JPH07176559A - Bonding device having more than two bonding heads - Google Patents

Abstract

PURPOSE:A first frame is transferred at high speed to a first bonding stage. Next, a second frame is transferred at high speed to a second bonding stage. Each frame is transferred onto each bonding stage by a preset pitch to obtain a bonding device with more than two bonding heads mounted. CONSTITUTION:When a first frame reaches directly under a roller 45a, the roller 45a descends to contact the frame. When the roller 45a drives in rotation so that the frame reached a preset position, a second frame projects to outside a magazine M and the frame reaches directly under a roller 43 of a substrate transport device. Thereafter, rollers 43a and 44a descend to contact the frame and the frame driven in rotation is transferred at high speed. Each frame sent at high speed by substrate transport devices 43 and 46 is transferred at low speed intermittently by a preset pitch by substrate transport devices 51 and 52 and bonding is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for receiving a large number of lead frames each having an IC chip, that is, a semiconductor component mounted thereon, and bonding the IC chips to the leads provided on the lead frame.
In particular, it relates to a bonding apparatus having two or more bonding heads.

[0002]

2. Description of the Related Art Conventionally, as a bonding device, a device which handles a so-called magazine as a frame accommodating means for accommodating a plurality of lead frames is known, and a wire bonding device as an example thereof is schematically shown in FIG. Show.

As shown in the figure, the wire bonder is loaded with a magazine 103 containing a plurality of lead frames 102 having a plurality of IC chips 101 mounted thereon in advance, and the lead frames 102 are sequentially taken out from the magazine 103 and bonded. A loader 106 for delivering onto the stage 105, a bonding means 108 for bonding and connecting the IC chip 101 on the lead frame mounted on the bonding stage 105 and the lead formed on the lead frame by using a fine metal wire (wire). And the empty magazine 103 is loaded, and the bonding means 108
The lead frame 102 bonded by the above is stored in the magazine 103 and the unloader 109.

Incidentally, the loader 106 and the unloader 109
Is equipped with positioning means for lowering and positioning the loaded magazine 103 by the arrangement pitch of each lead frame 102 (in this example, it is also a structure in which the lead frame 102 is moved up). Every time the bonding of the lead frame of
The next lead frame is subjected to bonding.

However, when the production amount is to be doubled, for example, by using the above-mentioned bonding apparatus, this bonding apparatus must be added, and at least 2 units are required.
A bonding machine is required. Moreover, in addition to the installation floor area required according to the external dimensions of the equipment for this added bonding equipment, when changing the type of lead frame to be bonded, it is necessary to change the type of each bonding equipment. Therefore, there is a problem that work efficiency is reduced.

[0006] Therefore, the applicant of the present application has decided to adopt one bonding apparatus, which is equipped with two or more bonding heads. There are four possible methods for this bonding apparatus.

In the first system, two lead frames 10 are provided when the transport direction is F as shown in FIG. 7 (A).
2 is simultaneously moved below the bonding heads 1 and 2, and the IC chips 101 mounted on the lead frame 102 are sequentially bonded.

In the second method, as shown in FIG. 7B, the IC chip 1 mounted on one lead frame is used.
01 is sent to the bonding head 1 side, the bonding head 1 first performs bonding every other frame, then the bonded lead frame 102 is sent to the bonding head 102 side, and the remaining IC chip 10
1 is intermittently sent every other frame to bond all IC chips 102.

The third type is an IC chip 1 mounted on one lead frame as shown in FIG. 8 (A).
01 is sent to the bonding head 1 side, the pad (not shown) and the lead of one IC chip 101 are first half-bonded by this bonding head 1, and the remaining half is bonded by the bonding head 2 side. .

As shown in FIG. 8 (B), the fourth type is composed of a carrying means for carrying the lead frame 102 and a bonding stage 105 (bonding stage center 105c in the figure) for bonding. The lead frames bonded by the respective bonding heads 1 and 2 can be carried to the carrying means in the directions indicated by the arrows.

