JP2503963Y2 - Drive unit for die bonder rotary type head mechanism - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for driving a die bonder rotary head mechanism in which a plurality of bonding heads in a die bonder used in the latter half of the semiconductor manufacturing process are arranged at a constant pitch on the same circumference. Is.

[0002]

2. Description of the Related Art Such a die bonder is one in which die chips formed on a wafer aligned with a substrate are adsorbed one by one and adhered and fixed to a substrate of an envelope such as a lead frame or a ceramic package. In this type of die bonder, as shown in FIG. 5 showing a plan view and “FIG. 6” showing a front view, in the same circumference of the cross-shaped rotary base 2 rotationally driven by the direct drive motor 1. There is a die bonder rotary head mechanism 7 in which bonding heads 3 to 6 are vertically provided at four positions. The die bonder rotary head mechanism 7 is articulated by the direct motor 1 at an angle of 90 ° corresponding to the arrangement pitch of the bonding heads 3 to 6, and each of the bonding heads 3 to 6 is located at the pickup stage P. , The die chip of the wafer 8 is vacuum-adsorbed by the downward movement, and when the die chip of the wafer 8 is moved to the bonding stage B after the two articulations, the die chip is moved downward to bond the die chip to the lead frame substrate of the envelope on the transfer rail 9. To do. Further, the camera 10 arranged on the pickup stage P images the die chip that is next picked up when the die bonder rotary head mechanism 7 rotates, processes the input image to recognize the quality of the die chip, and determines that it is a defective product. When it is recognized, the die bonder rotary head mechanism 7 is idled by 90 ° without adsorbing the die chip, and at that time, the quality of the die chip at the pickup position which is pitch-conveyed according to the size of the die chip is recognized. It is supposed to do.

[0003]

By the way, in the drive means of the die bonder rotary type head mechanism 7 described above, when the rotary type head mechanism 7 is rotated by 90 °, the camera 10 is operated.
Even if it is determined from the input image that the die chip at the pickup position is defective, the field of view of the camera 10 is blocked by the bonding heads 3 to 6 that are stationary downwards, so that the die chip is transferred to the next pickup position by pitch conveyance. The die chip cannot be imaged to recognize its quality. In order to capture the image of the die chip, the rotary head mechanism 7 is rotated by 90 ° in a state in which the die head is unavoidably attracted to the bonding heads 3 to 6.
Therefore, since there is no die chip in the bonding heads 3 to 6, which should normally be sucked in a vacuum, there is a problem that a vacuum leak occurs in the bonding heads 3 to 6 and the vacuum force cannot be stably maintained. Further, the two bonding heads 3 to 6 on the pickup stage P and the bonding stage B respectively move up and down at the same time so that the die chip pickup operation and the bonding operation can be performed at the same time. If the rotary head mechanism 7 is idled, a situation in which the bonding operation cannot be performed on the other hand during the pick-up operation on the one hand, which results in a tact loss.

Therefore, for the purpose of solving such a problem, there is provided an apparatus in which the camera 10 is arranged so that the die chip can be imaged obliquely so that the die chip can always be imaged regardless of the state of the rotary head mechanism 7. is there.
However, in addition to requiring an extra space for diagonally arranging the camera 10, the illumination method for obtaining a clear image and the calculation for recognizing the input image become extremely difficult, which causes image processing. Unreliable.

Therefore, the present invention provides a drive unit for a die bonder rotary head mechanism capable of performing high-speed die bonding by shortening the die bonding cycle time as much as possible while surely preventing vacuum leakage and tact loss of the bonding head. This is a technical issue.

