JP2000251536A - Anisotropic conductive adhesive - Google Patents
Anisotropic conductive adhesiveInfo
- Publication number
- JP2000251536A JP2000251536A JP5634599A JP5634599A JP2000251536A JP 2000251536 A JP2000251536 A JP 2000251536A JP 5634599 A JP5634599 A JP 5634599A JP 5634599 A JP5634599 A JP 5634599A JP 2000251536 A JP2000251536 A JP 2000251536A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- metal
- anisotropic conductive
- conductive adhesive
- resin particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、熱硬化型の異方性
導電接着剤に関し、特に電子機器におけるフリップチッ
プ接続用に好適なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting anisotropic conductive adhesive, and is particularly suitable for flip-chip connection in electronic equipment.
【０００２】[0002]
【従来の技術】異方性導電接着剤は、熱硬化性樹脂など
の絶縁樹脂中に導電粒子、例えば金属コーティング樹脂
粒子または金属粒子を含むものであり、この導電粒子を
通して圧着方向回路間の異方性電気的接続効果が得られ
ている。2. Description of the Related Art Anisotropic conductive adhesives contain conductive particles, for example, metal coating resin particles or metal particles, in an insulating resin such as a thermosetting resin. An isotropic electrical connection effect is obtained.
【０００３】従来の異方性導電接着剤は、導電粒子とし
て金属コーティング樹脂粒子か金属粒子か、どちらか一
種類の導電粒子が含まれるだけであり、あるいは隣接方
向回路間の絶縁を確実にするために上記一種類の導電粒
子に加えて非導電性フィラーが含まれているものもあっ
た。Conventional anisotropic conductive adhesives contain only one kind of conductive particles, metal coating resin particles or metal particles, or ensure insulation between circuits in adjacent directions. For this reason, in some cases, a non-conductive filler is contained in addition to the one kind of conductive particles.
【０００４】[0004]
【発明が解決しようとする課題】従来の異方性導電接着
剤によるフリップチップ接合の場合、接続圧力は導電粒
子によって電気接続信頼性を得るための重要なパラメー
ターである。In the case of the conventional flip chip bonding using an anisotropic conductive adhesive, the connection pressure is an important parameter for obtaining electrical connection reliability by the conductive particles.
【０００５】ところが、導電粒子が金属粒子の場合、一
般的に金属粒子の粒径は不均一であるから接続圧力が低
ければ、図２に示すように、ある素子バンプ４と基板電
極５との位置において大きい金属粒子２で導通すること
ができても、小さい金属粒子２′が分布している素子バ
ンプ４′と基板電極５′の位置では回路導通がとれない
ことがある。また、導電粒子が金属コーティング樹脂粒
子の場合、比較的に粒子の粒径は均一であるが、図３に
示すように、接続圧力が金属コーティング３１が施され
ている樹脂粒子３２の圧縮荷重限界を超えると、樹脂粒
子３２がが大きく変形して樹脂粒子３２表面の金属コー
ト膜３１が破裂し、素子バンプ４と基板電極５との回路
導通がとれなくなることもある。このように、一種類の
導電粒子のみを用いた従来の異方性導電接着剤の場合、
接続圧力によって、その導電粒子が効果的に電気接続に
寄与できなくなるという問題があった。However, when the conductive particles are metal particles, the particle diameter of the metal particles is generally non-uniform, so that if the connection pressure is low, as shown in FIG. Even if the large metal particles 2 can conduct electricity at the position, the circuit may not be conducted at the position between the element bump 4 'and the substrate electrode 5' where the small metal particles 2 'are distributed. When the conductive particles are metal-coated resin particles, the particle size of the particles is relatively uniform, but as shown in FIG. If the value exceeds the above, the resin particles 32 may be greatly deformed and the metal coat film 31 on the surface of the resin particles 32 may be ruptured, so that circuit conduction between the element bumps 4 and the substrate electrodes 5 may not be achieved. Thus, in the case of a conventional anisotropic conductive adhesive using only one kind of conductive particles,
There is a problem that the conductive particles cannot effectively contribute to the electrical connection due to the connection pressure.
【０００６】本発明の目的は、広い接続圧力範囲内でよ
り効果的に電気的接続信頼性を得ることができる異方性
導電接着剤を提供することである。[0006] It is an object of the present invention to provide an anisotropic conductive adhesive capable of more effectively obtaining electrical connection reliability within a wide connection pressure range.
