JPH0715825A - Outer semiconductive layer cutting apparatus - Google Patents

Abstract

PURPOSE:To provide an apparatus for cutting an outer semiductive layer uniformly with high quality. CONSTITUTION:The outer semiconductive layer cutting apparatus being fixed detachably to a power cable 3 having an exposed outer semiconductive layer 2 comprises a cutting head 17 for cutting the outer semiconductive layer 2 while reciprocating radially and rotary fed intermittently around the power cable 3. The cutting machine further comprises a detector 42 for detecting the lightness at a cutting part R of the outer semiconductive layer 2, a detector 43 for detecting the axial position of the cutting head 17, means 52 for storing the axial position of the cutting head 17 corresponding to an uncut position detected by the lightness detector 42, and means 53 for commanding to cut only the uncut part stored in the memory means 52.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to an external semiconductive layer cutting device.

[0002]

2. Description of the Related Art In a CV cable or other rubber or plastic insulated power cable, an outer semiconductive layer having a thickness of about 0.1 mm to 2.0 mm is coated on an insulating layer made of rubber or plastic. When connecting the power cable, it is necessary to remove the outer semiconductive layer of the cable end,
The outer semiconductive layer was manually scraped off by a worker using a piece of glass.

[0003]

Therefore, there has been a problem that the shaving state of the outer semiconductive layer greatly differs depending on the skill of the operator, which adversely affects the quality and performance of the power cable.

Therefore, an object of the present invention is to provide an external semiconductive layer cutting device capable of eliminating variations in the cutting state of the external semiconductive layer and finishing the product to a uniform quality.

[0005]

In order to achieve the above object, the present invention relates to an external semiconductive layer cutting device detachably attached to a power cable having an external semiconductive layer exposed. It has a cutting head that cuts the conductive layer while reciprocating in the axial direction of the power cable, and is provided with an intermittent rotary feed around the axial center of the power cable, and of the cut portion of the outer semiconductive layer. A lightness detector that detects lightness,
A position detector for detecting the axial position of the cutting head,
Storage means for storing the axial position of the cutting head corresponding to the uncut portion detected by the brightness detector, and cutting control means for instructing to cut only the uncut portion stored in the storage means. And ,.

[0006]

According to the present invention, the outer semiconductive layer can be cut by moving the cutting head in the axial direction of the power cable. Furthermore, if the cutting head is rotated intermittently and the outer semiconductive layer is cut in the axial direction at each rotation position, the entire circumference can be cut.

When the outer semiconductive layer is cut in the axial direction, only the uncut portion of the outer semiconductive layer stored by the cooperation of the brightness detector and the position detector is cut, and the variation of the cutting removal state is caused. Can be eliminated.

[0008]

The present invention will be described in detail below with reference to the drawings showing the embodiments.

FIG. 1 is a sectional side view of an external semiconductive layer cutting device according to the present invention, and FIG. 2 exemplifies a sectional front view thereof.

In the figure, reference numerals 1 and 1 denote a pair of cable holders arranged at predetermined intervals, which are detachably attached to a power cable 3 having an external semiconductive layer 2 exposed at predetermined intervals in the axial direction. To be

As shown in FIGS. 1 and 3, the cable holder 1 is provided with holder arcuate halves 4 and 4 along the outer circumference of the outer semiconductive layer 2.

With the holder halves 4 and 4, the outer semiconductive layer 2 is formed.
And the projecting pieces 5, 5 of both holder halves 4, 4 are clamped with a fixture 6, such as a bolt and nut, which is omitted from the alternate long and short dash line, and fixed in a gripping manner.

By the way, the power cable 3 includes a central conductor portion 7, a thick insulating layer 8 made of rubber or plastic (eg, crosslinked PE), and a thin outer semiconductive layer 2 having a thickness of about 0.1 mm to 2.0 mm. , A sheath (not shown) covering the outer semiconductive layer 2, and in the illustrated example, both cable holders 1, 1
Is fixed to the outer semiconductive layer 2, but one (the left side in the drawing) of the cable holder 1 may be fixed to the sheath. The outer semiconductive layer 2 is usually composed of carbon black-containing EVA, EEA, etc., and its hardness tends to be slightly lower than that of the crosslinked PE insulating layer 8.

