリエチレンテトラミン、アニリン等のポリアミ
ノ化合物、アジピン酸、フタル酸、イソフタル酸等の多
価カルボキシ化合物等とエピクロルヒドリン又は２−メ
チルエピクロルヒドリンを反応させて得られるグリシジ
ル型のエポキシ樹脂が挙げられ、またジシクロペンタジ
エンエポキサイド、ブタジエンダイマージエポキサイド
等の脂肪族および脂環族エポキシ樹脂等も挙げられ、こ
れらは単独又は２種以上混合して使用することができ
る。As the epoxy resin (A) used in the present invention, generally used epoxy resins can be used as long as they are polyvalent epoxy resins having two or more epoxy groups in one molecule. Specific examples include, for example, novolak resins such as phenol novolak and cresol novolak, bisphenol A, bisphenol F, resorcinol, polyhydric phenols such as bishydroxydiphenyl ether, ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, Glycidyl obtained by reacting polyhydric alcohols such as polypropylene glycol, polyamino compounds such as ethylenediamine, triethylenetetramine and aniline, polycarboxylic compounds such as adipic acid, phthalic acid and isophthalic acid with epichlorohydrin or 2-methylepichlorohydrin. And epoxy resins such as aliphatic and alicyclic epoxy resins such as dicyclopentadiene epoxide and butadiene dimer epoxide. Also, and these may be used alone or in combination.
【００１０】本発明に用いる（Ｂ）硬化剤としては、１
分子中に２個以上の活性水素を有するものであれば特に
制限することなく使用することができる。具体的なもの
として、例えば、ジエチレントリアミン、トリエチレン
テトラミン、メタフェニレンジアミン、ジシアンジアミ
ド、ポリアミドアミン等のポリアミノ化合物、無水フタ
ル酸、無水メチルナジック酸、ヘキサヒドロ無水フタル
酸、無水ピロメリット酸等の有機酸無水物、フェノール
ノボラック、クレゾールノボラック等のノボラック樹脂
等が挙げられ、これらは単独又は２種以上混合して使用
することができる。[0010] As the curing agent (B) used in the present invention, 1
Any compound having two or more active hydrogens in the molecule can be used without particular limitation. Specific examples include, for example, polyamino compounds such as diethylenetriamine, triethylenetetramine, metaphenylenediamine, dicyandiamide, and polyamidoamine; phthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, and organic acid anhydrides such as pyromellitic anhydride. And novolak resins such as phenol novolak and cresol novolak, and these can be used alone or in combination of two or more.
【００１１】本発明に用いる（Ｃ）導電粒子は、表面を
金めっきで被覆したＮｉ導電粒子である。Ｎｉ導電粒子
を被覆する金めっきの膜厚は、０．００１μｍ〜１μｍ
の範囲が好ましい。金めっき膜厚が０．００１μｍ未満
では抵抗値低下の効果が乏しく、１μｍを超えると金め
っき工程で粒子の凝集が発生して隣接回路間の絶縁性に
問題が生じたり、接続において金めっき皮膜にクラック
が発生して導通性が低下しやすい。The (C) conductive particles used in the present invention are Ni conductive particles whose surfaces are covered with gold plating. The thickness of the gold plating covering the Ni conductive particles is 0.001 μm to 1 μm.
Is preferable. If the thickness of the gold plating film is less than 0.001 μm, the effect of lowering the resistance value is poor. Cracks easily occur and the conductivity tends to decrease.
【００１２】[0012]
【作用】本発明による異方性導電接着剤によれば、Ｎｉ
導電粒子表面を金めっきし、特に所定の膜厚に金めっき
することで、バンプ付きチップを回路付き基板にフリッ
プチップ接続する等において、回路付き基板がＩＴＯ付
きガラス基板等の場合であっても、低抵抗の接続が可能
とすることができるのである。According to the anisotropic conductive adhesive of the present invention, Ni
The surface of the conductive particles is gold-plated, particularly by gold plating to a predetermined film thickness, so that a chip with a bump is flip-chip connected to a substrate with a circuit, even if the substrate with a circuit is a glass substrate with ITO or the like. Therefore, a connection with low resistance can be made possible.
【００１３】[0013]
【発明の実施の形態】本発明の実施例について説明す
る。Embodiments of the present invention will be described.