【０００７】[0007]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するために鋭意研究を進めた結果、導電粒子と
して金属コーティング樹脂粒子と金属粒子とを特定条件
で組み合わせて用いた異方性導電接着剤により、広い接
続圧力範囲内にあって導電粒子が効果的に電気的接続信
頼性を得ることを見いだし、本発明を完成したものであ
る。Means for Solving the Problems The inventors of the present invention have made intensive studies to achieve the above-mentioned object, and as a result, have used metal coating resin particles and metal particles as conductive particles in combination under specific conditions. The inventors have found that conductive particles can effectively obtain electrical connection reliability within a wide connection pressure range by using an isotropic conductive adhesive, and the present invention has been completed.
【０００８】即ち、本発明は、熱硬化性樹脂に金属コー
ティング樹脂粒子と金属粒子の二種類の導電粒子が混合
される熱硬化型異方性導電接着剤であって、混合される
金属コーティング樹脂粒子の平均粒径が金属粒子の平均
粒径より大きく、かつ、金属粒子の配合量が金属コーテ
ィング樹脂粒子の配合量の５０重量％〜１００重量％で
あることを特徴とする異方性導電接着剤である。That is, the present invention relates to a thermosetting anisotropic conductive adhesive in which two kinds of conductive particles of metal coating resin particles and metal particles are mixed with a thermosetting resin. Anisotropic conductive adhesive characterized in that the average particle size of the particles is larger than the average particle size of the metal particles, and the compounding amount of the metal particles is 50% by weight to 100% by weight of the compounding amount of the metal coating resin particles. Agent.
【０００９】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【００１０】本発明に用いる熱硬化性樹脂としては、エ
ポキシ樹脂、ポリイミド樹脂、フェノール樹脂など熱硬
化性のものであればよいが、１分子中に２個以上のエポ
キシ基を有する多価エポキシ樹脂が好ましい。エポキシ
樹脂の具体的なものとしては、例えば、フェノールノボ
ラックやクレゾールノボラック等のノボラック樹脂、ビ
スフェノールＡ、ビスフェノールＦ、レゾルシン、ビス
ヒドロキシジフェニルエーテル等の多価フェノール類、
エチレングリコール、ネオペンチルグリコール、グリセ
リン、トリメチロールプロパン、ポリプロピレングリコ
ール等の多価アルコール類、エチレンジアミン、トリエ
チレンテトラミン、アニリン等のポリアミノ化合物、ア
ジピン酸、フタル酸、イソフタル酸等の多価カルボキシ
化合物等とエピクロルヒドリン又は２−メチルエピクロ
ルヒドリンを反応させて得られるグリシジル型のエポキ
シ樹脂が挙げられ、またジシクロペンタジエンエポキサ
イド、ブタジエンダイマージエポキサイド等の脂肪族お
よび脂環族エポキシ樹脂等も挙げられ、これらは単独又
は２種以上混合して使用することができる。The thermosetting resin used in the present invention may be any thermosetting resin such as an epoxy resin, a polyimide resin, a phenol resin, etc., but a polyvalent epoxy resin having two or more epoxy groups in one molecule. Is preferred. Specific examples of epoxy resins include, for example, novolak resins such as phenol novolak and cresol novolak, polyphenols such as bisphenol A, bisphenol F, resorcinol, bishydroxydiphenyl ether,
Polyhydric alcohols such as ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, and polypropylene glycol; polyamino compounds such as ethylenediamine, triethylenetetramine, and aniline; and polycarboxylic compounds such as adipic acid, phthalic acid, and isophthalic acid. Glycidyl-type epoxy resins obtained by reacting epichlorohydrin or 2-methylepichlorohydrin are mentioned, and aliphatic and alicyclic epoxy resins such as dicyclopentadiene epoxide and butadiene dimer epoxide are also used, and these may be used alone or Two or more kinds can be used as a mixture.
【００１１】本発明に用いるエポキシ樹脂の硬化系成分
としては、１分子中に２個以上の活性水素を有するもの
であれば特に制限することなく使用することができる。
具体的なものとして、例えば、ジエチレントリアミン等
のポリアミノ化合物、無水フタル酸等の有機酸無水物、
フェノールノボラック等のノボラック樹脂等が挙げら
れ、これらは単独又は２種以上混合して使用することが
できる。The curing system component of the epoxy resin used in the present invention can be used without any particular limitation as long as it has two or more active hydrogens in one molecule.
