JPH07176554A - Chip detect position setting mechanism of die bonder - Google Patents

Abstract

PURPOSE:To prevent the degradation of reliability of the results of evaluating go or no-go marks generated due to illuminance discrepancy and the like and to improve the processing capacity and processing rate of a device when a chip recognition position of a die bonder is determined by a camera. CONSTITUTION:There is provided an image processing device, which performs image processing of a positioning chip 5, which can recognize in a view of a camera, and its adjacent chip 5a, separately, and which can independently set the correction of position setting of the positioning chip 5 and the detection of go and no-go mark evaluation areas of the adjacent chip 5a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die recognition and positioning mechanism for a die bonder used for assembling a semiconductor device.

[0002]

2. Description of the Related Art The conventional chip recognition and positioning mechanism of a die bonder includes the following three methods.

The first method is as shown in the configuration diagram of FIG.
The metal or plastic ring 3 to which the adhesive sheet 4 holding the chip 5 is attached is placed, and the motors 8, 8a,
8b driven XY-θ table 2, and XY
A camera 1 arranged above the -θ table, an image processing device 6 for processing an image recognized by the camera, and an arithmetic processing device 7 for calculating a deviation amount between the recognized chip and a previously input chip are provided. is doing.

Next, the operation will be described. In this method, as shown in the flowchart of FIG. 5, first, the chip on the adhesive sheet held by the metal or plastic ring placed on the XY-θ table was set above the XY-θ table. After the image is recognized by the camera and image processing is performed, the amount of deviation from the chip that has been input in advance is calculated by the arithmetic processing unit, and the motor for driving the XY-θ table is feedback-controlled to perform positioning.

Simultaneously with these series of operations, when the image is recognized by the camera and image processing is performed, the chip at the position adjacent to the chip for positioning is recognized by the arithmetic processing unit as shown in the recognition image diagram of FIG. Then, the good / defective mark determination areas 9 and 9a are calculated from the outer shape position of the chip to determine the good / defective mark.

When it is determined that the chip is good, the adjacent chip is positioned after the chip that is currently positioned. When it is determined that the chip is defective, the operation of positioning the chip is not performed.

The second method is to mount a metal or plastic ring 3 to which an adhesive sheet 4 for holding a chip 5 is attached, as shown in the configuration diagram of FIG. 7, and mount the motors 8, 8a, 8b.
X-Y-θ table 2 driven by
It has a plurality of cameras 1 and 1a arranged above the table, an image processing device 6 for processing the recognized image, and an arithmetic processing device 7 for calculating the amount of deviation between the recognized chip and the chip previously input. ing.

Next, the operation will be described. In this method, as shown in the flowchart of FIG. 8, first, the chip on the adhesive sheet held by the metal or plastic ring placed on the XY-θ table was set above the XY-θ table. Positioning is performed by performing feedback processing on the motor for driving the XY-θ table, which is recognized by the camera 1 and after image processing is performed, the amount of deviation from the chip that has been input in advance is calculated by the arithmetic processing unit.

Simultaneously with these series of operations, when the camera 1 recognizes and performs image processing, a chip at a position adjacent to a chip for positioning is recognized by another camera 1a and image processing is performed, and then the calculation processing device is provided. Position is recognized, and a good / defective mark determination area is calculated from the outer shape position of the chip to determine a good / defective mark.

After the judgment as good or bad, the same control as that of the method 1 was performed.

The third method is as shown in the configuration diagram of FIG.
A metal or plastic ring 3 to which an adhesive sheet 4 holding a chip 5 is attached is placed on the motors 8, 8a, 8
X-Y- [theta] table 2 driven by b and X-Y- [theta]
The camera 1 installed above the θ table, the image processing device 6 for processing the recognized image, the arithmetic processing device 7 for calculating the deviation amount between the recognized chip and the chip previously input, and the previous process A floppy disk drive or memory card reader 10 that reads the results from a floppy disk or memory card that inputs the results of good or bad chips, and a bar code reader 11 that reads the bar code for matching the results of the floppy disk with the ring. Have

Next, the operation will be described. In this method, as in the flow chart shown in FIG. 10, the result of good or bad chips in the previous step is read by a floppy disk drive or a memory card reader. Next, read the bar code of the ring with a bar code reader, extract the corresponding good or bad results from the previously read results, and place the XY-θ table at the pellet location where good information was obtained. The chip on the adhesive sheet that is operated and held by the metal or plastic ring is recognized by the camera installed above the XY-θ table, and after the image processing is performed, the deviation from the chip that has been input in advance is recognized. The amount was calculated by the arithmetic processing unit, and the positioning was performed by feedback-controlling the motor for driving the XY-θ table.

[0013]

Among the conventional chip recognition and positioning mechanisms, in the first method, image processing is performed at the same time with the chip for positioning which is recognized by the camera and the adjacent chip, so that unevenness in illuminance or the like occurs. As a result, the image after image processing of the adjacent chips cannot be distorted and positioned, so that the good / bad mark judgment area cannot be calculated, and as a result, the good / bad marks cannot be judged, resulting in a decrease in the processing capability of the device. was there.

In the second method, since the distance between the camera 1 and the camera 1a installed above the XY-θ table is wider than the distance between the pellet to be positioned and the adjacent pellet, the adjacent pellets can be recognized obliquely. However, there is a drawback that the positioning cannot be performed accurately.

In the third method, the device must have a bar code reader, a floppy disk unit or a memory card reader, which makes the device expensive.
Further, there is a drawback that the processing speed of the product of the apparatus is reduced because the processing time of the information processing is required.

