JPH07171761A - Abrasive solution feed mechanism for polishing device - Google Patents

Abrasive solution feed mechanism for polishing device

Info

Publication number
JPH07171761A
JPH07171761A JP32073793A JP32073793A JPH07171761A JP H07171761 A JPH07171761 A JP H07171761A JP 32073793 A JP32073793 A JP 32073793A JP 32073793 A JP32073793 A JP 32073793A JP H07171761 A JPH07171761 A JP H07171761A
Authority
JP
Japan
Prior art keywords
polishing
rotary shaft
polishing liquid
fixed
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP32073793A
Other languages
Japanese (ja)
Inventor
Yoshihiro Kitagawa
良弘 北川
Fumiaki Toyama
文章 外山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP32073793A priority Critical patent/JPH07171761A/en
Publication of JPH07171761A publication Critical patent/JPH07171761A/en
Withdrawn legal-status Critical Current

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Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To feed a sufficient quantity of abrasive solution to the polished surface of a workpiece stably over a long period of time. CONSTITUTION:This abrasive solution feed mechanism is rotatably supported on a housing 1, and the main constituent elements of this abrasive solution feed mechanism are a rotary shaft 3 provided with a polishing disc 2 integrally at the lower end, a blade cylinder 4 fixed to the outer periphery of the rotary shaft 3 by insertion, a fixed cylinder 6 provided around the outer periphery of the rotary shaft 3 by insertion with a space part 5 and fixed at its upper end to the housing 1, an abrasive solution feed pipe 7 connected to the fixed cylinder 6, and a feed hole 2a formed in the polishing disc 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、液晶パネル、イメージ
センサや半導体レーザのカバーガラスに用いられる薄板
ガラス等のように、高い精度が要求されるワークの表面
研磨加工に使用される研磨装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus used for polishing the surface of a work such as a liquid crystal panel, an image sensor and a thin glass used for a cover glass of a semiconductor laser, which requires high accuracy. .

【0002】[0002]

【従来の技術】例えば、液晶パネル、イメージセンサや
半導体レーザのカバーガラスに用いられる薄板ガラス
は、製造後、その表面を高精度に研磨加工して仕上げら
れるが、この種の研磨加工は、通常、研磨円盤に装着し
た研磨パッド(発砲ウレタン材などで形成される)をワ
ークの表面に圧接し、両者の間に研磨液を供給しながら
相対運動を与えることにより、ワークの表面から微量の
研磨代を取り去ってその寸法精度、表面平滑性を高める
ものである。
2. Description of the Related Art For example, a thin glass plate used for a liquid crystal panel, an image sensor or a cover glass for a semiconductor laser is finished by polishing the surface with high precision after manufacturing. , A polishing pad mounted on a polishing disc (formed of foamed urethane material, etc.) is pressed against the surface of the work piece, and a relative movement is given while supplying a polishing liquid between the two, so that a slight amount of polishing is done from the surface of the work piece By removing the margin, the dimensional accuracy and surface smoothness are improved.

【0003】ところで、この種の研磨加工において、ワ
ークの表面(研磨面)と研磨パッドとの間に十分な量の
研磨液を供給介在させることがワークの仕上げ精度を確
保する上で必要である。従来、研磨液の研磨面への供給
手段として、研磨円盤の回転軸の軸中心に設けた貫通穴
を経由して供給する手段、研磨面に外部から直接供給す
る手段が用いられていた。加工時、回転軸は回転するの
で、前者の場合、研磨液供給用のパイプをロータリージ
ョイントを介して回転軸の上部中央に接続することによ
り、加工中における研磨液供給を可能ならしめている。
By the way, in this type of polishing, it is necessary to supply a sufficient amount of polishing liquid between the surface (polishing surface) of the work and the polishing pad in order to secure the finishing accuracy of the work. . Conventionally, as a means for supplying the polishing liquid to the polishing surface, a means for supplying the polishing liquid via a through hole provided in the center of the rotary shaft of the polishing disk and a means for directly supplying the polishing surface from the outside have been used. Since the rotary shaft rotates during processing, in the former case, a polishing liquid supply pipe is connected to the center of the upper part of the rotary shaft via a rotary joint so that the polishing liquid can be supplied during processing.