Specific examples include, for example, polyamino compounds such as diethylenetriamine, organic acid anhydrides such as phthalic anhydride,
Novolak resins such as phenol novolak and the like can be mentioned, and these can be used alone or in combination of two or more.
【００１２】本発明に用いる金属コーティング樹脂粒子
としては、熱硬化性樹脂の樹脂粒子表面にニッケルを無
電解めっきで覆い、さらにその表面に金めっきを施した
ものなどが挙げられる。無電解めっき及び金属めっきに
用いられる金属は、ニッケル、金のほか、銅、銀、半田
なども用いることができる。この金属コーティング樹脂
粒子の平均粒径は、組み合わせて用いる金属粒子の平均
粒径より大きいものである。The metal-coated resin particles used in the present invention include those obtained by covering the surface of thermosetting resin resin particles with nickel by electroless plating and further plating the surface with gold. The metal used for the electroless plating and the metal plating may be nickel, gold, copper, silver, solder, or the like. The average particle size of the metal coating resin particles is larger than the average particle size of the metal particles used in combination.
【００１３】本発明に用いる金属粒子は、前記した金属
コーティング樹脂粒子より粒径が小さく、比較的硬い金
属を用いる。その理由は、従来技術欄と図３によって説
明したように、金属コーティング樹脂粒子３が比較的柔
らかいので、荷重をかけ過ぎ変形が大きくなると、樹脂
粒子３２表面の金属コート膜３１が破裂し、回路導通を
取れなくなることがある。そこで、図１に示すように、
金属コーティング樹脂粒子３より粒径が小さく、比較的
に硬い金属粒子２を入れることにより、金属コーティン
グ樹脂粒子３の変形量を適切に制御して金属コート膜３
１の破裂を防ぎ、バンプ４・電極５間の導通効果を確実
にすることができるためである。金属粒子の好適な具体
例には、例えば、ニッケル粒子が挙げられる。As the metal particles used in the present invention, a relatively hard metal having a smaller particle diameter than the above-mentioned metal-coated resin particles is used. The reason for this is that, as described with reference to the prior art section and FIG. 3, the metal-coated resin particles 3 are relatively soft, so that when the load is excessively applied and the deformation becomes large, the metal coat film 31 on the surface of the resin particles 32 ruptures, and the circuit In some cases, conduction cannot be achieved. Therefore, as shown in FIG.
By adding relatively hard metal particles 2 having a smaller particle size than the metal coating resin particles 3, the amount of deformation of the metal coating resin particles 3 is appropriately controlled, and the metal coating film 3 is formed.
1 can be prevented, and the conduction effect between the bump 4 and the electrode 5 can be ensured. Preferable specific examples of the metal particles include, for example, nickel particles.
【００１４】また、金属粒子の配合量は、金属コーティ
ング樹脂粒子の５０〜１００重量％の範囲で配合するこ
とが好ましい。この範囲を外れると、効果的な電気接続
信頼性が得られない。The amount of the metal particles is preferably in the range of 50 to 100% by weight of the metal-coated resin particles. Outside this range, effective electrical connection reliability cannot be obtained.
【００１５】[0015]
【作用】本発明の異方性導電接着剤によれば、金属コー
ティング樹脂粒子の平均粒径を金属粒子の平均粒径より
大きく、かつ、その配合量において金属粒子は金属コー
ティング樹脂粒子の５０〜１００重量％の範囲で構成し
たことによって、フリップチップ接合時、広い接続圧力
範囲内により効果的に電気的接続信頼性を得ることがで
きた。According to the anisotropic conductive adhesive of the present invention, the average particle size of the metal-coated resin particles is larger than the average particle size of the metal particles, and the amount of the metal particles is 50 to 50% of that of the metal-coated resin particles. With the configuration in the range of 100% by weight, electrical connection reliability could be more effectively obtained within a wide connection pressure range during flip chip bonding.
【００１６】[0016]
【発明の実施の形態】以下、本発明を実施例によって具
体的に説明するが、本発明はこれらの実施例により限定
されるものではない。以下の実施例および比較例におい
て「％」とは特に説明のない限り、「重量％」を意味す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, “%” means “% by weight” unless otherwise specified.
