JPH07169725A - Substrate cleaning device - Google Patents
Substrate cleaning deviceInfo
- Publication number
- JPH07169725A JPH07169725A JP6169223A JP16922394A JPH07169725A JP H07169725 A JPH07169725 A JP H07169725A JP 6169223 A JP6169223 A JP 6169223A JP 16922394 A JP16922394 A JP 16922394A JP H07169725 A JPH07169725 A JP H07169725A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning
- brush
- cleaning brush
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 105
- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 239000007788 liquid Substances 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000002245 particle Substances 0.000 abstract description 4
- 230000000284 resting effect Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば半導体ウエハ
やフォトマスク用ガラス板等（以下単に基板と称する）
を洗浄する基板洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a semiconductor wafer, a glass plate for a photomask, etc. (hereinafter simply referred to as a substrate).
The present invention relates to a substrate cleaning device for cleaning substrates.
【０００２】[0002]
【従来の技術】この種の基板洗浄技術としては、従来よ
り例えば特開昭５７−９０９４１号公報に開示されたス
イング式縦型洗浄装置が知られている。それは、基板を
吸着保持して回転する吸着チャックと、基板の洗浄面に
垂直に当接された回転ブラシと、回転ブラシを回転させ
るモータと、基板の直径方向に沿って上記回転ブラシを
前後進（スイング）させる駆動機構とを具備して成り、
回転する基板表面上で当該基板の直径方向に回転ブラシ
を当接させて往復移動させることにより、基板の表面を
洗浄するように構成されている。2. Description of the Related Art As a substrate cleaning technique of this type, a swing type vertical cleaning apparatus disclosed in, for example, Japanese Patent Laid-Open No. 57-90941 has been conventionally known. It is a suction chuck that holds and rotates a substrate, a rotating brush that is in vertical contact with the cleaning surface of the substrate, a motor that rotates the rotating brush, and a forward / backward movement of the rotating brush along the diameter direction of the substrate. (Swing) drive mechanism,
The surface of the substrate is cleaned by abutting a rotating brush on the surface of the rotating substrate in the diameter direction of the substrate and reciprocating the brush.
【０００３】[0003]
【発明が解決しようとする課題】この種の基板洗浄装置
では、洗浄を終えた基板を引き続き回転させて液切り乾
燥するが、上記従来例では回転ブラシを基板の直径範囲
内で往復移動させるように構成されているので、基板の
回転乾燥時においても、回転ブラシが基板の上側にある
ため、回転ブラシが含有する洗浄液の液滴が洗浄済みの
基板表面に落下し、パーティクル等が当該基板に再付着
するおそれがある。本発明はこのような事情に鑑みてな
されたもので、洗浄済みの基板にパーティクル等が再付
着するのを防止することを技術課題とする。In this type of substrate cleaning apparatus, the cleaned substrate is continuously rotated to drain and dry the substrate, but in the conventional example described above, the rotating brush is reciprocated within the diameter range of the substrate. Since the rotating brush is on the upper side of the substrate even when the substrate is rotated and dried, the droplets of the cleaning liquid contained in the rotating brush fall on the surface of the cleaned substrate, and the particles and the like adhere to the substrate. There is a risk of redeposition. The present invention has been made in view of the above circumstances, and an object thereof is to prevent particles and the like from reattaching to a cleaned substrate.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、本発明は以下のように構成される。即ち、回転する
基板の表面上に洗浄ブラシを移動させて基板表面を洗浄
する基板洗浄装置において、垂直軸を中心として回転可
能に前記洗浄ブラシを垂下支持する洗浄ブラシ支持手段
と、前記洗浄ブラシを回転させる洗浄ブラシ回転手段
と、前記洗浄ブラシ支持手段を駆動することにより、前
記洗浄ブラシが前記基板の回転中心と対向する中心位置
と、前記洗浄ブラシが前記基板の周縁と対向する周縁位
置と、前記洗浄ブラシが前記基板の周縁より外側に位置
する待機位置との間で、前記洗浄ブラシを移動させる洗
浄ブラシ移動手段と、前記基板の表面に洗浄液を供給す
る洗浄液供給手段とを具備することを特徴とする。In order to solve the above problems, the present invention is configured as follows. That is, in a substrate cleaning apparatus that moves a cleaning brush on the surface of a rotating substrate to clean the substrate surface, a cleaning brush support unit that hangs and supports the cleaning brush rotatably around a vertical axis, and the cleaning brush. By driving the cleaning brush rotating means for rotating and the cleaning brush supporting means, a central position where the cleaning brush faces the rotation center of the substrate, and a peripheral position where the cleaning brush faces the peripheral edge of the substrate, A cleaning brush moving means for moving the cleaning brush between the cleaning brush and a standby position located outside the peripheral edge of the substrate; and a cleaning liquid supply means for supplying a cleaning liquid to the surface of the substrate. Characterize.
