JPH07171534A - Base edge cleaning device - Google Patents

Abstract

PURPOSE:To reduce the release charge of a base generated at the time of releasing the base. CONSTITUTION:A base edge cleaning device is used for dissolving and removing thin films adhering to edges of a square base 1, and is provided with a base retaining section 2, a solvent nozzle, a movement mechanism and a negative pressure source 52. The base retaining section 2 is provided with a suction hole 13 for sucking the square base. The negative pressure source 52 is provided with a diffusion type combam 55 and communicates with the suction hole 13, and the negative pressure is generated by supplying the pressure controlled pressurized air to the combam 55. The square base is retained by the base retaining section 2. Washing liquid is fed from the solvent nozzle to the edge of the square base 1 retained by the base retaining section 2. The solvent nozzle is moved along the edge of the square base 1 by the movement mechanism.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an edge cleaning device, and more particularly to
The present invention relates to a substrate edge cleaning device that dissolves and removes unnecessary thin films attached to the edge of a rectangular substrate.

[0002]

2. Description of the Related Art Thin films (photoresist liquid, photosensitive polyimide resin, dyeing for color filters) are applied to rectangular substrates (glass substrates for liquid crystals, glass substrates for photomasks, ceramic substrates for manufacturing thermal heads, etc.). There is known a square substrate processing apparatus that forms a thin film of a liquid such as a chemical agent on the surface. This type of substrate processing apparatus includes a spin coater that forms a thin film on the surface of a square substrate, and a substrate edge cleaning device that dissolves and removes unnecessary thin films from the edges of the square substrate on which the thin film has been formed by the spin coater. An oven for drying the rectangular substrate from which the unnecessary thin film has been removed by the substrate edge cleaning device is provided.

The spin coater is provided with a substrate holding portion having a suction port for vacuum-sucking a rectangular substrate, and supplies a photoresist liquid onto the substrate while rotating the sucked rectangular substrate at a high speed. Form a thin film of photoresist. Further, the substrate edge cleaning device also includes a substrate holding portion that sucks and holds a rectangular substrate. The substrate edge cleaning device removes an unnecessary thin film on the edge of the rectangular substrate by ejecting the solvent while relatively moving the solvent nozzle along the edge of the suction-held rectangular substrate.

All of these substrate holders are connected to, for example, a factory vacuum line or a vacuum pump in order to make the suction port have a negative pressure. The negative pressure generated by these vacuum lines and vacuum pumps is usually a high negative pressure of about -76 cmHg.

[0005]

In an apparatus for rotating a square substrate at a high speed like a spin coater, the square substrate must be strongly sucked and held to prevent displacement due to centrifugal force, and the suction port is high. Need to maintain negative pressure.
However, in a device such as a substrate edge cleaning device which only needs to fix a square substrate or rotate it at a low speed, a large force does not act on the substrate during processing, and therefore strong adsorption is not necessary.

When the suction port is connected to a vacuum line or a vacuum pump, it is difficult to adjust the negative pressure, and since the substrate seals the suction port, the negative pressure becomes large, so that the suction force becomes excessively strong. Therefore, in the substrate edge cleaning device, there is a problem of destruction of the substrate surface layer due to peeling electrification, which occurs when the adsorption is released and the substrate and the contact portion of the substrate holder are separated.

An object of the present invention is to reduce peeling charge that occurs when a substrate is taken out in a substrate edge cleaning apparatus for cleaning the edge of a rectangular substrate.

[0008]

A substrate edge cleaning device according to the present invention is a device for dissolving and removing an unnecessary thin film adhering to the edge of a rectangular substrate, which is a substrate holding part, a solvent nozzle and a moving means. And a negative pressure generating means. The substrate holding part has a suction port for sucking the rectangular substrate. Solvent nozzle
A solvent is supplied to the edge of the rectangular substrate held by the substrate holder. The moving means relatively moves the solvent nozzle along the edge of the rectangular substrate. The negative pressure generating means is of a diffuser type, communicates with the suction port, and generates a negative pressure within a predetermined range by the pressurized fluid.

[0009]

In the substrate edge cleaning device according to the present invention, when the rectangular substrate is sucked by the substrate holding part, the adjusted pressurized fluid is passed through the diffuser type negative pressure generating means connected to the suction port. It flows to generate a negative pressure within a predetermined range. Then, the solvent nozzle moves along the edge by the moving means to supply the solvent to the sucked and held substrate.

Here, since the diffuser type negative pressure generating means is provided, the suction port can be set to a predetermined size by adjusting the flow rate of the pressurized fluid even when the suction port is sealed by the rectangular substrate. Adjustable to a negative pressure within the range. Therefore, it is possible to solve the problem that the substrate is sucked and held with an unnecessarily high suction force, and the peeling charge can be reduced.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a substrate edge cleaning apparatus according to an embodiment of the present invention comprises a substrate holder 2 for sucking and holding a rectangular substrate 1, and an end of the rectangular substrate 1 held by the substrate holder 2. A substrate edge cleaning tool 3 for cleaning the edge, and a cleaning tool moving mechanism 4 for moving the substrate edge cleaning tool 3 along the edge of the rectangular substrate 1.
It has and.

