JPH07159658A - Structure for coupling optical waveguide with optical element and its production - Google Patents
Structure for coupling optical waveguide with optical element and its productionInfo
- Publication number
- JPH07159658A JPH07159658A JP5306210A JP30621093A JPH07159658A JP H07159658 A JPH07159658 A JP H07159658A JP 5306210 A JP5306210 A JP 5306210A JP 30621093 A JP30621093 A JP 30621093A JP H07159658 A JPH07159658 A JP H07159658A
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- prism
- optical
- optical element
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は光導波路−光素子結合構
造およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical waveguide-optical element coupling structure and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】図４は従来型の３次元光導波路端部に設
けられた、反射ミラーを用いた、光導波路−光素子結合
構造である。本図はS.Koike,N.Matsuura,H.Takahara,"O
ptical waveguide-to-photodiode Coupling Technique Using Total Internal Reflection
mirrors fabricated in polyimide optical waveguides",The Pr
oceedings of 1993 JAPAN International Electronic Manufacturing Technology Symposium,pp.255-258 から
引用したものである。2. Description of the Related Art FIG. 4 shows an optical waveguide-optical element coupling structure using a reflection mirror provided at the end of a conventional three-dimensional optical waveguide. This figure shows S. Koike, N. Matsuura, H. Takahara, "O
ptical waveguide-to-photodiode Coupling Technique Using Total Internal Reflection
mirrors fabricated in polyimide optical waveguides ", The Pr
Oceedings of 1993 JAPAN International Electronic Manufacturing Technology Symposium, pp.255-258.
【０００３】図中、１は光導波路、２は面型受光素子、
３ははんだバンプ、４は誘電体基板、５はミラー、６は
受光素子受光面、７は金属パッドである。従来型の光導
波路−光素子結合構造においては、光導波路１中を伝播
してきた導波光が、光導波路１端部に設けたミラー５に
おいて反射されて、光が垂直に空間へ出射されたのち、
はんだバンプ３によって搭載された受光素子２の受光面
６に光結合され、信号伝送が行われるものである。In the figure, 1 is an optical waveguide, 2 is a surface type light receiving element,
3 is a solder bump, 4 is a dielectric substrate, 5 is a mirror, 6 is a light receiving surface of a light receiving element, and 7 is a metal pad. In the conventional optical waveguide-optical element coupling structure, the guided light propagating through the optical waveguide 1 is reflected by the mirror 5 provided at the end portion of the optical waveguide 1 and then the light is vertically emitted to the space. ,
The signal is transmitted by being optically coupled to the light receiving surface 6 of the light receiving element 2 mounted by the solder bump 3.
【０００４】光導波路１と光素子２との光結合のための
光路変換装置であるミラー５は従来では図５に示すプロ
セスを経て加工されていた。 第１工程：電極パッド７が形成されている誘電体基板４
上面に光導波路１となる誘電体層１０を形成する（図５
（ａ））。 第２工程：光導波路のコアパタンに相当する金属マスク
１０上を上述した誘電体層１ａ上に形成する（図５
（ｂ））。 第３工程：酸素プラズマ等による反応性イオンエッチン
グを行ない、誘電体基板４上に光導波路１を形成する
（図５（ｃ））。 第４工程：誘電体基板４を傾斜させて酸素プラズマ等に
よりエッチングを行なうことにより、光導波路１の端部
においてミラー５を形成する（図５（ｄ））。 第５工程：光素子２をはんだバンプ３を用いて誘電体基
板４上に搭載する（図５（ｅ））。 上記工程を経て光導波路−光素子結合構造が実現され
る。Conventionally, the mirror 5, which is an optical path changing device for optically coupling the optical waveguide 1 and the optical element 2, has been processed through the process shown in FIG. First step: Dielectric substrate 4 on which electrode pad 7 is formed
A dielectric layer 10 to be the optical waveguide 1 is formed on the upper surface (FIG. 5).
(A)). Second step: A metal mask 10 corresponding to the core pattern of the optical waveguide is formed on the dielectric layer 1a described above (FIG. 5).