[0011]

However, as shown in FIG.
In the second method shown in (B), since one lead frame is intermittently bonded one frame at a time, it is necessary to perform the positioning twice by the bonding heads 1 and 2, and the heater block has a different shape. It has the drawback of being complicated. Moreover, when one of the bonding heads is stopped due to a failure or the like, the other bonding head must be stopped and the work is stopped.
Moreover, when a bonding failure or the like occurs, it may be difficult to confirm in which device the failure has occurred.

The third system shown in FIG. 8A has the same problem as the second system, and further,
Since the two IC chips 101 are heated twice, problems such as oxidation may occur.

In the fourth method shown in FIG. 8B,
Since the transport means for transporting the lead frame 102 and the bonding stage 105 for bonding are separately configured, there is an advantage that the work can be continued even if one bonding head is stopped due to a failure or the like. However, there is a drawback that the device becomes large and the mechanism and control are complicated.

Therefore, the present invention has been made in view of the above points, and it is an object of the present invention to provide a bonding apparatus equipped with two or more bonding heads based on the first method.

[0015]

SUMMARY OF THE INVENTION According to the present invention, a plurality of frames each having a semiconductor component mounted therein and accommodated in a frame accommodating means are sequentially taken out and bonded on a bonding stage, and the frame after the bonding is completed. A first frame is transferred to the first bonding stage by the high-speed transfer means, and then a second frame is transferred to the second bonding stage by the high-speed transfer means. The bonding is performed by moving each frame on each bonding stage by a predetermined pitch.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a bonding apparatus according to the present invention will be described with reference to the attached drawings. In addition, although wire bonding is described as an example in the present embodiment, it goes without saying that the present invention is also applicable to die bonding and the like.

FIG. 1 is a plan view including a partial cross section of an entire bonding apparatus having two or more bonding heads according to the present invention, and FIG. 2 conceptually shows each mechanical portion of this bonding apparatus. There is. This bonding apparatus includes a loader 20, an unloader 30, and an XY drive mechanism 1.
0, the transport mechanism 40, the bonding stage 60, and the like.

As shown in FIG. 1, an XY drive mechanism 10 is mounted on a frame (not shown) of this bonding apparatus. As shown in FIG. 1, two XY drive mechanisms 10 are arranged in parallel along the transport mechanism 40. This XY
Since the drive mechanism 10 has the same configuration, only one will be described. The XY drive mechanism 10 includes an X table 11 that is movable in the X direction and a motor 13 that is a drive unit that drives the table, a Y table 12 that is movable in the Y direction, and a motor that is a drive unit that drives the table. It is composed of 14 etc. Bonding heads 1 and 2 for bonding are mounted on the XY drive mechanism 10. The bonding heads 1 and 2 are
A bonding arm 3 having a capillary (not shown) as a bonding tool attached to the tip thereof is provided.

A bonding stage 60 is provided in the center of the carrying mechanism 40 along the carrying direction (this bonding stage is an IC chip to be bonded and a plurality of IC chips before and after the bonding of the entire length of the lead frame L \ F). (Indicating the stage portion that carries the portion on which the IC chip is mounted) is disposed.

The bonding heads 1 and 2 are arranged so that the bonding arm 3 is swingably arranged immediately above the bonding stage 60, and the bonding arm 3 is brought into contact with or separated from the lead frame L \ F on the bonding stage 60. It comprises a contacting / separating means (not shown) for pressing, a camera and an illumination lamp (not shown) for picking up an image of the bonding target portion including the IC chip on the lead frame L \ F.

On the side of the bonding stage 60, a loader 20 and an unloader 30 (not shown as a whole) as positioning means shown in FIG. 2 are provided. The loader 20 carries a magazine M and sequentially takes out the lead frames L \ F arranged and housed in the magazine M and sends them to the bonding stage 60, and the lead frames L \\ bonded on the bonding stage 60. F is stored in the magazine M on the unloader 30 side. Since the loader 20 and the unloader 30 have the same configuration, only one of them will be mainly described.

As shown in FIG. 1, the loader 20 has an elevating member 21 having a substantially L-shaped cross section and capable of carrying one magazine M, and an elevating member 21 which is vertically guided. And guiding means (not shown). The magazine M is attachable to and detachable from the elevating member 21, and is fixed to the elevating member 21 by a lock member 22 mounted on the elevating member 21.