[0006]

According to the present invention, as a technical means for achieving the above-mentioned object, a driving device for a die bonder rotary type head mechanism is constructed as follows. That is, in a device for rotating a die bonder rotary head mechanism, in which a plurality of bonding heads are arranged at a constant pitch on the same circumference passing through the pickup stage and the bonding stage, at a predetermined angle, the position directly above the pickup stage. Image pickup means for inputting an image of at least the die chip at the pickup position and the die chip to be transferred to the next pickup position when the rotary head mechanism is rotated, and the quality of the die chip is determined from the image data by the image pickup means. The preceding recognition means and the die bonder rotary head are rotated by an angle corresponding to the constant pitch when the recognition result of the preceding recognition means is a good product, and when the recognition result is a defective product, 1/2 of the constant pitch is obtained. After rotating by an angle equivalent to It is configured as characterized by comprising a rotation control means for rotating angle of the other half when the recognition result of the non-defective by the pitch feed of Ichippu came out.

[0007]

For example, in the case of a die bonder rotary type head mechanism in which four bonding heads are arranged at 90 ° intervals, an image of at least two die chips is captured by the image pickup means when the rotary type head mechanism is rotated, The recognition means recognizes the quality of the die chip image at the pickup position. If the recognition result is a good product, the rotary head mechanism is rotated by 90 °, and then the pickup operation and the bonding operation are performed at the same time. First, the quality of the die chip to be transferred to the pickup position is recognized in advance, and if the recognition result is good, the recognized die chip is transferred to the pickup position by the pitch transfer and the rotary head is moved to 90. ° Rotate to pick up and bond at the same time No capture images of at least two die tip by the imaging means during the rotation, repeats the subsequent similar operation.

On the other hand, if the recognition result is a defective product,
After the die chips are conveyed by pitch and the defective die chips are removed from the pickup position, the rotary head is moved to 45
It is rotated only by °, and a new 2
The images of the individual die chips are taken in, the images of the die chips newly transferred to the pickup position are recognized by the preceding recognition means, and if the recognition result is again defective, pitch conveyance of the same die chips as described above, 2 The image of the die chip is captured and the image is recognized, and the same operation is repeated until the recognition result is a good product. Then, when the recognition result is good, the rotary head mechanism is set to 4
The bonding head is positioned at the pickup stage and the bonding stage by rotating 5 ° to perform the die chip pickup operation and the bonding operation. At this time, the quality of the die chip to be next transferred to the pickup position is recognized in advance, and if the recognition result is also a good product, the die chip recognized by the pitch conveyance is transferred to the pickup position and then rotary. The same operation is performed by rotating the rotary head mechanism by 90 °. On the other hand, if the recognition result is a defective product, the die chips are conveyed by pitch and the rotary head mechanism is rotated by 45 °.
Rotate and perform the same operation as described above.

Therefore, if it is recognized as a defective product, 45
While rotating, the die chips are conveyed at a pitch until the die chip at the pickup position is recognized as a good product, so even if it is recognized as a defective product, the rotary head mechanism does not idle and a vacuum leak or tact loss of the bonding head occurs. Never. Further, since the image pickup means captures the images of at least two die chips and performs the preceding recognition, the image pickup means such as a camera can be installed right above the bonding head of the pickup stage, and high reliability of image processing is maintained. it can. Further, when the recognition result is a non-defective product, it is rotated by 90 ° as in the conventional case, so that the bonding cycle time can be shortened as much as possible and high-speed bonding can be performed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below in detail with reference to the drawings. In this embodiment, driving of the rotary head mechanism 7 in the die bonder shown in FIGS. 5 and 6 will be described with reference to the flowchart of FIG. In addition, "FIG. 2" shown as an operation explanatory diagram
4 to 4, the same parts as those in FIG. 5 and FIG. 6 are designated by the same reference numerals. First, the rotary head mechanism 7 is changed from the state shown in FIG. 2 to the state shown in FIG.
Rotate by 5 ° (step S1), and at the time of this rotation, the images of the die chip to be picked up next and the die chip to be picked up next, which are picked up by the camera 10, are taken in (step S2), image processed and then picked up. The quality of the die chip to be recognized is recognized (step S
3). If the recognition result is a defective product, the defective die chip is removed from the pickup position and a new die chip is transferred to the pickup position by carrying the pitch of the die chip (step S4) while the rotary head 7 is stopped. . After that, the process jumps to step S2 and the images of the die chip to be picked up next time and the die chip to be picked up next time, which are picked up by the camera 10 again, are captured, and the quality of the die chip to be picked up next is recognized by image processing. The same operation is repeated until the recognition result is good.