【０００５】[0005]
【作用】本発明では、回転する基板の表面に洗浄液供給
手段で洗浄液を供給しつつ、回転する洗浄ブラシを基板
の中心位置で基板と当接させ、当該洗浄ブラシを基板の
中心位置から周縁位置まで移動させて基板表面を洗浄す
る。そして、基板の回転乾燥時には当該洗浄ブラシを待
機位置に移動させる。つまり、基板の洗浄後は、当該洗
浄ブラシを基板の周縁より外側に位置する待機位置に移
動させることにより、洗浄ブラシが含有する洗浄液の液
滴が洗浄済みの基板表面に落下することはない。According to the present invention, while supplying the cleaning liquid to the surface of the rotating substrate by the cleaning liquid supply means, the rotating cleaning brush is brought into contact with the substrate at the center position of the substrate, and the cleaning brush is moved from the center position to the peripheral position of the substrate. To clean the substrate surface. Then, when rotating and drying the substrate, the cleaning brush is moved to the standby position. That is, after cleaning the substrate, by moving the cleaning brush to the standby position located outside the peripheral edge of the substrate, the droplets of the cleaning liquid contained in the cleaning brush do not drop on the surface of the cleaned substrate.
【０００６】[0006]
【実施例】以下、図１及び図２に基づいて説明する。こ
こで、図１は本発明の一実施例であって、基板洗浄装置
の機能説明用側面図、図２はその斜視図である。この基
板洗浄装置は、洗浄ブラシ支持手段と、洗浄ブラシ回転
手段と、洗浄ブラシ移動手段と、洗浄液供給手段とを具
備している。ここで、後述する揺動アーム１は洗浄ブラ
シ支持手段に該当し、駆動モータ３は洗浄ブラシ回転手
段に該当し、アーム支軸５の回転駆動手段１１及び昇降
駆動手段１７は洗浄ブラシ移動手段に該当し、洗浄液供
給ノズル４３は洗浄液供給手段に該当する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A description will be given below with reference to FIGS. Here, FIG. 1 is a side view for explaining the function of a substrate cleaning apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view thereof. This substrate cleaning apparatus includes a cleaning brush supporting unit, a cleaning brush rotating unit, a cleaning brush moving unit, and a cleaning liquid supply unit. Here, the swing arm 1 described later corresponds to a cleaning brush supporting means, the drive motor 3 corresponds to a cleaning brush rotating means, and the rotation driving means 11 and the elevating driving means 17 of the arm support shaft 5 function as a cleaning brush moving means. The cleaning liquid supply nozzle 43 corresponds to cleaning liquid supply means.