【００１４】実施例 まず、平均粒径５μｍのニッケル粒子の表面に金めっき
を行い、膜厚０．１μｍの金めっきで被覆された金めっ
き被覆ニッケル粒子を得た。EXAMPLE First, gold plating was performed on the surface of nickel particles having an average particle size of 5 μm to obtain gold-plated nickel particles coated with gold plating having a thickness of 0.1 μm.
【００１５】次に、ビスフェノールＡ型エポキシ樹脂
と、無水フタル酸、およびイミダゾール変性物を混合し
て得た熱硬化性樹脂１００重量部中に、上記金めっき被
覆ニッケル粒子を３０重量部加えてペースト状異方性導
電接着剤を得た。Next, 30 parts by weight of the gold-plated nickel particles were added to 100 parts by weight of a thermosetting resin obtained by mixing a bisphenol A type epoxy resin, phthalic anhydride, and a modified imidazole, and the paste was added. Anisotropic conductive adhesive was obtained.
【００１６】この接着剤を、電極幅５５μｍ、電極間隔
１５μｍのＩＴＯ付きガラス基板に塗布し、同一パター
ンで作成されたもう一つのフレキシブル基板を重ね、１
５０℃、１００秒、４５ｋｇ／ｃｍ2 の条件で圧着した
後、対向電極間の導通抵抗の測定を行って、接続抵抗値
とした。This adhesive is applied to a glass substrate with ITO having an electrode width of 55 μm and an electrode interval of 15 μm, and another flexible substrate formed in the same pattern is overlaid.
After crimping under the conditions of 50 ° C., 100 seconds and 45 kg / cm 2 , the conduction resistance between the opposing electrodes was measured to obtain the connection resistance value.
【００１７】比較例１ まず、平均粒径５μｍのニッケル粒子の表面に金メッキ
を行い、膜厚０．０００５μｍの金めっきで被覆された
金めっき被覆ニッケル粒子を得た。Comparative Example 1 First, gold plating was performed on the surface of nickel particles having an average particle diameter of 5 μm to obtain gold-plated nickel particles coated with gold plating having a thickness of 0.0005 μm.
【００１８】次に、ビスフェノールＡ型エポキシ樹脂
と、無水フタル酸、およびイミダゾール変性物を混合し
て得た熱硬化性樹脂１００重量部中に、上記金めっき被
覆ニッケル粒子を３０重量部加えてペースト状異方性導
電接着剤を得た。Next, 30 parts by weight of the above-mentioned gold-plated nickel particles were added to 100 parts by weight of a thermosetting resin obtained by mixing a bisphenol A type epoxy resin, phthalic anhydride and a modified imidazole, and paste was added. Anisotropic conductive adhesive was obtained.
【００１９】この接着剤を、実施例１と同様に、電極幅
５５μｍ、電極間隔１５μｍのＩＴＯ付きガラス基板に
塗布し、同一パターンで作成されたもう一つのフレキシ
ブル基板を重ね、１５０℃、１００秒、４５ｋｇ／ｃｍ
2 の条件で圧着した後、対向電極間の導通抵抗の測定を
行って、接続抵抗値とした。This adhesive was applied to a glass substrate with ITO having an electrode width of 55 μm and an electrode interval of 15 μm in the same manner as in Example 1, and another flexible substrate formed in the same pattern was overlaid at 150 ° C. for 100 seconds. , 45kg / cm
After crimping under the conditions of 2 , the conduction resistance between the opposing electrodes was measured to determine the connection resistance value.
【００２０】比較例２ ビスフェノールＡ型エポキシ樹脂と、無水フタル酸、お
よびイミダゾール変性物を混合して得た熱硬化性樹脂１
００重量部中に、平均粒径５μｍのニッケル粒子を３０
重量部加えてペースト状異方性導電接着剤を得た。Comparative Example 2 Thermosetting resin 1 obtained by mixing bisphenol A type epoxy resin, phthalic anhydride and imidazole modified product
30 parts by weight of nickel particles having an average particle size of 5 μm in 00 parts by weight.
A paste-like anisotropic conductive adhesive was obtained in addition to parts by weight.
