JPH07159658A - Structure for coupling optical waveguide with optical element and its production - Google Patents

Structure for coupling optical waveguide with optical element and its production

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Publication number
JPH07159658A
JPH07159658A JP30621093A JP30621093A JPH07159658A JP H07159658 A JPH07159658 A JP H07159658A JP 30621093 A JP30621093 A JP 30621093A JP 30621093 A JP30621093 A JP 30621093A JP H07159658 A JPH07159658 A JP H07159658A
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Prior art keywords
optical waveguide
optical
prism
optical element
surface
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Pending
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JP30621093A
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Japanese (ja)
Inventor
Shinji Koike
Hideyuki Takahara
真司 小池
秀行 高原
Original Assignee
Nippon Telegr & Teleph Corp <Ntt>
日本電信電話株式会社
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

PURPOSE: To execute optical coupling of an optical element and an optical waveguide in an arbitrary optical waveguide position and to rapidly produce an optical coupling system by mounting the optical element on a dielectric substrate with a structure bestriding a prism and the optical waveguide.
CONSTITUTION: The dielectric substrate 4 has a groove part 9 having a base parallel with ah optical waveguide plane on a side to be mounted with the optical element 2 and in a position in front of the end of the optical waveguide 1. The prism 8 is mounted in the, groove part 9 in a position where the optical axis of the optical waveguide 1 and the optical axis of the mounted optical element 2 are aligned. The optical element 2 is mounted on the dielectric substrate 4 with the structure bestriding the prism 8 and the optical waveguide 1. The guided light propagating in the optical waveguide 1 is emitted into the air at the end of the optical waveguide 1 and after the guided light is reflected by the prism 8, the guided light receives polarization and the light is taken out of the dielectric substrate 4 perpendicularly upward and arrives at a photodetecting surface 6. The optical coupling is thus executed. As a result, the degree of freedom in the arrangement of the optical coupling system is improved without giving a limitation to the production position thereof.
COPYRIGHT: (C)1995,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は光導波路−光素子結合構造およびその製造方法に関するものである。 BACKGROUND OF THE INVENTION The present invention is an optical waveguide - to an optical element coupling structure and a manufacturing method thereof.

【0002】 [0002]

【従来の技術】図4は従来型の3次元光導波路端部に設けられた、反射ミラーを用いた、光導波路−光素子結合構造である。 BACKGROUND ART FIG. 4 is provided in the three-dimensional optical waveguide end portion of a conventional, using a reflection mirror, an optical waveguide - an optical element coupling structure. 本図はS.Koike,N.Matsuura,H.Takahara,"O This figure S.Koike, N.Matsuura, H.Takahara, "O
ptical waveguide-to-photodiode Coupling Technique Using Total Internal Reflection ptical waveguide-to-photodiode Coupling Technique Using Total Internal Reflection
mirrors fabricated in polyimide optical waveguides",The Pr mirrors fabricated in polyimide optical waveguides ", The Pr
oceedings of 1993 JAPAN International Electronic Manufacturing Technology Symposium,pp.255-258 から引用したものである。 oceedings of 1993 JAPAN International Electronic Manufacturing Technology Symposium, is quoted from pp.255-258.

【0003】図中、1は光導波路、2は面型受光素子、 [0003] In the figure, 1 is an optical waveguide, 2 the surface light-receiving device,
3ははんだバンプ、4は誘電体基板、5はミラー、6は受光素子受光面、7は金属パッドである。 3 the solder bumps, the dielectric substrate 4, 5 mirror 6 the light receiving element receiving surface, 7 is a metal pad. 従来型の光導波路−光素子結合構造においては、光導波路1中を伝播してきた導波光が、光導波路1端部に設けたミラー5において反射されて、光が垂直に空間へ出射されたのち、 Conventional optical waveguide - in the optical element coupling structure, waveguide light propagating through the optical waveguide 1 is reflected in the mirror 5 provided in the optical waveguide 1 ends, then the light is emitted to vertically space ,
はんだバンプ3によって搭載された受光素子2の受光面6に光結合され、信号伝送が行われるものである。 Receiving surface 6 of the light receiving element 2 mounted by solder bumps 3 are optically coupled, in which signal transmission is performed.

