JP2791740B2 - Composite plating equipment - Google Patents

Composite plating equipment

Info

Publication number
JP2791740B2
JP2791740B2 JP30424193A JP30424193A JP2791740B2 JP 2791740 B2 JP2791740 B2 JP 2791740B2 JP 30424193 A JP30424193 A JP 30424193A JP 30424193 A JP30424193 A JP 30424193A JP 2791740 B2 JP2791740 B2 JP 2791740B2
Authority
JP
Japan
Prior art keywords
composite plating
electrode
plating solution
peripheral surface
inner peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30424193A
Other languages
Japanese (ja)
Other versions
JPH07157895A (en
Inventor
拓士 近藤
裕昭 間瀬
清信 溝上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP30424193A priority Critical patent/JP2791740B2/en
Priority to US08/326,372 priority patent/US5516417A/en
Publication of JPH07157895A publication Critical patent/JPH07157895A/en
Application granted granted Critical
Publication of JP2791740B2 publication Critical patent/JP2791740B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cylinder Crankcases Of Internal Combustion Engines (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、エンジンのシリンダの
ような中空部材の内周面に、例えばニカジルメッキと呼
ばれる複合メッキを施す装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying, for example, nickel plating to the inner peripheral surface of a hollow member such as an engine cylinder.

【0002】[0002]

【従来の技術】例えばエンジンのシリンダは内部をピス
トンが摺動するため、特にシリンダブロックがアルミ合
金からなる場合にはシリンダの内周面の耐摩耗性を向上
させる必要がある。ところで、クランク掃気式の2サイ
クルエンジンのようにシリンダの内周面に開口部を設け
なければならない場合にはシリンダ内にスリーブを嵌着
させることが困難であり、この様な場合にシリンダの内
周面に複合メッキを施す場合がある。このようなシリン
ダの内周面に複合メッキを施すものとしては、シリンダ
の内周面との間に隙間を存して電極を挿入し、該隙間に
硫酸ニッケル中に炭化珪素の微粒子を混入させた複合メ
ッキ液を流し、ニッケル中に炭化珪素の微粒子を包含さ
せた、いわゆるニカジルメッキを施すものが知られてい
る。ところが、微粒子を複合メッキ層内に包含させるた
めには複合メッキ液の流速をあまり速くすることができ
ず、このため隙間における複合メッキ液の流れが層流状
態になる。すると、複合メッキ液の上流側では炭化珪素
等の微粒子が複合メッキ層内によく包含されるが、下流
側では内周面近傍の複合メッキ液の微粒子の含有量が減
少するため複合メッキ層内の微粒子の包含量が減少し、
上流側と下流側とで複合メッキ層が不均一になるという
不具合がある。
2. Description of the Related Art For example, since a piston slides inside an engine cylinder, it is necessary to improve the wear resistance of the inner peripheral surface of the cylinder particularly when the cylinder block is made of an aluminum alloy. By the way, when an opening must be provided on the inner peripheral surface of a cylinder as in a crank scavenging two-stroke engine, it is difficult to fit a sleeve into the cylinder. Composite plating may be applied to the peripheral surface. In order to apply composite plating to the inner peripheral surface of such a cylinder, electrodes are inserted with a gap between the inner peripheral surface of the cylinder and silicon carbide fine particles mixed in nickel sulfate in the gap. There is known a method in which a so-called nicazil plating in which fine particles of silicon carbide are contained in nickel by flowing a composite plating solution is performed. However, the flow rate of the composite plating solution cannot be made too high in order to include the fine particles in the composite plating layer, so that the flow of the composite plating solution in the gap becomes laminar. Then, on the upstream side of the composite plating solution, fine particles such as silicon carbide are well contained in the composite plating layer. The inclusion amount of fine particles of
There is a problem that the composite plating layer becomes uneven between the upstream side and the downstream side.

【0003】このような不具合を解決するものとして、
例えば特開昭52−93636号公報により、複合メッ
キ液の流れ方向を一定周期毎に反転させるようにしたも
のが知られている。
In order to solve such a problem,
For example, Japanese Patent Application Laid-Open No. 52-93636 discloses a technique in which the flow direction of a composite plating solution is reversed at regular intervals.

【0004】[0004]

【発明が解決しようとする課題】上記従来の複合メッキ
液の流れ方向を一定周期毎に反転させるものでは、シリ
ンダの両端部分の複合メッキの状態を同様にすることは
できても中央部分は両端部より複合メッキされにくいと
いう不具合があり、円筒部の長さが長くなるに連れその
傾向は大きくなる。
In the above-described conventional method in which the flow direction of the composite plating solution is reversed at regular intervals, the state of the composite plating at both end portions of the cylinder can be made the same, but the center portion is formed at both ends. There is a disadvantage that the composite plating is less likely to occur than the portion, and the tendency increases as the length of the cylindrical portion increases.

【0005】そこで本発明は、上記の問題点に鑑み、中
空部材の内周面に均一に複合メッキを施すことのできる
複合メッキ装置を提供することを目的とする。
In view of the above problems, an object of the present invention is to provide a composite plating apparatus capable of uniformly performing composite plating on the inner peripheral surface of a hollow member.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、請求項1の発明は、中空部材の内周面に複合メッキ
を施す装置において、中空部材を内周面の母線が上下方
向を向くように保持した状態で、該内周面との間に所定
間隔の隙間を存して挿入される電極と、挿入状態にある
電極の下方に対向する吐出口を有し該吐出口の内径が該
電極の外径寸法と同径もしくはそれより小径の複合メッ
キ液供給管とを備え、該吐出口から上記隙間に、気泡を
含んだ複合メッキ液を供給するようにしたことを特徴と
する。
According to a first aspect of the present invention, there is provided an apparatus for performing composite plating on an inner peripheral surface of a hollow member. An electrode inserted with a predetermined gap between the electrode and the inner peripheral surface, and an ejection port facing below the electrode in the inserted state, and an inner diameter of the ejection port. Is provided with a composite plating solution supply pipe having the same diameter as or smaller than the outer diameter of the electrode, and supplying the composite plating solution containing bubbles to the gap from the discharge port. .