[0016]

A die recognition and positioning mechanism for a die bonder according to the present invention comprises an XY-θ table on which a metal or plastic ring on which an adhesive sheet for holding chips is attached is placed, and an XY-table. a motor that drives θ, a camera installed above the XY-θ table,
An image processing device that separately performs image processing of the recognized positioning chip and an adjacent chip, and can set a judgment area for a good mark or a defective mark of the adjacent chip independently of the outer shape recognition of the positioning chip. An arithmetic processing unit for calculating the amount of deviation between the chip to be positioned and the chip previously input is provided.

[0017]

The present invention will be described below with reference to the drawings. FIG. 1 is a flowchart of the first embodiment of the present invention.
The configuration of a die bonder to which the present invention can be applied is the same as FIG. 4 showing the conventional technique. As shown in the flow chart of FIG. 1, a chip 5 for positioning on the adhesive sheet 4 held by a metal or plastic ring 3 placed on the XY-θ table 2 in the camera 1 and a chip for performing this positioning. Recognize adjacent chips.
The recognized image is taken into the image processing device 6, and the image processing of the chip to be positioned and the chip adjacent thereto is simultaneously performed individually.

Next, the arithmetic processing unit 7 calculates the amount of deviation between the current position of the chip for which image processing has been performed for positioning and the chip that has been input in advance, and the amount of deviation is X.
-Y- [theta] table is transmitted to the motors 8, 8a, 8b that drive the table to perform feedback control, and at the same time, the image of the chip adjacent to the chip to be positioned is image-processed. The judgment is made for the judgment area of.

After the mounting of the positioned chip is completed, when the positioning operation of the next chip is performed, the chip judged to be defective from the judgment result of the good mark and the defective mark previously carried out is not positioned, and the next chip is positioned. Take action.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a flowchart of the second embodiment of the present invention. FIG. 3 is a configuration diagram of the second embodiment of the present invention. A chip 5 for positioning on an adhesive sheet 4 held by a metal or plastic ring 3 placed on an XY-θ table 2 in a camera 1, and a plurality of chips 5a adjacent to the chip for positioning. , 5b are recognized. The recognized image is taken into the image processing device 6, and the image processing of the positioning chip and a plurality of adjacent chips is simultaneously performed individually.

Next, the arithmetic processing unit 7 calculates the amount of deviation between the current position of the chip for which image processing has been performed for positioning and the previously input chip, and the amount of deviation is X
-Y- [theta] tables are transmitted to the motors 8, 8a, 8b that drive the tables to perform feedback control, and at the same time, images that have been subjected to image processing of a plurality of chips adjacent to the chips to be positioned are set in advance. Judgment is performed on the judgment areas of the good and bad marks.

When the positioning operation of the next chip is carried out after the mounting of the positioned chips is completed, it is judged as defective according to the judgment result of the good mark and the defective mark for the plurality of chips which can be recognized in one field of view of the camera carried out previously. The chip is not positioned, but the next chip is positioned.

[0023]

As described above, according to the present invention, image processing is performed separately for a chip for positioning which is recognized by a camera and an adjacent chip, and the adjacent chip has a good or defective mark determination area. Since the judgment can be made independently of the outer shape recognition of the positioning chip, there is an effect that the reliability of the judgment result of the good or bad mark caused by the unevenness of illuminance or the like can be improved and the deterioration of the processing capacity of the apparatus can be prevented. Further, the processing speed of the device varies depending on the non-defective product rate of the chips on the adhesive sheet, but if the non-defective product ratio is the same as in the relationship between the non-defective product ratio and the processing speed of the device shown in FIG. 11, the processing time becomes short. Have.

[Brief description of drawings]

FIG. 1 is a flowchart of a first embodiment of the present invention.

FIG. 2 is a flowchart of a second embodiment of the present invention.

FIG. 3 is a configuration diagram of a die bonder to which a second embodiment of the present invention can be applied.

FIG. 4 is a configuration diagram of a die bonder to which the conventional method 1 can be applied.

FIG. 5 is a flowchart of method 1 of a chip recognition positioning mechanism of a conventional die bonder.

FIG. 6 is a recognition image diagram according to the conventional method 1.

FIG. 7 is a configuration diagram of a die bonder to which a conventional method 2 can be applied.

FIG. 8 is a flowchart of conventional method 2.

FIG. 9 is a configuration diagram of a die bonder to which a conventional method 3 can be applied.

FIG. 10 is a flowchart of conventional method 3.

FIG. 11 is a graph comparing the processing speeds of the conventional method 3 and the first embodiment.

[Explanation of symbols]

1, 1a camera 2 XY-θ table 3 ring 4 adhesive sheet 5, 5a, 5b chip 6 image processing device 7 arithmetic processing device 8, 8a, 8b motor 9, 9a good, defective mark determination area 10 floppy disk drive Or memory card reader

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Claims (1)

[Claims] 1. An XY-θ table mounted with a metal or plastic ring to which an adhesive sheet holding a chip is attached and driven by a motor, and a camera installed above the XY-θ table. In a chip recognition positioning mechanism of a die bonder having an image processing device for processing a recognized image and an arithmetic processing device for calculating a deviation amount between the recognized chip and a previously input chip, a chip to be positioned recognized by the camera. And an adjacent chip are separately image-processed, and an image processing device capable of recognizing the judgment area for the good or bad mark of the adjacent chip, which is performed simultaneously with the positioning of the chip to be positioned, independently of the outer shape recognition of the positioning chip. A chip recognition and positioning mechanism for the die bonder characterized by being equipped.