【0004】[0004]

【発明が解決しようとする課題】回転軸の貫通穴を経由
して研磨液を供給する手段では、ロータリージョイント
の回転部分と非回転部分との間のシール部が研磨液中の
研磨剤によって、常時、研磨されることになり、上記シ
ール部に磨耗等が生じ、このシール部から研磨液漏れが
発生し易いという問題点がある。しかも、漏れた研磨液
が装置の軸受部分や摺動部分に侵入すると、該部分に磨
耗や錆等が発生し、装置の運転に支障をきたすという欠
点がある。
In the means for supplying the polishing liquid via the through hole of the rotary shaft, the seal portion between the rotating portion and the non-rotating portion of the rotary joint is made by the polishing agent in the polishing liquid. There is a problem in that the above-mentioned seal portion is always worn, abrasion is caused, and the polishing liquid easily leaks from this seal portion. In addition, if the leaked polishing liquid enters the bearing portion or the sliding portion of the device, wear or rust will occur on the portion, which will hinder the operation of the device.

【0005】また、研磨液を研磨面に外部から直接供給
する手段では、研磨面の特に中央部に研磨液が均等に行
き渡りにくく、そのために、均等な研磨加工ができない
という問題点がある。
Further, in the means for directly supplying the polishing liquid to the polishing surface from the outside, it is difficult to evenly spread the polishing liquid especially to the central portion of the polishing surface, which causes a problem that uniform polishing cannot be performed.

【0006】そこで、本発明の目的は、ワークの研磨面
に十分な量の研磨液を長期にわたって安定供給すること
のできる研磨液供給機構を提供することにある。
Therefore, an object of the present invention is to provide a polishing liquid supply mechanism capable of stably supplying a sufficient amount of polishing liquid to the polishing surface of a work for a long period of time.

【0007】[0007]

【課題を解決するための手段】本発明の研磨装置の研磨
液供給機構は、ハウジングに回転自在に支持され、その
下端に研磨円盤を備えた回転軸と、前記回転軸の外周に
空間部を隔てて外挿され、その上端を前記ハウジングに
固定された固定筒と、前記固定筒に接続された研磨液供
給パイプと、前記研磨円盤に形成された供給穴とを備
え、前記研磨液供給パイプからの研磨液を、前記空間部
および供給穴を経由してワークの研磨面に供給するもの
である。
A polishing liquid supply mechanism of a polishing apparatus according to the present invention includes a rotary shaft rotatably supported by a housing, a rotary disk having a polishing disk at a lower end thereof, and a space portion around the rotary shaft. The polishing liquid supply pipe includes a fixed cylinder that is externally inserted at a distance and has its upper end fixed to the housing, a polishing liquid supply pipe connected to the fixed cylinder, and a supply hole formed in the polishing disk. Is supplied to the polishing surface of the work through the space and the supply hole.

【0008】また、本発明の研磨装置の研磨液供給機構
は、上記構成において、前記回転軸の外周に、この回転
軸の回転に伴い、前記空間部内の研磨液に前記供給穴側
への圧送力を及ぼす軸流翼を設けたものである。
Further, in the polishing liquid supply mechanism of the polishing apparatus of the present invention, in the above structure, the polishing liquid in the space portion is pressure-fed to the supply hole side on the outer periphery of the rotation shaft as the rotation shaft rotates. Axial flow blades that exert force are provided.

【0009】[0009]

【作用】研磨液供給パイプは固定筒に接続される。固定
筒はハウジングに固定されており、回転はしない。研磨
液は、研磨液供給パイプから、固定筒と回転軸との間に
形成される空間部に供給され、この空間部と研磨円盤に
形成された供給穴とを経由してワークの研磨面に均等に
供給される。
The polishing liquid supply pipe is connected to the fixed cylinder. The fixed cylinder is fixed to the housing and does not rotate. The polishing liquid is supplied from the polishing liquid supply pipe to the space formed between the fixed cylinder and the rotary shaft, and is supplied to the polishing surface of the workpiece through the space and the supply hole formed in the polishing disk. Supplied evenly.