Behind the elevating member 21, the elevating member 21
A feed screw 23 such as a long ball screw is rotatably provided so as to extend in the up-and-down direction to be moved.
A belt wheel 24 is fitted on the upper end of the feed screw 23. A pulse motor (not shown) is disposed near the belt wheel 24, and the belt wheel 25 fitted to the output shaft of the pulse motor and the belt wheel 24 have the belt 2
6 is hung around. Further, a nut (not shown) is built in the rear surface of the elevating member 21, and the nut is screwed into the feed screw 23.

The above-mentioned configuration constitutes the positioning means. By controlling the operation of the pulse motor, the loader 20 as this positioning means appropriately moves and positions the magazine M carried by the lifting member 21 provided therein in the lead frame arrangement direction of the magazine M.

Next, the frame take-out means for taking out the lead frames L \ F one by one from the magazine M positioned by the loader 20 and sending them to the bonding stage 60 will be described.

As shown in FIG. 1, the lead frame L \ F in the magazine M loaded on the elevating member 21 is provided on the side of the elevating member 21 of the loader 20 to operate the loader 20. A push mechanism 3 for projecting one sheet at a time
1 is provided. The push mechanism 31 includes a motor 32 and a pulley 32 fitted to an output shaft of the motor 32.
a, another pulley 33 arranged apart from the pulley 32a, a belt 34 wound around the pulleys 32a and 33, and a frame 35 coupled to the belt 34,
The pusher 36 is fixed to the frame 35 and engages with the lead frame L \ F at its tip to push the lead frame L / F out of the magazine M. That is, when the motor 32 rotates in the forward and reverse directions, the pusher 3 passes through the belt 34.
6 reciprocates to push the lead frame L \ F out of the magazine M when the pusher 36 moves forward. The push mechanism 31 is not provided on the unloader 30 side.

On the other hand, as shown in FIG. 1, a pair of guide rails 41 and 42 are provided in parallel so as to sandwich the two bonding stages 60 from both sides. These guide rails 41, 42 prevent the meandering of the lead frame L \ F that is carried after being projected out of the magazine M and brought onto the bonding stage 60, and is a conveyance for performing highly accurate conveyance. It defines a path. The guide rails 41 and 42 can be divided and configured as shown by a line H-H shown by a virtual line in FIG. That is, in this case, a total of four guide rails are used. By doing so, there is an advantage that the guide rail becomes short in the case of configuring the transport mechanism 40, so that the guide rail can be easily processed and the parallelism of the rail can be easily obtained with high accuracy. Moreover, the guide rails for each of the bonding heads 1 and 2 can be individually and independently positioned. As a result, for example, in the case of normal lead frame transportation, when there is a space between the lead frame and the lead frame of 0.1 mm to 0.2 mm, for example, a state in which the guide rails and the lead frame substantially contact each other during bonding. If the guide rails are moved to perform the positioning operation, if the guide rails of the bonding heads 1 and 2 are not divided, they will be positioned integrally. The positioning operation becomes possible and the positioning is extremely easy. For example, for a lead frame in which one bonding head 1 (or 2) is performing bonding and the other bonding head 2 (or 1) has completed bonding It becomes possible to discharge.

Along the one guide rail 41, there are provided substrate transfer devices 43 and 44 having rollers 43a and 44a for frame transfer, respectively. This conveys to the bonding head 2 side, and rollers 45a and 46 are used as a conveying device to the bonding head 1 side.
Substrate transfer devices 45 and 46 including a are provided. Since the substrate transfer devices 43 to 46 have the same structure, one substrate transfer device 43 will be described in detail. The pitch P ₁ (see FIG. 1) between the substrate transfer devices 43 and 44 is set smaller than the length of the lead frame L \ F. This is because the lead frame L \ F is transferred between the substrate transfer devices 43 and 44. These substrate transfer devices 43 to 46 constitute a high speed transfer means. The high-speed transfer means is not limited to the rollers, but may have another structure.