【0004】光導波路1と光素子2との光結合のための光路変換装置であるミラー5は従来では図5に示すプロセスを経て加工されていた。 [0004] Mirror 5 is an optical path converting device for optical coupling between the optical waveguide 1 and the optical element 2 has been processed through the process illustrated in Figure 5 in the conventional. 第1工程:電極パッド7が形成されている誘電体基板4 First step: a dielectric substrate 4 on which the electrode pads 7 are formed
上面に光導波路1となる誘電体層10を形成する(図5 Forming a dielectric layer 10 of the optical waveguide 1 on the upper surface (FIG. 5
(a))。 (A)). 第2工程:光導波路のコアパタンに相当する金属マスク10上を上述した誘電体層1a上に形成する(図5 Second step: the upper metal mask 10 corresponding to core pattern of optical waveguide is formed on the dielectric layer 1a as described above (FIG. 5
(b))。 (B)). 第3工程:酸素プラズマ等による反応性イオンエッチングを行ない、誘電体基板4上に光導波路1を形成する(図5(c))。 Step 3: perform a reactive ion etching with oxygen plasma or the like to form an optical waveguide 1 on the dielectric substrate 4 (FIG. 5 (c)). 第4工程:誘電体基板4を傾斜させて酸素プラズマ等によりエッチングを行なうことにより、光導波路1の端部においてミラー5を形成する(図5(d))。 Step 4: By performing etching by so inclining the dielectric substrate 4 oxygen plasma or the like to form a mirror 5 at the end of the optical waveguide 1 (FIG. 5 (d)). 第5工程:光素子2をはんだバンプ3を用いて誘電体基板4上に搭載する(図5(e))。 Step 5: Using the bumps 3 solder light element 2 is mounted on the dielectric substrate 4 (FIG. 5 (e)). 上記工程を経て光導波路−光素子結合構造が実現される。 Optical waveguide through the above steps - optical element coupling structure is realized.

【0005】 [0005]

【発明が解決しようとする課題】しかしながら、従来の結合構造製作工程では、ミラー5を形成するのに数時間の反応性イオンエッチングが必要なために、製作効率が悪かった。 [SUMMARY OF THE INVENTION However, in the conventional coupling structure fabrication process, for reactive ion etching of several hours to form the mirror 5 is needed, production efficiency is poor. また、誘電体基板4を傾斜して、ミラー5を形成するため、ミラー5の斜め面が一方向に限定されるなどの問題点があった。 Further, by inclining the dielectric substrate 4, to form a mirror 5, obliquely surface of the mirror 5 has a problem such as being limited in one direction.

【0006】本発明は、上記問題を解決するために、光導波路−光素子結合構造を効率よく製作するとともに、 The present invention, in order to solve the above problems, an optical waveguide - with efficiently manufacture an optical element coupling structure,
その製作位置に制限をあたえず光結合系配置の自由度を向上する光導波路−光素子結合構造およびその製造方法を提供することを目的とする。 And an object thereof is to provide an optical element coupling structure and a manufacturing method thereof - the optical waveguide to improve the flexibility of the optical coupling system disposed without causing limitation on the production position.

