JP2515879Y2 - Substrate support - Google Patents
Substrate supportInfo
- Publication number
- JP2515879Y2 JP2515879Y2 JP1990094882U JP9488290U JP2515879Y2 JP 2515879 Y2 JP2515879 Y2 JP 2515879Y2 JP 1990094882 U JP1990094882 U JP 1990094882U JP 9488290 U JP9488290 U JP 9488290U JP 2515879 Y2 JP2515879 Y2 JP 2515879Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate support
- support
- moving body
- wall surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、スピンコータやスピンディベロッパー等の
各種の基板処理部に半導体ウエハなどの基板を供給し、
あるいは排出する際に用いる基板支持具に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention supplies substrates such as semiconductor wafers to various substrate processing units such as spin coaters and spin developers.
Alternatively, the present invention relates to a substrate support used when discharging.
〈従来の技術〉 この種の基板支持具としては、例えば特開昭63-21335
5号公報中に示されているように、断面形状がＬ字形の
基板載置アームを平行に対向配置したものがある。この
基板支持具によれば、基板の対向部位を前記アームの段
部に載置することによって、基板を支持している。<Prior Art> As a substrate support of this type, for example, JP-A-63-21335
As shown in Japanese Patent Publication No. 5, there is one in which substrate mounting arms having an L-shaped cross section are arranged in parallel and opposite to each other. According to this substrate support, the substrate is supported by placing the facing portion of the substrate on the stepped portion of the arm.
〈課題が解決しようとする問題点〉 上述した従来の基板支持具は、それ以前のものに比べ
れば基板裏面が汚染されるのが格段に少なくなっている
が、なお残っているという問題点がある。<Problems to be Solved by the Problem> In the conventional substrate support described above, the back surface of the substrate is significantly less polluted than the previous ones, but the problem remains. is there.
すなわち、従来の基板支持具は、対向して配置した横
長の基板載置アームに、基板の対向部位を受止め支持さ
せるものであるので、搬送中の基板の安定性を維持する
ために、基板の載せ代を比較的大きくしており、このた
め基板裏面が基板載置アームに大きい面積で接触し、こ
の接触部分において依然として基板裏面が汚染されやす
いという問題点がある。That is, in the conventional substrate support tool, the horizontally long substrate placing arms are arranged to receive and support the facing portions of the substrate, and therefore, in order to maintain the stability of the substrate during transfer, However, there is a problem that the back surface of the substrate comes into contact with the substrate mounting arm over a large area, and the back surface of the substrate is still easily contaminated at this contact portion.
また、従来の基板支持具は、その構造上、基板を支持
する機能しかもっておらず、基板の位置決めには別の手
段および別の行程を必要とするので、その分、この種の
基板支持具を用いた基板処理装置が大型化するととも
に、位置決めする工程の時間が要るので基板移送時間が
長くなるという問題点もある。Further, since the conventional substrate support has only the function of supporting the substrate in its structure and requires another means and another step for positioning the substrate, the substrate support of this type is correspondingly provided. There is also a problem that the substrate processing apparatus using the above-mentioned apparatus becomes large in size and the time for the positioning process is long, so that the substrate transfer time becomes long.
本考案は、このような事情に鑑みてなされたものであ
って、基板裏面でのパーティクルの発生を抑制すること
ができるとともに、位置決め機能をも発揮させることが
できる基板支持具を提供することを目的とする。The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a substrate holder that can suppress the generation of particles on the back surface of the substrate and can also exert a positioning function. To aim.
〈課題を解決するための手段〉 上記目的を達成するために、本考案は次のような構成
を採る。<Means for Solving the Problems> In order to achieve the above object, the present invention employs the following configuration.
