JPH07157895A - Composite plating device - Google Patents
Composite plating deviceInfo
- Publication number
- JPH07157895A JPH07157895A JP30424193A JP30424193A JPH07157895A JP H07157895 A JPH07157895 A JP H07157895A JP 30424193 A JP30424193 A JP 30424193A JP 30424193 A JP30424193 A JP 30424193A JP H07157895 A JPH07157895 A JP H07157895A
- Authority
- JP
- Japan
- Prior art keywords
- composite plating
- electrode
- peripheral surface
- inner peripheral
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cylinder Crankcases Of Internal Combustion Engines (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、エンジンのシリンダの
ような中空部材の内周面に、例えばニカジルメッキと呼
ばれる複合メッキを施す装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying a composite plating, such as Nikasil plating, to the inner peripheral surface of a hollow member such as an engine cylinder.
【0002】[0002]
【従来の技術】例えばエンジンのシリンダは内部をピス
トンが摺動するため、特にシリンダブロックがアルミ合
金からなる場合にはシリンダの内周面の耐摩耗性を向上
させる必要がある。ところで、クランク掃気式の2サイ
クルエンジンのようにシリンダの内周面に開口部を設け
なければならない場合にはシリンダ内にスリーブを嵌着
させることが困難であり、この様な場合にシリンダの内
周面に複合メッキを施す場合がある。このようなシリン
ダの内周面に複合メッキを施すものとしては、シリンダ
の内周面との間に隙間を存して電極を挿入し、該隙間に
硫酸ニッケル中に炭化珪素の微粒子を混入させた複合メ
ッキ液を流し、ニッケル中に炭化珪素の微粒子を包含さ
せた、いわゆるニカジルメッキを施すものが知られてい
る。ところが、微粒子を複合メッキ層内に包含させるた
めには複合メッキ液の流速をあまり速くすることができ
ず、このため隙間における複合メッキ液の流れが層流状
態になる。すると、複合メッキ液の上流側では炭化珪素
等の微粒子が複合メッキ層内によく包含されるが、下流
側では内周面近傍の複合メッキ液の微粒子の含有量が減
少するため複合メッキ層内の微粒子の包含量が減少し、
上流側と下流側とで複合メッキ層が不均一になるという
不具合がある。2. Description of the Related Art For example, since a piston slides inside a cylinder of an engine, it is necessary to improve the wear resistance of the inner peripheral surface of the cylinder especially when the cylinder block is made of aluminum alloy. By the way, it is difficult to fit the sleeve into the cylinder when an opening is required to be provided on the inner peripheral surface of the cylinder as in a crank scavenging two-cycle engine. The peripheral surface may be subjected to composite plating. As a method of performing composite plating on the inner peripheral surface of such a cylinder, an electrode is inserted with a gap between the inner peripheral surface of the cylinder and the fine particles of silicon carbide mixed into nickel sulfate. It is known to perform so-called Nikasil plating in which nickel is mixed with fine particles of silicon carbide by flowing a composite plating solution. However, the flow rate of the composite plating solution cannot be increased so much in order to include the fine particles in the composite plating layer, so that the flow of the composite plating solution in the gap becomes a laminar flow state. Then, on the upstream side of the composite plating solution, fine particles such as silicon carbide are often included in the composite plating layer, but on the downstream side, the content of the fine particles of the composite plating solution near the inner peripheral surface decreases, so that The amount of fine particles contained in
There is a problem that the composite plating layer becomes non-uniform on the upstream side and the downstream side.
【0003】このような不具合を解決するものとして、
例えば特開昭52−93636号公報により、複合メッ
キ液の流れ方向を一定周期毎に反転させるようにしたも
のが知られている。To solve such a problem,
For example, Japanese Patent Laid-Open No. 52-93636 discloses a device in which the flow direction of the composite plating solution is reversed at regular intervals.