As shown in FIGS. 3 and 4, the substrate transfer device 43 has a slider 47 which is vertically movable and rotatably supports the roller 43a, and a pulse which is attached to the slider 47 and rotationally drives the roller. It has a motor 48, an air cylinder 49 for pushing up the slider 47, and a coil spring (not shown) for urging the slider 47 downward. As shown, air cylinder 49
While the rod 49a of the roller 43a is pulled in, the roller 43a contacts the lead frame L \ F by the biasing force of the coil spring and transfers the lead frame L \ F. Away from. A solenoid plunger may be used instead of the air cylinder.

Other substrate transfer devices 51 and 52 are provided on the other guide rail 42 side. Since the substrate transfer device 52 has the same configuration as 51, the substrate transfer device 5
The configuration of No. 1 will be described. This substrate transfer device 51 is
A base portion 54 mounted on a slider 53 provided so as to reciprocate in the direction in which the lead frame L \ F should be conveyed (a direction perpendicular to the paper surface in FIG. 3), and a pair provided on the base portion 54. Gripping mechanisms 55 and 56. A nut (not shown) is built in the slider 53, and a long feed screw 57 screwed into the nut is provided. The feed screw 57 is rotationally driven by a pulse motor (not shown), whereby the base portion 54 reciprocates together with the slider 53.

Since both of the above-mentioned gripping mechanisms 55 and 56 have the same construction, one gripping mechanism 56 will be described in detail. The pitch P ₂ (see FIG. 1) between the gripping mechanisms 55 and 56 is set smaller than the length of the lead frame L \ F. This is also the same as between the substrate transfer devices 43 and 44 described above, and both gripping mechanisms 55 and 56.
This is because the lead frame L \ F is transferred between them.

The gripping mechanism 56 shown in FIG.
4 has a pair of gripping members 58 and 59 which are vertically and linearly attached to each other so as to be vertically movable. Then, the lead frames L \ F as substrates, which are formed in, for example, rectangular plates at the tips of the gripping members 58, 59, respectively.
The claw portions 58a and 59a for holding the side end portions of the are fixedly provided.

Here, the opening / closing means for opening / closing both the gripping members 58 and 59 is constructed as follows.

The opening / closing means has a gripping member interlocking mechanism (not shown). The gripping member interlocking mechanism interlocks the pair of gripping members 58 and 59. As shown in FIG. 3, the spindle 61 has a base portion 5
4 is rotatably attached via a bearing 62. A substantially disk-shaped cam member 63 having a cam surface on the outer periphery is fitted as a displacement member at one end of the spindle 61, and a roller as a cam follower provided at the lower end of one gripping member 59. The cam surface is in sliding contact with 64. The other end of the spindle 61 is connected to the output shaft of the pulse motor via a coupler (not shown). As the displacement member, other than the cam member 63, various structures can be adopted.

That is, when the spindle 61 is rotationally driven by the pulse motor, the cam member 63 is rotated, whereby a driving force is applied to the gripping member 59 via the roller 64 and the gripping member 59 is closed ( (Upward)
To the other gripping member 58 via a gripping member interlocking mechanism (not shown), and the gripping member 58 also moves or displaces in the closing direction (downward). Is configured.

The pulse motor, the coupler, the spindle 61, and the bearing 62 constitute a driving force applying means for applying a driving force to the cam member 63. Further, the driving force applying means, the cam member 63, the roller 64 as a cam follower, and the gripping member interlocking mechanism constitute the opening / closing means described above.

The spindles provided in both the gripping mechanisms 55 and 56 are synchronized with the cam member 63 provided in the gripping mechanism 56 by the belt wound around the toothed belt wheel and the gripping mechanism 5 is provided.
A cam member (not shown) included in 5 is rotationally driven.
Therefore, a plurality of cam members are driven by one pulse motor.

The substrate transfer device 51 is constructed as described above.

Next, the pressing means for pressing and fixing the lead frame L \ F to the bonding stage 38 during bonding on the bonding stage 38 will be described.

As shown in FIG. 1, this pressing means has a frame presser 68 for pressing the lead frames L \ F. As is clear from FIG. 1, a plurality of IC chips (semiconductors) 69 are mounted on the lead frame L \ F side by side at equal pitches in the longitudinal direction of the lead frame, and these are mounted on the frame retainer 68. An opening 68a facing the IC chip 69 is formed. The frame retainer 68 is vertically guided by a guide (not shown).