【０００７】この実施例装置は回転可能に設けた洗浄ブ
ラシ２を垂下支持し、水平揺動可能に設けられた揺動ア
ーム１と、揺動アーム１をその上端部に支持し、回転及
び昇降可能に設けられたアーム支軸５と、アーム支軸５
を位置制御可能に回転駆動する回転駆動手段１１と、ア
ーム支軸５を昇降駆動する昇降駆動手段１７と、アーム
支軸５に固定され揺動アーム１の荷重を受け止めるアー
ム荷重受止板７と、アーム１の減速下降用の錘り２２を
載置し、昇降可能に設けられた錘載置板２１と、その両
端部が上下方向に揺動可能に支持された両腕てこ２５
と、錘載置板２１の上昇速度を減速する減速シリンダ３
１と、錘載置板２１の上昇位置を微調整可能に規制する
ストッパ３２とを具備して成り、洗浄ブラシ２の、基板
表面への当接に際し、アーム荷重受止板７を両腕てこ２
５の一方の腕２５ａに載せ掛けるとともに、錘載置板２
１を他方の腕２５ｂに載せ掛けてアーム支軸５の下降速
度を減速することにより、スピンチャック４２の上面に
保持された基板４１上へ、洗浄ブラシ２を緩やかに当接
するように構成されている。なお、図１中符号４３は純
水等の洗浄液供給ノズルを示す。In the apparatus of this embodiment, a cleaning brush 2 rotatably supported is suspended, and a swing arm 1 horizontally swingably supported, and the swing arm 1 is supported at its upper end portion to rotate and lift. Arm support shaft 5 and arm support shaft 5
A rotation drive means 11 for rotationally driving the arm support shaft 5, a lift drive means 17 for lifting and lowering the arm support shaft 5, and an arm load receiving plate 7 fixed to the arm support shaft 5 for receiving the load of the swing arm 1. , A weight placing plate 21 on which a weight 22 for decelerating and descending the arm 1 is placed and which can be moved up and down, and both arm levers 25 whose both ends are supported to be vertically swingable.
And a deceleration cylinder 3 for decelerating the rising speed of the weight mounting plate 21.
1 and a stopper 32 that regulates the rising position of the weight mounting plate 21 so that the lifting position of the weight mounting plate 21 can be finely adjusted. Two
5 is placed on one arm 25a and the weight mounting plate 2
By mounting 1 on the other arm 25b and reducing the descending speed of the arm support shaft 5, the cleaning brush 2 is gently contacted with the substrate 41 held on the upper surface of the spin chuck 42. There is. Reference numeral 43 in FIG. 1 denotes a cleaning liquid supply nozzle for pure water or the like.
【０００８】洗浄ブラシ２は揺動アーム１の先端側に回
転自在に垂下支持されており、揺動アーム１の基端側に
配置した駆動モータ３によって伝動ベルト４を介して回
転駆動される。なお、洗浄ブラシ２はスポンジ状のも
の、羽毛状のもの等、洗浄工程等に応じて適宜選択して
使用される。揺動アーム１はその基端部がアーム支軸５
の上端部に固定され、アーム支軸５を中心として水平回
転可能に、かつ、アーム支軸５を昇降することにより昇
降自在に設けられている。The cleaning brush 2 is rotatably supported on the tip end side of the swing arm 1 and is rotationally driven by a drive motor 3 arranged on the base end side of the swing arm 1 via a transmission belt 4. The cleaning brush 2 is sponge-shaped, feather-shaped, or the like, and is appropriately selected and used according to the cleaning process. The oscillating arm 1 has an arm supporting shaft 5 at its base end.
Is fixed to the upper end of the arm support shaft 5 so as to be horizontally rotatable about the arm support shaft 5 and to be movable up and down by elevating the arm support shaft 5.
