JPH07161516A - Bond magnet and its production - Google Patents

Abstract

PURPOSE:To obtain a bond magnet provided with an electrolytic plating film, an electroless plating film or an electrodeposition film without sacrifice of magnetic characteristics by filling pores on the surface of bond magnet with a resin layer and forming a conductive layer on there. CONSTITUTION:The bond magnet is applied with a conductive layer entirely or partially on the surface through a resin layer. The surface roughness is set such that the maximum height (Rmax) on the surface of the conductive layer is 400mum or less when the reference length is 25mm. The conductive layer is composed of a powder of an element selected from Cu, Cr, Zn, Ni, Cd, Sn, Pb, Fe, Au, Ag, Pt, Pd, Rh, Al, Nd or an aggregate of one or more kind of alloy powder principally comprising these elements. This constitution allows electrolytic plating, electroless plating or electrodeposition while inhibiting intrusion of plating liquid into the pores on the surface of a bond magnet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bond magnet used in a stepping motor for a floppy disk drive, a spindle motor for a hard disk drive and the like and a method for producing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner, shorter, and smaller, the electronic parts constituting them have tended to become smaller. This tendency is also seen in motors, which requires smaller and more complex magnets to be built in. Against this background, there is an increasing demand for bonded magnets that can meet the needs for downsizing and complicated shapes.

The conventional bonded magnet and its manufacturing method will be described below. The bond magnet is a composite magnetic material containing magnetic powder and a binder as main components, and its manufacturing method is generally compression molding, injection molding, extrusion molding, or rolling molding. Ferrite, SmCo, N as magnetic powder
Although dFeB-based magnetic particles are generally used, NdFeB-based magnetic powders are mainly used in applications where high magnetic properties are required. In addition, as the binder, an organic binder is mainly used because of its superiority in molding processing, and especially in applications where high magnetic properties are required, the mainstream is a thermosetting resin that is suitable for compression molding and can produce high density products. Has become. Among such bonded magnets, NdFeB-based magnets contain a large amount of iron, which easily becomes an oxide, and therefore it is essential to form a corrosion resistant film on the surface of the bonded magnet. Further, in a bonded magnet molded by compression molding, it is essential to form a film on the surface of the bonded magnet in order to prevent the loss of magnetic powder. Furthermore, in the case of bonded magnets that require decorative functions such as medical supplies, it is necessary to form a film on the surface of the bonded magnets in order to give it a beautiful appearance.

The components of these films are noble metals, epoxy resins, fluorine resins, silicon resins, etc. The method of forming them is electrolytic plating, electroless plating or vacuum deposition for metal films, and electroplating for resin films. Coating and spray coating are common.

[0005]

However, in the above conventional structure, in electrolytic plating, electroless plating, and electrodeposition coating, the plating solution or the electrodeposition coating solution penetrates through the pores on the surface of the bond magnet, and the magnetic characteristics based on it The problem is that it is not practical to control the decrease in the temperature, and it is not practical due to the high cost in vacuum deposition. In spray coating, a resin film that can withstand practical use is formed on the edge of the bond magnet. There was a problem that it could not be done. Among the above-mentioned conventional problems, the present invention discloses a technique for preventing the problem that the plating solution or the electrodeposition coating solution enters from the holes on the surface of the bond magnet, particularly in the electrolytic plating, the electroless plating and the electrodeposition coating. And specifically,
A bond magnet capable of performing electroplating, electroless plating, or electrodeposition coating with a conductive layer formed on the surface of the bond magnet via a resin layer while suppressing the invasion of a plating solution into the pores of the surface. The manufacturing method is provided.

[0006]