【００１７】実施例１ エポキシ樹脂としてＥＬＭ−１００（住友化学社製、商
品名）５０％、イミダゾール系硬化促進剤としてＰ−１
０９０／Ｌ−６１８（四国化成社製、商品名）５％、エ
ポキシシランカップリング剤としてＳＺ６０２３（東レ
・ダウコーニング・シリコーン社製、商品名）１％を混
合して得た熱硬化性樹脂に樹脂粒子表面にニッケルを無
電解めっきで覆い、そらにその表面に金めっきを施した
金属コーティング樹脂粒子（粒径３μｍ、金被覆率８０
％）を５重量％添加し、金属粒子のニッケル粒子（平均
粒径０．４μｍ、Ｍａｘ２μｍ）を５重量％添加し、異
方性導電接着剤を得た。Example 1 ELM-100 (manufactured by Sumitomo Chemical Co., Ltd., 50%) as an epoxy resin and P-1 as an imidazole-based curing accelerator
090 / L-618 (trade name, manufactured by Shikoku Chemicals) and 1% of SZ6023 (trade name, manufactured by Dow Corning Toray Silicone Co., Ltd.) as an epoxy silane coupling agent. Metal-coated resin particles in which nickel is covered by electroless plating on the surface of the resin particles and the surface thereof is plated with gold (particle diameter 3 μm, gold coverage 80
%), And 5% by weight of nickel metal particles (average particle size: 0.4 μm, Max: 2 μm) to obtain an anisotropic conductive adhesive.
【００１８】得られた接着剤を用いて、金バンプ付きチ
ップ（６ｍｍ×６ｍｍ、ピッチ１４０μｍ）をフレキシ
ブル基板（電極幅８０μｍ、電極間隔６０μｍ）上に１
８０℃，６０秒，５０ｋｇ／ｃｍ2 の条件でフリップチ
ップを実装した後、各端子の接続抵抗の測定を行った。Using the obtained adhesive, a chip with gold bumps (6 mm × 6 mm, pitch 140 μm) is placed on a flexible substrate (electrode width 80 μm, electrode interval 60 μm).
After mounting the flip chip under the conditions of 80 ° C., 60 seconds, and 50 kg / cm 2 , the connection resistance of each terminal was measured.
【００１９】実施例２ エポキシ樹脂としてＥＬＭ−１００（住友化学社製、商
品名）５０％、イミダゾール系硬化促進剤としてＰ−１
０９０／Ｌ−６１８（四国化成社製、商品名）５％、エ
ポキシシランカップリング剤としてＳＺ６０２３（東レ
・ダウコーニング・シリコーン社製、商品名）１％を混
合して得た熱硬化性樹脂に樹脂粒子表面にニッケルを無
電解めっきで覆い、そらにその表面に金めっきを施した
金属コーティング樹脂粒子（粒径３μｍ、金被覆率８０
％）を５重量％添加し、金属粒子のニッケル粒子（平均
粒径０．４μｍ、Ｍａｘ２μｍ）を５重量％添加し、異
方性導電接着剤を得た。Example 2 ELM-100 (trade name, manufactured by Sumitomo Chemical Co., Ltd.) 50% as an epoxy resin, and P-1 as an imidazole-based curing accelerator
090 / L-618 (trade name, manufactured by Shikoku Chemicals) and 1% of SZ6023 (trade name, manufactured by Dow Corning Toray Silicone Co., Ltd.) as an epoxy silane coupling agent. Metal-coated resin particles in which nickel is covered by electroless plating on the surface of the resin particles and the surface thereof is plated with gold (particle diameter 3 μm, gold coverage 80
%), And 5% by weight of nickel metal particles (average particle size: 0.4 μm, Max: 2 μm) to obtain an anisotropic conductive adhesive.
【００２０】得られた接着剤を用いて、金バンプ付きチ
ップ（６ｍｍ×６ｍｍ、ピッチ１４０μｍ）をフレキシ
ブル基板（電極幅８０μｍ、電極間隔６０μｍ）上に１
８０℃，６０秒，３０００ｋｇ／ｃｍ2 の条件でフリッ
プチップを実装した後、各端子の接続抵抗の測定を行っ
た。Using the obtained adhesive, a chip with gold bumps (6 mm × 6 mm, pitch 140 μm) is placed on a flexible substrate (electrode width 80 μm, electrode interval 60 μm).
After mounting the flip chip under the conditions of 80 ° C., 60 seconds and 3000 kg / cm 2 , the connection resistance of each terminal was measured.
【００２１】比較例１ エポキシ樹脂としてＥＬＭ−１００（住友化学社製、商
品名）５０％、イミダゾール系硬化促進剤としてＰ−１
０９０／Ｌ−６１８（四国化成社製、商品名）５％、エ
ポキシシランカップリング剤としてＳＺ６０２３（東レ
・ダウコーニング・シリコーン社製、商品名）１％を混
合して得た熱硬化性樹脂に金属粒子のニッケル粒子（平
均粒径０．４μｍ、Ｍａｘ２μｍ）を１０重量％添加
し、異方性導電接着剤を得た。Comparative Example 1 ELM-100 (manufactured by Sumitomo Chemical Co., Ltd., 50%) as an epoxy resin, and P-1 as an imidazole-based curing accelerator
090 / L-618 (trade name, manufactured by Shikoku Chemicals) and 1% of SZ6023 (trade name, manufactured by Dow Corning Toray Silicone Co., Ltd.) as an epoxy silane coupling agent. Nickel particles (average particle size: 0.4 μm, Max: 2 μm) as metal particles were added at 10% by weight to obtain an anisotropic conductive adhesive.
【００２２】得られた接着剤を用いて、金バンプ付きチ
ップ（６ｍｍ×６ｍｍ、ピッチ１４０μｍ）をフレキシ
ブル基板（電極幅８０μｍ、電極間隔６０μｍ）上に１
８０℃，６０秒，５０ｋｇ／ｃｍ2 の条件で圧着した
後、各端子の接続抵抗の測定を行った。Using the obtained adhesive, a chip with gold bumps (6 mm × 6 mm, pitch 140 μm) is placed on a flexible substrate (electrode width 80 μm, electrode interval 60 μm).
After crimping under the conditions of 80 ° C., 60 seconds and 50 kg / cm 2 , the connection resistance of each terminal was measured.
【００２３】比較例２ エポキシ樹脂としてＥＬＭ−１００（住友化学社製、商
品名）５０％、イミダゾール系硬化促進剤としてＰ−１
０９０／Ｌ−６１８（四国化成社製、商品名）５％、エ
ポキシシランカップリング剤としてＳＺ６０２３（東レ
・ダウコーニング・シリコーン社製、商品名）１％を混
合して得た熱硬化性樹脂に樹脂粒子表面にニッケルを無
電解めっきで覆い、そらにその表面に金めっきを施した
金属コーティング樹脂粒子（粒径３μｍ、金被覆率８０
％）を１０重量％添加し、異方性導電接着剤を得た。Comparative Example 2 ELM-100 (manufactured by Sumitomo Chemical Co., Ltd., 50%) as an epoxy resin, and P-1 as an imidazole-based curing accelerator
090 / L-618 (trade name, manufactured by Shikoku Chemicals) and 1% of SZ6023 (trade name, manufactured by Dow Corning Toray Silicone Co., Ltd.) as an epoxy silane coupling agent. Metal-coated resin particles in which nickel is covered by electroless plating on the surface of the resin particles and the surface thereof is plated with gold (particle diameter 3 μm, gold coverage 80
%) Was added to obtain an anisotropic conductive adhesive.
【００２４】得られた接着剤を用いて、金バンプ付きチ
ップ（６ｍｍ×６ｍｍ、ピッチ１４０μｍ）をフレキシ
ブル基板（電極幅８０μｍ、電極間隔６０μｍ）上に１
８０℃，６０秒，３０００ｋｇ／ｃｍ2 の条件で圧着し
た後、各端子の接続抵抗の測定を行った。Using the obtained adhesive, a chip with gold bumps (6 mm × 6 mm, pitch 140 μm) is placed on a flexible substrate (electrode width 80 μm, electrode interval 60 μm).
After crimping under the conditions of 80 ° C., 60 seconds, and 3000 kg / cm 2 , the connection resistance of each terminal was measured.
【００２５】以上、実施例１、２および比較例１、２の
接続抵抗の測定結果を表１に示したが、本発明の効果が
確認できた。As described above, the measurement results of the connection resistance of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1, and the effect of the present invention was confirmed.