【０００９】アーム支軸５は、基台４０上に固定した支
軸用ボス６に回転及び昇降自在に支持されており、この
アーム支軸５にはボス６の上方に位置する部位にアーム
荷重受止板７が固定されるとともに、基台４０を貫通し
た下部に、スプラインスリーブ８を介して従動プーリ１
０が連結されている。即ち、アーム支軸５の下部はスプ
ライン軸５ｂになっており、このスプライン軸５ｂにス
プラインスリーブ８を外嵌し、スプラインスリーブ８を
軸受９を介して回転可能に基台４０へ支持し、スプライ
ンスリーブ８のプーリ固定軸８ｂに従動プーリ１０が固
定されている。The arm support shaft 5 is supported by a support shaft boss 6 fixed on a base 40 so as to be rotatable and movable up and down. The arm support shaft 5 has an arm load at a position above the boss 6. The receiving plate 7 is fixed, and the driven pulley 1 is provided below the penetrating base 40 via a spline sleeve 8.
0s are connected. That is, the lower part of the arm support shaft 5 is a spline shaft 5b. A spline sleeve 8 is fitted onto the spline shaft 5b, and the spline sleeve 8 is rotatably supported on a base 40 via a bearing 9, The driven pulley 10 is fixed to the pulley fixing shaft 8b of the sleeve 8.
【００１０】アーム支軸５の回転駆動手段１１は、駆動
プーリ１３及び伝動ベルト１４を介して従動プーリ１０
を正逆転駆動する駆動モータ１２と、位置制御用のセン
サ１５Ａ・１５Ｂ・１５Ｃを具備して成り、揺動アーム
１の先端に取り付けられた洗浄ブラシ２の位置につい
て、待機位置Ａ、基板４１の中心位置Ｂ、基板４１の周
縁位置Ｃを検出して位置制御するように構成されてい
る。なお符号１６Ａ・１６Ｂ・１６Ｃはそれぞれ所定位
置にスリットが付設された円板を示す。The rotation driving means 11 of the arm support shaft 5 is driven by a driven pulley 10 via a driving pulley 13 and a transmission belt 14.
Is provided with a drive motor 12 for driving forward and backward, and sensors 15A, 15B, 15C for position control. Regarding the position of the cleaning brush 2 attached to the tip of the swing arm 1, the standby position A and the substrate 41 The center position B and the peripheral position C of the substrate 41 are detected and the position is controlled. Reference numerals 16A, 16B, and 16C denote discs each having a slit provided at a predetermined position.
【００１１】昇降駆動手段１７は、基台４０の下側にエ
アシリンダ１８を固定し、エアシリンダ１８の出力ロッ
ド１９をアーム支軸５の下端（スプライン軸５ｂ）に押
し当てて進退させることにより、揺動アーム１を昇降駆
動するように構成されている。なお、符号２０Ａ・２０
Ｂは、出力ロッド１９の進退位置を検知するセンサを示
し、出力ロッド１９の進退ストロークに沿って付設され
ている。The lifting drive means 17 fixes the air cylinder 18 to the lower side of the base 40, and pushes the output rod 19 of the air cylinder 18 against the lower end (spline shaft 5b) of the arm support shaft 5 to move it forward and backward. The swing arm 1 is configured to be moved up and down. Note that reference numerals 20A and 20
B indicates a sensor that detects the forward / backward position of the output rod 19, and is attached along the forward / backward stroke of the output rod 19.
【００１２】ここで、揺動アーム１は、待機位置Ａでは
アーム荷重受止板７が支軸ボス６の上面に載った状態で
停止しており、基板４１の洗浄に際して、先ず待機位置
Ａでエアシリンダ１８の出力ロッド１９を進出させてア
ーム支軸５を押し上げることにより揺動アーム１を持ち
上げ、次いで駆動モータ１２を正転させて揺動アーム１
の先端に取付けられた洗浄ブラシ２を基板４１の中心位
置Ｂへ移動させ、その中心位置Ｂでエアシリンダ１８の
出力ロッド１９を退行させて揺動アーム１を下降させる
ことにより、アーム荷重受止板７が前記両腕てこ２５の
一方の短腕２５ａに付設したコロ２６に載り掛かるよう
になっている。At the standby position A, the swing arm 1 is stopped with the arm load receiving plate 7 resting on the upper surface of the spindle boss 6, and when cleaning the substrate 41, the swing arm 1 is first moved to the standby position A. The output rod 19 of the air cylinder 18 is advanced to push up the arm support shaft 5 to lift the swinging arm 1, and then the drive motor 12 is normally rotated to rotate the swinging arm 1.