【0004】[0004]
【発明が解決しようとする課題】上記従来の複合メッキ
液の流れ方向を一定周期毎に反転させるものでは、シリ
ンダの両端部分の複合メッキの状態を同様にすることは
できても中央部分は両端部より複合メッキされにくいと
いう不具合があり、円筒部の長さが長くなるに連れその
傾向は大きくなる。In the above-mentioned conventional one in which the flow direction of the composite plating solution is reversed at regular intervals, the state of composite plating at both end portions of the cylinder can be made the same, but the central portion is at both ends. There is a problem that composite plating is less likely to occur than the cylindrical portion, and this tendency increases as the length of the cylindrical portion increases.
【0005】そこで本発明は、上記の問題点に鑑み、中
空部材の内周面に均一に複合メッキを施すことのできる
複合メッキ装置を提供することを目的とする。In view of the above problems, it is an object of the present invention to provide a composite plating apparatus capable of uniformly performing composite plating on the inner peripheral surface of a hollow member.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
に、請求項1の発明は、中空部材の内周面に複合メッキ
を施す装置において、中空部材を内周面の母線が上下方
向を向くように保持した状態で、該内周面との間に所定
間隔の隙間を存して挿入される電極と、挿入状態にある
電極の下方に対向する吐出口を有し該吐出口の内径が該
電極の外径寸法と同径もしくはそれより小径の複合メッ
キ液供給管とを備え、該吐出口から上記隙間に、気泡を
含んだ複合メッキ液を供給するようにしたことを特徴と
する。In order to achieve the above object, the invention of claim 1 is an apparatus for performing a composite plating on the inner peripheral surface of a hollow member, wherein the generatrix of the inner peripheral surface of the hollow member is vertical. The electrode is inserted so as to have a predetermined gap between it and the inner peripheral surface in a state of being held so as to face, and the discharge port facing below the electrode in the inserted state has an inner diameter of the discharge port. Is provided with a composite plating solution supply pipe having a diameter equal to or smaller than the outer diameter of the electrode, and the composite plating solution containing bubbles is supplied from the discharge port to the gap. .
【0007】請求項2の発明は、上記請求項1の発明に
おいて、上記電極の先端部を先端に向って漸次小径に形
成したことを特徴とする。The invention of claim 2 is characterized in that, in the invention of claim 1, the tip portion of the electrode is formed to have a gradually smaller diameter toward the tip.
【0008】[0008]
【作用】複合メッキ液中に気泡を混入させると、該気泡
の上昇により複合メッキ液が攪拌され、隙間内における
複合メッキ液の流れが乱流になり、内周面の下流側の部
分にも微粒子を含んだ複合メッキ液が供給され複合メッ
キ層が均一化される。そして更に、上記吐出口の内径を
電極の外径と同じかそれよりも小さくすると、吐出口か
ら中空部へ吐出された複合メッキに含まれる気泡は全て
一旦電極の先端に衝突する。すると、気泡は電極の表面
に付着し、電極の表面に付着したまま隙間内を上昇す
る。気泡は、気泡の上部に位置する複合メッキ液を押し
のけながら上昇するので、気泡の上昇により電極表面近
傍の微粒子を多く含む複合メッキ液が中空部材の内周面
側に押しのけられ、これにより内周面の全域にわたって
微粒子を多く含んだ複合メッキ液が供給されて複合メッ
キ層中の微粒子の包含量が更に均一になる。When bubbles are mixed in the composite plating solution, the rise of the bubbles causes the composite plating solution to be agitated, the flow of the composite plating solution in the gap becomes a turbulent flow, and the downstream portion of the inner peripheral surface is also affected. A composite plating solution containing fine particles is supplied to make the composite plating layer uniform. Further, when the inner diameter of the ejection port is equal to or smaller than the outer diameter of the electrode, all the bubbles contained in the composite plating ejected from the ejection port to the hollow portion once collide with the tip of the electrode. Then, the bubbles adhere to the surface of the electrode and rise in the gap while being adhered to the surface of the electrode. Since the bubbles rise while pushing away the composite plating solution located above the bubbles, the rise of the bubbles displaces the composite plating solution containing many fine particles near the electrode surface toward the inner peripheral surface of the hollow member, thereby The composite plating solution containing a large amount of fine particles is supplied over the entire area of the surface, so that the inclusion amount of the fine particles in the composite plating layer becomes more uniform.
