JPH0716419U - Insulation board for electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide an insulating substrate for electronic parts, which maintains good insulation against aging and has good workability and high reliability. There is a crystal oscillator including a metal base having lead terminals 61 and 62, a crystal plate 6 electrically connected to an inner lead of the lead terminal, and a metal cap 3. The crystal oscillator and the crystal vibration are provided. In the insulating substrate 1 interposed between the circuit board 8 on which the child is mounted, protrusions 1a and 11a are provided on the front and back surfaces of the insulating substrate, and the insertion hole 1b has substantially the same area as the cross-sectional area of the lead terminal. The insertion hole 11b is formed such that the width dimension in the lateral direction is substantially the same as the lead terminal diameter and the longitudinal direction is at least larger than the lead terminal diameter.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure of an insulating substrate for electronic components which is interposed between an electronic component and a circuit board.

[0002]

[Prior art]

 In recent years, there has been a demand for an insulating substrate that prevents influence over time and maintains reliable insulation by increasing the density. Therefore, the insulating substrate for electronic parts is used to insulate the circuit board from the circuit board. An insulating substrate used for a crystal oscillator as an insulating substrate for electronic parts will be described as an example. As an insulating substrate for a crystal unit, as shown in the bottom view of the insulating substrate in FIG. 5 (cited from Japanese Utility Model Laid-Open No. 3-119917), the insulating substrate 21 has lead terminal insertion holes 22 and 23 of the crystal unit. The protrusions 24, 25, 26, 27 are provided at a plurality of locations on one main surface, and the main surface of the insulating substrate provided with the protrusions is on the circuit board side, and this insulating substrate is a crystal. There was a configuration in which it was interposed between the vibrator and the circuit board. With this configuration, the flux can be degassed when the lead terminals are soldered. Further, even if the flux crawls up through the insertion hole of the circuit board, it is removed by the cleaning liquid injected into the gap due to the projection, and the flux does not remain. Therefore, good insulation can be maintained against changes with time such as corrosion of lead terminals.

[0003]

[Problems to be solved by the device]

 However, since the protrusions on the insulating substrate are provided on only one main surface, the main surface of the insulating substrate on which the protrusions are provided is assumed to be the crystal oscillator side and the space between the crystal oscillator and the circuit board is set. In some cases, it is also assumed that the flux is intervened in this case. At this time, the effect of degassing the flux is completely lost, and the flux cannot be removed by the cleaning liquid. Therefore, in order to attach the insulating substrate, the side provided with the protrusion must be the circuit board side, which causes a problem that workability is deteriorated. In addition, as shown in the front view of the case where an insulating substrate is incorporated in the crystal unit of FIG. 6, there is an error in the pitch between the lead terminals due to misalignment or bending of the lead terminals 61 and 62 when the crystal unit is assembled. In the insertion hole in the insulating substrate, due to this error, the lead terminal of the crystal unit cannot be inserted, or if the lead terminal 62 is inserted in a bent state, stress is applied to the insulating substrate 21. This caused strain, which adversely affected the insulating board and caused accidents such as fatigue breakage of lead terminals. These problems have made it difficult to handle assembly automation.

Therefore, an object of the present invention is to provide an insulating substrate for electronic parts, which maintains good insulation against changes with time and has good workability and high reliability.

[0005]

[Means for Solving the Problems]

 In order to solve the conventional problems, the insulating substrate of the present invention is a metal base having a plurality of lead terminals and an element electrically connected to at least two inner leads of the lead terminals, and this element is hermetically sealed. There is an electronic component provided with a metal cap, and a protrusion is provided on the front and back surfaces of the insulating substrate in an insulating substrate interposed between the electronic component and a circuit board on which the electronic component is mounted.

At least one of the insertion holes for inserting the lead terminal of the electronic component has substantially the same area as the cross-sectional area of the lead terminal, and the other insertion holes have a lateral width dimension of the lead terminal. The size is approximately the same as the diameter, and the longitudinal direction is at least larger than the diameter of the lead terminal.

In addition, protrusions are provided on the front and back surfaces of the insulating substrate, and at least one of the insertion holes for inserting the lead terminal of the electronic component has substantially the same area as the cross-sectional area of the lead terminal. The width of the insertion hole is substantially the same as the diameter of the lead terminal and the length of the insertion hole is at least larger than the diameter of the lead terminal.

[0008]

[Action]

 By providing protrusions on both the front and back of the insulating substrate, the front and back are no longer distinguished, and the workability of mounting on electronic components is improved.

At least one of the insertion holes has an area substantially the same as the cross-sectional area of the lead terminal, and the other insertion holes have a widthwise dimension substantially equal to the lead terminal diameter and a longitudinal dimension. By making the direction at least larger than the diameter of the lead terminal, even if the lead terminal width of the electronic component is slightly displaced or slightly bent, the insertion hole of the same area as the lead cross-sectional area of the insulating substrate can be used for reliable positioning. The other side and adjust the shift on the other hand to insert it securely.

In addition, protrusions are provided on the front and back surfaces of the insulating substrate, and at least one of the insertion holes has an area substantially the same as the cross-sectional area of the lead terminal, and the other insertion holes have a lateral width dimension. By forming the lead terminal with a diameter substantially the same as that of the lead terminal and having a longitudinal direction larger than the diameter of the lead terminal at least, distinction between the front side and the back side is eliminated, the workability of mounting to the electronic component is improved, and the lead terminal width of the electronic component is improved. Even if there is a slight deviation or a slight bend, it is possible to make sure positioning with an insertion hole that is approximately the same area as the lead cross-sectional area of the insulating substrate, and adjust the deviation on the other side to insert it securely.

[0011]

【Example】

 Next, an embodiment of the present invention will be described with reference to FIG. 1, FIG. 2, FIG. 3, and FIG. FIG. 1 is a front view showing a state where a crystal oscillator using the insulating substrate of the present invention is mounted on the substrate, and FIG. 2 shows a state where a crystal resonator using the insulating substrate of the present invention is mounted on the substrate. FIG. 3 is a sectional view, FIG. 3 is a plan view of the insulating substrate of the present invention, and FIG. 4 is a front view of the insulating substrate of the present invention. The crystal unit supports a crystal plate 6 on which an excitation electrode 7 is formed by a support 5, and hermetically insulates and insulates the lead terminals 61 and 62 through the glass 4 and a sealed metal base 2 and these. It is composed of a metal cap 3 for stopping. The insulating substrate 1 is made of nylon 49, for example, and four protrusions 1a are provided on one main surface, and four protrusions 11a are provided on the other main surface. The protrusions 1a and 11a may be provided at least so as to form a uniform gap between the circuit board 8 and the insulating substrate 1, and are not limited to the number and arrangement position as shown in the drawing. . The insertion holes 1b and 11b into which the lead terminals of the crystal resonator having a circular cross section are inserted near both ends in the longitudinal direction of the insulating substrate 1 have a pitch between the centers thereof and a pitch between the lead terminals of the crystal resonator. The insertion holes 1b are formed at the same interval, and one insertion hole 1b is formed in a circular shape having a diameter (t) substantially the same as the diameter of the lead terminal, and the other insertion hole 11b is formed in the insulating substrate in the width direction of the lead terminal. The width (w) of the insulating substrate in the longitudinal direction is at least larger than the diameter of the lead terminal. In this embodiment, the w dimension is twice the t dimension. Further, the insertion holes 1b and 11b are formed in a tapered shape in which the center of the cross section of the insertion hole is the narrowest part and the width is gradually widened toward the main surface of each insulating substrate 1, so that the lead terminals are sandwiched between them. And it can be supported by line contact. These shapes can be easily formed by resin molding.

The insulating substrate 1 formed as described above is attached to the lead terminals 61 and 62 of the crystal resonator as shown in the sectional view of FIG. 2, and the metal base 2 of the crystal resonator and the circuit board 8 are attached. And the lead terminals 61 and 62 and the circuit board 8 are electrically and mechanically joined by the conductive joining material 9.

Next, a specific operation based on the embodiment of the present invention will be described. The insulating substrate 1 of the present invention is provided with the protrusions 1a, 1a, 1a, 1a and 11a, 11a, 11a, 11a on the front and back main surfaces. Even if it is interposed between the circuit board 8 and the lead terminals 61 and 62, the degassing of the flux can be surely performed at the time of soldering. Further, when the flux crawls up through the insertion hole of the circuit board and the hardened flux remains, the residue of the flux absorbs moisture in the air, especially in the insulating substrate 1 formed of resin or the like. Although there is a problem that the lead terminal 61 or the lead terminal 62 and the metal base 2 are short-circuited, the circuit board 8 formed by the protrusions 1a, 1a, 1a, 1a or 11a, 11a, 11a, 11a of the insulating substrate 1 With the gap between the insulating substrate 1 and the insulating substrate 1 and the metal base 2 of the crystal unit, the injected cleaning liquid reliably removes the residue of the flux. Also, good insulation can be maintained against changes over time such as corrosion of the lead terminals 61 and 62. The insertion hole 1b of the insulating substrate 1 of the present invention has substantially the same area as the cross-sectional area of the lead terminal 61 or 62, and the other insertion hole 11b has the width dimension in the short direction as the diameter of the lead terminal 61 or 62. Since the dimensions are approximately the same and the longitudinal direction is formed to be twice the diameter of the lead terminals 61 or 62, the pitch between the lead terminals may be different due to misalignment or bending of the lead terminals during crystal oscillator assembly. Even if an error occurs, the lead terminal 61 can be surely positioned and inserted in the insertion hole 1b, and the lead terminal 62 can be surely inserted by adjusting the deviation in the insertion hole 11b.

In the present invention, the crystal oscillator has been described as an example, but the electronic component is not limited to the crystal oscillator, and any electronic component that uses an insulating substrate to insulate the circuit board from the electronic component is used. Needless to say, it can be applied to electronic components such as piezoelectric filters, piezoelectric oscillators, capacitors and resistors.

[0015]

[Effect of device]

 According to claim 1, since the projections are provided on both the front and back surfaces of the insulating substrate, the front and back sections are not separated, and the workability of mounting electronic components is improved. Thus, it is possible to provide a highly reliable insulating substrate for electronic components, which maintains good insulation against aging.

According to a second aspect, at least one of the insertion holes has substantially the same area as the cross-sectional area of the lead terminal, and the other insertion holes have a widthwise dimension substantially equal to the lead terminal diameter. Even if the lead terminal width of the electronic component is slightly deviated or slightly bent due to the dimensions and the lengthwise direction being formed larger than the lead terminal diameter, an insertion hole with the same area as the lead cross-sectional area of the insulating substrate can be used. It is possible to make sure positioning, and on the other hand, adjust the deviation to ensure insertion. Therefore, if the lead terminals of electronic components cannot be inserted or if the lead terminals are inserted in a bent state, stress will be applied to the insulating substrate and distortion will not be adversely affected, and the insulation substrate for electronic components will be highly reliable. Can be provided.

According to a third aspect of the present invention, protrusions are provided on the front and back surfaces of the insulating substrate, and at least one of the insertion holes has an area that is substantially the same as the cross-sectional area of the lead terminal and the other insertion holes. Has a width dimension in the widthwise direction which is approximately the same as the diameter of the lead terminal and a lengthwise direction which is at least larger than the diameter of the lead terminal, so that there is no distinction between the front side and the backside, and the workability of mounting electronic components is improved. Regardless of which one is attached, reliable degassing can be performed at all times, and good insulation is maintained over time, and even if the lead terminal width of the electronic component is slightly misaligned or slightly bent, the lead breaks on the insulating substrate. The insertion hole having the same area as the area can be surely positioned, and the other side can adjust the deviation to ensure the insertion. Therefore, if the lead terminal of the electronic component cannot be inserted, or if the lead terminal is inserted in a bent state, stress is exerted on the insulating substrate and distortion is not caused. Due to these effects, it is possible to provide a more reliable insulating substrate for electronic parts that can be applied to an automatic assembly machine.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing an embodiment of the present invention.

FIG. 3 is a plan view of an insulating substrate according to an embodiment of the present invention.

FIG. 4 is a front view of an insulating substrate according to an embodiment of the present invention.

FIG. 5 is a bottom view of an insulating substrate showing a conventional example.

FIG. 6 is a plan view showing a state in which an insulating substrate having a conventional problem is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a, 11a ... Protrusion 1b, 11b ... Insertion hole 2 ... Metal base 3 ... Metal cap 4 ... Glass 5 ... Support 6 ... Crystal plate 61 , 62 ... Lead terminal 7 ... Excitation electrode 8 ... Circuit board 9 ... Conductive bonding material 21 ... Insulating substrate 22, 23 ... Insertion hole 24, 25, 26, 27 ...・ Protrusion

Claims (3)

[Scope of utility model registration request] 1. An electronic component comprising a metal base having a plurality of lead terminals, an element electrically connected to at least two inner leads of the lead terminal, and a metal cap for hermetically sealing the element. An insulating substrate for an electronic component, characterized in that, in an insulating substrate interposed between the electronic component and a circuit board on which the electronic component is mounted, protrusions are provided on front and back surfaces of the insulating substrate. 2. An electronic component comprising a metal base having a plurality of lead terminals, an element electrically connected to at least two inner leads of the lead terminals, and a metal cap hermetically sealing the element. Yes, in an insulating substrate interposed between the electronic component and a circuit board on which the electronic component is mounted, at least one of the insertion holes for inserting the lead terminal of the electronic component has a cross-sectional area of the lead terminal. An insulating substrate for electronic parts, which has substantially the same area, and other insertion holes are formed such that the width dimension in the lateral direction is substantially the same as the diameter of the lead terminal and the longitudinal direction is at least larger than the diameter of the lead terminal. . 3. An electronic component comprising a metal base having a plurality of lead terminals, an element electrically connected to at least two inner leads of the lead terminal, and a metal cap hermetically sealing the element. Yes, in an insulating substrate interposed between the electronic component and a circuit board on which the electronic component is mounted, protrusions are provided on the front and back surfaces of the insulating substrate, and among the insertion holes for inserting the lead terminals of the electronic component. At least one insertion hole has substantially the same area as the cross-sectional area of the lead terminal, and the other insertion holes have a widthwise dimension substantially the same as the lead terminal diameter and a longitudinal direction at least larger than the lead terminal diameter. An insulating substrate for electronic parts, which is characterized by being