As shown in FIG. 2, the substrate holder 2 has a substrate mounting plate 10 on which the rectangular substrate 1 is mounted, a rotary shaft 11 for supporting the substrate mounting plate 10, and a rotary shaft 11 which is rotatable. And an elevating frame 12 for supporting the same. A plurality of suction holes 13 are opened on the upper surface of the substrate mounting plate 10. These suction holes 13 are in communication with each other via a communication hole 14.

On the upper part of the elevating frame 12, a rotary shaft 11 is provided.
A bearing portion 15 that rotatably supports the motor shaft 16 is disposed below the motor shaft 16 that rotates the rotating shaft 11.
It is arranged with a facing upward. The lower end of the rotary shaft 11 is keyed to the motor shaft 16a. The elevating frame 12 is movably supported by four elevating guides 17 provided upright on the base frame 5.
It is driven up and down by a lifting air cylinder 6 which is erected between 7 and 7.

At the center of the rotary shaft 11, a communication hole 14 is formed at the upper end.
A ventilation hole 18 communicating with the above is formed in the upper and lower sides. A communication hole 19 is formed at the lower end of the ventilation hole 18 and extends radially to the side surface of the rotary shaft 11. An annular space 19a is formed in the outer peripheral opening of the communication hole 19. The bearing portion 15 of the elevating frame 12 is formed with a communication hole 20 extending in the radial direction at a position facing the annular space 19a. An O-ring 21 for sealing the annular space 19a of the rotating shaft 11 is arranged above and below the communication hole 20. Communication hole 20
Are connected to an ionizer 23 via an intake pipe 22. The ionizer 23 neutralizes the generated static electricity.

The substrate mounting plate 10, the rotating shaft 11, the bearing portion 15 of the elevating frame 12, the negative pressure path portions such as the pipe joints are all made of a dielectric material (for example, tetrafluoroethylene resin). The ionizer 23 is connected to a negative pressure source (described later) and a pressure source (described later). Substrate edge cleaning tool 3
Is a box-shaped first support frame 31, a second support frame 32 attached to the first support frame 31, and a second support frame 32.
And a third support frame 33 attached to the third support frame 33.
Fourth and fifth support frames 3 integrally attached to
4 and 35. The second support frame 32 is attached to the first support frame 31 so that the fixed position thereof can be finely adjusted in the direction in which the second support frame 32 comes into contact with and separates from the edge of the rectangular substrate 1 (left-right direction in FIG. 1). The third support frame 33 is attached to the second support frame 33 so that the fixed position can be finely adjusted in the vertical direction.

The third support frame 33 has a first solvent nozzle 36a for discharging a solvent to the back surface of the edge of the rectangular substrate 1 to dissolve the unnecessary thin film, and a gas for discharging the melted material into a rectangular shape. A first gas nozzle 37a is provided that blows away from the edge of the substrate. Further, the fourth support frame 34 is provided with a second solvent nozzle 36b that discharges a solvent onto the surface of the rectangular substrate 1 to dissolve the unnecessary thin film, and the fifth support frame 35 is provided with
There is provided a second gas nozzle 37b that discharges gas to blow the melted material outward beyond the edge of the rectangular substrate 1.

The cleaning tool moving mechanism 4 is, as shown in FIG.
The substrate edge cleaning tool 3 is placed in a direction along the edge of the rectangular substrate 1 (see FIG.
A first moving mechanism 41 for moving the first moving mechanism 41,
It has a second moving mechanism 42 that moves the moving mechanism 41 in a direction of moving toward and away from the rectangular substrate 1. The first moving mechanism 41 includes a mounting base 43 that is long in the direction along the edge, a drive pulley 44 and a driven pulley 45 that are arranged at both ends of the mounting base 43, and a belt 46 that spans both pulleys 44 and 45. The motor 47 is linked to the drive pulley 44.
The first support frame 31 is integrally attached to the belt 46. Further, the first support frame 31 is supported by a guide 48 long in the longitudinal direction of the mounting base 43 so as to be horizontally movable. The second moving mechanism 42 includes a pair of guides 50 that movably support the mounting base 43 in a direction of moving toward and away from the rectangular substrate 1.
It has an air cylinder 51 for moving the mounting base 43.

The ionizer 23, as shown in FIG.
The negative pressure source 52 and the pressure source 53 are connected via a tee joint 54. The negative pressure source 52 has a diffuser-type convum 55 connected to the tee joint 54. The convum 55 is connected to a pressurizing pipe 56 for supplying pressurized air to the convum 55. The upstream end of the pressurized pipe 56 is connected to a pressurized air supply source (not shown) (for example, a pressurized air pipe in a factory or a compressor). Further, the pressurizing pipe 56 has an air supply valve 57 in order from the upstream side.
And a needle valve 58 is arranged. Needle valve 58
Is a valve for adjusting the air flow rate in the pressurizing pipe 56, and can be manually adjusted. Also, tee joint 5
A manometer 64 for measuring negative pressure is arranged between 4 and the convum 55, and a drain 59 is arranged on the downstream side of the convum 55. Here, the negative pressure generated in the convum 55 is adjusted to -10 cmHg to -60 by adjusting the amount of the pressurized air supplied to the convum 55 with the needle valve 58.
It can be adjusted in the range of cmHg.