By moving the cleaning brush 2 attached to the tip of the base plate to the central position B of the substrate 41, retracting the output rod 19 of the air cylinder 18 and lowering the swing arm 1 at the central position B, the arm load is received. The plate 7 is adapted to rest on a roller 26 attached to one short arm 25a of the both arm levers 25.
【００１３】錘載置板２１は、両腕てこ２５を介して揺
動アーム１の下降速度を減速するためのもので、基台４
０に固定具２３を介して立設した昇降案内棒２４に沿っ
て昇降するように設けられており、上記両腕てこ２５の
他方の長腕２５ｂに付設したコロ２７に載り掛かるよう
に構成されている。なお、錘載置板２１に載置される錘
り２２は、適宜重量調整可能に設けられ、少なくとも揺
動アーム１の荷重とアーム支軸５の荷重との和による偶
力モーメントが、当該錘り２２の重量による偶力モーメ
ントよりも若干大きくなるように設定される。また、両
腕てこ２５は、その両端部が支軸２８を中心として垂直
面内で上下方向に揺動可能に支軸用ボス６に支持されて
いる。The weight mounting plate 21 is for reducing the descending speed of the swing arm 1 via the both arm levers 25, and the base 4
0 is provided so as to be lifted up and down along a lift guide rod 24 erected via a fixture 23, and is configured to rest on a roller 27 attached to the other long arm 25b of the both arm levers 25. ing. The weight 22 mounted on the weight mounting plate 21 is provided so that the weight can be adjusted as appropriate, and the couple moment due to the sum of the load of the swing arm 1 and the load of the arm support shaft 5 is at least the weight. It is set to be slightly larger than the couple moment due to the weight of the ball 22. Both ends of the both arm levers 25 are supported by the support shaft boss 6 so as to be swingable in the vertical direction in a vertical plane about the support shaft 28.
【００１４】また、基台４０に立設した固定金具３０に
は、錘載置板２１の上昇速度を適宜減速する減速シリン
ダ３１及び錘載置板２１の上限位置を規定するストッパ
３２が設けられており、減速シリンダ３１のオリフィス
（図示せず）を適宜調整することで、両腕てこ２５を介
して下降する洗浄ブラシ２の下降速度を所望の速度まで
減速することができるとともに、マイクロメータ３３に
よりストッパ３２の規制位置を微調整することで、洗浄
ブラシ２の下端の位置を適宜設定することができ、これ
により洗浄ブラシ２が基板４１に下降当接する際の衝撃
をなくすように構成されている。Further, the fixing metal fitting 30 provided upright on the base 40 is provided with a deceleration cylinder 31 for appropriately reducing the rising speed of the weight mounting plate 21 and a stopper 32 for defining the upper limit position of the weight mounting plate 21. By appropriately adjusting the orifice (not shown) of the deceleration cylinder 31, the descending speed of the cleaning brush 2 descending via the both arm levers 25 can be decelerated to a desired speed, and the micrometer 33 is also provided. By finely adjusting the restriction position of the stopper 32, the position of the lower end of the cleaning brush 2 can be appropriately set, and thereby the impact when the cleaning brush 2 is brought into abutting contact with the substrate 41 is eliminated. There is.
【００１５】なお、アーム支軸５の支持用ボス６には支
持具３５を介してブラシ回転始動センサ３６が設けら
れ、他方上記錘載置板２１には被検板３７が立設されて
おり、錘載置板２１が一定の高さまで上昇して、センサ
３６が被検板３７を検知することに基づき洗浄ブラシ２
が、基板４１に当接する前に回転始動するように構成さ
れている。A brush rotation start sensor 36 is provided on the support boss 6 of the arm support shaft 5 via a support 35, while a test plate 37 is erected on the weight mounting plate 21. , The weight mounting plate 21 rises to a certain height, and the sensor 36 detects the plate 37 to be inspected.