すなわち、本考案は、基板を支持して移動することに
よって、基板搬送する基板搬送装置の基板支持具におい
て、基板の外周縁よりも中心側に寄った基板裏面の少な
くとも３箇所をほぼ点接触状態で支持する突出体と、基
板の外周縁に沿って配設されるとともに、前記突出体上
端より高い位置まで延設した垂直壁面と、この垂直壁面
の上端から上拡がりに傾斜したテーパー案内壁面とを備
えたものである。That is, according to the present invention, in a substrate support of a substrate transfer device for transferring a substrate by supporting and moving the substrate, at least three points on the back surface of the substrate closer to the center side than the outer peripheral edge of the substrate are in a substantially point contact state. A vertical wall that is disposed along the outer peripheral edge of the substrate and that extends to a position higher than the upper end of the projection, and a tapered guide wall that slopes upward from the upper end of the vertical wall. It is equipped with.
〈作用〉 本考案の作用は次のとおりである。<Operation> The operation of the present invention is as follows.
すなわち、基板支持具上において、およその位置合わ
せ状態で、基板を下降するか基板支持具を上昇して、基
板支持具に基板が載置されると、基板の外周縁がテーパ
ー案内壁面に接触しながら垂直壁面に下降案内されるこ
とにより、基板の位置決めが行われる。位置決めされた
基板は、その外周縁よりも中心側に寄った基板裏面の少
なくとも３箇所を突出体によってほぼ点接触状態で支持
される。That is, when the substrate is placed on the substrate support by descending the substrate or raising the substrate support in a roughly aligned state on the substrate support, the outer peripheral edge of the substrate comes into contact with the tapered guide wall surface. However, the substrate is positioned by being guided down the vertical wall. The positioned substrate is supported in a substantially point-contact state by at least three points on the back surface of the substrate closer to the center side than the outer peripheral edge of the substrate.
〈実施例〉 以下、本考案の実施例を図面に基づいて詳細に説明す
る。<Embodiment> An embodiment of the present invention will be described below in detail with reference to the drawings.
第１図は本考案に係る基板支持具を備えた基板給排装
置の平面図、第２図はその正面図、また、第３図は右方
からの側面図である。FIG. 1 is a plan view of a substrate feeding / discharging device provided with a substrate support according to the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a side view from the right side.
第１図に示すように、基板処理部１を構成するスピン
コータの処理カップ２の上面には基板出し入れ用の開口
2aが形成されているとともに、この開口2aの中央に昇降
自在なスピンチャック３が配備されている。第１図にお
いて、基板処理部１の左側が未処理基板搬入側、右側が
処理ずみ基板排出側となっており、それぞれの箇所に屈
伸自在な基板搬入用吸着アーム４、基板排出用吸着アー
ム５が配備されているとともに、処理カップ２の左右に
近接して基板搬入位置P1と基板排出位置P2とが設定され
ている。As shown in FIG. 1, an opening for loading and unloading the substrate is formed on the upper surface of the processing cup 2 of the spin coater that constitutes the substrate processing unit 1.
2a is formed, and a spin chuck 3 which can be raised and lowered is arranged at the center of the opening 2a. In FIG. 1, the left side of the substrate processing unit 1 is the unprocessed substrate loading side, and the right side is the processed substrate discharging side. The substrate loading suction arm 4 and the substrate discharging suction arm 5 are bendable and extendable at their respective positions. And a substrate loading position P 1 and a substrate discharging position P 2 are set near the left and right of the processing cup 2.
基板処理部１の前部にはフレーム６が立設されてお
り、このフレーム６の左右に設けられたブラケット７間
に上下一対のガイド軸８が水平に架設され、これらのガ
イド軸８に第１移動体９と第２移動体10とがスライド軸
受11を介して水平移動自在に支持されている。A frame 6 is erected on the front part of the substrate processing unit 1, and a pair of upper and lower guide shafts 8 are horizontally installed between brackets 7 provided on the left and right sides of the frame 6, and the guide shafts 8 A first moving body 9 and a second moving body 10 are supported by a slide bearing 11 so as to be horizontally movable.