As shown in FIGS. 1 and 2, each cable holder 1 is provided with a base block 9 in series.
The pair of base blocks 9, 9 are connected by a cylindrical slide shaft 10, 10 in the axial direction of the power cable 3.

The slide shafts 10, 10 are arranged in parallel with each other, and a screw shaft 11 parallel to the slide shaft 10 is provided at an intermediate portion thereof.
Is rotatably attached to the base blocks 9, 9.

One end of the screw shaft 11 projects outward from the one base block 9, and a timing pulley 12 is attached to the one end.

Further, a motor 13 is fixed to one of the base blocks 9, and a timing pulley 14 is attached to a rotation output shaft of the motor 13.

A timing belt 15 is wound around the timing pulleys 12 and 14 so as to mesh with each other, and a motor 13
The forward / reverse rotation driving of the screw shaft 11 causes the screw shaft 11 to rotate forward / reversely around its axis.

A frame 16 is attached to the slide shafts 10 and 10.
A reciprocating plate 18 having a cutting head 17 and a cutting head 17 is slidably attached, and the reciprocating plate 18 is reciprocally driven along the slide shafts 10 and 10 by a linear feed means 24, and a rotary feed means 31 is used. The cutting head 17 is intermittently driven to rotate.

Specifically, the frame 16 has a plate-shaped base portion 19
And a cylindrical boss portion 20 protruding from the base portion 19 in the axial direction.
And the shaft hole 21 of the boss 20 has a power cable 3
Is loosely inserted.

At the lower end of the base 19, a pair of insertion holes 22, 22 are provided.
And screw holes 23 are formed respectively, and the slide shafts 10 and 10 are slidably inserted into the insertion holes 22 and 22, and the screw holes
The screw shaft 11 is screwed into the screw 23.

Therefore, when the screw shaft 11 is rotated by the drive of the motor 13, the reciprocating plate 18 is screwed back and forth, and the slide shaft 10,
Move along 10. The motor 13, the screw shaft 11, the timing pulleys 12 and 14, the timing belt 15 and the screw hole 23.
The linear feed means 24 is configured by the above.

A position detector 43 such as a rotary encoder is provided at the other end of the screw shaft 11 so that the axial position of the reciprocating movable plate 18 can be detected.

A stepping motor 25 is fixed to the upper end of the base portion 19, and a pinion gear 26 is attached to the rotary shaft of the stepping motor 25.

Next, the cutting head 17 has a cylindrical portion 27, a flange portion 28 protruding from one end of the cylindrical portion 27 in the outer diameter direction,
Consists of.

The inner peripheral surface of the cylindrical portion 27 is pivotally attached to the outer peripheral surface of the boss portion 20 via a bearing 29, and the cutting head 17 is rotatable about the axis of the power cable 3.

Further, a gear 30 is provided on the outer peripheral surface of the cylindrical portion 27, and the pinion gear 26 meshes with the gear 30.

Therefore, when the stepping motor 25 is rotationally driven by a predetermined angle, the cutting head 17 is rotated by a predetermined angle via the pinion gear 26 and the gear 30. The stepping motor 25, the pinion gear 26, the gear 30, and the like constitute the rotary feed means 31.

Further, three auxiliary wheels 33 are provided on the end surface of the flange portion 28 of the cutting head 17 and the end surface of the base portion 19 of the frame 16 via supporting members 32.

The auxiliary wheels 33 ... Can roll on the outer peripheral surface of the outer semiconductive layer 2 in the axial direction thereof, and can be reciprocally moved.
During the reciprocating movement of 18, the power cable 3 is supplementarily supported.

Further, a cutting blade 34 is attached to the cutting head 17 so as to come into contact with and separate from the outer semiconductive layer 2 from the outer diameter direction.

Specifically, on the end surface of the flange portion 28, a fluid cylinder 35 driven by hydraulic pressure or pneumatic pressure, and a fluid cylinder 35
Is attached to the slide member 36 that reciprocates in the radial direction by the drive, and the cutting blade 34 is fixed to the slide member 36 via the fixing member 37.

The cutting blade 34 is pressed against the outer semiconductive layer 2 from the outer diameter direction by the driving of the fluid cylinder 35, and the reciprocating plate is moved.
By moving the 18 (cutting head 17) along the slide shafts 10 and 10, it is possible to cut the outer semiconductive layer 2 into a band shape in the axial direction by the cutting blade 34 (see FIG. 6).