However, it is configured to start rotating before coming into contact with the substrate 41.
【００１６】以下、上記実施例装置の動作について簡単
に説明する。基板の洗浄動作開始前には、揺動アーム１
は、待機位置Ａで待機しており、この位置Ａでは、アー
ム荷重受止板７は支軸用ボス６の上面に載った状態で停
止している。基板４１の洗浄が行われる場合には、先ず
待機位置Ａでエアシリンダ１８の出力ロッド１９でアー
ム支軸５を押し上げ、次いで駆動モータ１２でアーム支
軸５をその軸線回りに回転させることにより洗浄ブラシ
２を基板４１の中心位置Ｂへ移動させる。The operation of the apparatus of the above embodiment will be briefly described below. Before starting the substrate cleaning operation, the swing arm 1
Stands by at the standby position A, and at this position A, the arm load receiving plate 7 is stopped while resting on the upper surface of the spindle boss 6. When the substrate 41 is washed, first, at the standby position A, the output rod 19 of the air cylinder 18 pushes up the arm support shaft 5, and then the drive motor 12 rotates the arm support shaft 5 around its axis to perform cleaning. The brush 2 is moved to the center position B of the substrate 41.
【００１７】次に、その位置Ｂでエアシリンダ１８の出
力ロッド１９を退行させてアーム支軸５を下降させるこ
とにより、アーム荷重受止板７を両腕てこ２５の一方の
コロ２６に載せ掛ける。このときブラシ回転始動センサ
３６が作動して、洗浄ブラシ２が始動回転する。Next, at the position B, the output rod 19 of the air cylinder 18 is retracted to lower the arm support shaft 5, thereby mounting the arm load receiving plate 7 on one roller 26 of the two arm levers 25. . At this time, the brush rotation start sensor 36 operates and the cleaning brush 2 starts to rotate.
【００１８】一方、錘載置板２１は、両腕てこ２５の他
方のコロ２７に載り掛かっており、アーム支軸５の下降
に伴って、両腕てこ２５を介して押し上げられる。この
とき、錘載置板２１上の錘り２２及び減速シリンダ３１
の出力ロッド３１ａが錘載置板２１の上昇速度を減じる
ように作用するので、短腕２５ａ側に載り掛かっている
アーム荷重受止板７の下降速度は一層減速される。そし
て洗浄ブラシ２は回転しながら基板４１上に緩やかに当
接し、次いであるいは同時に、錘載置板２１がストッパ
３２に当接して下降停止する。これにより、洗浄ブラシ
が基板表面と接触状態で始動回転するのを回避して、基
板の表面に微細な傷が発生するのを防止することができ
る。On the other hand, the weight mounting plate 21 rests on the other roller 27 of the both arm levers 25 and is pushed up via the both arm levers 25 as the arm support shaft 5 descends. At this time, the weight 22 on the weight mounting plate 21 and the deceleration cylinder 31
Output rod 31a acts to reduce the ascending speed of the weight mounting plate 21, so that the descending speed of the arm load receiving plate 7 resting on the short arm 25a side is further reduced. Then, the cleaning brush 2 gently contacts the substrate 41 while rotating, and then or at the same time, the weight mounting plate 21 contacts the stopper 32 and stops descending. As a result, it is possible to prevent the cleaning brush from starting and rotating in contact with the surface of the substrate, and prevent generation of fine scratches on the surface of the substrate.