第２図に示すように、フレーム６の前面には、上下２
本のタイミングベルト12,13が、それぞれ駆動プーリ14,
15と従動プーリ16,17とにわたって水平に巻回され、下
側のタイミングベルト12は第１移動体９に、また上側の
タイミングベルト13は第２移動体10に、それぞれ連結具
18,19を介して連結されている。第３図に示すように、
フレーム６の背部に配設したモータ20,21で駆動プーリ1
4,15をそれぞれ正逆転することで、第１、第２移動体9,
10をそれぞれ左右に往復移動させるよう構成されてい
る。As shown in FIG.
The timing belts 12 and 13 of the book are driven pulleys 14 and 13, respectively.
The timing belt 12 on the lower side is connected to the first moving body 9 and the timing belt 13 on the upper side is connected to the second moving body 10, and is connected to the second moving body 10 respectively.
It is connected via 18,19. As shown in FIG.
Drive pulley 1 with motors 20 and 21 arranged at the back of frame 6
By reversing 4, 15 respectively, the first and second moving bodies 9,
Each of the 10 is configured to reciprocate left and right.
第１移動体９の上部背面には左右一対のガイドレール
22が固設されており、これに沿って昇降自在な第１基板
支持具23が装着されている。また、第２移動体10の上部
背面にも同様のガイドレール22があり、このガイドレー
ル22に沿って昇降自在な第２基板支持具24が装着されて
いる。A pair of left and right guide rails is provided on the upper rear surface of the first moving body 9.
22 is fixedly mounted, and a first substrate support 23 that can be raised and lowered is mounted along this. A similar guide rail 22 is also provided on the rear surface of the upper portion of the second moving body 10, and a second substrate support 24 that can be raised and lowered along the guide rail 22 is mounted.
第１基板支持具23および第２基板支持具24は、側面形
状が逆Ｌ字形の昇降ベース23a,24aと、これらの上面に
後向き片持ち状に連結された基板支持具23b,24bとから
なり、基板支持具23b,24bは、基板形状に応じて着脱交
換できるようにノブボルト25で連結されている。The first substrate support member 23 and the second substrate support member 24 are composed of lifting bases 23a, 24a each having an inverted L-shaped side surface, and substrate support members 23b, 24b connected to their upper surfaces in a rearward cantilever manner. The board support members 23b, 24b are connected by a knob bolt 25 so that they can be attached / detached according to the shape of the board.
そして、第１、第２基板支持具23,24の各昇降ベース2
3a,24aの前面下部には、上下一対のガイドローラ対26が
それぞれ軸支されており、これらのガイドローラ対26の
間に係合する角棒状の昇降体27が水平に架設されてい
る。この昇降体27の左右には、同じ長さの揺動リング28
a,28bが枢支連結され、もって、昇降体27と左右の揺動
リンク28a、28bとが平行四連リンク構造に連結されてい
る。そして、左側の揺動リンク28aが、フレーム６に取
り付けられたエアーシリンダ29のピストンロッド29aに
連結されている。このエアーシリンダ29の伸縮作動によ
って揺動リンク28aが揺動し、もって昇降体27が平行に
昇降し、この昇降体27にガイドローラ26を介して係合し
た第１基板支持具23と第２基板支持具24が同時に同量だ
け昇降するようになっている。Then, the elevating bases 2 of the first and second substrate supporting members 23, 24
A pair of upper and lower guide roller pairs 26 are axially supported on the lower front surfaces of 3a and 24a, and a rectangular rod-shaped lifting body 27 that engages between these guide roller pairs 26 is horizontally installed. On the left and right of this lifting body 27, there are rocking rings 28 of the same length.
The a and 28b are pivotally connected, so that the lifting body 27 and the left and right swing links 28a and 28b are connected in a parallel four-link structure. The swing link 28a on the left side is connected to the piston rod 29a of the air cylinder 29 attached to the frame 6. By the expansion and contraction operation of the air cylinder 29, the swinging link 28a swings, and thus the lifting body 27 moves up and down in parallel, and the first substrate support tool 23 and the second substrate support 23 which are engaged with the lifting body 27 via the guide roller 26. Substrate support 24 is simultaneously moved up and down by the same amount.