On the other hand, as shown in FIG. 3, the bonding stage 60 has a lead frame L \
A heating means 60a for heating F to a predetermined temperature is built in.

As shown in FIG. 1, various sensors 7
0 to 74 are provided along the guide rail 42 that guides the lead frame L \ F. These sensors are
For example, the photo sensor includes a light emitting element and a light receiving element.

In the sensor 70 arranged near the magazine M on the elevating member 21, the end portion of the lead frame L \ F projecting outside the magazine M by the push mechanism 31 is attached to the roller 43a of the substrate transfer device 43. It is for detecting whether or not it has been reached. The second sensor 71 provided in the vicinity of the bonding stage 60 functions as a frame arrival detection unit that detects that the edge of the lead frame L \ F has arrived at this position and issues a signal. Further, the third sensor 72 acts as a detecting means for counting the position of the lead frame L \ F conveyed through the second sensor 71, and the fourth sensor 73 is bonded by the bonding means. The fifth sensor 74 detects the arrival at the stage 60, and the fifth sensor 74 stores the lead frame in the unloader 30 by detecting the arrival of the lead frame L \ F at the end edge of the unloader 30. It is a thing.

Next, the operation of the bonding apparatus having the above structure will be described.

First, the operation of the bonder as a whole will be described.

When the operation button or the like for starting the work is operated, a magazine M containing a plurality of lead frames L / F each mounted with an IC chip is supplied as shown in FIG. Lifting member 2
1 and is fixed to the elevating member 21 by the lock member 22.

When the magazine M is placed on the elevating member 21, the magazine M has a sensor (not shown) on the elevating member 21.
Is detected and a detection signal is emitted. Then, the loader 20 is operated, and the lead frame L \ F at the bottom of the plurality of lead frames L \ F arranged in the magazine M is sent out onto the bonding stage 60. The lead frame L \ F taken out on the bonding stage 60 is intermittently fed by the loader by the arrangement pitch of the mounted IC chips, and accordingly is heated to a predetermined temperature on the bonding stage 60. It At the same time, the bonding head 1
The XY drive mechanism 10 is operated, and the pads (electrodes) on the respective IC chips and the leads formed in the lead frame L \ F are bonded and connected by a conductive thin metal wire (wire: not shown). .

When the bonding of the lead frames L \ F is completed as described above, the lead frames are stored in the magazine M of the unloader 30. With respect to the second lead frame L \ F, the same operation as that for the first lead frame is performed and bonding is performed, and the lead frame L \ F is stored in the magazine M of the unloader 30. After that, the series of operations described above is repeated for all the lead frames L \ F in the magazine M, and the bonding is continued.

By the way, in the bonding apparatus of this embodiment, two bonding heads 1 and 2 are mounted. Therefore, by operating the push mechanism 31 shown in FIG. 1, the lowest lead frame L \ in the magazine M
F is projected outside the magazine. Then, the protrusion of the lead frame L \ F is detected by the sensor 70.
At this time, the end portion of the lead frame L \ F in the protruding direction reaches immediately below the roller 43a of the substrate transfer device 43 shown in FIG. 1, but the rollers 43a and 44a are the rod 4 shown in FIG.
It is raised by the action of 9a and does not interfere with the lead frame. After that, as shown in FIG. 4, the rollers 43a and 44a are lowered to come into contact with the lead frames L \ F, and the rollers 43a and 45a are rotationally driven to move the lead frames to the right side in FIG. It is conveyed at high speed toward.

Then, the end portion of the first lead frame L \ F in the feed direction reaches directly below the roller 45a of the next substrate carrying device 45 via the substrate carrying device 44. At this time, the roller 45a is raised and does not interfere with the lead frame. Incidentally, the fact that the end of the lead frame L \ F in the feed direction reaches just below the roller 45a means that an encoder (not shown) provided in the previous substrate transfer device 43 or a sensor (not shown) arranged near the roller 45a. The arrival of the lead frame L \ F can be detected by.