【００２６】[0026]
【表１】 [Table 1]
【００２７】[0027]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の異方性導電接着剤は、金属コーティング樹
脂粒子と金属粒子の二種類導電粒子が特定条件で混合さ
れることにより、広い接続圧力範囲において効果的に電
気的接続信頼性を得ることができる。As is apparent from the above description and Table 1, the anisotropic conductive adhesive of the present invention is obtained by mixing two kinds of conductive particles of metal coating resin particles and metal particles under specific conditions. Electrical connection reliability can be effectively obtained in a wide connection pressure range.
【図１】本発明の異方性導電接着剤による素子バンプと
基板電極の接合の模式断面図である。FIG. 1 is a schematic cross-sectional view of joining an element bump and a substrate electrode with an anisotropic conductive adhesive of the present invention.
【図２】従来の異方性導電接着剤であって、導電粒子と
して金属粒子を用いたものによる素子バンプと基板電極
の接合の模式断面図である。FIG. 2 is a schematic cross-sectional view of a conventional anisotropic conductive adhesive in which metal bumps are used as conductive particles to bond an element bump and a substrate electrode.
【図３】従来の異方性導電接着剤であって、導電粒子と
して金属コーティング樹脂粒子を用いたものによる素子
バンプと基板電極の接合の模式断面図である。FIG. 3 is a schematic cross-sectional view of a conventional anisotropic conductive adhesive in which element bumps and substrate electrodes are bonded by using metal-coated resin particles as conductive particles.
１ 熱硬化性樹脂 ２，２′ 金属粒子 ３，３′ 金属コーティング樹脂粒子 ３１ 金属コート膜 ３２ 樹脂粒子 ４ 素子バンプ ５ 基板電極 DESCRIPTION OF SYMBOLS 1 Thermosetting resin 2, 2 'Metal particle 3, 3' Metal coating resin particle 31 Metal coat film 32 Resin particle 4 Element bump 5 Board electrode
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｂ 5/16 Ｈ０１Ｂ 5/16 Ｈ０１Ｌ 21/60 ３１１ Ｈ０１Ｌ 21/60 ３１１Ｓ (72)発明者 岸本 泰一 神奈川県川崎市川崎区千鳥町９番２号 東 芝ケミカル株式会社川崎工場内 Ｆターム(参考） 4J040 EB031 EC001 EH011 HA066 HA076 JB02 JB10 KA03 KA07 KA32 LA09 5F044 KK01 LL09 QQ01 5G301 DA02 DA29 DA42 DA57 DD03 5G307 HA02 HB03 HB06 HC01 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01B 5/16 H01B 5/16 H01L 21/60 311 H01L 21/60 311S (72) Inventor Taiichi Kishimoto Kanagawa 9-2 Chidori-cho, Kawasaki-ku, Kawasaki-ku, Japan Toshiba Chemical Corporation Kawasaki Plant F-term (reference) 4J040 EB031 EC001 EH011 HA066 HA076 JB02 JB10 KA03 KA07 KA32 LA09 5F044 KK01 LL09 QQ01 5G301 DA02 DA29 DA42 DA57 DD03 5G307 HA02 HC01
Claims (1)
子と金属粒子の二種類の導電粒子が混合される熱硬化型
異方性導電接着剤であって、混合される金属コーティン
グ樹脂粒子の平均粒径が金属粒子の平均粒径より大き
く、かつ、金属粒子の配合量が金属コーティング樹脂粒
子の配合量の５０重量％〜１００重量％であることを特
徴とする異方性導電接着剤。1. A thermosetting anisotropic conductive adhesive in which two kinds of conductive particles of metal coating resin particles and metal particles are mixed with a thermosetting resin, wherein the average particle size of the mixed metal coating resin particles is An anisotropic conductive adhesive characterized in that the diameter is larger than the average particle size of the metal particles, and the amount of the metal particles is 50% by weight to 100% by weight of the amount of the metal coating resin particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5634599A JP2000251536A (en) | 1999-03-04 | 1999-03-04 | Anisotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5634599A JP2000251536A (en) | 1999-03-04 | 1999-03-04 | Anisotropic conductive adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000251536A true JP2000251536A (en) | 2000-09-14 |
Family
ID=13024654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5634599A Pending JP2000251536A (en) | 1999-03-04 | 1999-03-04 | Anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000251536A (en) |
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|---|---|---|---|---|
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