第５図および第６図に第２基板支持具24の詳細な構造
を示す。5 and 6 show the detailed structure of the second substrate support 24.
前記基板支持具24bは軽量化のための抜き孔30を備え
ており、その下面の基端側と遊端側にはスペーサ31を介
して基板位置決め部材32がボルト連結されるとともに、
更にその下面の左右両端（第５図では上下両端に相当）
には基板受け止めピース33がボルト連結されている。The substrate support 24b is provided with a hole 30 for reducing the weight, and a substrate positioning member 32 is bolted to the base end side and the free end side of the lower surface thereof via a spacer 31, and
Furthermore, the left and right ends of the lower surface (corresponding to the upper and lower ends in FIG. 5)
A substrate receiving piece 33 is bolted to the.
各基板位置決め部材32には、基板Ｗの周方向四箇所に
おいて基板周縁に当接する位置決め部32aが突設されて
いる。この位置決め部32aには、基板Ｗの外周縁に当接
する垂直壁面34と、これに連なる上拡がり傾斜のテーパ
ー案内壁面35とが備えられており、上方より送り込まれ
てきた基板Ｗを各テーパー案内壁面35で案内して位置決
めするようになっている。Each of the substrate positioning members 32 is provided with a positioning portion 32a that abuts the peripheral edge of the substrate W at four locations in the circumferential direction of the substrate W. The positioning portion 32a is provided with a vertical wall surface 34 that comes into contact with the outer peripheral edge of the substrate W, and a taper guide wall surface 35 that is continuous with the vertical wall surface 34 and has an upwardly sloping slope. The wall surface 35 guides and positions it.
また、基板受止めピース33の先端には基板Ｗの外周縁
より少し中心側寄りの下面を略点接触状に載置支持する
突出体36が設けられていて、前記垂直壁面34は、この突
出体36の高さから基板厚以上の高さまで形成されてい
る。上述した基板位置決めの部材32および基板受止めピ
ース33は、滑動性および耐摩耗性の高いフッ素樹脂材で
構成されている。Further, at the tip of the substrate receiving piece 33, there is provided a projecting member 36 for mounting and supporting the lower surface slightly closer to the center side than the outer peripheral edge of the substrate W in a substantially point contact manner. It is formed from the height of the body 36 to a height equal to or higher than the substrate thickness. The substrate positioning member 32 and the substrate receiving piece 33 described above are made of a fluororesin material having high slidability and wear resistance.
なお、第１基板支持具23の基板支持具23bは、上記し
た第２基板支持具24の基板支持具24bの左右を互い違い
に構成したものである。The substrate support 23b of the first substrate support 23 is configured by staggering the left and right sides of the substrate support 24b of the second substrate support 24 described above.
次に上記のように構成した基板給排装置の動作につい
て説明する。Next, the operation of the substrate feeding / discharging device configured as described above will be described.
第１図および第２図は第１移動体９および第２移動体
10がそれぞれ原点に位置する状態を示し、この状態では
第１基板支持具23は基板搬入位置P1において下降し、ま
た、第２基板支持具24は基板排出位置P2において下降し
ている。1 and 2 show a first moving body 9 and a second moving body.
10 shows a state in which they are respectively located at the origin, and in this state, the first substrate support 23 is lowered at the substrate loading position P 1 , and the second substrate support 24 is lowered at the substrate discharge position P 2 .