When it is confirmed that the end of the first frame, that is, the first lead frame L \ F in the feed direction has reached the position just below the roller 45a, the roller 45a is lowered and the lead frame L is moved. \ F to contact the roller 45
A is rotationally driven and the lead frame is sent to the position shown in FIG.

When the first lead frame L \ F reaches a predetermined position, the second frame, that is, the second lead frame L \ F is pushed out of the magazine M by the push mechanism 31. Then, this lead frame L \ F
Of the board transfer device 43 shown in FIG.
Reach just below the roller 43a. At this time, the roller 43a
And 44a are raised by the action of the rod 49a shown in FIG. 3, and do not interfere with the lead frame. After that, the rollers 43a and 44a are lowered and come into contact with the lead frame L \ F so that the rollers 43a and 4a
When the lead frame 4a is rotationally driven, the lead frame is conveyed rightward in FIG. 1 at a high speed, and the bonding head 2 enables bonding.

Further, the holding mechanisms 55 and 56 of the substrate transfer devices 51 and 52 provided on the opposite side of the substrate transfer devices 43 to 46 are kept in the open state, and these lead frames are being transferred. It does not interfere with L \ F.

The lead frame L \ F sent at a high speed by the substrate transfer devices 43 to 46 is the substrate transfer device 5.
1 and 52 are intermittently transferred at a predetermined pitch at a low speed to perform a bonding operation.

In this bonding apparatus, the substrate transfer devices 43 to 46 are used when the lead frame L \ F is transferred at a high speed, and the substrate transfer devices 51 and 52 are used when the lead frame L \ F is moved at a relatively low speed or intermittently. it can. It is also possible to increase the speed by changing the strokes of the substrate transfer devices 51 and 52.

Next, according to the bonding apparatus of the present invention, as shown in FIG. 5, the first lead frame L \ F extruded by the push mechanism 31 is conveyed and the tip thereof is detected by the sensor 73. The tip of the second lead frame L \ F is detected by the sensor 70.
Then, the respective lead frames L \ F are bonded, discharged to the unloader 30 side, and stored.

On the other hand, in FIG. 6, bonding is performed according to the method shown in FIG. 7B. In this method, the tip of the first lead frame L \ F is detected by the sensor 70. First, each frame is transferred and bonded intermittently. Next, the remaining pads whose tip is detected by the sensor 73 conveyed to the bonding head 1 side are intermittently bonded to complete the bonding of the first lead frame L \ F. Therefore,
In FIG. 6, the bonding heads 1 and 2 are provided for one lead frame L \ F.

Therefore, in FIGS. 5 and 6, the lead frame L \ F is replaced by the push mechanism 31.
The time from the discharge of \ F to the bonding is shown on the vertical axis. As is clear from FIGS. 5 and 6, in the transfer method 1, as shown in FIG. \ F is completed in about 10 seconds, the one shown in FIG. 6 takes about 1 time to complete the bonding of the first lead frame L \ F.
Since it takes about 0 seconds, it is clear that high speed bonding cannot be performed. In this case, as the lead frame L \ F, eight lead frames having 80 pins were used for comparison.

Further, in the structure shown in FIG. 6, since two bonding heads intervene in one lead frame L \ F, it is not possible to carry out bonding when one head fails. Even if both bonding heads are in an operable state, it is difficult to know which bonding head is abnormal when a bonding failure or the like occurs.

Further, in the bonding apparatus according to the present invention, even when a plurality of bonding apparatuses are arranged in series, adjustment and the like are easy and it is easy to cope with high speed. Further, since the roller is used as the substrate transfer device, the frame can be transferred at high speed.

In the above embodiment, each roller 43 for transferring the lead frame L \ F at high speed.
With respect to a, 44a, 45a, and 46a, the frame transfer speed is variable by changing the rotation speed of the pulse motor that is the drive source of these. That is, while the lead frame L \ F taken out from the magazine M on the loader 20 is brought to the bonding position, the rollers are normally rotated at high speed, and the lead frame L \ F after the bonding is completed on the unloader 30. A relatively low speed is used when the transfer is carried out so as to be accommodated in the M. This avoids inconveniences such as collapse of the loop shape of the wire (not shown) stretched by bonding.