Reference numeral 38 is a pressing force detector for detecting the pressing force of the cutting blade 34 against the outer semiconductive layer 2, and a load cell or the like is used.

The cutting blade 34 is plate-shaped, and the cutting edge 39 thereof is formed in an arc shape as shown in FIG. 4 or a linear shape as shown in FIG.

Then, as shown in FIG. 7, the pressing force of the cutting blade 34 against the outer semiconductive layer 2 is controlled by the pressing force control means 47.
It is controlled to a predetermined value set by the setter 48.

The pressing force control means 47 includes a pressure proportional control valve 49,
It is composed of a fluid cylinder 35, a pressing force detector 38, etc., a signal from the pressing force detector 38 is fed back to the pressure proportional control valve 49, the pressure of the fluid cylinder 35 is controlled, and the pressing force of the cutting blade 34 is It is held at a predetermined value.

Further, as shown in FIG. 1, on the end face of the flange portion 28, radial displacement of each portion of the strip-shaped cut portion R (see FIG. 6) of the outer semiconductive layer 2 is provided via the mounting piece 40. A displacement sensor 41 for detecting (for example, cutting allowance) and a lightness detector 42 for detecting lightness of each portion of the cut portion R are attached.
As the lightness detector 42, a color sensor or a reflection type optical sensor is used.

As shown in FIGS. 6 and 7, the insulating layer 8 is usually used.
Is white and the outer semiconductive layer 2 is black. Therefore, the outer semiconductive layer 2 is completely removed by cutting and the insulating layer 8 is exposed (white). The lightness detector 42 can detect the (black) portion of the outer semiconductive layer 2 such as uncut portion, which is hereinafter referred to as an uncut portion M.

Based on the lightness data detected by the lightness detector 42, the lightness determining means 46 including the comparator 44 and the setting device 45 completes the cutting of the predetermined cut portion R in the outer semiconductive layer 2. Whether or not it is determined.

That is, by the comparator 44, the uncut portion M /
(Cut portion S + uncut portion M), that is, the ratio of black / (white + black), and the judgment reference value set by the setter 45 (for example, 5
%) Is compared with, and if it is less than the judgment reference value,
It is determined that the cutting of the corresponding cut portion R is completed.

The judgment result of the lightness judgment means 46 is the cutting control means.
If it is determined that the cutting is completed, the cutting control means 53 gives a command to the stepping motor 25 to cause the cutting head 17 to move to the next cutting target, as shown in FIGS. 1, 6 and 7. The cutting portion R ₁ is rotationally driven at a preset rotational angle.

Further, the cutting head 17 corresponding to the black uncut portion M in the brightness data detected by the brightness detector 42 (detected by the position detector 43), that is, the cutting blade 34 in the axial direction. The position is stored in the storage means 52.

The cutting control means 53 gives a command to the motor 13 and the pressure proportional control valve 49 to cut only the uncut portion M stored in the storage means 52.

Next, the displacement sensor 41 stores the radial position of each portion of the cut portion R before cutting, detects the displacement of each portion of the cut portion R after cutting, and detects the cutting allowance. .

The cutting allowance detected by the displacement sensor 41 is compared with the limit value of the cutting allowance set by the setter 50 by the comparator 51. If the cutting allowance exceeds the limit value, the cutting by the brightness determining means 46 is performed. Regardless of the completion determination result, a command is given to the stepping motor 25 via the cutting control means 53 to make the cutting head 17
Is rotated to the next cut portion R ₁ .

By doing so, excessive cutting of the insulating layer 8 can be prevented, and the required thickness can be secured, so it is safe even when using high-voltage power. Moreover, it also functions as an alarm for irregularities on the cutting surface.

Now, an example of a procedure for cutting the outer semiconductive layer 2 by the outer semiconductive layer cutting device configured as described above will be described below.

The outer semiconductive layer 2 is attached to the cable holders 1, 1
When the device is started in the state of being clamped by, the command is given to the motor 13 from the cutting control means 53 and the cutting blade 34
However, the external semiconductive layer 2 is cut by moving in the axial direction while pressing the first cut portion R with a predetermined pressure.