【0007】 [0007]

【課題を解決するための手段】上記課題を解決する本発明は、誘電体基板上で、相異なる誘電体を積層して構成される光導波路と光素子とを光結合させる構造において、前記誘電体基板のうち、前記光素子が搭載される側で且つ前記光導波路の端部前方の位置に、前記光導波路面と平行な底面を持つ溝部を有し、前記溝部に、前記光導波路の光軸と、搭載される前記光素子の光軸とを一致させる位置でプリズムが搭載され、前記プリズムならびに前記光導波路を跨ぐ構造にて、前記光素子が前記誘電体基板上に搭載されていることを特徴とする。 To solve the above problems SUMMARY OF THE INVENTION The present invention is a dielectric substrate, in the structure for optically coupling the configured optical waveguide and the optical element by laminating different dielectric, the dielectric among the body substrate, the end portion ahead of the position of and the optical waveguide on the side where the optical element is mounted has a groove with the optical waveguide plane parallel to the bottom surface, the groove, the light of the optical waveguide a shaft, a prism is mounted in a position to match the optical axis of the optical element to be mounted at the structure across the prism and the optical waveguide, said optical element is mounted on the dielectric substrate the features.

【0008】また上記課題を解決する本発明は、光導波路−光素子結合構造において、前記プリズムの一面、および、前記溝部の底面に金属コートを施し、さらに前記溝部の底面の金属コートの上面にはんだシートを設けるかあるいははんだ層を形成し、前記はんだシート上面あるいははんだ層上面に、前記プリズムのうち金属コートを施した面を搭載し、前記誘電体基板ならびに前記プリズムを加熱・溶融することにより、前記誘電体基板上に前記プリズムを接続することを特徴とする。 [0008] The present invention for solving the above problems, an optical waveguide - In the optical element coupling structure, one surface of the prism, and is subjected to metal coating on the bottom of the groove, the more the upper surface of the metal coating of the bottom surface of the groove forming a or solder layer provided solder sheet, the solder sheet top or solder layer top surface, equipped with a surface which has been subjected to metal coating of the prism, by heating and melting said dielectric substrate and said prism characterized by connecting said prism to said dielectric substrate.

【0009】また上記課題を解決する本発明は、光導波路−光素子結合構造において、前記プリズムの一面にはんだ層を形成し、および、前記溝部の底面に金属コートを施し、前記金属コートが施された溝部底面に、前記プリズムのうちはんだ層を形成した面を搭載し、前記誘電体基板ならびに前記プリズムを加熱・溶融することにより、前記誘電体基板上に前記プリズムを接続することを特徴とする。 [0009] The present invention for solving the above problems, an optical waveguide - In the optical element coupling structure, to form a solder layer on one surface of the prism, and is subjected to metal coating on the bottom of the groove, the metal coat facilities to have been the groove bottom, equipped with a surface forming a solder layer of the prism, by heating and melting the dielectric substrate and the prism, and characterized by connecting said prism to said dielectric substrate to.

【0010】また上記課題を解決する本発明は、前記溝部に搭載された前記プリズムの面の内、前記光導波路の端部と相対する斜め面に反射膜が形成されていることを特徴とする。 [0010] The present invention for solving the above problems, among surfaces of the prism mounted on the groove, characterized in that the reflection film is formed on the opposite oblique surface and an end portion of the optical waveguide .

【0011】 [0011]

【作用】本発明による、光導波路−光素子結合構造およびその製造方法を用いれば、任意の光導波路位置で光素子と光導波路との光結合が行え、かつ短時間に光結合系が製作可能となる。 [Action] according to the invention, an optical waveguide - the use of the optical element coupling structure and a manufacturing method thereof, any can optical coupling between the optical element and the optical waveguide in the optical waveguide position, and the optical coupling system can be manufactured in a short time to become.

【0012】 [0012]

【実施例】図1は本発明の第1実施例を説明する図であって、1は光導波路、2は受光素子、3ははんだバンプ、4は誘電体基板、6は受光素子受光面、7は電極パッド、8はプリズム、9はプリズム搭載溝である。 DETAILED DESCRIPTION FIG. 1 is a diagram for explaining a first embodiment of the present invention, 1 denotes an optical waveguide, 2 light receiving element, the solder bumps 3, the dielectric substrate 4, 6 light receiving element receiving surface, 7 the electrode pad, 8 prism, 9 is a prism mounting groove.