なお、この場合、基板処理部１には既に基板Ｗが供給
されて処理を受けており、また、基板搬入位置P1には次
に処理されるべき基板Ｗが吸着アーム４によって搬入さ
れている。第１、第２移動体9,10の原点検知は、第２図
に示すように、第１、第２移動体9,10の下部に取付けた
検知片37,38をフレーム６の下部前面の左右端近くに設
けた光センサS0、S0によって検知することによる。In this case, the substrate W has already been supplied to the substrate processing unit 1 for processing, and the substrate W to be processed next has been loaded into the substrate loading position P 1 by the suction arm 4. . As shown in FIG. 2, the origin detection of the first and second moving bodies 9 and 10 is performed by mounting the detecting pieces 37 and 38 attached to the lower portions of the first and second moving bodies 9 and 10 on the lower front surface of the frame 6. By detecting with the optical sensors S 0 and S 0 provided near the left and right ends.
以下、第４図を参照して説明する。第４図は、第１、
第２基板支持具23,24の矩形サイクルの動作順序を示し
た模式図である。Hereinafter, description will be given with reference to FIG. FIG. 4 shows the first,
It is a schematic diagram which showed the operation sequence of the rectangular cycle of the 2nd board | substrate support tool 23,24.
（１）基板処理部１での処理が終了すると、先ず第２移
動体10が左方に向けて移動し、第２基板支持具24の中心
が基板処理部１のチャックセンターP0に至ると停止する
（第４図中のストローク）。(1) When the processing in the substrate processing section 1 is completed, first, the second moving body 10 moves to the left, and the center of the second substrate support 24 reaches the chuck center P 0 of the substrate processing section 1. Stop (stroke in Fig. 4).
なお、第２移動体10のチャックセンター検知は、第２
図に示した検知片38を光センサS1で検知するすることで
行い、最終的な位置決めは第１移動体９と第２移動体10
のストッパー41a,41bの当接による。The chuck center of the second moving body 10 is detected by the second
The detection piece 38 shown in the figure is detected by the optical sensor S 1 , and the final positioning is performed by the first moving body 9 and the second moving body 10.
This is due to the contact of the stoppers 41a and 41b.
（２）次に、エアーシリンダ29が伸縮作動して昇降体27
が一定ストロークだけ上昇し、これに伴って第１基板支
持具23と第２基板支持具24が同時に上昇する。(2) Next, the air cylinder 29 expands and contracts to move the lifting body 27.
Rises by a certain stroke, and the first substrate support 23 and the second substrate support 24 rise simultaneously with this.
これによって、基板搬入位置P1に搬入されている未処
理基板Ｗが第１基板支持具23に位置決めされた状態で受
取られるとともに、基板処理部１のスピンチャック３上
の処理ずみ基板Ｗが第２基板支持具24に位置決めされた
状態で受取られる（第４図のストローク） なお、昇降体27の上昇位置検知は昇降体27の左端に取
付けた検知片39を、ブラケット７に取付けた光センサS2
で検知することによっている（第２図参照）。As a result, the unprocessed substrate W loaded into the substrate loading position P 1 is received while being positioned in the first substrate support 23, and the processed substrate W on the spin chuck 3 of the substrate processing unit 1 is transferred to the first substrate support 23. 2 Received in a state of being positioned on the substrate support 24 (stroke in FIG. 4). The rising position of the lifting body 27 is detected by an optical sensor in which a detection piece 39 mounted on the left end of the lifting body 27 is mounted on the bracket 7. S 2
It is based on the detection (see Fig. 2).
（３）次に、両ベルト12,13が同方向に駆動されて第１
移動体９と第２移動体10が同時に右方に移動され、第１
移動体９は第１基板支持具23がチャックセンターP0に至
ると停止し、第２移動体10は第２基板支持具24が基板排
出位置P2に一致する原点まで移動して停止する（第４図
中のストローク）。(3) Next, both belts 12 and 13 are driven in the same direction to
The moving body 9 and the second moving body 10 are simultaneously moved to the right,
The movable body 9 stops when the first substrate support 23 reaches the chuck center P 0 , and the second movable body 10 moves to the origin where the second substrate support 24 coincides with the substrate discharge position P 2 and then stops ( Stroke in Fig. 4).