[Means for Solving the Problems] Many bonded magnets have magnetic particles exposed on the surface, and conventionally, the conductivity of the magnetic particles is utilized to form a coating film such as plating. However, since there are holes on the surface of the bond magnet, when plating treatment is applied to the conventional bond magnet, as shown in FIG. 1, the plating solution or the electrodeposition coating solution penetrates through the holes on the surface of the bond magnet, which causes This is a cause of deterioration of characteristics. In addition, since the magnetic powder is not exposed on the entire surface, there are some discontinuities in the plating film, which leads to deterioration in rust prevention performance. In order to solve the above problem, the present invention solves this problem by closing the pores on the surface of the bonded magnet with a resin layer and forming a conductive layer made of metal powder or the like on it to give conductivity to the entire surface. It proposes the method to do. If the resin layer fills at least the pores and the conductive layer exists at least on the plugged resin layer, the purpose of imparting conductivity to the entire surface can be achieved, but as shown in FIG. The resin layer may be formed not only on the pores but also on the entire surface. In such a case, the conductive layer is also formed on the entire surface corresponding to the resin layer. The present invention made based on such an idea comprises the following 13 items. (1) A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface. (2) The bonded magnet according to (1), wherein the surface roughness is set so that the maximum height (R _max ) of the surface of the conductive layer when the reference length is 25 mm is 400 μm or less. (3) Conductive layer is Cu, Cr, Zn, Ni, Cd, Sn, P
b, Fe, Au, Ag, Pt, Pd, Rh, Al, Nd
It is a set of one or more powders of a simple substance consisting of the elements listed in (1) or powders of an alloy containing the above-mentioned elements as the main component (1).
Alternatively, the bonded magnet according to (2). (4) The bonded magnet according to (3), wherein the major axis of the powder is 1 mm or less. (5) The bonded magnet according to (4), wherein the powder is scaly. (6) A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface and an electrolytic plating film on the entire surface. (7) A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface and an electroless plating film on the entire surface. (8) A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface and a resin film on the entire surface. (9) A method for producing a bonded magnet, in which a conductive layer is formed after forming a resin layer on the whole or a part of the surface. (10) The method for producing a bonded magnet according to (9), wherein the surface roughness is set so that the maximum height (R _max ) of the surface of the conductive layer when the reference length is 25 mm is 400 μm or less. (11) Conductive layer is Cu, Cr, Zn, Ni, Cd, Sn, P
b, Fe, Au, Ag, Pt, Pd, Rh, Al, Nd
It is a set of one or more powders of a simple substance consisting of the elements listed in (1) or powders of an alloy containing the above elements as a main component (9).
Alternatively, the bonded magnet manufacturing method according to (10). (12) The method for producing a bonded magnet according to (11), wherein the major axis of the powder is 1 mm or less. (13) The method for producing a bonded magnet according to (12), wherein the powder is flaky.

[0007]

Since the resin layer seals the pores on the surface of the bonded magnet, it is possible to prevent the invasion of the plating solution or the electrodeposition coating solution, which is unavoidable during the electrolytic plating, the electroless plating and the electrodeposition coating. Further, this resin layer also functions as an adhesive layer, and since the conductive layer can be fixed on the surface, it is possible to impart high conductivity to the surface of the bonded magnet, which cannot be obtained by the resin layer alone. Film formation by electrolytic plating, electrodeposition coating, etc. becomes easy. Further, the method of imparting conductivity to the bond magnet by forming a conductive layer on the surface is a conventional conductivity imparting method in which a mixture of a resin and a conductive substance is applied to the surface of the bond magnet or a binder contains a conductive substance. It is more efficient than the above, and the conductivity can be efficiently imparted to the surface of the bonded magnet. As described above, according to the configuration of the present invention, it is possible to perform electrolytic plating, electroless plating, or electrodeposition coating with the pores on the surface of the bonded magnet sealed.

[0008]

EXAMPLES The details of the present invention will be described below based on specific examples.

(Examples 1 to 6) N passed 32 mesh
dFeB isotropic magnetic powder (MQP manufactured by General Motors)
-B) A magnetic powder compound consisting of 97 wt% and an epoxy adhesive 3 wt% was press-molded at a molding pressure of 5 t / cm ² and cured under an argon atmosphere at 180 ° C. for 1 hour to obtain 30 mm × 5 mm × 3 mm as shown in FIG. A rectangular parallelepiped bonded magnet was obtained. Use this bond magnet with epoxy adhesive 10
The MEK solution was impregnated with the wt% MEK solution for 5 minutes, drained sufficiently and dried under reduced pressure to dry the MEK. 1000 pieces of bond magnets having an uncured epoxy adhesive layer on the surface thus produced, 200000 pieces of copper balls having a diameter of 1 mm, and 100 g of Ni powder having a long diameter of 0.5 μm are placed in a vibration type ball mill and subjected to vibration treatment. Then, a bond magnet having Ni powder adhered to the surface thereof was obtained due to the tackiness of the uncured epoxy adhesive. This was cured at 180 ° C. for 1 hour and then washed with water to remove excess Ni powder. Through the above procedure, a bonded magnet having a conductive layer with a resin layer on the surface was obtained. This was sandblasted to adjust the maximum height (R _max ) of the conductive layer surface with a reference length of 25 mm as shown in (Table 2). Then, by performing electroplating under the conditions shown in (Table 1), a bond having a conductive layer 3 via a resin layer 2 on the surface and an electroplating film 4 on the surface as shown in the conceptual diagram of FIG. The magnet 1 was produced. Further, as a comparative example, the above-described 30 mm × 5 mm × 3 mm rectangular parallelepiped bond magnet was similarly subjected to electrolytic plating treatment without forming a resin layer and a conductive layer to produce a bond magnet having an electrolytic plating film.

[0010]

[Table 1] The properties of the obtained isotropic bonded magnet are shown in (Table 2).

[0011]

[Table 2] As is clear from this (Table 2), according to the bonded magnet of the present example and the method for manufacturing the same, no deterioration in magnetic properties, which could not be suppressed by the conventional electrolytic plating film and the method for forming the same, was observed, and high corrosion resistance was obtained. It can be seen that an excellent bonded magnet can be obtained.

(Embodiment 7) NdF passed 32 mesh
eB isotropic magnetic powder (MQP-made by General Motors)
B) A magnetic powder compound consisting of 96 wt% and an epoxy adhesive 4 wt% was press-molded at a molding pressure of 5 t / cm ² and cured at 150 ° C. for 2 hours in an argon atmosphere, and as shown in FIG. A cylindrical bonded magnet having a size of 12 mm was obtained. MEK was dried by impregnating this bonded magnet with a 10 wt% MEK solution of an epoxy adhesive for 5 minutes, then sufficiently draining and drying under reduced pressure. 1000 bond magnets having an uncured epoxy adhesive layer on the surface thus prepared and a diameter of 1 mm
20000 copper balls, 50 g of Ni powder having a long diameter of 0.7 μm and 50 g of Cu powder having a long diameter of 0.6 μm are put into a vibration type ball mill and subjected to a vibration treatment. A bonded magnet with Cu powder attached was obtained. This was cured at 150 ° C. for 2 hours and then washed with water to remove excess Ni powder and Cu powder. Through the above procedure, a bonded magnet having a conductive layer with a resin layer on the surface was obtained. By subjecting this to electroless plating under the conditions shown in (Table 3), a bond magnet having a conductive layer 3 with a resin layer 2 interposed on the surface and an electroless plating film 5 thereon as shown in FIG. 1 was produced. In addition, as a comparative example, the same electroless plating treatment was performed on the cylindrical bonded magnet having a radius of the bottom surface of 6 mm and a height of 12 mm without forming the epoxy adhesive layer and the conductive layer, and the surface was electroless plated. A bonded magnet having a coating was produced.

[0013]

[Table 3] The properties of the obtained isotropic bonded magnet are shown in (Table 4).

[0014]

[Table 4] As is clear from this (Table 4), according to the bonded magnet of the present example and the method for manufacturing the same, no deterioration in magnetic properties, which could not be suppressed by the conventional electroless plating film and the method for forming the same, was observed and high corrosion resistance was obtained. It can be seen that an excellent bonded magnet can be obtained.

(Embodiment 8) NdF passed 32 mesh
eB isotropic magnetic powder (MQP-made by General Motors)
B) A magnetic powder compound consisting of 97 wt% and an epoxy adhesive of 3 wt% was press-molded at a molding pressure of 5 t / cm ² and cured at 180 ° C. for 1 hour in an argon atmosphere, and FIG.
A cubic bonded magnet having a side of 5 mm as shown in FIG. This bond magnet is 10 wt% M of epoxy adhesive
The EK solution was impregnated for 5 minutes, drained sufficiently, and then cured at 180 ° C. for 1 hour. 2 more impregnation and cure
After repeating 10 times, 10 wt% M of epoxy adhesive again
MEK was dried by impregnating the EK solution for 5 minutes, draining the solution sufficiently, and then drying under reduced pressure. 500 bond magnets having an uncured epoxy adhesive layer on the surface thus manufactured and copper balls 1500 having a diameter of 2 mm
50 g of Cu powder having a diameter of 00 and a major axis of 0.8 μm was put into a vibration type ball mill and subjected to a vibration treatment to obtain a bonded magnet having Cu powder adhered to the surface due to the tackiness of the uncured epoxy adhesive. This was cured at 180 ° C. for 1 hour and then washed with water to remove excess Cu powder. Through the above procedure, a bonded magnet having a conductive layer with a resin layer on the surface was obtained. Electrodeposition coating was applied to this using a paint for electrodeposition coating (Elektron manufactured by Kansai Paint) under the condition of an electrodeposition voltage of 140 V, and then 170
By performing curing at 20 ° C. for 20 minutes, a bonded magnet 1 having a conductive layer 3 with a resin layer 2 interposed on the surface and having an electrodeposition coating film 6 thereon was prepared as shown in FIG. In addition, as a comparative example, the above-mentioned cubic bonded magnet having a side of 5 mm was subjected to the same electrodeposition coating treatment without forming an epoxy adhesive layer and a Cu layer, to produce a bonded magnet having an electrodeposition coating film on the surface. . The characteristics of the obtained isotropic bonded magnet are shown in (Table 5).

[0016]

[Table 5] As is clear from this (Table 5), according to the bonded magnet of the present example and the method for manufacturing the same, no deterioration in magnetic properties that could not be suppressed by the conventional electrodeposition coating film and the method for forming the same was observed, and high corrosion resistance was obtained. It can be seen that an excellent bonded magnet can be obtained.

In each of the above embodiments, the magnetic powder was NdFeB type, but other rare earth type magnetic powder such as SmFeN type and SmCo type, Ba type ferrite, Sr type ferrite, Mn.
An oxide-based magnetic powder such as Zn-based ferrite can be used. The above-mentioned treatment of a bonded magnet made of ferrite is effective in applications where appearance is important. The surface of these magnetic particles may be treated with a silane-based or titanate-based coupling agent or the like in order to improve dispersibility. The magnetic powder content is preferably 50 to 98 wt%. For applications requiring high magnetic properties, 97 wt% is more preferable because a high-density molded body can be obtained, but if the amount exceeds 98 wt%, the binder becomes insufficient and the strength of the bond magnet itself is significantly reduced.

As the main component of the binder, general-purpose ones such as epoxy resin and nylon resin can be used. Generally, an epoxy resin is used for compression molding and a nylon resin is used for injection molding. When the main component is a thermosetting resin, a general curing agent can be used. It is also effective to add an appropriate curing accelerator if necessary. It is possible to appropriately add a plasticizer and a lubricant for improving the moldability, but in order to maintain the strength of the bonded magnet itself, the addition amount thereof is preferably in the range of 5 to 50 wt%.

Although it is a resin layer formed on the surface of the bonded magnet, a usual thermosetting resin such as epoxy type, phenol type, acrylic type and a curing agent suitable therefor can be used as a main component. It is also effective to add a curing accelerator. In addition, the conductive material layer can be efficiently attached by mixing the resin with an adhesive. If the main component of the resin layer and the main component of the binder of the bond magnet are the same, the adhesive strength between the bond magnet and the resin layer becomes strong, which is preferable. The thickness is preferably 100 μm or less, though it depends on the smoothness of the surface of the bonded magnet. When it is 100 μm or more, when the conductive substance adheres, it sinks into the resin layer and the surface roughness cannot be ignored. Further, as the method for forming this resin layer, a general method such as a spray method, a dipping method, or a vacuum impregnation method can be used. Overcoating is effective for improving the smoothness of the surface, but the total thickness of the resin layer is 10
It is necessary that the thickness be 0 μm or less. If necessary, the surface of the bonded magnet may be washed or polished before forming the resin layer, or may be treated with a silane-based or titanate-based coupling agent.

The conductive layer is formed on the resin layer, and its component is C in addition to Ni and Cu in the above embodiment.
u, Cr, Zn, Ni, Cd, Sn, Pb, Fe, A
At least one element selected from the group consisting of the elements listed in u, Ag, Pt, Pd, Rh, Al and Nd or the alloys containing the above elements as the main component can be used. These are adhered and fixed in a powder state on the resin layer formed on the surface of the bonded magnet, but in particular, the edge portion can be uniformly coated N
i, Cu, Al and the like are preferable. Further, this powder preferably has a major axis of 1 mm or less. If the major axis exceeds this value, the edge portion will not be sufficiently covered. From the viewpoint of covering the edge portion, it is more preferable that the powder has a scaly shape. The thickness of the conductive layer depends on the properties of the powder used, but is preferably 100 μm or less. If it is thicker than this, the effect of fixing by the resin layer becomes thin. More preferably, it is 50 μm or less. The surface roughness is 25
It is necessary that the maximum height (R _max ) is 400 μm or less with respect to mm. If the maximum height is higher than this, pinholes are likely to occur during electrolytic plating, electroless plating, and electrodeposition coating, which leads to corrosion of the base magnet. In particular, when the maximum height (R _max ) is larger than the total thickness of the resin layer and the conductive layer, the base magnet is partially exposed, which is not preferable. Further, the smaller the surface resistance of the conductive layer, the easier the electrolytic plating, the electroless plating, and the electrodeposition coating, but it is preferably 500 Ω / sq or less. It is more preferably 200 Ω / sq or less, and if 50 Ω / sq or less, a very good film formation becomes possible.

Regarding the method of forming the conductive layer, in addition to the vibration treatment in the vibrating ball mill as in the above embodiment, a molding method using a rotary barrel device or a centrifugal barrel device can be used. Further, as a concrete method of the electrolytic plating, the electroless plating, and the electrodeposition coating, a general method may be applied in addition to the above-mentioned embodiment.

Aqueous solutions for electrolytic plating include copper cyanide bath, copper pyrophosphate bath, copper sulfate bath, matte Ni bath, Watt bath, sulfamic acid bath, wood strike bath, immersion Ni bath, and hexavalent Cr low concentration. Bath, Hexavalent Cr Sargent Bath, Hexavalent Cr Fluoride Containing Bath, High Cyanide Alkaline Z
n plating bath, medium cyanide alkali Zn plating bath, low cyanide alkali Zn plating bath, zincate bath, cyanide Cd plating bath, borofluoride Cd plating bath, sulfuric acid S
n plating bath, borofluoric acid Sn plating bath, borofluoric acid Pb
Plating bath, sulfamic acid Pb plating bath, methanesulfonic acid Pb plating bath, borofluoric acid solder plating bath, phenolsulfonic acid solder plating bath, alkanolsulfonic acid solder plating bath, chloride Fe plating bath, sulfate Fe plating bath, ho Fluoride Fe plating bath, sulfamate Fe plating bath, Sn-Co alloy stannate bath, Sn-C
o alloy pyrophosphoric acid bath, Sn-Co alloy fluoride bath, Sn
-Ni alloy pyrophosphoric acid bath, Sn-Ni alloy fluoride bath, etc. can be appropriately selected depending on the anode metal species.
Additives such as a leveler agent, an anti-pitting agent, a satin-forming agent, an anode dissolving agent, a PH buffer and a stabilizer can also be added. Further, as a post-process, a washing process with water, a washing process with hot water, a sealing treatment process and the like can be added depending on the purpose.

Next, as the electroless plating solution, the ones listed below are appropriately selected according to the metal species to be plated.
Cu sulfate and Rochelle salt, formaldehyde, N carbonate
Cu plating bath containing some of a, Na hydroxide, EDTA, Na cyanide, etc. Ni sulphate, Ni chloride or mixtures thereof with Na acetate, lactic acid, N citrate
a, N containing some of sodium hypophosphite, boric acid, ammonium sulfate, ammonium chloride, ethylenediamine, ammonium citrate, Na pyrophosphate, etc.
i plating bath or Ni alloy plating bath. A Co plating bath or Co alloy plating bath containing Co sulfate and some of Na hypophosphite, Na citrate, Na tartrate, ammonium sulfate, boric acid, and the like. An Au plating bath containing potassium dicyanoaurate (I), potassium tetracyanoaurate (III) or a mixture thereof and some of potassium cyanide, potassium hydroxide, lead chloride, potassium borohydride and the like. An Ag plating bath containing silver cyanide and some of Na cyanide, Na hydroxide, dimethylamine borane, thiourea and the like. Palladium chloride,
A palladium plating bath containing some of ammonium hydroxide, ammonium chloride, sodium ethylenediamine tetraacetate, Na phosphinate, hydrazine and the like. A tin plating bath containing tin chloride and some of Na citrate, Na ethylenediamine tetraacetate, Na nitro triacetate, Titanium trichloride, Na acetate, benzene sulfonic acid and the like.
Etc. can be used. Incidentally, it is possible to further add additives such as a brightening agent, a leveler agent, a pit preventing agent, a satin forming agent, a PH buffer, a stabilizer and a complexing agent. Further, in the electroless plating method used in the present invention, chromate treatment, washing with water, washing with hot water or the like can be carried out as a post-treatment step. Examples of the plating metal with which the object to be processed is coated by the electroless plating process performed in the present invention include Cu, Ni, Co, and S.
n, Ag, Au, Pt and Ni-Co, Ni-Co-
B, Ni-Co-P, Ni-Fe-P, Ni-WP,
Ni-P, Co-Fe-P, Co-WP, Co-Ni
-Mn-Re- and the like can be exemplified, and can be appropriately selected according to the purpose.

Finally, as the electrodeposition coating, an anion electrodeposition coating method in which the article to be coated is used as an anode or a cationic electrodeposition coating method in which the article to be coated is used as a cathode can be adopted. The resin used for anionic electrodeposition coating is a drying oil, polyester, polybutadiene, epoxy ester, polycarboxylic acid resin having a polyacrylic acid ester skeleton, which is usually neutralized with a base such as organic amine or caustic potash to form an aqueous solution. Alternatively, it becomes water and becomes negatively charged. As a resin used for cationic electrodeposition coating, a polyamino resin mainly having an epoxy resin, an acrylic resin or the like as a skeleton is usually neutralized with an organic acid and made into an aqueous solution or water dispersion to be positively charged. Further, the above resin may contain a rust preventive pigment such as zinc oxide, zinc chromate, strontium chromate, and Suzutan, or may contain benzotriazole.

The above description is an example of forming an electrolytic plating film, an electroless plating film, and an electrodeposition coating film on the conductive layer, but it is also possible to form a resin film in place of these films. It is the scope of the invention.

[0026]

As described above in detail, according to the present invention, the holes on the surface of the bonded magnet are sealed by the resin layer and the conductive layer is formed on the resin layer, so that the electrolytic plating is performed without deteriorating the magnetic characteristics. It is possible to produce a bonded magnet having a film, an electroless plating film, or an electrodeposition coating film,
Since it becomes possible to dramatically improve the corrosion resistance of the bonded magnet, its industrial value is extremely high.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a surface state of a conventional bonded magnet before and after plating treatment.

FIG. 2 is an explanatory view showing a surface state of a bonded magnet according to the present invention before and after plating treatment.

FIG. 3 is an explanatory view showing a surface state of a bonded magnet according to the present invention before and after plating treatment.

FIG. 4 is an explanatory diagram showing the outer shape of the bonded magnet used in Examples 1 to 6.

FIG. 5 is an explanatory view showing an outline of a laminated structure of a bonded magnet surface of Examples 1 to 6.

FIG. 6 is an explanatory view showing the outer shape of the bonded magnet used in Example 7.

FIG. 7 is an explanatory view showing an outline of a laminated structure on the surface of a bonded magnet of Example 7.

FIG. 8 is an explanatory view showing the outer shape of the bonded magnet used in Example 8.

FIG. 9 is an explanatory view showing the outline of the laminated structure of the surface of the bonded magnet of Example 8.

[Explanation of symbols]

1 Bonded magnet 2 Resin layer 3 Conductive layer 4 Electrolytic plating film 5 Electroless plating film 6 Electrodeposition coating film

Claims (13)

[Claims] 1. A bond magnet having a conductive layer with a resin layer on the whole or a part of the surface. 2. The bond magnet according to claim 1, wherein the surface roughness is set such that the maximum height of the surface of the conductive layer is 400 μm or less when the reference length is 25 mm. 3. The conductive layer is Cu, Cr, Zn, Ni, C
d, Sn, Pb, Fe, Au, Ag, Pt, Pd, R
The bonded magnet according to claim 1 or 2, which is a set of one or more powders of a simple substance consisting of the elements listed in h, Al and Nd or powders of an alloy containing the above element as a main component. 4. The major axis of the powder is 1 mm or less.
The bond magnet described. 5. The bonded magnet according to claim 4, wherein the powder is scaly. 6. A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface and an electrolytic plating film on the entire surface. 7. A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface and an electroless plating film on the entire surface. 8. A bonded magnet having a conductive layer with a resin layer on the whole or a part of the surface and a resin film on the entire surface. 9. A method for producing a bonded magnet, wherein a conductive layer is formed after forming a resin layer on the whole or a part of the surface. 10. The method for producing a bonded magnet according to claim 9, wherein the surface roughness is set so that the maximum height of the conductive layer surface is 400 μm or less when the reference length is 25 mm. 11. The conductive layer is Cu, Cr, Zn, Ni, C
d, Sn, Pb, Fe, Au, Ag, Pt, Pd, R
The method for producing a bonded magnet according to claim 9 or 10, which is a set of one or more powders of a simple substance composed of the elements listed in h, Al and Nd or powders of an alloy containing the above element as a main component. 12. The method for producing a bonded magnet according to claim 11, wherein the major axis of the powder is 1 mm or less. 13. The method for producing a bonded magnet according to claim 12, wherein the powder is scaly.