The pressure source 53 has a nitrogen pipe 60 connected to the tee joint 54. The upstream end of the nitrogen pipe 60 is connected to a pressurized nitrogen gas supply source (not shown) (for example, a pressurized nitrogen gas pipe or nitrogen gas cylinder in a factory). In addition, a nitrogen supply valve 61, a needle valve 62, and a filter 63 are arranged in this order from the upstream side in the nitrogen pipe 60. The needle valve 62 is a valve for adjusting the nitrogen gas flow rate in the nitrogen pipe 60, and can be manually adjusted. Since the negative pressure source 52 is provided with the convum 55, most of the nitrogen gas passing through the nitrogen pipe 60 is supplied to the substrate mounting plate 10 side, and the adsorption operation by the substrate mounting plate 10 is released. . At this time, since the ionized gas that has passed through the ionizer 23 is supplied to the substrate mounting plate 10 side, the charging of the rectangular substrate 1 on the substrate mounting plate 10 is neutralized.

Next, the operation of the above embodiment will be described. When the rectangular substrate 1 is mounted on the substrate mounting plate 10, the air supply valve 57 is opened to supply the compressed air to the convum 55. As a result, the suction hole 13 has a weak negative pressure, and the square substrate 1 is sucked by the weak force of the minimum required source. In addition, by adjusting the flow rate of the air with the needle valve 58 in advance, the negative pressure generated in the convum 55 is, for example, -15 cmHg to -20
Adjust to cmHg. At this time, the negative pressure is measured by the manometer 63.

Next, the first moving mechanism 41 and the second moving mechanism 42 are controlled to dispose the substrate edge cleaning tool 3 at a corner portion facing the edge of one side of the rectangular substrate 1. Then, the first moving mechanism 41 is operated to move the substrate edge holder 3 along the edge. At the same time, the solvent is ejected from the solvent nozzles 36a and 36b, and the compressed gas is ejected from the gas nozzles 37a and 37b.

When the edge cleaning of one side is completed, the substrate edge cleaning tool 3 is moved by the second moving mechanism 42 in the direction away from the rectangular substrate 1. Then, the rectangular substrate 1 is rotated by 90 °. Then, the substrate edge cleaning tool 3 is advanced to a position facing the next one side and moved to the corner. Then, a similar substrate edge cleaning operation is performed. These steps are similarly performed on the remaining two sides, and the edge cleaning on the four sides of the rectangular substrate 1 is completed.

When the edge cleaning of all sides is completed, the air supply valve 57 is closed and the nitrogen gas supply valve 61 is opened. Also, the ionizer 23 is turned on. Then, the adsorption holes 13 become positive pressure by the nitrogen gas, and the adsorption of the rectangular substrate 1 is released.
At this time, since the negative pressure until then is relatively low,
Static electricity generated when peeling the rectangular substrate 1 is small. Also, since the static electricity is neutralized by the ionizer 23,
The static electricity generated by peeling charging is less.

The rectangular substrate 1 from which the suction has been released is carried to the next step by a carrying means (not shown). Here, since the negative pressure at the time of suction of the rectangular substrate 1 is controlled by the flow rate of the pressurized air supplied to the diffuser type convum 55, even if the suction hole 13 is sealed by the rectangular substrate 1. Negative pressure is maintained at low pressure, and the amount of peeling charge when adsorption is released is small.

[Other Embodiments] (a) Instead of the convum 55, another diffuser type negative pressure generating means such as an ejector type or a kounder type may be used. (B) The four edges of the rectangular substrate may be cleaned at the same time. (C) As the pressurized fluid located in the convum 55, other fluid such as pressurized water or pressurized nitrogen may be used instead of the pressurized air.

[0026]

In the substrate edge cleaning device according to the present invention, the negative pressure is generated within the predetermined range by the diffuser type negative pressure generating means, and the substrate is sucked and held by the negative pressure. Therefore, the negative pressure can be adjusted. Therefore, the problem of holding the substrate with an unnecessarily high suction force can be solved, and peeling charge can be reduced.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a substrate edge cleaning device according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional side view thereof.

FIG. 3 is a schematic diagram showing the piping route.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Square substrate 2 Substrate holding part 4 Cleaning tool moving mechanism 13 Adsorption holes 36a, 36b Solvent nozzle 41 First moving mechanism 52 Negative pressure source

Claims (1)

[Claims] 1. A substrate edge cleaning device for dissolving and removing an unnecessary thin film adhering to the edge of a rectangular substrate, comprising: a substrate holder having a suction port for sucking the rectangular substrate; and the substrate holder. A solvent nozzle for supplying a solvent to the edge of the rectangular substrate held by the moving means; a moving means for relatively moving the solvent nozzle along the edge of the rectangular substrate; A substrate edge cleaning device, comprising: a diffuser-type negative pressure generating means for generating a negative pressure within a predetermined range by a pressurized fluid.