なお、第１移動体９のチャックセンター検知は、検知
片37を光センサS3で検知することによる。また、最終的
な位置決めは第１、第２移動体9,10に取り付けられたス
トッパー42a,42bの当接による。The chuck center of the first moving body 9 is detected by detecting the detection piece 37 with the optical sensor S 3 . Further, the final positioning is performed by abutting the stoppers 42a and 42b attached to the first and second moving bodies 9 and 10.
（４）次に、エアーシリンダ29が収縮作動して昇降体27
が一定距離だけ下降し、これに伴って第１基板支持具23
と第２基板支持具24とが同時に下降する（第４図中のス
トローク）。これによって、第１基板支持具23の未処
理基板がスピンチャック３に受渡されるとともに、第２
基板支持具24の処理ずみ基板が基板排出用吸着アーム５
に受渡される。(4) Next, the air cylinder 29 is contracted to move up and down the moving body 27.
Lowers by a certain distance, and the first substrate support 23
And the second substrate support 24 simultaneously descend (stroke in FIG. 4). As a result, the unprocessed substrate of the first substrate support 23 is delivered to the spin chuck 3 and the second substrate
The processed substrate of the substrate support 24 is the substrate discharge suction arm 5
To be delivered to.
なお、昇降体27の下降位置検知は、昇降体27の右端に
取付けた検知片40を光センサS4で検知することによる
（第２図参照）。The lowering position of the lifting body 27 is detected by detecting the detection piece 40 attached to the right end of the lifting body 27 with the optical sensor S 4 (see FIG. 2).
（５）次に、第１移動体９のみが原点まで水平移動して
元の状態に戻る（第４図中のストローク）。(5) Next, only the first moving body 9 horizontally moves to the origin and returns to the original state (stroke in FIG. 4).
以上が１回の基板給排動作であり、これを基板処理終
了ごとに繰り返すことで、基板Ｗを１枚づつ供給・排出
することができる。The above is one substrate supply / discharge operation, and by repeating this every time substrate processing is completed, the substrates W can be supplied / discharged one by one.
なお、第２図中のS5〜S8は第１移動体９、および第２
移動体10の加減速制御用の位置検出光センサである。In addition, S 5 to S 8 in FIG. 2 are the first moving body 9 and the second moving body.
A position detection optical sensor for acceleration / deceleration control of the moving body 10.
以上の実施例の説明では、スピンコータを例にとって
説明したが、本考案は、スピンディベロッパー等のその
他の回転式基板処理装置にも適用することができる。In the above description of the embodiments, the spin coater is taken as an example, but the present invention can also be applied to other rotary substrate processing apparatuses such as a spin developer.
また、実施例では４個の突出体36によって、基板Ｗを
受け止め支持するように構成したが、このような突出体
は少なくとも３個あればよい。Further, in the embodiment, the four protrusions 36 are configured to receive and support the substrate W, but at least three such protrusions may be used.
〈考案の効果〉 以上説明したように、本考案によれば、基板裏面への
接触面積を大幅に減少することができ、これによって基
板裏面の汚染を極力抑えることができる。<Effect of the Invention> As described above, according to the present invention, the contact area with the back surface of the substrate can be greatly reduced, and thereby the contamination on the back surface of the substrate can be suppressed as much as possible.
また、基板支持具自体にテーパー案内壁面とこれに連
設する垂直壁面を備え、基板の自重落下によって自動的
に基板の位置決めが行われるようにしているので、専用
の位置決め手段や、そのための工程が不要となり、装置
の小型化や基板移送時間の短縮化を図ることができる。In addition, since the substrate support itself has a tapered guide wall surface and a vertical wall surface connected to the tapered guide wall surface so that the substrate is automatically positioned by its own weight drop, a dedicated positioning means and a process therefor are provided. Is unnecessary, and it is possible to reduce the size of the apparatus and shorten the substrate transfer time.