【００１９】次に、揺動アーム１の駆動モータ１２を逆
転させることにより、洗浄ブラシ２を回転させた状態で
基板４１の中心位置Ｂから周縁位置Ｃへ向けて移動さ
せ、同時に洗浄液供給ノズル４３から洗浄液を吐出させ
て基板４１全面を洗浄する。そして基板４１の洗浄後
は、当該洗浄ブラシ２を前記待機位置Ａに移動させる。
なお、洗浄ブラシ２が基板の中心位置Ｂから周縁位置Ｃ
へ向けて移動する間、アーム荷重受止板７はコロ２６に
載り掛かったままの状態に維持される。また、基板の洗
浄が不十分な場合等、必要な場合には、洗浄ブラシ２の
持ち上げ、基板の中心位置Ｂへの移動、洗浄ブラシ２の
軟着、基板の周縁位置Ｃへの移動という一連の動作が必
要回数繰り返される。Next, by rotating the drive motor 12 of the swinging arm 1 in the reverse direction, the cleaning brush 2 is moved from the central position B of the substrate 41 toward the peripheral position C while the cleaning brush 2 is rotated, and at the same time, the cleaning liquid supply nozzle 43. The cleaning liquid is discharged from the substrate to clean the entire surface of the substrate 41. Then, after cleaning the substrate 41, the cleaning brush 2 is moved to the standby position A.
The cleaning brush 2 moves from the center position B to the peripheral position C of the substrate.
The arm load receiving plate 7 is maintained on the roller 26 while moving toward. If necessary, such as when the substrate is not sufficiently cleaned, the cleaning brush 2 is lifted, the substrate is moved to the center position B, the cleaning brush 2 is softly attached, and the substrate is moved to the peripheral position C. The above operation is repeated as many times as necessary.
【００２０】なお、上記実施例では、洗浄ブラシ２を基
板４１上へ当接させて洗浄する場合について例示した
が、いわゆるハイドロプレーン方式においては、ストッ
パ３２を微調整することにより洗浄ブラシ２を基板４１
よりわずかに浮上させて洗浄することもできる。In the above embodiment, the cleaning brush 2 is brought into contact with the substrate 41 for cleaning, but in the so-called hydroplane system, the cleaning brush 2 is cleaned by finely adjusting the stopper 32. 41
It can also be floated slightly and washed.
【００２１】[0021]
【発明の効果】以上の説明で明らかなように、本発明に
よれば、基板の洗浄後は、当該洗浄ブラシを基板の周縁
より外側に位置する待機位置に移動させることにより、
洗浄ブラシが含有する洗浄液の液滴が洗浄後の基板表面
に落下することはないので、洗浄済みの基板にパーティ
クル等が再付着するのを防止することができる。As is apparent from the above description, according to the present invention, after cleaning the substrate, by moving the cleaning brush to the standby position located outside the peripheral edge of the substrate,
Since the droplets of the cleaning liquid contained in the cleaning brush do not drop on the surface of the substrate after cleaning, it is possible to prevent particles and the like from reattaching to the cleaned substrate.
【図１】本発明に係る基板洗浄装置の一実施例を示す機
能説明用側面図である。FIG. 1 is a side view for explaining a function showing an embodiment of a substrate cleaning apparatus according to the present invention.
【図２】本発明に係る基板洗浄装置の斜視図である。FIG. 2 is a perspective view of a substrate cleaning apparatus according to the present invention.
１…洗浄ブラシ支持手段（揺動アーム）、２…洗浄ブラ
シ、３…洗浄ブラシ回転手段（駆動モータ）、１１・１
７…洗浄ブラシ移動手段（アーム支軸の回転駆動手段及
び昇降駆動手段）、４１…基板、４３…洗浄液供給手段
（洗浄液供給ノズル）、Ａ…待機位置、Ｂ…基板の中心
位置、Ｃ…基板の周縁位置。DESCRIPTION OF SYMBOLS 1 ... Washing brush support means (swinging arm), 2 ... Washing brush, 3 ... Washing brush rotating means (driving motor), 11.1.