【0009】尚、電極の先端に衝突し付着した気泡が電
極の表面に沿って上昇する際に気泡の移動方向が急激に
変化すると気泡が電極の表面から剥離するおそれがあ
る。そこで上記のごとく電極の先端部を先端に向って漸
次小径にすることにより気泡の移動方向が急激に変化し
ないようにして気泡の剥離を防止する。When bubbles adhering to the tip of the electrode rise along the surface of the electrode and the direction of movement of the bubble changes abruptly, the bubble may be separated from the surface of the electrode. Therefore, as described above, the tip portion of the electrode is gradually reduced in diameter toward the tip so that the moving direction of the bubble does not suddenly change and the peeling of the bubble is prevented.
【0010】[0010]
【実施例】図1を参照して、Wはアルミ合金からなる2
ストロークエンジンのシリンダブロックであり、上下に
貫通するシリンダWcを備えており、給気及び掃気用の
空間Sが該シリンダWcに開口して設けられており、該
空間SはキャップCによって外部に対して密閉されてい
る。該シリンダブロックWは保持台1上に載置され、該
保持台1に設けられた複合メッキ液供給管11とシリン
ダWcとが一致するように設定されている。また、該シ
リンダWcには上方から先端が略半球形に形成された電
極2が挿入されており、該電極2とシリンダWcの内周
面Wfとの間には隙間Gが形成され、複合メッキ液供給
管11から供給される複合メッキ液が該隙間G内を流れ
るように設定されている。ここで、電極2の直径をDと
し、複合メッキ液供給管11の該電極2の先端に対向す
る吐出口11aの内径をdとすると、本実施例の場合D
>dとした。EXAMPLES Referring to FIG. 1, W is made of an aluminum alloy 2
It is a cylinder block of a stroke engine, has a cylinder Wc penetrating up and down, and a space S for supply and scavenging is provided in the cylinder Wc so that the space S is opened to the outside by a cap C. Are sealed. The cylinder block W is placed on the holding table 1, and the composite plating solution supply pipe 11 provided on the holding table 1 and the cylinder Wc are set to coincide with each other. Further, an electrode 2 having a substantially hemispherical tip is inserted into the cylinder Wc from above, and a gap G is formed between the electrode 2 and the inner peripheral surface Wf of the cylinder Wc to perform composite plating. The composite plating solution supplied from the solution supply pipe 11 is set to flow in the gap G. Here, if the diameter of the electrode 2 is D and the inner diameter of the discharge port 11a of the composite plating solution supply pipe 11 facing the tip of the electrode 2 is d, then in the case of this embodiment D
> D.
【0011】ところで、該複合メッキ液供給管11は管
路12を介して図外の複合メッキ液供給用のポンプに接
続されており、また該管路12の途中には空気混入路1
3が接続されている。該空気混入路13には図外のコン
プレッサが接続されており所定量の空気を管路12内の
複合メッキ液中に混入させるように構成されている。こ
のように混入された空気は気泡14となって複合メッキ
液と共に複合メッキ液供給管11を上昇し、吐出口11
aからシリンダWc内に吐出される。そして、上記隙間
G内を流れてシリンダブロックWの上面を押えている押
え部材3の空間31内に流出し、管路32を介して図外
のタンクへと還流される。そして、該タンク内にて抜気
された後、再びポンプにより管路12に送り出される。By the way, the composite plating solution supply pipe 11 is connected to a pump (not shown) for supplying the composite plating solution through a pipe line 12, and an air mixing passage 1 is provided in the middle of the pipe line 12.
3 is connected. A compressor (not shown) is connected to the air mixing path 13 so that a predetermined amount of air is mixed into the composite plating solution in the conduit 12. The air thus mixed becomes bubbles 14 and rises in the composite plating solution supply pipe 11 together with the composite plating solution, and the discharge port 11
It is discharged from a into the cylinder Wc. Then, it flows through the gap G, flows out into the space 31 of the holding member 3 holding the upper surface of the cylinder block W, and is returned to the tank (not shown) via the pipe 32. Then, after being degassed in the tank, it is sent again to the conduit 12 by the pump.