(B)). Third step: Reactive ion etching using oxygen plasma or the like is performed to form the optical waveguide 1 on the dielectric substrate 4 (FIG. 5C). Fourth step: The mirror 5 is formed at the end of the optical waveguide 1 by tilting the dielectric substrate 4 and performing etching with oxygen plasma or the like (FIG. 5D). Fifth step: The optical element 2 is mounted on the dielectric substrate 4 using the solder bumps 3 (FIG. 5 (e)). The optical waveguide-optical element coupling structure is realized through the above steps.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
結合構造製作工程では、ミラー５を形成するのに数時間
の反応性イオンエッチングが必要なために、製作効率が
悪かった。また、誘電体基板４を傾斜して、ミラー５を
形成するため、ミラー５の斜め面が一方向に限定される
などの問題点があった。However, in the conventional bonded structure manufacturing process, the manufacturing efficiency was poor because the reactive ion etching for several hours was required to form the mirror 5. Moreover, since the mirror 5 is formed by inclining the dielectric substrate 4, there is a problem that the oblique surface of the mirror 5 is limited to one direction.
【０００６】本発明は、上記問題を解決するために、光
導波路−光素子結合構造を効率よく製作するとともに、
その製作位置に制限をあたえず光結合系配置の自由度を
向上する光導波路−光素子結合構造およびその製造方法
を提供することを目的とする。In order to solve the above problems, the present invention efficiently manufactures an optical waveguide-optical element coupling structure, and
An object of the present invention is to provide an optical waveguide-optical element coupling structure and a method for manufacturing the same in which the degree of freedom in arranging the optical coupling system is improved without giving any limitation to the manufacturing position.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決する本発
明は、誘電体基板上で、相異なる誘電体を積層して構成
される光導波路と光素子とを光結合させる構造におい
て、前記誘電体基板のうち、前記光素子が搭載される側
で且つ前記光導波路の端部前方の位置に、前記光導波路
面と平行な底面を持つ溝部を有し、前記溝部に、前記光
導波路の光軸と、搭載される前記光素子の光軸とを一致
させる位置でプリズムが搭載され、前記プリズムならび
に前記光導波路を跨ぐ構造にて、前記光素子が前記誘電
体基板上に搭載されていることを特徴とする。The present invention for solving the above-mentioned problems provides a structure for optically coupling an optical waveguide and an optical element which are formed by laminating different dielectrics on a dielectric substrate. On the side of the body substrate on which the optical element is mounted and in front of the end portion of the optical waveguide, a groove portion having a bottom surface parallel to the optical waveguide surface is provided, and the optical waveguide of the optical waveguide is provided in the groove portion. A prism is mounted at a position where the axis coincides with the optical axis of the mounted optical element, and the optical element is mounted on the dielectric substrate in a structure straddling the prism and the optical waveguide. Is characterized by.
【０００８】また上記課題を解決する本発明は、光導波
路−光素子結合構造において、前記プリズムの一面、お
よび、前記溝部の底面に金属コートを施し、さらに前記
溝部の底面の金属コートの上面にはんだシートを設ける
かあるいははんだ層を形成し、前記はんだシート上面あ
るいははんだ層上面に、前記プリズムのうち金属コート
を施した面を搭載し、前記誘電体基板ならびに前記プリ
ズムを加熱・溶融することにより、前記誘電体基板上に
前記プリズムを接続することを特徴とする。According to the present invention for solving the above-mentioned problems, in the optical waveguide-optical element coupling structure, a metal coat is applied to one surface of the prism and the bottom surface of the groove portion, and further, to the top surface of the metal coat on the bottom surface of the groove portion. By providing a solder sheet or forming a solder layer, and mounting the metal coated surface of the prism on the solder sheet upper surface or the solder layer upper surface, and heating and melting the dielectric substrate and the prism. The prism is connected on the dielectric substrate.
【０００９】また上記課題を解決する本発明は、光導波
路−光素子結合構造において、前記プリズムの一面には
んだ層を形成し、および、前記溝部の底面に金属コート
を施し、前記金属コートが施された溝部底面に、前記プ
リズムのうちはんだ層を形成した面を搭載し、前記誘電
体基板ならびに前記プリズムを加熱・溶融することによ
り、前記誘電体基板上に前記プリズムを接続することを
特徴とする。The present invention which solves the above-mentioned problems provides an optical waveguide-optical element coupling structure in which a solder layer is formed on one surface of the prism, and a metal coat is applied to the bottom surface of the groove portion. The surface of the prism on which the solder layer is formed is mounted on the bottom surface of the groove, and the prism is connected to the dielectric substrate by heating and melting the dielectric substrate and the prism. To do.
