JPH0716946B2 - Method for producing epoxy resin molding material - Google Patents
Method for producing epoxy resin molding materialInfo
- Publication number
- JPH0716946B2 JPH0716946B2 JP1134010A JP13401089A JPH0716946B2 JP H0716946 B2 JPH0716946 B2 JP H0716946B2 JP 1134010 A JP1134010 A JP 1134010A JP 13401089 A JP13401089 A JP 13401089A JP H0716946 B2 JPH0716946 B2 JP H0716946B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- parts
- molding material
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体素子を保護する目的で用いられる半
導体封止に有用なエポキシ樹脂成形材料の製造方法に関
する。Description: TECHNICAL FIELD The present invention relates to a method for producing an epoxy resin molding material useful for encapsulating a semiconductor, which is used for the purpose of protecting a semiconductor element.
近年、半導体分野においては高集積、高機能、高速、高
出力化の要求が年々高まってきている。それに伴い半導
体装置を封止成形する封止成形材料に対して、耐湿性は
もとろんのこと低応力、高熱伝導性などの要求がなされ
ている。このために、無機質充填材をますます高充填さ
せる必要に迫られてきている。しかしながら、封止成形
材料の低応力、高熱伝導性を得るために、樹脂、及び硬
化剤に対して、無機質充填剤を高充填させると成形材料
の低粘度を確保することはできなかった。したがって、
成形材料の高粘度化のために半導体装置内のワイヤー変
形や切断を招き、さらには耐湿性に有害な成形品として
の半導体装置に未充填やボイドなどを生じると言う問題
があった。In recent years, in the semiconductor field, demands for high integration, high functionality, high speed, and high output have been increasing year by year. Along with this, there is a demand for not only moisture resistance but also low stress and high thermal conductivity for encapsulating molding materials for encapsulating and molding semiconductor devices. For this reason, it is necessary to fill the inorganic filler with a higher amount. However, in order to obtain low stress and high thermal conductivity of the encapsulating molding material, it was not possible to secure a low viscosity of the molding material when the resin and the curing agent were highly filled with the inorganic filler. Therefore,
There has been a problem that the high viscosity of the molding material causes wire deformation and cutting in the semiconductor device, and further, unfilling and voids are generated in the semiconductor device as a molded product which is harmful to moisture resistance.
無機質充填材を高充填させながら、なおかつ低粘度で成
形性に優れたエポキシ樹脂成形材料の製造方法を提供す
ることにある。An object of the present invention is to provide a method for producing an epoxy resin molding material which is highly filled with an inorganic filler and has a low viscosity and excellent moldability.
本発明者らは、課題を解決するために成形前にあっては
樹脂の硬化を殆ど進行させずに、先ず無機質充填剤と樹
脂を充分に混練して濡らた後に、100メッシュ未満の硬
化助剤を均一に分散すると、成形材料として低粘度化が
図れ、無機質充填剤が高い割合で充填することを見出
し、本発明に至った。In order to solve the problem, the present inventors hardly advance the curing of the resin before molding, and first knead the inorganic filler and the resin sufficiently to wet them, and then cure them to less than 100 mesh. The present invention has been found out that when the auxiliary agent is uniformly dispersed, the viscosity of the molding material can be lowered, and the inorganic filler is filled in a high proportion.
すなわち、本発明は、（イ）エポキシ樹脂を10〜20重量
部、（ロ）フェノールノボラック系硬化剤を５〜10重量
部、および、（ハ）無機質充填剤を、上記エポキシ樹脂
およびフェノールノボラック系硬化剤の合計量100重量
部に対して、400〜1000重量部の割合で含有する樹脂組
成物、この樹脂組成物を加熱、溶融、混練した後、冷
却、粉砕した粉粒体に、100メッシュ未満の粒子で構成
されている固形の硬化助剤を、上記エポキシ樹脂および
フェノールノボラック系硬化剤の合計量100重量部に対
して0.05〜５重量部の割合で分散させることを特徴とす
るエポキシ樹脂成形材料の製造方法を要旨としている。That is, the present invention provides (a) an epoxy resin in an amount of 10 to 20 parts by weight, (b) a phenol novolac-based curing agent in an amount of 5 to 10 parts by weight, and (c) an inorganic filler in the epoxy resin and the phenol novolac-based material. Based on 100 parts by weight of the total amount of the curing agent, a resin composition containing in a ratio of 400 to 1000 parts by weight, heating, melting and kneading the resin composition, cooled, pulverized into a granular material, 100 mesh An epoxy resin characterized by dispersing a solid curing aid composed of particles of less than 0.05 to 5 parts by weight based on 100 parts by weight of the total amount of the epoxy resin and the phenol novolac-based curing agent. The gist is the method of manufacturing the molding material.
以下に、前記の発明を説明する。まず本発明のエポキシ
樹脂（イ）としては、耐湿性、耐熱性等の性能の良好な
ものとして知られている公知のものを適宜使用すること
ができる。このようなエポキシ樹脂自体としては、例え
ばノボラック型エポキシ樹脂、ビスフェノールＡ型エポ
キシ樹脂、ビスフェノールＦ型エポキシ樹脂、脂環式エ
ポキシ樹脂、ハロゲン化エポキシ樹脂などを例示するこ
とができ、10〜20重量部の範囲で用いることができる。The above invention will be described below. First, as the epoxy resin (a) of the present invention, a known one known to have good performance such as moisture resistance and heat resistance can be appropriately used. Examples of the epoxy resin itself include novolac type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, halogenated epoxy resin, etc. It can be used in the range of.
フェノールノボラック系硬化剤（ロ）としては１分子中
に２個以上のフェノール性水酸基を有するフェノールノ
ボラック型樹脂を好ましいものとして例示することがで
き、従来より使用されているフェノールノボラック樹
脂、クレゾールノボラック樹脂、キシレノールノボラッ
ク樹脂などを５〜10重量部の範囲で用いることができ
る。As the phenol novolac type curing agent (b), a phenol novolac type resin having two or more phenolic hydroxyl groups in one molecule can be exemplified as a preferable one, and a phenol novolac resin and a cresol novolac resin which have been conventionally used can be exemplified. , Xylenol novolac resin and the like can be used in the range of 5 to 10 parts by weight.
無機質充填材（ハ）としては、通常使用される例えば結
晶シリカ、溶融シリカ、アルミナ、窒化ケイ素、酸化チ
タン、炭酸カルシュウムなどの粉末を単独又は、組合せ
て（イ）および（ロ）成分の合計量100重量部に対して4
00〜1000重量部と、高い配合割合で用いることができ
る。特には、高純度の結晶シリカ、溶融シリカ、アルミ
ナ、窒化ケイ素が望ましい。また、これら無機質充填材
の粒径は、100μ未満のものが成形金型のゲートを詰ま
らせないので好ましい。なお無機質充填材と樹脂との濡
れを良くするためこれら無機質充填材を予めカップリン
グ剤、例えばエポキシシラン、アミノシランなどで処理
することもできる。As the inorganic filler (c), generally used powders such as crystalline silica, fused silica, alumina, silicon nitride, titanium oxide, calcium carbonate, etc., alone or in combination, the total amount of (a) and (b) components. 4 for 100 parts by weight
It can be used in a high mixing ratio of 100 to 1000 parts by weight. In particular, high-purity crystalline silica, fused silica, alumina, and silicon nitride are desirable. Further, the particle size of these inorganic fillers is preferably less than 100 μm, because it does not clog the gate of the molding die. Incidentally, in order to improve the wettability between the inorganic filler and the resin, these inorganic fillers can be previously treated with a coupling agent such as epoxysilane or aminosilane.
硬化助剤（ニ）としては、イミダゾール類、３級アミン
などが望ましく、その使用量は（イ）および、（ロ）成
分の合計量100重量部に対して0.05〜５重量部用いるこ
とができる。この硬化助剤は100メッシュ未満の粒子で
構成されている固形の粉末である。粒径が100メッシュ
未満であるので、上記無機質充填剤が高充填された粉粒
体に添加する際、均一に分散することができ、得られる
エポキシ樹脂成形材料の成形性が優れる。さらに、硬化
助剤が微粒子であると、金型のゲートの詰まりを防止で
きる。As the curing aid (d), imidazoles, tertiary amines and the like are desirable, and the amount thereof can be used in an amount of 0.05 to 5 parts by weight per 100 parts by weight of the total amount of the components (a) and (b). . This curing aid is a solid powder composed of particles of less than 100 mesh. Since the particle size is less than 100 mesh, the inorganic filler can be uniformly dispersed when added to a highly filled powdery material, and the epoxy resin molding material obtained has excellent moldability. Further, when the curing aid is fine particles, it is possible to prevent the gate of the mold from clogging.
その他、離型剤として、通常使用される例えばカルナバ
ワックス、ステアリング酸、ステアリン酸の金属塩など
が用いられ、染顔料としてはカーボンブラック、酸化チ
タン、アゾ系の含金属化合物の黒色有機染料などが用い
られ、難燃剤としては三酸化アンチモン、水酸化アルミ
ニウムなどが必要に応じて用いられる。In addition, as a release agent, usually used carnauba wax, steering acid, stearic acid metal salt, etc. are used, and as the pigment, carbon black, titanium oxide, black organic dye of azo metal-containing compound, etc. Used as the flame retardant, antimony trioxide, aluminum hydroxide and the like are used as necessary.
以上の成分を配合して成形材料化するに際しては、加
熱、溶融、混練は熱ロール又は、ニーダーなどによりお
こなうことができ、分散、冷却、粉砕も成形材料の生産
に用いられる通常の装置を使用することができる。これ
らの装置を用いて、成分（イ）のエポキシ樹脂、成分
（ロ）のフェノールノボラック系硬化剤、成分（ハ）の
無機質充填材および離型剤、染顔料、難燃剤など、その
他、成分を必要に応じて配合し、混合分散機にかけた粉
体を、熱ロールでシート状にし、冷却機で固くし、粉砕
機で粉粒体とした。この粉粒体に成分（ニ）の硬化助剤
を後添加し、混合分散機にかけて均一分散してエポキシ
樹脂成形材料を製造することができる。When blending the above components into a molding material, heating, melting, and kneading can be performed with a hot roll, a kneader, or the like, and dispersion, cooling, and pulverization can also be performed using an ordinary apparatus used for producing a molding material. can do. Using these devices, other components such as epoxy resin of component (a), phenol novolac type curing agent of component (b), inorganic filler and mold release agent of component (c), dyes and pigments, flame retardants, etc. The powders, which were blended as necessary, and subjected to a mixing / dispersing machine were made into a sheet shape with a hot roll, hardened with a cooling machine, and made into a granular material with a pulverizing machine. An epoxy resin molding material can be manufactured by post-adding a curing aid of the component (d) to the powder and granules and uniformly dispersing the mixture with a mixing and dispersing machine.
実施例１ エポキシ樹脂としてオルソクレゾールノボラックエポキ
シ樹脂（エポキシ当量220、軟化点64℃）を14重量部、
硬化剤としてフェノールノボラック樹脂（OH当量110、
軟化点80℃）を７重量部、無機質充填材としては、結晶
シリカを100重量部、この結晶シリカの表面改質として
エポキシカップリング剤を0.5重量部、離型剤としてカ
ルナバワックスを0.4重量部、顔料としてはカーボンブ
ラックを0.4重量部、これらの成分を均一分散した後、1
00℃の熱ロールで加熱、溶融、混練を25回繰り返し充分
に行ったものを冷却、粉砕して粉粒体としたものに硬化
助剤として、粒径100メッシュ未満の２メチルイミダゾ
ールを0.1重量部加えて、均一分散、混合せてエポキシ
樹脂成形材料とした。従って、エポキシ樹脂、およびフ
ェノールノボラック樹脂の合計量100重量部に対して
は、無機質充填剤は476重量部、硬化助剤は0.48重量部
であった。Example 1 14 parts by weight of orthocresol novolac epoxy resin (epoxy equivalent 220, softening point 64 ° C.) as an epoxy resin,
Phenol novolac resin (OH equivalent 110,
(Softening point 80 ° C) 7 parts by weight, as an inorganic filler, 100 parts by weight of crystalline silica, 0.5 parts by weight of an epoxy coupling agent as a surface modification of the crystalline silica, and 0.4 parts by weight of carnauba wax as a release agent. , 0.4 parts by weight of carbon black as a pigment, after uniformly dispersing these components, 1
Heating, melting, and kneading with a hot roll of 00 ° C 25 times was sufficiently repeated to cool and pulverize into powder and granules, and 0.1 weight of 2-methylimidazole having a particle size of less than 100 mesh was used as a curing aid. Part of the mixture was added and uniformly dispersed and mixed to obtain an epoxy resin molding material. Therefore, with respect to the total amount of the epoxy resin and the phenol novolac resin being 100 parts by weight, the inorganic filler was 476 parts by weight and the curing aid was 0.48 parts by weight.
実施例２ 実施例１の硬化助剤２メチルイミダゾールの配合割合を
0.2重量部とした以外は実施例１と全く同様にしてエポ
キシ樹脂成形材料とした。Example 2 The mixing ratio of the curing aid 2 methylimidazole of Example 1 was changed.
An epoxy resin molding material was prepared in exactly the same manner as in Example 1 except that 0.2 part by weight was used.
比較例１ 実施例１の硬化助剤２メチルイミダゾールの粒径を100
メッシュ以上の２メチルイミダゾールとした以外は、実
施例１と全く同様にしてエポキシ樹脂成形材料とした。Comparative Example 1 The particle size of the curing aid 2 methylimidazole of Example 1 was 100
An epoxy resin molding material was prepared in exactly the same manner as in Example 1 except that 2-methylimidazole having a mesh size or more was used.
比較例２ 実施例１と同じ成分配合で、硬化助剤の２メチルイミダ
ゾールも他の成分と一緒に最初から均一分散した後、10
0℃の熱ロールで加熱、溶融、混練を６回繰り返し行っ
たものを、冷却、粉砕して粉粒体のエポキシ樹脂成形材
料とした。なお、同じ配合品で100℃の熱ロールで加
熱、溶融、混練を12回繰り返し行ったものを、冷却、粉
砕して粉粒体のエポキシ樹脂成形材料としたものにおい
ては、成形することができないぐらい硬化が進んでい
た。Comparative Example 2 With the same composition of ingredients as in Example 1, the curing aid 2-methylimidazole was uniformly dispersed from the beginning together with the other ingredients, and then 10
A product obtained by repeating heating, melting and kneading 6 times with a hot roll at 0 ° C. was cooled and pulverized to obtain a powdery granular epoxy resin molding material. It should be noted that it is not possible to mold a product obtained by repeating heating, melting, and kneading 12 times with a hot roll of 100 ° C. with the same compounded product, and cooling and crushing it into a powdery granular epoxy resin molding material. It was about to cure.
以上で得たそれぞれのエポキシ樹脂成形材料を用いて成
形材料の成形性代用特性として、溶融粘度を島津製高化
式フローテスター（ノズルの形状φ1mm、厚み2mm、荷重
30kg/cm2、ポット温度150℃）で、スパイラルフローをE
MMMIに準じ金型温度170℃で、ゲルタイムをJSR型キュラ
ストメーター（金型温度170℃）でそれぞれ測定し、こ
れらの値を第１表に示した。また、実際の成形性とし
て、アルミニウム配線TEG素子を実装したリードフレー
ムを16DIPにトランスファー成形で成形した後、ワイヤ
ー変形は軟Ｘ線でφ25μの金線の変形度合いを観察して
判定し、ボイドは16DIP成形品の外観を観察して穴径が
0.3mm以上の穴径のものがあれば×として判定し、未充
填も16DIP成形品の外観を観察して判定し、これらの結
果も第１表に示した。Using the epoxy resin molding materials obtained above, as a substitute for the moldability of the molding material, the melt viscosity was measured by Shimadzu's high-performance flow tester (nozzle shape φ1 mm, thickness 2 mm, load
Spiral flow E at 30kg / cm 2 and pot temperature 150 ℃
According to MMMI, the mold temperature was 170 ° C. and the gel time was measured with a JSR type curast meter (mold temperature 170 ° C.), and these values are shown in Table 1. In addition, as the actual formability, after the lead frame mounted with the aluminum wiring TEG element was formed by transfer molding on 16DIP, the wire deformation was judged by observing the deformation degree of the gold wire of φ25μ with soft X-ray, and the void was Observe the appearance of the 16DIP molded product
If there was a hole diameter of 0.3 mm or more, it was judged as x, and the unfilled 16 DIP molded product was judged by observing the appearance, and these results are also shown in Table 1.