【0012】上記構成によれば、図2に示すように、D
>dに設定されているので、吐出口11aから吐出され
る複合メッキ液中の気泡14は全て電極2の先端に衝突
し電極2の表面に付着する。電極2の先端を略半球形に
形成したので、電極2の表面に付着した気泡14は剥離
することなく該表面に付着しながら上昇する。この時、
電極2の表面に付着している気泡14の上部Pに位置す
る十分に微粒子を含んだ複合メッキ液は、気泡が上昇す
ることにより内周面Wfに向って押しのけられる。気泡
14は電極2の表面に沿ってシリンダWcの上端に対応
する部分まで上昇するので、内周面Wfの全域にわたっ
て、電極2側から内周面Wfに向って微粒子を多く含ん
だ複合メッキ液が供給され、均一な複合メッキ層が得ら
れる。According to the above configuration, as shown in FIG.
Since> d is set, all the bubbles 14 in the composite plating solution ejected from the ejection port 11a collide with the tip of the electrode 2 and adhere to the surface of the electrode 2. Since the tip of the electrode 2 is formed in a substantially hemispherical shape, the bubbles 14 adhering to the surface of the electrode 2 do not separate but rise while adhering to the surface. This time,
The composite plating liquid, which is located on the upper portion P of the bubble 14 adhering to the surface of the electrode 2 and contains sufficient fine particles, is pushed away toward the inner peripheral surface Wf as the bubble rises. Since the bubbles 14 rise along the surface of the electrode 2 to a portion corresponding to the upper end of the cylinder Wc, the composite plating solution containing a large amount of fine particles from the electrode 2 side toward the inner peripheral surface Wf over the entire inner peripheral surface Wf. Is supplied to obtain a uniform composite plating layer.
【0013】尚、本実施例の場合、複合メッキ液として
水1リットル当たりに硫酸ニッケル400グラム・ほう
酸35グラム・炭化珪素の微粉末60グラムを添加し、
更にサッカリンナトリウムを2.5グラム加えて硬度調
整したpH=4のものを用い、炭化珪素の微粒子を包含
したニッケルが複合メッキされる、いわゆるニカジルメ
ッキと呼ばれる複合メッキを施すようにした。また複合
メッキ条件は、空気を混入しない場合における隙間Gで
の複合メッキ液流速が15cm/sで、複合メッキ液温度が
60℃で、陰極電流密度が28A/dm2である。また、吐
出口11aの内径dを電極2の直径Dより小さくした
が、両者を同一寸法に設定してもよく、その場合であっ
ても全ての気泡14を電極2の表面に付着させることが
できる。In this embodiment, 400 g of nickel sulfate, 35 g of boric acid, and 60 g of fine powder of silicon carbide were added to 1 liter of water as a composite plating solution.
Further, 2.5 g of saccharin sodium was added to adjust the hardness to pH = 4, and composite plating called nickel plating containing nickel particles containing silicon carbide was performed. The composite plating conditions are that the flow rate of the composite plating solution in the gap G when air is not mixed is 15 cm / s, the temperature of the composite plating solution is 60 ° C., and the cathode current density is 28 A / dm 2 . Although the inner diameter d of the discharge port 11a is smaller than the diameter D of the electrode 2, both may be set to have the same size, and even in that case, all the bubbles 14 can be attached to the surface of the electrode 2. it can.