【００１０】また上記課題を解決する本発明は、前記溝
部に搭載された前記プリズムの面の内、前記光導波路の
端部と相対する斜め面に反射膜が形成されていることを
特徴とする。Further, the present invention for solving the above-mentioned problems is characterized in that a reflecting film is formed on an oblique surface of the surface of the prism mounted in the groove, the surface facing the end of the optical waveguide. .
【００１１】[0011]
【作用】本発明による、光導波路−光素子結合構造およ
びその製造方法を用いれば、任意の光導波路位置で光素
子と光導波路との光結合が行え、かつ短時間に光結合系
が製作可能となる。By using the optical waveguide-optical element coupling structure and the manufacturing method thereof according to the present invention, the optical element and the optical waveguide can be optically coupled at any optical waveguide position, and the optical coupling system can be manufactured in a short time. Becomes
【００１２】[0012]
【実施例】図１は本発明の第１実施例を説明する図であ
って、１は光導波路、２は受光素子、３ははんだバン
プ、４は誘電体基板、６は受光素子受光面、７は電極パ
ッド、８はプリズム、９はプリズム搭載溝である。1 is a view for explaining a first embodiment of the present invention, in which 1 is an optical waveguide, 2 is a light receiving element, 3 is a solder bump, 4 is a dielectric substrate, 6 is a light receiving element light receiving surface, Reference numeral 7 is an electrode pad, 8 is a prism, and 9 is a prism mounting groove.
【００１３】本光結合構造によれば、光導波路１中を伝
播してきた導波光が光導波路１の端部において空気中に
出射し、プリズム８によって反射の後に導波光が偏向を
受け、光が誘電体基板４から垂直上方に取り出されて受
光面６に達し光結合が行われる。According to this optical coupling structure, the guided light propagating through the optical waveguide 1 is emitted into the air at the end of the optical waveguide 1, and the guided light is deflected after being reflected by the prism 8 It is taken out vertically upward from the dielectric substrate 4, reaches the light receiving surface 6, and is optically coupled.
【００１４】本発明による光結合構造の製作工程を図２
及び図３に示しており、１ａは光導波路層、１は光導波
路、２は受光素子、３ははんだバンプ、４ａは誘電体基
板、４ｂは電気配線層、６は受光面、７は電極パッド、
８はプリズム、８ａはプリズム搭載面、９はプリズム搭
載溝、１０は光導波路コア形成用マスク、１１はプリズ
ム搭載溝形成用ストップ層、１２はプリズム搭載溝深さ
調整ストップ層である。FIG. 2 shows a manufacturing process of the optical coupling structure according to the present invention.
As shown in FIG. 3, 1a is an optical waveguide layer, 1 is an optical waveguide, 2 is a light receiving element, 3 is a solder bump, 4a is a dielectric substrate, 4b is an electric wiring layer, 6 is a light receiving surface, and 7 is an electrode pad. ,
Reference numeral 8 is a prism, 8a is a prism mounting surface, 9 is a prism mounting groove, 10 is an optical waveguide core forming mask, 11 is a prism mounting groove forming stop layer, and 12 is a prism mounting groove depth adjustment stop layer.
【００１５】本光結合構造の製作工程は次のとおりであ
る。 第１製作工程：誘電体基板４ａ上にプリズム搭載溝深さ
調整ストップ層１２を形成する。なお、該プリズム搭載
溝深さ調整ストップ層１２は一例として４層からなり、
最上層は光導波路コア形成用マスク１０と同一材料（例
えばＴｉ）からなり、下層については電極パッド７と同
一金属構成（例えば上層からＡｕ−Ｐｔ−Ｔｉ）とする
か、または半田コート（例えばＰｂ−Ｓｎ）とする（図
２（１）参照）。The manufacturing process of this optical coupling structure is as follows. First manufacturing process: The prism mounting groove depth adjustment stop layer 12 is formed on the dielectric substrate 4a. The prism mounting groove depth adjustment stop layer 12 is composed of four layers as an example,
The uppermost layer is made of the same material as the optical waveguide core forming mask 10 (for example, Ti), and the lower layer has the same metal structure as that of the electrode pad 7 (for example, Au-Pt-Ti from the upper layer) or a solder coat (for example, Pb). -Sn) (see FIG. 2 (1)).
【００１６】第２製作工程：前記誘電体基板４ａ上に電
気配線層４ｂを形成する（図２（２）参照）。 第３製作工程：電極パッド７を電気配線層４ｂ上に形成
する（図２（３）参照）。 第４製作工程：電気配線層４ｂ上にプリズム搭載溝形成
用ストップ層１１を、プリズム搭載溝９に相当する部分
を除いて被覆する（図２（４）参照）。 第５製作工程：プリズム搭載溝形成用ストップ層１１上
に光導波路層１ａを形成する（図２（５）参照）。Second manufacturing step: An electric wiring layer 4b is formed on the dielectric substrate 4a (see FIG. 2 (2)). Third manufacturing step: The electrode pad 7 is formed on the electric wiring layer 4b (see FIG. 2C). Fourth manufacturing step: The electric wiring layer 4b is covered with the prism mounting groove forming stop layer 11 except for the portion corresponding to the prism mounting groove 9 (see FIG. 2 (4)). Fifth manufacturing step: The optical waveguide layer 1a is formed on the prism mounting groove forming stop layer 11 (see FIG. 2 (5)).
【００１７】第６製作工程：光導波路層１ａ上に光導波
路コア形成用のエッチングマスクである光導波路コア形
成用マスク１０を形成する（図３（６）参照）。 第７製作工程：一例として酸素プラズマによって、プリ
ズム搭載溝深さ調整ストップ層１２から見えるまでエッ
チングを行なう（図３（７）参照）。Sixth Manufacturing Step: An optical waveguide core forming mask 10 which is an etching mask for forming an optical waveguide core is formed on the optical waveguide layer 1a (see FIG. 3 (6)). Seventh Fabrication Step: As an example, etching is performed using oxygen plasma until it is visible from the prism mounting groove depth adjustment stop layer 12 (see FIG. 3 (7)).
【００１８】第８製作工程：ふっ酸等による化学溶液に
浸し、光導波路コア形成用マスク１０ならびにプリズム
搭載溝深さ調整ストップ層１２の第１層を剥離する。さ
らに、誘電体基板４ａとの接続面がＡｕ−Ｓｎ，Ａｇ−
ＳｎならびにＰｂ−Ｓｎ等の合金によりコーティングし
ているプリズム搭載面８ａをプリズム搭載溝９に向け
て、プリズム８を搭載し、加熱溶融することにより、プ
リズム８を基板４ａに固定する（図３（８）参照）。Eighth manufacturing step: The optical waveguide core forming mask 10 and the first layer of the prism mounting groove depth adjustment stop layer 12 are removed by immersing in a chemical solution such as hydrofluoric acid. Further, the connection surface with the dielectric substrate 4a has Au-Sn, Ag-
The prism 8 is fixed to the substrate 4a by mounting the prism 8 with the prism mounting surface 8a coated with an alloy such as Sn and Pb-Sn facing the prism mounting groove 9 and heating and melting (see FIG. 3 ( 8)).
【００１９】第９製作工程：受光素子２をＩｎ等の低融
点金属のはんだバンプ３により電極パッド７上に形成す
る（図３（９）参照）。Ninth manufacturing step: The light receiving element 2 is formed on the electrode pad 7 by the solder bump 3 of a low melting point metal such as In (see FIG. 3 (9)).
【００２０】本実施例による光導波路−光素子結合構造
およびその製造方法によれば、導波路伝播光を効率よく
受光素子６に光結合できるとともに、プリズムの搭載位
置の制限を受けないなどの特徴を有する。加えて、従来
の反応性イオンエッチング技術によるミラーの形成と比
べて大幅に製作時間を削減することができる。According to the optical waveguide-optical element coupling structure and the method of manufacturing the same according to the present embodiment, the waveguide propagation light can be efficiently optically coupled to the light receiving element 6, and the mounting position of the prism is not limited. Have. In addition, the manufacturing time can be significantly reduced as compared with the formation of the mirror by the conventional reactive ion etching technique.
【００２１】以上本発明を前記実施例に基づき説明を行
なったが、本発明は前記実施例に限定されるものではな
く、その要旨を逸脱しない範囲において種々変更可能で
あることは勿論である。Although the present invention has been described based on the above-described embodiments, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.