実施例１及び実施例２は、エポキシ樹脂、およびフェノ
ールノボラック樹脂の合計量100重量部に対しては、無
機質充填剤を400充填部以上の高充填で混練した粉粒体
に、100メッシュ未満の粒子で構成された硬化助剤を添
加し、分散したことにより、比較例１〜２に比較して、
溶融粘度を大幅に低下し、スパイラルフローを大幅に大
きくすることができ、16DIPの実際の成形においてもこ
れら低粘度化の効果だけでなく、ボイドの存在や、未充
填箇所の存在において、良好な結果を示している。In Examples 1 and 2, the total amount of the epoxy resin and the phenol novolac resin was 100 parts by weight. By adding and dispersing the curing aid composed of particles, as compared with Comparative Examples 1 and 2,
The melt viscosity can be significantly reduced and the spiral flow can be greatly increased. In addition to the effect of lowering the viscosity in the actual molding of 16DIP, it is possible to obtain good results in the presence of voids and the presence of unfilled parts. The results are shown.
比較例１に示したように、後添加の硬化助剤が100メシ
ュ以上の粒子を含むものは、無機質充填剤の充填が未充
填の存在が認められ、特性にばらつきを生じた。さら
に、金型のゲート詰まりを生じた。比較例２に示したよ
うに、硬化助剤も他の成分と一緒に最初から配合したも
のは、実施例１と同様の配合にもかかわらず溶融粘度が
大きく、スパイラルフローが小さく、ワイヤー変形、ボ
イドの存在、及び無機質充填剤の充填が未充填の存在が
認められ、特性が劣っていた。 As shown in Comparative Example 1, in the case where the post-added curing aid contained particles of 100 mesh or more, the presence of unfilled inorganic filler was recognized, and the characteristics varied. Furthermore, the gate of the mold was clogged. As shown in Comparative Example 2, the one in which the curing aid was also compounded from the beginning together with the other components had a large melt viscosity, a small spiral flow, a wire deformation, despite the same composition as in Example 1. The presence of voids and the presence of unfilled inorganic filler were observed, and the properties were inferior.
上述のように本発明は、エポキシ樹脂、及び、フェノー
ルノボラック系硬化剤の合計量100重量部に対し、無機
質充填剤が400〜1000重量部配合された粉粒体に、100メ
ッシュ未満の粒子で構成されている硬化助剤を後から添
加し分散する方法によって、エポキシ樹脂成形材料中の
無機質充填剤を高い割合で充填することができる。その
結果、本発明によって得られたエポキシ樹脂成形材料は
低応力、高熱伝導性の要求に答えることができると共
に、従来のように無機質充填剤の添加量の増大に伴って
発生したワイヤーの変形や切断を起こすことがなく、成
形性に優れる。さらに、本発明によって得られたエポキ
シ樹脂成形材料は、成形の際の金型のゲート詰まりを防
ぐことができる。As described above, the present invention, the epoxy resin, and, with respect to the total amount of 100 parts by weight of the phenol novolac-based curing agent, the inorganic filler is 400-1000 parts by weight in the powder blended, particles less than 100 mesh. The inorganic filler in the epoxy resin molding material can be filled at a high ratio by the method of adding the constituent curing aid later and dispersing it. As a result, the epoxy resin molding material obtained by the present invention can meet the demands of low stress and high thermal conductivity, and the wire deformation and the deformation that occurred with the increase of the addition amount of the inorganic filler as in the prior art. It does not cause cutting and has excellent moldability. Furthermore, the epoxy resin molding material obtained by the present invention can prevent the gate clogging of the mold during molding.