【００２１】この接着剤を、実施例１と同様に、電極幅
５５μｍ、電極間隔１５μｍのＩＴＯ付きガラス基板に
塗布し、同一パターンで作成されたもう一つのフレキシ
ブル基板を重ね、１５０℃、１００秒、４５ｋｇ／ｃｍ
2 の条件で圧着した後、対向電極間の導通抵抗の測定を
行って、接続抵抗値とした。This adhesive was applied to a glass substrate with ITO having an electrode width of 55 μm and an electrode interval of 15 μm in the same manner as in Example 1, and another flexible substrate formed in the same pattern was overlaid at 150 ° C. for 100 seconds. , 45kg / cm
After crimping under the conditions of 2 , the conduction resistance between the opposing electrodes was measured to determine the connection resistance value.
【００２２】実施例１、比較例１〜２で作成したペース
ト状異方性導電接着剤について測定した接続抵抗値の結
果を表１に示す。Table 1 shows the results of the connection resistance values measured for the paste-like anisotropic conductive adhesives prepared in Example 1 and Comparative Examples 1 and 2.
【００２３】[0023]
【表１】 [Table 1]
【００２４】[0024]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明によれば、Ｎｉ導電粒子の表面を０．００１
μｍ〜１μｍの範囲で被覆することにより、ＩＴＯ付き
ガラス基板等においても、低抵抗の接続の確保が容易な
異方性導電接着剤を得ることができた。As is apparent from the above description and Table 1, according to the present invention, the surface of the Ni conductive particles has a thickness of 0.001%.
By coating in the range of μm to 1 μm, it was possible to obtain an anisotropic conductive adhesive which can easily secure a low-resistance connection even on a glass substrate with ITO or the like.
Claims (2)
び（Ｃ）導電粒子を必須成分とし、（Ｃ）導電粒子が、
粒子表面を金めっきで被覆したＮｉ導電粒子であること
を特徴とする異方性導電接着剤。Claims: 1. An epoxy resin, (B) a curing agent and (C) conductive particles are essential components, and (C) the conductive particles are:
An anisotropic conductive adhesive characterized by being Ni conductive particles whose surface is coated with gold plating.
膜厚が、０．００１μｍ〜１μｍの範囲である請求項１
記載の異方性導電接着剤。2. The film thickness of the gold plating on the surface of the Ni conductive particles is in the range of 0.001 μm to 1 μm.
The anisotropic conductive adhesive according to claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP362999A JP2000207942A (en) | 1999-01-11 | 1999-01-11 | Aerotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP362999A JP2000207942A (en) | 1999-01-11 | 1999-01-11 | Aerotropic conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000207942A true JP2000207942A (en) | 2000-07-28 |
Family
ID=11562798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP362999A Pending JP2000207942A (en) | 1999-01-11 | 1999-01-11 | Aerotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000207942A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514560B2 (en) * | 2001-02-12 | 2003-02-04 | Korea Advanced Institute Of Science And Technology | Method for manufacturing conductive adhesive for high frequency flip chip package applications |
| JP2006124607A (en) * | 2004-11-01 | 2006-05-18 | Denso Corp | Conductive adhesive and electronic device using the same |
| JP2010174096A (en) * | 2009-01-28 | 2010-08-12 | Fujikura Kasei Co Ltd | Anisotropic conductive adhesive |
| CN104342060A (en) * | 2013-07-30 | 2015-02-11 | 上海天臣防伪技术股份有限公司 | Anisotropic conductive adhesive for RFID, and its preparation method |
-
1999
- 1999-01-11 JP JP362999A patent/JP2000207942A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514560B2 (en) * | 2001-02-12 | 2003-02-04 | Korea Advanced Institute Of Science And Technology | Method for manufacturing conductive adhesive for high frequency flip chip package applications |
| JP2006124607A (en) * | 2004-11-01 | 2006-05-18 | Denso Corp | Conductive adhesive and electronic device using the same |
| JP2010174096A (en) * | 2009-01-28 | 2010-08-12 | Fujikura Kasei Co Ltd | Anisotropic conductive adhesive |
| CN104342060A (en) * | 2013-07-30 | 2015-02-11 | 上海天臣防伪技术股份有限公司 | Anisotropic conductive adhesive for RFID, and its preparation method |
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