【0013】本光結合構造によれば、光導波路1中を伝播してきた導波光が光導波路1の端部において空気中に出射し、プリズム8によって反射の後に導波光が偏向を受け、光が誘電体基板4から垂直上方に取り出されて受光面6に達し光結合が行われる。 According to the present optical coupling structure, waveguide light propagating through the optical waveguide 1 is emitted into the air at the end of the optical waveguide 1, the guided light is subjected to deflection after reflected by the prism 8, the light reaching light coupled to the light receiving surface 6 is made from a dielectric substrate 4 is taken out vertically upward.

【0014】本発明による光結合構造の製作工程を図2 [0014] The manufacturing process of the optical coupling structure according to the present invention FIG. 2
及び図3に示しており、1aは光導波路層、1は光導波路、2は受光素子、3ははんだバンプ、4aは誘電体基板、4bは電気配線層、6は受光面、7は電極パッド、 And is shown in Figure 3, 1a denotes an optical waveguide layer, 1 optical waveguide, 2 light receiving element, the solder bumps 3, 4a is a dielectric substrate, 4b are electric wiring layer, the light-receiving surface 6, 7 the electrode pads ,
8はプリズム、8aはプリズム搭載面、9はプリズム搭載溝、10は光導波路コア形成用マスク、11はプリズム搭載溝形成用ストップ層、12はプリズム搭載溝深さ調整ストップ層である。 8 prism, 8a prism mounting surface, 9 the prism mounting groove, the optical waveguide core forming mask 10, 11 is a prism mounting groove forming a stop layer, 12 is a prism mounted groove depth adjustment stop layer.

【0015】本光結合構造の製作工程は次のとおりである。 The production process of the present optical coupling structure is as follows. 第1製作工程:誘電体基板4a上にプリズム搭載溝深さ調整ストップ層12を形成する。 The first manufacturing process: forming a prism mounting groove depth adjustment stop layer 12 on the dielectric substrate 4a. なお、該プリズム搭載溝深さ調整ストップ層12は一例として4層からなり、 Incidentally, the prism mounting groove depth adjustment stop layer 12 is made of four layers as an example,
最上層は光導波路コア形成用マスク10と同一材料(例えばTi)からなり、下層については電極パッド7と同一金属構成(例えば上層からAu−Pt−Ti)とするか、または半田コート(例えばPb−Sn)とする(図2(1)参照)。 The top layer consists of an optical waveguide for forming a core mask 10 of the same material (e.g. Ti), or for the lower layer and the electrode pad 7 and the same metal structure (e.g., Au-Pt-Ti from the upper layer), or a solder coating (e.g. Pb -sn) and reference (FIG. 2 (1)).

【0016】第2製作工程:前記誘電体基板4a上に電気配線層4bを形成する(図2(2)参照)。 A second fabrication step: forming the dielectric electric wiring layer 4b on the substrate 4a (see Fig. 2 (2)). 第3製作工程:電極パッド7を電気配線層4b上に形成する(図2(3)参照)。 Third manufacturing process: forming the electrode pads 7 on the electric wiring layer 4b (see FIG. 2 (3)). 第4製作工程:電気配線層4b上にプリズム搭載溝形成用ストップ層11を、プリズム搭載溝9に相当する部分を除いて被覆する(図2(4)参照)。 Fourth manufacturing process: a prism mounting groove forming a stop layer 11 to the electric wiring layer 4b, coated except for the portion corresponding to the prism mounting groove 9 (see FIG. 2 (4)). 第5製作工程:プリズム搭載溝形成用ストップ層11上に光導波路層1aを形成する(図2(5)参照)。 Fifth Production Process: forming an optical waveguide layer 1a on the prism mounting groove forming a stop layer 11 (see FIG. 2 (5)).

【0017】第6製作工程:光導波路層1a上に光導波路コア形成用のエッチングマスクである光導波路コア形成用マスク10を形成する(図3(6)参照)。 [0017] The sixth manufacturing step: forming an optical waveguide core forming mask 10 as an etching mask for the optical waveguide core formed on the optical waveguide layer 1a (see FIG. 3 (6)). 第7製作工程:一例として酸素プラズマによって、プリズム搭載溝深さ調整ストップ層12から見えるまでエッチングを行なう(図3(7)参照)。 Seventh manufacturing process: the oxygen plasma as an example, it is etched to appear from the prism mounting groove depth adjustment stop layer 12 (see FIG. 3 (7)).

【0018】第8製作工程:ふっ酸等による化学溶液に浸し、光導波路コア形成用マスク10ならびにプリズム搭載溝深さ調整ストップ層12の第1層を剥離する。 The eighth manufacturing process: immersed in a chemical solution with hydrofluoric acid or the like, peeling the first layer of the optical waveguide core forming mask 10 and the prism mounting groove depth adjustment stop layer 12. さらに、誘電体基板4aとの接続面がAu−Sn,Ag− Furthermore, the connection surfaces of the dielectric substrate 4a is Au-Sn, Ag-
SnならびにPb−Sn等の合金によりコーティングしているプリズム搭載面8aをプリズム搭載溝9に向けて、プリズム8を搭載し、加熱溶融することにより、プリズム8を基板4aに固定する(図3(8)参照)。 The prism mounting surface 8a that is coated with Sn and alloys such as Pb-Sn toward the prism mounting groove 9, equipped with a prism 8, by heating and melting, to secure the prism 8 to the substrate 4a (FIG. 3 ( 8) reference).

【0019】第9製作工程:受光素子2をIn等の低融点金属のはんだバンプ3により電極パッド7上に形成する(図3(9)参照)。 The ninth fabrication step: forming on the electrode pad 7 by solder bumps 3 of low melting point metal such as a light-receiving element 2 an In (see Fig. 3 (9)).

【0020】本実施例による光導波路−光素子結合構造およびその製造方法によれば、導波路伝播光を効率よく受光素子6に光結合できるとともに、プリズムの搭載位置の制限を受けないなどの特徴を有する。 The optical waveguide according to the present embodiment - According to the optical element coupling structure and a manufacturing method thereof, characterized in it is possible optical coupling efficiently receiving element 6 a waveguide propagating light, such as not limited by the mounting position of the prism having. 加えて、従来の反応性イオンエッチング技術によるミラーの形成と比べて大幅に製作時間を削減することができる。 In addition, it is possible to reduce significantly production times compared with the formation of the mirror by the conventional reactive ion etching technique.

【0021】以上本発明を前記実施例に基づき説明を行なったが、本発明は前記実施例に限定されるものではなく、その要旨を逸脱しない範囲において種々変更可能であることは勿論である。 [0021] Although the present invention been explained based on the embodiments, the present invention is not limited to the above embodiments, it is without departing from the scope and spirit thereof may be variously modified.

【0022】例えば実施例においてはプリズム8のプリズム搭載溝9への搭載にあたり、プリズム8の搭載面8 [0022] Upon mounting of the prism mounting groove 9 of the prism 8 in the Examples, mounting surface 8 of the prism 8
aにはんだコートしこの面を基板内に搭載することとしているが、この搭載面8aを金属コートし、はんだシートやはんだ層をプリズム搭載溝上面に配置し、プリズム搭載後、加熱することによりプリズムを基板内に固定る方法でもよい。 Although the fact that coated solder a mounting this plane in the substrate, the prism by the mounting surface 8a and the metal coating, place the solder sheet or solder layer to the prism mounting groove top, after the prism mounting, heating it may be a fixed Ru method in the substrate.

【0023】さらに、プリズム8の導波路伝播光反射面において、金属コートを施して反射効率を高めてもよい。 Furthermore, in the waveguide propagates light reflecting surface of the prism 8, may enhance reflection efficiency by applying a metal coating. また本実施例においては、プリズム搭載溝深さ調整ストップ層12を設け、溝深さを調整したが、エッチング時間を調整することによりプリズム深さを制御してもよい。 In the present embodiment, the prism mounting groove depth adjustment stop layer 12 is provided, has been adjusted groove depth may be controlled prism depth by adjusting the etching time. さらに、溝部へのプリズムの固着方法としてUV Furthermore, UV as a fixing method of a prism into the groove
硬化接着剤を用いてもよい。 It may also be used curing adhesive.

【0024】加えて、ここでは光導波路として一本の光導波路と一個の光素子の光結合系、プリズム搭載法に関する実施例についてしか記載していないが、本発明に係る光導波路−光素子結合構造およびその製造方法が複数本の光導波路にも適応できるのは言うまでもない。 [0024] In addition, where one optical waveguide and one of the optical coupling system of an optical device as an optical waveguide is not described only for examples relating to prism mounting method, the optical waveguide according to the present invention - optical element combination structure and a manufacturing method thereof is needless to say can be adapted to the optical waveguide of the plurality of lines.

【0025】 [0025]

【発明の効果】本発明によれば、導波路伝播光を効率よく受光素子に光結合できるとともに、光結合器であるプリズムの搭載位置の制限を受けないなどの特徴を有する。 According to the present invention, it is possible optically coupled to efficiently receiving element a waveguide propagating light has characteristics such as not limited by the mounting position of the prism is an optical coupler. 加えて、従来の反応性イオンエッチング技術によるミラーの形成と比べて大幅に製作時間を削減することができる。 In addition, it is possible to reduce significantly production times compared with the formation of the mirror by the conventional reactive ion etching technique.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の実施例に係る光導波路−光素子結合構造を示す構成図。 [1] optical waveguide according to an embodiment of the present invention - configuration diagram showing a configuration of an optical element coupling structure.

【図2】実施例の光導波路−光素子結合構造の製造方法の第1製作工程〜第5製作工程を示す説明図。 Explanatory view showing a first manufacturing step to the fifth manufacturing process of a method for manufacturing the optical element coupling structure - [2] The optical waveguide of Example.

【図3】実施例の光導波路−光素子結合構造の製造方法の第6製作工程〜第9製作工程を示す説明図。 [3] Example of an optical waveguide - 6 explanatory view showing a manufacturing step to ninth fabrication step of the manufacturing method of the optical element coupling structure.

【図4】従来の光導波路−光素子結合構造を示す構成図。 [4] Conventional optical waveguide - configuration diagram showing a configuration of an optical element coupling structure.

【図5】従来の光導波路−光素子結合構造の製造方法を示す説明図。 Explanatory view showing a method for manufacturing an optical element coupling structure - [5] Conventional optical waveguide.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 光導波路 2 受光素子 3 はんだバンプ 4 誘電体基板 4a 誘電体基板 4b 電気配線層 5 ミラー 6 受光素子受光面 7 電極パッド 8 プリズム 8a プリズム搭載面 9 プリズム搭載溝 10 光導波路コア形成用マスク 11 プリズム搭載溝形成用ストップ層 12 プリズム搭載溝深さ調整ストップ層 First optical waveguide second light receiving element 3 solder bumps 4 dielectric substrate 4a dielectric substrate 4b electric wiring layer 5 mirror 6 receiving element receiving surface 7 the electrode pads 8 prism 8a prism mounting surface 9 prism mounting groove 10 optical waveguide core forming mask 11 prism mounting groove forming a stop layer 12 prism mounting groove depth adjustment stop layer

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 6識別記号 庁内整理番号 FI 技術表示箇所 H01L 31/0232 ────────────────────────────────────────────────── ─── front page continued (51) Int.Cl. 6 in identification symbol Agency Docket No. FI art display portion H01L 31/0232

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 誘電体基板上で、相異なる誘電体を積層して構成される光導波路と光素子とを光結合させる構造において、 前記誘電体基板のうち、前記光素子が搭載される側で且つ前記光導波路の端部前方の位置に、前記光導波路面と平行な底面を持つ溝部を有し、 前記溝部に、前記光導波路の光軸と、搭載される前記光素子の光軸とを一致させる位置でプリズムが搭載され、 前記プリズムならびに前記光導波路を跨ぐ構造にて、前記光素子が前記誘電体基板上に搭載されていることを特徴とする光導波路−光素子結合構造。 In 1. A dielectric substrate, in the structure for optically coupling the configured optical waveguide and the optical element by laminating different dielectric of the dielectric substrate, the side where the optical element is mounted in and the ends forward position of the optical waveguide has a groove with the optical waveguide plane parallel to the bottom surface, the groove, the optical axis of the optical waveguide, and the optical axis of the optical element mounted prism is mounted in a position to match at structure across the prism and the optical waveguide, the optical waveguide wherein the optical element is characterized in that it is mounted on the dielectric substrate - an optical element coupling structure.
  2. 【請求項2】 請求項1記載の光導波路−光素子結合構造において、前記プリズムの一面、および、前記溝部の底面に金属コートを施し、さらに前記溝部の底面の金属コートの上面にはんだシートを設けるかあるいははんだ層を形成し、前記はんだシート上面あるいははんだ層上面に、前記プリズムのうち金属コートを施した面を搭載し、前記誘電体基板ならびに前記プリズムを加熱・溶融することにより、前記誘電体基板上に前記プリズムを接続することを特徴とする光導波路−光素子結合構造の製造方法。 2. A method according to claim 1, wherein the optical waveguide - In the optical element coupling structure, one surface of the prism, and is subjected to metal coating on the bottom of the groove, the more the solder on the upper surface of the metal coating on the bottom of the groove seat or to form a solder layer is provided, the solder sheet top or solder layer top surface, equipped with a surface which has been subjected to metal coating of the prism, by heating and melting the dielectric substrate and the prism, the dielectric method for manufacturing an optical element coupling structure - the optical waveguide, characterized by connecting the prism onto the body substrate.
  3. 【請求項3】 請求項1記載の光導波路−光素子結合構造において、前記プリズムの一面にはんだ層を形成し、 3. A process according to claim 1, wherein the optical waveguide - In the optical element coupling structure, to form a solder layer on one surface of the prism,
    および、前記溝部の底面に金属コートを施し、前記金属コートが施された溝部底面に、前記プリズムのうちはんだ層を形成した面を搭載し、前記誘電体基板ならびに前記プリズムを加熱・溶融することにより、前記誘電体基板上に前記プリズムを接続することを特徴とする光導波路−光素子結合構造の製造方法。 And, applying metal coating on the bottom of the groove, the groove bottom surface, wherein the metal coating has been applied, equipped with a surface forming a solder layer of the prism, heating and melting said dielectric substrate and said prism the optical waveguide is characterized by connecting said prism to said dielectric substrate - the method for manufacturing an optical element coupling structure.
  4. 【請求項4】 請求項1において、前記溝部に搭載された前記プリズムの面の内、前記光導波路の端部と相対する斜め面に反射膜が形成されていることを特徴とする光導波路−光素子結合構造。 4. The method of claim 1, of the surface of the prism mounted on the groove portion, the optical waveguide, wherein a reflective film on opposite oblique surface and an end portion of the optical waveguide is formed - optical element coupling structure.
JP30621093A 1993-12-07 1993-12-07 Structure for coupling optical waveguide with optical element and its production Pending JPH07159658A (en)

Priority Applications (1)

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JP30621093A JPH07159658A (en) 1993-12-07 1993-12-07 Structure for coupling optical waveguide with optical element and its production

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