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/29 23/31 // Ｂ２９Ｋ 63:00 105:16 Ｃ０８Ｌ 63:00 Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H01L 23/29 23/31 // B29K 63:00 105: 16 C08L 63:00
Claims (1)
後、冷却、粉砕した粉粒体に、100メッシュ未満の粒子
で構成されている固形の硬化助剤を、下記エポキシ樹脂
およびフェノールノボラック系硬化剤の合計量100重量
部に対して0.05〜５重量部の割合で分散させることを特
徴とするエポキシ樹脂成形材料の製造方法。 上記樹脂組成物は、 （イ）エポキシ樹脂を10〜20重量部、 （ロ）フェノールノボラック系硬化剤を５〜10重量部、
および、 （ハ）無機質充填剤を、前記エポキシ樹脂およびフェノ
ールノボラック系硬化剤の合計量100重量部に対して、4
00〜1000重量部の割合で含有する。1. A powdery material obtained by heating, melting and kneading the following resin composition, cooling and pulverizing the resin composition, with a solid curing aid composed of particles of less than 100 mesh, the following epoxy resin and phenol. A method for producing an epoxy resin molding material, which comprises dispersing 0.05 to 5 parts by weight with respect to 100 parts by weight of the total amount of the novolac-based curing agent. The resin composition comprises (a) an epoxy resin in an amount of 10 to 20 parts by weight, (b) a phenol novolac-based curing agent in an amount of 5 to 10 parts by weight,
And (c) the inorganic filler in an amount of 4 parts by weight per 100 parts by weight of the total amount of the epoxy resin and the phenol novolac-based curing agent.
It is contained in a proportion of 100 to 1000 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134010A JPH0716946B2 (en) | 1989-05-26 | 1989-05-26 | Method for producing epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1134010A JPH0716946B2 (en) | 1989-05-26 | 1989-05-26 | Method for producing epoxy resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03211A JPH03211A (en) | 1991-01-07 |
| JPH0716946B2 true JPH0716946B2 (en) | 1995-03-01 |
Family
ID=15118271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1134010A Expired - Lifetime JPH0716946B2 (en) | 1989-05-26 | 1989-05-26 | Method for producing epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0716946B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3695683B2 (en) * | 1998-02-16 | 2005-09-14 | 住友ベークライト株式会社 | Resin composition milling equipment |
| WO2012017571A1 (en) * | 2010-08-05 | 2012-02-09 | 住友ベークライト株式会社 | Functional particle, group of functional particles, filler, resin composition for electronic part, electronic part, and semiconductor device |
| JP5838659B2 (en) | 2010-09-02 | 2016-01-06 | 住友ベークライト株式会社 | Method for producing resin molded body, method for producing resin composition |
| JP5621663B2 (en) * | 2011-03-02 | 2014-11-12 | 住友ベークライト株式会社 | Semiconductor encapsulating resin composition, semiconductor device and manufacturing method thereof |
| JP5824900B2 (en) * | 2011-06-21 | 2015-12-02 | 住友ベークライト株式会社 | Manufacturing method of resin raw material powder, resin raw material powder, resin molded body, and electronic component device |
| JPWO2022149594A1 (en) * | 2021-01-08 | 2022-07-14 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52135673A (en) * | 1976-05-10 | 1977-11-12 | Hitachi Ltd | Resin composition for semiconductor sealing |
| JPS59129231A (en) * | 1983-01-12 | 1984-07-25 | Hitachi Chem Co Ltd | Production of epoxy resin molding material |
| JPS60257548A (en) * | 1984-06-04 | 1985-12-19 | Hitachi Chem Co Ltd | Manufacture of molding material for sealing |
| JPS6227111A (en) * | 1985-07-29 | 1987-02-05 | 渡辺 邦夫 | Method of molding concrete product |
| DE3617652A1 (en) * | 1986-05-26 | 1987-12-03 | Troester Maschf Paul | EXTRUDER SYSTEM FOR SHEATING A STRAND-SHAPED PRODUCT, ESPECIALLY A CABLE |
| JPS63251420A (en) * | 1987-04-07 | 1988-10-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
-
1989
- 1989-05-26 JP JP1134010A patent/JPH0716946B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03211A (en) | 1991-01-07 |
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