【0010】回転軸の外周に設けられた軸流翼は、回転
軸の回転に伴って回転し、研磨液供給パイプから空間部
に供給された研磨液に供給穴側への圧送力を及ぼすこと
により、研磨液の供給を確実ならしめる。
The axial blades provided on the outer periphery of the rotary shaft rotate with the rotation of the rotary shaft, and exert a pumping force to the supply hole side to the polishing liquid supplied from the polishing liquid supply pipe to the space. This ensures the supply of the polishing liquid.

【0011】[0011]

【実施例】以下、本発明の実施例を図面に従って説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

【0012】図1に示すように、この実施例の研磨液供
給機構は、ハウジング1に回転自在に支持され、その下
端に研磨円盤2を一体に備えた回転軸3と、回転軸3の
外周に外挿固定された翼筒4と、回転軸3の外周に空間
部5を隔てて外挿され、その上端をハウジング1に固定
された固定筒6と、固定筒6に接続された研磨液供給パ
イプ7と、研磨円盤2に形成された供給穴2aとを主要
な要素として構成される。回転軸3は図示されていない
回転駆動手段によって回転駆動され、ハウジング1に対
し、同図に示す矢印方向に回転する。また、回転軸3は
図示されていない昇降駆動手段によって昇降駆動され、
ハウジング1と一体となって昇降移動する。薄板ガラス
等のワークWが所定位置に供給されると、回転軸3およ
びその下端の研磨円盤2が回転しながら下降し、研磨円
盤2の下端面に装着された研磨パッド8がワークWの研
磨面Sに圧接され、研磨加工が開始される。
As shown in FIG. 1, the polishing liquid supply mechanism of this embodiment is rotatably supported by a housing 1 and has a rotary shaft 3 integrally provided with a polishing disk 2 at its lower end, and an outer periphery of the rotary shaft 3. A blade cylinder 4 externally fixed to the rotary shaft 3, a fixed cylinder 6 externally inserted to the outer periphery of the rotary shaft 3 with a space 5 therebetween, and an upper end of which is fixed to the housing 1, and a polishing liquid connected to the fixed cylinder 6. The supply pipe 7 and the supply hole 2a formed in the polishing disk 2 are main elements. The rotary shaft 3 is rotationally driven by a rotary drive means (not shown) and rotates with respect to the housing 1 in the direction of the arrow shown in the figure. Further, the rotating shaft 3 is driven up and down by a lifting drive means (not shown),
It moves up and down together with the housing 1. When the work W such as thin glass is supplied to a predetermined position, the rotating shaft 3 and the polishing disc 2 at the lower end thereof rotate and descend, and the polishing pad 8 mounted on the lower end surface of the polishing disc 2 polishes the work W. The surface S is pressed and the polishing process is started.

【0013】回転軸3はハウジング1に挿通され、軸受
10で回転自在に支持される。ハウジング1の下端と回
転軸3との間は複数のシール部材11によってシールさ
れ、研磨液が軸受10内に侵入しないよう配慮されてい
る。
The rotary shaft 3 is inserted into the housing 1 and is rotatably supported by bearings 10. A space between the lower end of the housing 1 and the rotary shaft 3 is sealed by a plurality of sealing members 11 to prevent the polishing liquid from entering the bearing 10.

【0014】固定筒6は、その上端に溶着等適宜の手段
で固着された環状のフランジ6aを介してハウジング1
の下端にボルト13で固定される。フランジ6aの内径
は固定筒6よりも小径であり、そのため、固定筒6と回
転軸3との間に形成される空間部5が、フランジ6aの
内径部分によって上方から覆われた状態になる。
The fixed barrel 6 is provided with a housing 1 via an annular flange 6a fixed to the upper end thereof by a suitable means such as welding.
It is fixed to the lower end of the with bolts 13. The inner diameter of the flange 6a is smaller than that of the fixed barrel 6, so that the space 5 formed between the fixed barrel 6 and the rotating shaft 3 is covered from above by the inner diameter portion of the flange 6a.