【0014】ところで、上記実施例では空気を単に混入
させたが、気泡の大きさを小さくする場合には、多孔質
素材を介して空気を混入させたり、吐出口より上流側で
複合メッキ液を攪拌して気泡を細分化するようにすれば
よい。また、上記実施例では、電極2の先端を略半球形
に形成したが、テーパ状やその他の形状であっても、先
端に向って漸次細くなる形状であればよい。更に、複合
メッキ液に空気を混入させたが、ヘリウムガス・アルゴ
ンガス・窒素ガス、その他の不活性ガスを混入させても
よい。By the way, although air is simply mixed in the above-mentioned embodiment, when the size of bubbles is reduced, air is mixed through a porous material or a composite plating solution is provided upstream of the discharge port. It suffices to stir to break up the bubbles. Further, in the above-mentioned embodiment, the tip of the electrode 2 is formed in a substantially hemispherical shape, but it may have a tapered shape or any other shape as long as the shape gradually becomes smaller toward the tip. Further, although air is mixed in the composite plating solution, helium gas, argon gas, nitrogen gas, or other inert gas may be mixed.
【0015】[0015]
【発明の効果】以上の説明から明らかなように、本発明
によれば、複合メッキ液に混入させた気泡を電極に沿わ
せて上昇させ電極表面付近の微粒子を多く含んだ複合メ
ッキ液を内周面全域に供給するようにしたので、該内周
面に均一な複合メッキを施すことができる。As is apparent from the above description, according to the present invention, the composite plating solution containing a large amount of fine particles in the vicinity of the electrode surface is generated by raising the bubbles mixed in the composite plating solution along the electrode. Since it is supplied to the entire peripheral surface, uniform composite plating can be applied to the inner peripheral surface.
【図1】 本発明を実施するための装置の構成を示す図FIG. 1 is a diagram showing a configuration of an apparatus for carrying out the present invention.
【図2】 電極表面に付着した気泡の詳細を示す部分拡
大図FIG. 2 is a partially enlarged view showing details of bubbles attached to the electrode surface.
1 保持台 2 電極 3 押え部材 11a 吐出口 13 空気混入路 14 気泡 D 電極の直径 d 吐出口の内径 G 隙間 Wc シリンダ Wf 内周面 DESCRIPTION OF SYMBOLS 1 Holding table 2 Electrode 3 Holding member 11a Discharge port 13 Air mixing path 14 Bubble D Electrode diameter d Discharge port inner diameter G Gap Wc Cylinder Wf Inner peripheral surface
Claims (2)
置において、中空部材を内周面の母線が上下方向を向く
ように保持した状態で、該内周面との間に所定間隔の隙
間を存して挿入される電極と、挿入状態にある電極の下
方に対向する吐出口を有し該吐出口の内径が該電極の外
径寸法と同径もしくはそれより小径の複合メッキ液供給
管とを備え、該吐出口から上記隙間に、気泡を含んだ複
合メッキ液を供給するようにしたことを特徴とする複合
メッキ装置。1. An apparatus for performing composite plating on an inner peripheral surface of a hollow member, wherein the hollow member is held with the generatrix of the inner peripheral surface facing in the vertical direction, and a predetermined interval is provided between the hollow member and the inner peripheral surface. Supplying a composite plating solution having an electrode inserted with a gap and an ejection port facing below the electrode in the inserted state, the inner diameter of the ejection port being the same as or smaller than the outer diameter of the electrode A composite plating apparatus comprising a pipe and supplying a composite plating liquid containing bubbles from the discharge port to the gap.
径に形成したことを特徴とする請求項1記載の複合メッ
キ装置。2. The composite plating apparatus according to claim 1, wherein the tip portion of the electrode is formed to have a gradually smaller diameter toward the tip.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30424193A JP2791740B2 (en) | 1993-12-03 | 1993-12-03 | Composite plating equipment |
US08/326,372 US5516417A (en) | 1993-10-22 | 1994-10-20 | Method and apparatus for applying composite plating on hollow member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30424193A JP2791740B2 (en) | 1993-12-03 | 1993-12-03 | Composite plating equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07157895A true JPH07157895A (en) | 1995-06-20 |
JP2791740B2 JP2791740B2 (en) | 1998-08-27 |
Family
ID=17930695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30424193A Expired - Fee Related JP2791740B2 (en) | 1993-10-22 | 1993-12-03 | Composite plating equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2791740B2 (en) |
-
1993
- 1993-12-03 JP JP30424193A patent/JP2791740B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2791740B2 (en) | 1998-08-27 |
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