Then, when it is recognized that the die chip at the pickup position is a good product, the rotary head mechanism 7
Is rotated by 45 ° (step S5) to be in the state of "FIG. 4", the die chip at the pickup position is precisely positioned based on the processed image (step S6), and then the die chip is picked up by suction by the bonding head 4, Moreover, the die chip of the bonding head 6 on the bonding stage B is bonded to the lead frame substrate (step S7). Subsequently, the quality of the die chip to be picked up next at the position close to the pickup position is recognized in advance (step S8),
If the recognition result is a defective product, the die chips are conveyed by pitch (step S9), and then the process is jumped to step S1 to rotate the rotary head mechanism 7 by 45 ° and the same operation as described above is performed. On the other hand, when the preceding recognition result is a non-defective product, the die chips are conveyed by pitch (step S10) and the previously recognized die chips are transferred to the pickup position, and then the rotary head mechanism 7 is moved by 90 ° from the state of FIG. While rotating, the images of the die chip to be picked up next time and the die chip to be picked up next time taken by the camera 10 during this rotation are taken in (step S11). After the die chip at the pickup position is precisely positioned (step S12) based on the processed image of the die chip to be picked up next, this die chip is picked up and the die chip is bonded to the lead frame substrate on the opposite side (step S13). Subsequently, the quality of the die chip to be picked up next in the proximity of the pick-up position is recognized in advance (step S14), and if the recognition result is a non-defective product, the process jumps to step S10, the pitch conveyance is performed, and the preceding recognition is performed. The die chip is transferred to the pick-up position, and if the recognition result is a non-defective product, the operations of steps S10 to S14 are repeated to repeat the rotary head mechanism 7
Is always rotated 90 ° to continue the pickup operation and the bonding operation, and when the recognition result indicates that the product is defective, the operation is jumped to step S1 and the same operation as described above is repeated.

[0012]

As described above, according to the method for driving the die bonder rotary type head of the present invention, the rotary head is rotated at a constant pitch angle based on the result of prior recognition of the die chip when the recognition result is good. In the case of a defective product, the die chip is rotated by an angle of ½ of a certain pitch and pitch-transferred until the recognition result is a good product. Therefore, the bonding head on the pickup stage always has a good die chip. Since it is adsorbed, there is no vacuum leak or tact loss in the bonding head, and the rotation of the rotary head is controlled based on the result of prior recognition, so the bonding cycle time is shortened as much as possible and high-speed die bonding is performed. Can also,
By performing the preceding recognition, the image pickup means can be installed right above the die chip, and it is possible to save space and improve the reliability of image processing.

[Brief description of drawings]

FIG. 1 is a flowchart of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of the operation thereof.

FIG. 3 is an explanatory diagram of the same operation.

FIG. 4 is an explanatory diagram of the same operation.

FIG. 5 is a plan view of a general die bonder.

FIG. 6 is a front view of it.

[Explanation of symbols]

 3 to 6 bonding head 7 die bonder rotary head mechanism 10 camera (imaging means) P pickup stage B bonding stage

Claims (1)

(57) [Scope of utility model registration request] 1. A device for rotatably driving a die bonder rotary head mechanism in which a plurality of bonding heads are arranged at a constant pitch on the same circumference passing through the pickup stage and the bonding stage at a predetermined angle. An image pickup means which is arranged right above and which inputs an image of at least the die chip at the pick-up position and the die chip to be transferred to the pick-up position at the time of rotation of the rotary head mechanism, and the quality of the die chip from the image data by the image pick-up means. When the recognition result of the preceding recognition means is a non-defective product, the preceding bond recognition means for determining whether or not the die bonder rotary head is rotated by an angle corresponding to the constant pitch, and when the recognition result is a defective product, the fixed pitch Rotate by an angle equivalent to 1/2 And a rotation control means for rotating the remaining 1/2 angle when a non-defective product is obtained by pitch conveyance of the die chip.