【0015】翼筒4の外周には、図2に示すようなスク
リュウ状の軸流翼4aが設けられている。回転軸3が回
転すると、翼筒4が回転軸3と一体となって回転し、こ
れにより、軸流翼4aが空間部5内で回転する。軸流翼
4aは、回転軸3の回転に伴って同図に矢印で示す方向
に回転することにより、空間部5内の研磨液を下方に向
けて圧送する作用をなす。尚、翼筒4の上端と位置決め
部材12との間にはワッシャ14が介装される。このワ
ッシャ14の下端面は固定筒6のフランジ6aの上端面
と間隔を隔てて対向する。
A screw-shaped axial flow blade 4a as shown in FIG. 2 is provided on the outer circumference of the blade cylinder 4. When the rotary shaft 3 rotates, the blade cylinder 4 rotates together with the rotary shaft 3, whereby the axial blade 4a rotates in the space 5. The axial blade 4a rotates in the direction shown by the arrow in the figure in accordance with the rotation of the rotary shaft 3 to serve to pump the polishing liquid in the space 5 downward. A washer 14 is interposed between the upper end of the blade 4 and the positioning member 12. The lower end surface of the washer 14 faces the upper end surface of the flange 6a of the fixed barrel 6 with a space.

【0016】研磨液供給パイプ7は固定筒6の側部に接
続され、供給源(図示省略)から圧送されてくる研磨液
Lを、空間部5に供給する。
The polishing liquid supply pipe 7 is connected to the side portion of the fixed cylinder 6 and supplies the polishing liquid L pumped from a supply source (not shown) to the space 5.

【0017】研磨円盤2の上端面には図3に示すような
環状凹部2bが設けられ、この環状凹部2bの底部分に
複数の供給穴2aが円周等間隔に形成されている。各供
給穴2aは研磨円盤2を軸方向に貫通し、それぞれ図4
に示す研磨パッド8の中心穴8aに連通する。また、環
状凹部2bの外周縁には回転筒15の下端が嵌め合わさ
れ、ボルト16で固定される。この回転筒15は、固定
筒6の外周に間隔を隔てて外挿され、固定筒6の下端か
ら略中央部分までを覆う。
An annular recess 2b as shown in FIG. 3 is provided on the upper end surface of the polishing disc 2, and a plurality of supply holes 2a are formed at equal intervals in the bottom of the annular recess 2b. Each supply hole 2a penetrates the polishing disk 2 in the axial direction,
The central hole 8a of the polishing pad 8 shown in FIG. Further, the lower end of the rotary cylinder 15 is fitted to the outer peripheral edge of the annular recess 2b and is fixed by the bolt 16. The rotary cylinder 15 is externally fitted to the outer periphery of the fixed cylinder 6 with a space therebetween, and covers the lower end of the fixed cylinder 6 to a substantially central portion thereof.