7 ... Cleaning brush moving means (rotation driving means and lifting driving means for arm support shaft), 41 ... Substrate, 43 ... Cleaning liquid supply means (cleaning liquid supply nozzle), A ... Standby position, B ... Substrate center position, C ... Substrate Edge position.
Claims (1)
動させて基板表面を洗浄する基板洗浄装置において、 垂直軸を中心として回転可能に前記洗浄ブラシを垂下支
持する洗浄ブラシ支持手段と、 前記洗浄ブラシを回転させる洗浄ブラシ回転手段と、 前記洗浄ブラシ支持手段を駆動することにより、前記洗
浄ブラシが前記基板の回転中心と対向する中心位置と、
前記洗浄ブラシが前記基板の周縁と対向する周縁位置
と、前記洗浄ブラシが前記基板の周縁より外側に位置す
る待機位置との間で、前記洗浄ブラシを移動させる洗浄
ブラシ移動手段と、 前記基板の表面に洗浄液を供給する洗浄液供給手段と、 を具備することを特徴とする基板洗浄装置。1. A substrate cleaning apparatus for cleaning a substrate surface by moving a cleaning brush on a surface of a rotating substrate, a cleaning brush supporting unit for rotatably supporting the cleaning brush rotatably about a vertical axis, Cleaning brush rotating means for rotating the cleaning brush, and a central position where the cleaning brush opposes the rotation center of the substrate by driving the cleaning brush supporting means,
Cleaning brush moving means for moving the cleaning brush between a peripheral position where the cleaning brush faces the peripheral edge of the substrate and a standby position where the cleaning brush is positioned outside the peripheral edge of the substrate; A substrate cleaning apparatus comprising: a cleaning liquid supply unit that supplies a cleaning liquid to the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16922394A JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16922394A JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16567894A Division JP2618834B2 (en) | 1994-07-19 | 1994-07-19 | Substrate cleaning method and substrate cleaning apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07169725A true JPH07169725A (en) | 1995-07-04 |
| JP2727413B2 JP2727413B2 (en) | 1998-03-11 |
Family
ID=15882508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16922394A Expired - Lifetime JP2727413B2 (en) | 1994-07-21 | 1994-07-21 | Substrate cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2727413B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005098919A1 (en) * | 2004-04-06 | 2005-10-20 | Tokyo Electron Limited | Board cleaning apparatus, board cleaning method, and medium with recorded program to be used for the method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790941A (en) * | 1980-11-27 | 1982-06-05 | Toshiba Corp | Swing type vertical washer |
| JPS62125632A (en) * | 1985-11-26 | 1987-06-06 | Ricoh Co Ltd | Cleaning method for substrate of glass wafer, optical disc substrate or the like |
| JPS62128125A (en) * | 1985-11-29 | 1987-06-10 | Canon Inc | Wafer washing apparatus |
-
1994
- 1994-07-21 JP JP16922394A patent/JP2727413B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5790941A (en) * | 1980-11-27 | 1982-06-05 | Toshiba Corp | Swing type vertical washer |
| JPS62125632A (en) * | 1985-11-26 | 1987-06-06 | Ricoh Co Ltd | Cleaning method for substrate of glass wafer, optical disc substrate or the like |
| JPS62128125A (en) * | 1985-11-29 | 1987-06-10 | Canon Inc | Wafer washing apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005098919A1 (en) * | 2004-04-06 | 2005-10-20 | Tokyo Electron Limited | Board cleaning apparatus, board cleaning method, and medium with recorded program to be used for the method |
| CN100449702C (en) * | 2004-04-06 | 2009-01-07 | 东京毅力科创株式会社 | Board cleaning apparatus, board cleaning method, and medium with recorded program to be used for the method |
| US7803230B2 (en) | 2004-04-06 | 2010-09-28 | Tokyo Electron Limited | Substrate cleaning apparatus, substrate cleaning method, and medium for recording program used for the method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2727413B2 (en) | 1998-03-11 |
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