In the above embodiment, the case where only wire bonding is performed has been described, but it goes without saying that the present invention can be applied to other work such as die bonding. For example, considering the above-mentioned embodiment, it can be mentioned that the bonding head 1 in the former stage is for die bonding and the bonding head 2 in the latter stage is for wire bonding.

[0063]

As described above, according to the present invention,
A plurality of frames each having a semiconductor component mounted therein and housed in the frame accommodating means are sequentially taken out, and the frames are conveyed to a bonding stage by a conveying mechanism to perform bonding, and the frame after the bonding is transferred to the frame accommodating means. In the bonding apparatus to be housed, the first frame is transferred to the first bonding stage by the high-speed transfer means, and then the second frame is transferred to the second bonding stage by the high-speed transfer means to transfer each frame to the other. Since the bonding is carried out by moving the lead frame by a predetermined pitch at a time, the lead frame can be transported at a high speed, and it is not necessary to position the lead frame twice for one lead frame. The shape of the heater block can also be easily configured. Further, according to the present invention, even if the bonding head is stopped due to a failure or the like, it is not necessary to stop the other bonding head, so that work efficiency is not reduced, and even if a bonding failure or the like occurs, it can be confirmed. There is an effect that work becomes easy. Further, according to the present invention, even if there are a plurality of bonding heads, the product type can be easily exchanged, and the device can be downsized.

[Brief description of drawings]

FIG. 1 is a plan view including a partial cross section of a bonding apparatus.

FIG. 2 is an operation explanatory view of an internal mechanism such as a lifting member shown in FIG.

FIG. 3 is a cross-sectional view with respect to FIG.

FIG. 4 is an explanatory diagram of the substrate transfer device shown in FIG.

FIG. 5 is a diagram showing a bonding timing of the bonding apparatus according to the present invention.

FIG. 6 is a diagram showing timing of bonding according to another method.

FIG. 7A and FIG. 7B are diagrams showing a bonding method.

FIG. 8A and FIG. 8B are views showing a bonding method.

FIG. 9 is a diagram showing a conventional bonding apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Bonding head 2 Bonding head 3 Bonding arm 10 XY drive mechanism 11 X table 12 Y table 13,14 Motor 20 Loader 21 Elevating member 22 Locking member 23 Feed screw 24,25 Belt wheel 26 Belt 30 Unloader 31 Push mechanism 32 Motor 32a, 33 Pulley 34 Belt 35 Frame 36 Pusher 40 Transfer Mechanism 41, 42 Guide Rail 43, 44, 45, 46 Substrate Transfer Device 43a, 44a, 45a, 46a Roller 47 Slider 48 Pulse Motor 49 Air Cylinder 49a Rod 51, 52 Substrate Transfer Device 53 slider 54 base part 55, 56 gripping mechanism 57 feed screw 58, 59 gripping member 58a, 59a claw part 60 bonding stage 60a heating means 61 spindle 62 Bearings 63 cam member 64 the roller 68 frames presser 68a opening 69 IC chip 70,71,72,73,74 sensor

Claims (5)

[Claims] 1. A frame in which a plurality of frames each having a semiconductor component mounted therein and accommodated in a frame accommodating means are sequentially taken out, the frames are conveyed to a bonding stage by a conveying mechanism to perform bonding, and the bonding is completed. A first frame is transferred to the first bonding stage by the high-speed transfer means, and then a second frame is transferred to the second bonding stage by the high-speed transfer means. A bonding apparatus having two or more bonding heads, wherein each frame is moved by a predetermined pitch on each bonding stage to perform bonding. 2. The bonding apparatus according to claim 1, wherein the predetermined pitch is an arrangement pitch of semiconductor components arranged on the frame. 3. The bonding apparatus according to claim 1, wherein the high speed transfer means is a roller. 4. The transport mechanism includes a guide rail,
2. The bonding apparatus according to claim 1, wherein the guide rail is divided along a direction intersecting with the carrying direction. 5. The high-speed transfer means has a variable frame transfer speed.
The bonding apparatus according to any one of the above.