【0018】供給パイプ7から空間部5に供給された研
磨液Lは、回転軸3と一体となって回転する翼筒4の軸
流翼4aによって空間部5内を下方の供給穴2b側に向
けて圧送され、一旦、研磨円盤2の環状凹部2bに入っ
たのち、環状凹部2bから各供給穴2aに流入し、さら
に研磨パッド8の中心穴8aを通って研磨面Sに供給さ
れる。そのため、ワークWの研磨面Sに十分な量の研磨
液Lが長期にわたって安定供給される。また、固定筒6
と回転筒15との間、固定筒6のフランジ6aとワッシ
ャ14との間の間隔部がラビリンス空間になるので、研
磨液Lの漏れが生じにくい。
The polishing liquid L supplied from the supply pipe 7 to the space portion 5 is moved inside the space portion 5 toward the lower supply hole 2b side by the axial flow blades 4a of the blade cylinder 4 which rotates integrally with the rotating shaft 3. It is pressure-fed toward the polishing disk 2, and once enters the annular recess 2b of the polishing disk 2, then flows into each supply hole 2a from the annular recess 2b and is further supplied to the polishing surface S through the center hole 8a of the polishing pad 8. Therefore, a sufficient amount of the polishing liquid L is stably supplied to the polishing surface S of the work W for a long period of time. In addition, the fixed cylinder 6
Since the labyrinth space is formed between the rotary cylinder 15 and the rotary cylinder 15 and between the flange 6a of the fixed cylinder 6 and the washer 14, the polishing liquid L is unlikely to leak.

【0019】尚、この実施例では、スクリュー状の軸流
翼4aを備えた翼筒4を回転軸3の外周に挿通固定して
あるが、軸流翼はプロペラ状(ファン状)のものでも良
く、また、回転軸3の外周に直接形成しても良い。
In this embodiment, the blade cylinder 4 having the screw-shaped axial flow blades 4a is inserted and fixed to the outer periphery of the rotary shaft 3, but the axial flow blades may be propeller-shaped (fan-shaped). Alternatively, it may be formed directly on the outer circumference of the rotary shaft 3.

【0020】[0020]

【発明の効果】以上説明したように、本考案によれば、
ハウジングに固定された固定筒に研磨液供給パイプを接
続すると共に、この固定筒と回転軸との間に形成される
空間部と研磨円盤に形成された供給穴とを経由して、研
磨液をワークの研磨面に供給する構成としたので、従来
構成のように、ロータリージョイントのシール部分から
研磨液漏れが発生するといった弊害がなく、しかも、研
磨面の広い領域にわたって十分な量の研磨液を均等に供
給することができる。
As described above, according to the present invention,
The polishing liquid supply pipe is connected to the fixed cylinder fixed to the housing, and the polishing liquid is supplied through the space formed between the fixed cylinder and the rotating shaft and the supply hole formed in the polishing disk. Since it is configured to supply to the polishing surface of the workpiece, there is no adverse effect such as the leakage of polishing liquid from the seal part of the rotary joint unlike the conventional configuration, and a sufficient amount of polishing liquid can be applied over a wide area of the polishing surface. Can be supplied evenly.

【0021】また、回転軸の外周に、この回転軸の回転
に伴い、上記空間部内の研磨液に供給穴側への圧送力を
及ぼす軸流翼を設けることにより、研磨液の安定供給を
より一層確実ならしめることができる。
Further, by providing an axial flow vane on the outer circumference of the rotary shaft, which exerts a pressure-feeding force to the supply hole side to the polishing liquid in the above space in accordance with the rotation of the rotation shaft, the polishing liquid is supplied more stably. You can make it more certain.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の実施例を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of the present invention.

【図2】図1における翼筒の斜視図である。FIG. 2 is a perspective view of the blade shown in FIG.

【図3】図1における研磨円盤の平面図である。FIG. 3 is a plan view of the polishing disk in FIG.

【図4】図1における研磨パッドの平面図である。FIG. 4 is a plan view of the polishing pad in FIG.

【符号の説明】[Explanation of symbols]

1 ハウジング 2 研磨円盤 2a 供給穴 3 回転軸 4 翼筒 4a 軸流翼 5 空間部 6 固定筒 7 研磨液供給パイプ 8 研磨パッド W ワーク S 研磨面 1 Housing 2 Polishing Disc 2a Supply Hole 3 Rotating Shaft 4 Blade Tube 4a Axial Flow Blade 5 Space 6 Fixed Tube 7 Polishing Liquid Supply Pipe 8 Polishing Pad W Work S Polishing Surface