At the same time, the displacement sensor 41 detects the cutting allowance, and the brightness detector 42 detects the brightness.

When the outer semiconductive layer 2 is cut in the axial direction by the required length, the cutting blade 34 returns to its original position, the first cutting of the first cut portion R is completed, and the lightness judging means 46. At, it is determined whether the cutting is completed, and at the comparator 51, it is determined whether the cutting allowance exceeds the limit value.

If the cutting allowance does not exceed the limit value and the cutting is not completed yet, the uncut portion in the first cut part R is cut until the cutting allowance exceeds the limit value or the cutting is completed. Only M is pressed by the cutting blade 34 with a predetermined pressure and repeatedly cut.

If the cutting allowance exceeds the limit value or the cutting is completed, the cutting head 17 rotates to the next cut portion R ₁ .

Then, the same procedure as described above is repeated,
The outer semiconductive layer 2 is cut all around.

In addition, in the above cutting procedure, there may be a case where the entire cut portion R including the cut portion S is repeatedly cut without repeatedly cutting only the uncut portion M.

As described above, when the power cable 3 is connected, the outer semiconductive layer 2 of the cable terminal can be simply and automatically removed, and the labor and labor can be saved.

At this time, in order to perform the cutting work in the clean booth like the prefabricated joint, the portion to be cut is covered and the cut pieces are collected to prevent environmental pollution due to residual foreign matters and the like.

Although the electric power cable 3 is subjected to a straightening operation for straightening it by removing curling at the time of drum winding or bending at the time of drawing in before connecting, it is extremely difficult to make it completely straight. Even when the power cable 3 is not in the straight state as described above at the time of cutting, the pressing force control means 47
Since it is possible to perform cutting by controlling the pressing force of the cutting blade 34 to a predetermined value, the outer semiconductive layer 2 can be removed satisfactorily and smoothly.

Further, the lightness judging means 46 judges the completion of cutting of each cut portion R ... Of the outer semiconductive layer 2 and cooperates with the rotary feeding means 31 to make the outer semiconductive layer 2 over the entire circumference. , It is possible to automatically cut in a predetermined cutting state.

[0060]

Since the present invention is constructed as described above, it has the following great effects.

The outer semiconductive layer 2 of the power cable 3 can be safely and automatically removed without any manual work, and the variation in the cutting removal state of the outer semiconductive layer 2 can be eliminated, and the uniform quality can be obtained. Can be finished.

Further, even if the thickness of the outer semiconductive layer 2 is partially different or partially uneven, the brightness detector 42
Since only the uncut portion M that has been stored can be cut by the cooperation of the position detector 43 and the position detector 43, the cut portion S (insulating layer 8) is not excessively cut, and the uncut portion can be reliably eliminated. Become.

[Brief description of drawings]

FIG. 1 is a sectional side view showing an embodiment of the present invention.

FIG. 2 is a sectional front view.

FIG. 3 is a front view of a cable holder.

FIG. 4 is an enlarged front view of a main part of a cutting blade.

FIG. 5 is an enlarged front view of a main part of a modified example of the cutting blade.

FIG. 6 is a plan view showing a cut state of an outer semiconductive layer.

FIG. 7 is a block diagram showing an overall configuration.

[Explanation of symbols]

 2 External semi-conductive layer 3 Power cable 17 Cutting head 42 Brightness detector 43 Position detector 52 Memory means 53 Cutting control means R Cut part M Uncut part

Front page continuation (72) Inventor Tadashi Asai 8 Nishinomachi, Higashimukaijima, Amagasaki City, Hyogo Prefecture Mitsubishi Electric Wire & Cable Co., Ltd.

Claims (1)

[Claims] 1. An external semiconductive layer cutting device detachably attached to a power cable having an exposed external semiconductive layer, the external semiconductive layer being cut while reciprocating in the axial direction thereof. A lightness detector that has a cutting head that is intermittently fed around the axis of the power cable, and that detects the lightness of the cut portion of the external semiconductive layer,
A position detector for detecting the axial position of the cutting head,
Storage means for storing the axial position of the cutting head corresponding to the uncut portion detected by the brightness detector, and cutting control means for instructing to cut only the uncut portion stored in the storage means. An external semiconducting layer cutting device comprising: