JPH07158624A - Bonding structure - Google Patents

Abstract

PURPOSE:To enable the setting of such structure as to attain alignment simultaneously with the prevention of adhesive leakage by forming a bonded part into two-stage recessed shape, and changing the shape of a protruding part for alignment. CONSTITUTION:A cover 1 at a part of a groove is provided with a protrusion, differently from the other part so as to be able to determine the direction of the cover 1. At this time, the direction of the cover 1 is determined by engaging a recessed notch 8 with a protruding part 7. This engaged part can restrain the cover 1 from approaching the groove, and the overflow quantity of adhesive can be reduced. A failure caused by the leakage of adhesive can be thereby eliminated in the stage of manufacturing the product of an electronic circuit device for an automobile according to the demand of low cost. At the time of making structure simple and compact, alignment by the whole shape is attained at the same time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device for mounting inside an engine, and in bonding between constituent parts,
The present invention relates to an adhesive structure capable of simultaneously preventing leakage of an adhesive and aligning it.

[0002]

2. Description of the Related Art As a prior art, for example, in a hot-wire air flow meter, the structure of the recess is the structure of a single-stage groove,
Positioning is performed not by the shape of the convex portion but by the overall shape.

[0003]

In order to reduce the cost of automobile electronic circuit device products, it is necessary to eliminate defects due to leakage of adhesive at the manufacturing stage. Also, simplification of the structure for the purpose of downsizing may make it difficult to perform alignment based on the overall shape.

It is an object of the present invention to set up a structure that prevents the leakage of the adhesive and aligns it at the same time.

[0005]

In order to achieve the object of the present invention, it is necessary to form the concave portion in two stages in the shape of the portion to be adhered in order to prevent the leakage of the adhesive, and to perform the alignment. Therefore, it is necessary to change the shape of the convex portion.

[0006]

The adhesive can be prevented from leaking by forming the groove at the bonding portion in two stages, and the projection can be provided with the projection and the recess can be engaged with each other to perform the alignment.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A sectional view of a module to which the prior art is applied is shown in FIG. In the bonded structure to which this conventional technique is applied, there is a possibility that the adhesive leaks inward and the reliability of the hybrid IC substrate is impaired, depending on the amount of the adhesive. In the present invention, the leakage of the adhesive is suppressed by having the structure shown in the sectional view of FIG. 4 and 5 are enlarged views of the bonded portion between the housing and the cover. It is also possible to determine the direction of the cover by forming a protrusion in a part of the groove differently from the other part as shown in FIG. An enlarged view of the housing at this time is shown in FIG. 6, and an enlarged view of the cover is shown in FIG. At this time, the direction of the cover is determined by engaging the cutout (8) in FIG. 6 and the protrusion (7) in FIG. Further, this meshing portion can prevent the cover from entering the groove, and can reduce the amount of adhesive overflowing.

[0008]

By applying the present invention, it becomes possible to prevent the leakage of the adhesive and perform the alignment at the same time.

[Brief description of drawings]

FIG. 1 is a sectional view of a module to which a conventional technique is applied.

FIG. 2 is an enlarged cross-sectional view of an adhesive structure to which a conventional technique is applied.

FIG. 3 is a cross-sectional view of an adhesive structure according to the present invention.

FIG. 4 is an enlarged sectional view of an adhesive structure according to the present invention.

FIG. 5 is an enlarged cross-sectional view of an adhesive structure according to the present invention.

FIG. 6 is an enlarged view of a housing according to the present invention.

FIG. 7 is an enlarged view of a cover according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Cover, 2 ... Adhesives 1, 3 ... Housing, 4 ... Base, 5 ... Hybrid IC board, 6 ... Adhesives 2, 7 ... Convex protrusions, 8 ... Recessed crevices.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yasushi Narita 2477 Kashima Yatsu Kashima, Katsuta City, Ibaraki Prefecture 3 Hitachi Automotive Engineering Co., Ltd.

Claims (1)

[Claims] 1. An electronic circuit device composed of an electronic component semiconductor, a circuit board, a connector, a cover, a housing, etc., wherein the structure for adhering between the cover and the housing has a two-step groove with a recess. The convex part is inserted in the deeper groove of the groove of the groove and the adhesive pushed out from the deep groove is stored in the shallow groove. Adhesive structure to do.