さらに、本案考案によれば、基板を点接触で支持する
突出体は、基板の外周縁よりも中心側に寄った基板裏面
を支持するので、基板周縁の角部分に応力が加わらな
い。その結果として、基板周縁の角部分にクラックが発
生したり、また、それによって発塵することもない。Further, according to the present invention, since the projecting body that supports the substrate in point contact supports the back surface of the substrate that is closer to the center side than the outer peripheral edge of the substrate, stress is not applied to the corner portions of the peripheral edge of the substrate. As a result, no cracks are generated at the corners of the peripheral edge of the substrate, and no dust is generated thereby.
図面は本考案の一実施例に係り、第１図は装置全体の平
面図、第２図はその一部を切欠いた正面図、第３図は第
１図における右方からの側面図、第４図は第１基板支持
具および第２基板支持具の作動サイクルを示す説明図、
第５図は第２基板支持具の一部切欠き拡大平面図、第６
図はその一部切欠き側面図である。 １……基板処理部、９……第１移動体 10……第２移動体、23……第１基板支持具 24……第２基板支持具、34……垂直壁面 35……テーパー案内壁面、36……突出体 Ｗ……基板 P0……チャックセンター P1……基板搬入位置 P2……基板搬出位置1 is a plan view of the entire apparatus, FIG. 2 is a front view with a part cut away, FIG. 3 is a side view from the right side in FIG. 1, and FIG. FIG. 4 is an explanatory view showing an operation cycle of the first substrate support and the second substrate support,
FIG. 5 is a partially cutaway enlarged plan view of the second substrate support, FIG.
The figure is a partially cutaway side view thereof. 1 ... Substrate processing unit, 9 ... First moving body 10 ... Second moving body, 23 ... First substrate support 24 ... Second substrate support, 34 ... Vertical wall surface 35 ... Tapered guide wall surface , 36 …… Projection W …… Substrate P 0 …… Chuck center P 1 …… Substrate loading position P 2 …… Substrate unloading position
Claims (1)
板搬送する基板搬送装置の基板支持具において、 基板の外周縁よりも中心側に寄った基板裏面の少なくと
も３箇所をほぼ点接触状態で支持する突出体と、基板の
外周縁に沿って配設されるとともに、前記突出体上端よ
り高い位置まで延設した垂直壁面と、この垂直壁面の上
端から上拡がりに傾斜したテーパー案内壁面とを備えた
ことを特徴とする基板支持具。1. In a substrate support of a substrate transfer device for transferring a substrate by supporting and moving the substrate, at least three points on the back surface of the substrate closer to the center side than the outer peripheral edge of the substrate are in a substantially point contact state. A protruding body for supporting, a vertical wall surface which is arranged along the outer peripheral edge of the substrate and extends to a position higher than the upper end of the protruding body, and a tapered guide wall surface which is inclined upward from the upper end of the vertical wall surface. A substrate support characterized by being provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990094882U JP2515879Y2 (en) | 1990-09-10 | 1990-09-10 | Substrate support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990094882U JP2515879Y2 (en) | 1990-09-10 | 1990-09-10 | Substrate support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0452743U JPH0452743U (en) | 1992-05-06 |
| JP2515879Y2 true JP2515879Y2 (en) | 1996-10-30 |
Family
ID=31833160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990094882U Expired - Fee Related JP2515879Y2 (en) | 1990-09-10 | 1990-09-10 | Substrate support |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2515879Y2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63257217A (en) * | 1987-04-15 | 1988-10-25 | Hitachi Ltd | Jig for heat treatment |
| JPH01100446U (en) * | 1987-12-23 | 1989-07-05 | ||
| JPH0295244U (en) * | 1989-01-13 | 1990-07-30 | ||
| JPH081921B2 (en) * | 1990-01-13 | 1996-01-10 | 東京エレクトロン株式会社 | Semiconductor manufacturing equipment |
-
1990
- 1990-09-10 JP JP1990094882U patent/JP2515879Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0452743U (en) | 1992-05-06 |
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