【００２２】例えば実施例においてはプリズム８のプリ
ズム搭載溝９への搭載にあたり、プリズム８の搭載面８
ａにはんだコートしこの面を基板内に搭載することとし
ているが、この搭載面８ａを金属コートし、はんだシー
トやはんだ層をプリズム搭載溝上面に配置し、プリズム
搭載後、加熱することによりプリズムを基板内に固定る
方法でもよい。For example, in the embodiment, when mounting the prism 8 in the prism mounting groove 9, the mounting surface 8 of the prism 8 is mounted.
Although it is supposed that a is solder-coated and this surface is mounted in the substrate, the mounting surface 8a is metal-coated, a solder sheet or a solder layer is arranged on the prism mounting groove upper surface, and after mounting the prism, the prism is heated. May be fixed in the substrate.
【００２３】さらに、プリズム８の導波路伝播光反射面
において、金属コートを施して反射効率を高めてもよ
い。また本実施例においては、プリズム搭載溝深さ調整
ストップ層１２を設け、溝深さを調整したが、エッチン
グ時間を調整することによりプリズム深さを制御しても
よい。さらに、溝部へのプリズムの固着方法としてＵＶ
硬化接着剤を用いてもよい。Further, a metal coating may be applied to the waveguide propagating light reflecting surface of the prism 8 to enhance the reflection efficiency. Further, in this embodiment, the prism mounting groove depth adjustment stop layer 12 is provided to adjust the groove depth, but the prism depth may be controlled by adjusting the etching time. Furthermore, UV is used as a method of fixing the prism to the groove.
A curing adhesive may be used.
【００２４】加えて、ここでは光導波路として一本の光
導波路と一個の光素子の光結合系、プリズム搭載法に関
する実施例についてしか記載していないが、本発明に係
る光導波路−光素子結合構造およびその製造方法が複数
本の光導波路にも適応できるのは言うまでもない。In addition, although only the optical coupling system of one optical waveguide and one optical element as an optical waveguide and the prism mounting method are described here, the optical waveguide-optical element coupling according to the present invention is described. It goes without saying that the structure and the manufacturing method thereof can be applied to a plurality of optical waveguides.
【００２５】[0025]
【発明の効果】本発明によれば、導波路伝播光を効率よ
く受光素子に光結合できるとともに、光結合器であるプ
リズムの搭載位置の制限を受けないなどの特徴を有す
る。加えて、従来の反応性イオンエッチング技術による
ミラーの形成と比べて大幅に製作時間を削減することが
できる。According to the present invention, the waveguide propagation light can be efficiently optically coupled to the light receiving element, and the mounting position of the prism as the optical coupler is not limited. In addition, the manufacturing time can be significantly reduced as compared with the formation of the mirror by the conventional reactive ion etching technique.
【図１】本発明の実施例に係る光導波路−光素子結合構
造を示す構成図。FIG. 1 is a configuration diagram showing an optical waveguide-optical element coupling structure according to an embodiment of the present invention.
【図２】実施例の光導波路−光素子結合構造の製造方法
の第１製作工程〜第５製作工程を示す説明図。FIG. 2 is an explanatory view showing first to fifth manufacturing steps of the method of manufacturing the optical waveguide-optical element coupling structure according to the embodiment.
【図３】実施例の光導波路−光素子結合構造の製造方法
の第６製作工程〜第９製作工程を示す説明図。FIG. 3 is an explanatory view showing sixth to ninth manufacturing steps of the method of manufacturing the optical waveguide-optical element coupling structure according to the embodiment.
【図４】従来の光導波路−光素子結合構造を示す構成
図。FIG. 4 is a configuration diagram showing a conventional optical waveguide-optical element coupling structure.
【図５】従来の光導波路−光素子結合構造の製造方法を
示す説明図。FIG. 5 is an explanatory view showing a method for manufacturing a conventional optical waveguide-optical element coupling structure.