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 研磨円盤に装着した研磨具をワークの表
面に圧接し、両者の間に研磨液を供給しながら相対運動
を与えて研磨加工を行なう研磨装置の研磨液供給機構に
おいて、 ハウジングに回転自在に支持され、その下端に前記研磨
円盤を備えた回転軸と、前記回転軸の外周に空間部を隔
てて外挿され、その上端を前記ハウジングに固定された
固定筒と、前記固定筒に接続された研磨液供給パイプ
と、前記研磨円盤に形成された供給穴とを備え、 前記研磨液供給パイプからの研磨液を、前記空間部およ
び供給穴を経由してワークの研磨面に供給することを特
徴とする研磨装置の研磨液供給機構。
1. A polishing liquid supply mechanism of a polishing apparatus, in which a polishing tool mounted on a polishing disk is pressed against a surface of a work, and a relative movement is given while a polishing liquid is supplied between them to perform a polishing process. A rotary shaft that is rotatably supported and has the polishing disk at its lower end; a fixed cylinder that is externally inserted on the outer periphery of the rotary shaft with a space between them; and its upper end is fixed to the housing; And a supply hole formed in the polishing disc, and the polishing liquid from the polishing liquid supply pipe is supplied to the polishing surface of the workpiece through the space and the supply hole. A polishing liquid supply mechanism for a polishing apparatus.
【請求項2】 前記回転軸の外周に、この回転軸の回転
に伴い、前記空間部内の研磨液に前記供給穴側への圧送
力を及ぼす軸流翼を設けたことを特徴とする請求項1の
研磨装置の研磨液供給機構。
2. An axial flow vane is provided on the outer circumference of the rotary shaft, which exerts a pumping force to the polishing liquid in the space portion toward the supply hole side as the rotary shaft rotates. Polishing liquid supply mechanism of the polishing apparatus of 1.
JP32073793A 1993-12-21 1993-12-21 Abrasive solution feed mechanism for polishing device Withdrawn JPH07171761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32073793A JPH07171761A (en) 1993-12-21 1993-12-21 Abrasive solution feed mechanism for polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32073793A JPH07171761A (en) 1993-12-21 1993-12-21 Abrasive solution feed mechanism for polishing device

Publications (1)

Publication Number Publication Date
JPH07171761A true JPH07171761A (en) 1995-07-11

Family

ID=18124743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32073793A Withdrawn JPH07171761A (en) 1993-12-21 1993-12-21 Abrasive solution feed mechanism for polishing device

Country Status (1)

Country Link
JP (1) JPH07171761A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0839602A1 (en) * 1996-10-01 1998-05-06 Z. BAVELLONI S.p.A. Unit for polishing bevels on the edges of glass plates, particularly on numeric-control machines
WO2003078103A1 (en) * 2002-03-20 2003-09-25 Nikon Corporation Polishing equipment, and method of manufacturing semiconductor device using the equipment
CN108032147A (en) * 2017-12-08 2018-05-15 上海航天设备制造总厂有限公司 Spiral inner wall line weld grinding control method and device
CN112658968A (en) * 2020-12-19 2021-04-16 华中科技大学 Wafer grinding device based on laser in-situ assistance

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0839602A1 (en) * 1996-10-01 1998-05-06 Z. BAVELLONI S.p.A. Unit for polishing bevels on the edges of glass plates, particularly on numeric-control machines
US6004192A (en) * 1996-10-01 1999-12-21 Z. Bavelloni S.P.A. Unit for polishing bevels on the edges of glass plates, particularly on numeric-control machines
WO2003078103A1 (en) * 2002-03-20 2003-09-25 Nikon Corporation Polishing equipment, and method of manufacturing semiconductor device using the equipment
CN108032147A (en) * 2017-12-08 2018-05-15 上海航天设备制造总厂有限公司 Spiral inner wall line weld grinding control method and device
CN108032147B (en) * 2017-12-08 2019-10-25 上海航天设备制造总厂有限公司 Spiral inner wall line weld grinding control method and device
CN112658968A (en) * 2020-12-19 2021-04-16 华中科技大学 Wafer grinding device based on laser in-situ assistance

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