１ 光導波路 ２ 受光素子 ３ はんだバンプ ４ 誘電体基板 ４ａ 誘電体基板 ４ｂ 電気配線層 ５ ミラー ６ 受光素子受光面 ７ 電極パッド ８ プリズム ８ａ プリズム搭載面 ９ プリズム搭載溝 １０ 光導波路コア形成用マスク １１ プリズム搭載溝形成用ストップ層 １２ プリズム搭載溝深さ調整ストップ層 1 Optical Waveguide 2 Light-Receiving Element 3 Solder Bump 4 Dielectric Substrate 4a Dielectric Substrate 4b Electric Wiring Layer 5 Mirror 6 Light-Receiving Element Light-Receiving Surface 7 Electrode Pad 8 Prism 8a Prism Mounting Surface 9 Prism Mounting Groove 10 Optical Waveguide Core Forming Mask 11 Prism Stop layer for forming mounting groove 12 Stop layer for prism mounting groove depth adjustment
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 31/0232 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 31/0232
Claims (4)
して構成される光導波路と光素子とを光結合させる構造
において、 前記誘電体基板のうち、前記光素子が搭載される側で且
つ前記光導波路の端部前方の位置に、前記光導波路面と
平行な底面を持つ溝部を有し、 前記溝部に、前記光導波路の光軸と、搭載される前記光
素子の光軸とを一致させる位置でプリズムが搭載され、 前記プリズムならびに前記光導波路を跨ぐ構造にて、前
記光素子が前記誘電体基板上に搭載されていることを特
徴とする光導波路−光素子結合構造。1. A structure for optically coupling an optical waveguide and an optical element, which is formed by laminating different dielectrics on a dielectric substrate, in which side of the dielectric substrate the optical element is mounted. And at a position in front of the end of the optical waveguide, a groove having a bottom surface parallel to the optical waveguide surface is provided, and the optical axis of the optical waveguide and the optical axis of the optical element to be mounted are provided in the groove. An optical waveguide-optical element coupling structure, characterized in that a prism is mounted at a position to match the optical element and the optical element is mounted on the dielectric substrate so as to straddle the prism and the optical waveguide.
造において、前記プリズムの一面、および、前記溝部の
底面に金属コートを施し、さらに前記溝部の底面の金属
コートの上面にはんだシートを設けるかあるいははんだ
層を形成し、前記はんだシート上面あるいははんだ層上
面に、前記プリズムのうち金属コートを施した面を搭載
し、前記誘電体基板ならびに前記プリズムを加熱・溶融
することにより、前記誘電体基板上に前記プリズムを接
続することを特徴とする光導波路−光素子結合構造の製
造方法。2. The optical waveguide-optical element coupling structure according to claim 1, wherein a metal coat is applied to one surface of the prism and a bottom surface of the groove portion, and a solder sheet is further provided on a top surface of the metal coat on the bottom surface of the groove portion. By providing or forming a solder layer, a metal coated surface of the prism is mounted on the solder sheet upper surface or the solder layer upper surface, and the dielectric substrate and the prism are heated and melted to form the dielectric layer. A method of manufacturing an optical waveguide-optical element coupling structure, characterized in that the prism is connected to a body substrate.
造において、前記プリズムの一面にはんだ層を形成し、
および、前記溝部の底面に金属コートを施し、前記金属
コートが施された溝部底面に、前記プリズムのうちはん
だ層を形成した面を搭載し、前記誘電体基板ならびに前
記プリズムを加熱・溶融することにより、前記誘電体基
板上に前記プリズムを接続することを特徴とする光導波
路−光素子結合構造の製造方法。3. The optical waveguide-optical element coupling structure according to claim 1, wherein a solder layer is formed on one surface of the prism,
And applying a metal coating to the bottom surface of the groove, and mounting the surface of the prism on which the solder layer is formed on the bottom surface of the groove provided with the metal coating, and heating and melting the dielectric substrate and the prism. The method of manufacturing an optical waveguide-optical element coupling structure, wherein the prism is connected on the dielectric substrate.
た前記プリズムの面の内、前記光導波路の端部と相対す
る斜め面に反射膜が形成されていることを特徴とする光
導波路−光素子結合構造。4. The optical waveguide according to claim 1, wherein a reflective film is formed on a surface of the prism mounted in the groove, which is an oblique surface facing the end of the optical waveguide. Optical element coupling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5306210A JPH07159658A (en) | 1993-12-07 | 1993-12-07 | Structure for coupling optical waveguide with optical element and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5306210A JPH07159658A (en) | 1993-12-07 | 1993-12-07 | Structure for coupling optical waveguide with optical element and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07159658A true JPH07159658A (en) | 1995-06-23 |
Family
ID=17954322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5306210A Pending JPH07159658A (en) | 1993-12-07 | 1993-12-07 | Structure for coupling optical waveguide with optical element and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07159658A (en) |
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