【0007】請求項2の発明は、上記請求項1の発明に
おいて、上記電極の先端部を先端に向って漸次小径に形
成したことを特徴とする。
According to a second aspect of the present invention, in the first aspect of the present invention, the distal end of the electrode is formed to have a gradually decreasing diameter toward the distal end.

【0008】[0008]

【作用】複合メッキ液中に気泡を混入させると、該気泡
の上昇により複合メッキ液が攪拌され、隙間内における
複合メッキ液の流れが乱流になり、内周面の下流側の部
分にも微粒子を含んだ複合メッキ液が供給され複合メッ
キ層が均一化される。そして更に、上記吐出口の内径を
電極の外径と同じかそれよりも小さくすると、吐出口か
ら中空部へ吐出された複合メッキに含まれる気泡は全て
一旦電極の先端に衝突する。すると、気泡は電極の表面
に付着し、電極の表面に付着したまま隙間内を上昇す
る。気泡は、気泡の上部に位置する複合メッキ液を押し
のけながら上昇するので、気泡の上昇により電極表面近
傍の微粒子を多く含む複合メッキ液が中空部材の内周面
側に押しのけられ、これにより内周面の全域にわたって
微粒子を多く含んだ複合メッキ液が供給されて複合メッ
キ層中の微粒子の包含量が更に均一になる。
When bubbles are mixed in the composite plating solution, the bubbles rise and the composite plating solution is agitated, and the flow of the composite plating solution in the gap becomes turbulent, and the downstream portion of the inner peripheral surface also flows. A composite plating solution containing fine particles is supplied to make the composite plating layer uniform. Further, when the inner diameter of the discharge port is equal to or smaller than the outer diameter of the electrode, all the bubbles contained in the composite plating discharged from the discharge port to the hollow portion once strike the tip of the electrode. Then, the bubbles adhere to the surface of the electrode, and rise in the gap while remaining attached to the surface of the electrode. Since the bubbles rise while pushing away the composite plating solution located above the bubbles, the rising of the bubbles pushes the composite plating solution containing a large amount of fine particles near the electrode surface toward the inner peripheral surface side of the hollow member, thereby causing the inner peripheral surface to move. The composite plating solution containing a large amount of fine particles is supplied over the entire area of the surface, so that the inclusion amount of the fine particles in the composite plating layer becomes more uniform.

【0009】尚、電極の先端に衝突し付着した気泡が電
極の表面に沿って上昇する際に気泡の移動方向が急激に
変化すると気泡が電極の表面から剥離するおそれがあ
る。そこで上記のごとく電極の先端部を先端に向って漸
次小径にすることにより気泡の移動方向が急激に変化し
ないようにして気泡の剥離を防止する。
[0009] When the moving direction of the bubble suddenly changes when the bubble colliding with and adheres to the tip of the electrode rises along the surface of the electrode, the bubble may be separated from the surface of the electrode. Thus, as described above, the tip of the electrode is gradually reduced in diameter toward the tip, so that the moving direction of the bubbles does not suddenly change, and the separation of the bubbles is prevented.

【0010】[0010]

【実施例】図1を参照して、Wはアルミ合金からなる2
ストロークエンジンのシリンダブロックであり、上下に
貫通するシリンダWcを備えており、給気及び掃気用の
空間Sが該シリンダWcに開口して設けられており、該
空間SはキャップCによって外部に対して密閉されてい
る。該シリンダブロックWは保持台1上に載置され、該
保持台1に設けられた複合メッキ液供給管11とシリン
ダWcとが一致するように設定されている。また、該シ
リンダWcには上方から先端が略半球形に形成された電
極2が挿入されており、該電極2とシリンダWcの内周
面Wfとの間には隙間Gが形成され、複合メッキ液供給
管11から供給される複合メッキ液が該隙間G内を流れ
るように設定されている。ここで、電極2の直径をDと
し、複合メッキ液供給管11の該電極2の先端に対向す
る吐出口11aの内径をdとすると、本実施例の場合D
>dとした。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG.
It is a cylinder block of a stroke engine, and is provided with a cylinder Wc that penetrates vertically, and a space S for air supply and scavenging is provided in the cylinder Wc so as to be opened. And sealed. The cylinder block W is mounted on the holding table 1 and is set such that the composite plating solution supply pipe 11 provided on the holding table 1 and the cylinder Wc coincide. An electrode 2 having a substantially hemispherical tip is inserted into the cylinder Wc from above, and a gap G is formed between the electrode 2 and the inner peripheral surface Wf of the cylinder Wc. The composite plating solution supplied from the solution supply pipe 11 is set so as to flow through the gap G. Here, assuming that the diameter of the electrode 2 is D, and the inside diameter of the discharge port 11a of the composite plating solution supply pipe 11 that faces the tip of the electrode 2 is d, in the case of this embodiment, D
> D.

【0011】ところで、該複合メッキ液供給管11は管
路12を介して図外の複合メッキ液供給用のポンプに接
続されており、また該管路12の途中には空気混入路1
3が接続されている。該空気混入路13には図外のコン
プレッサが接続されており所定量の空気を管路12内の
複合メッキ液中に混入させるように構成されている。こ
のように混入された空気は気泡14となって複合メッキ
液と共に複合メッキ液供給管11を上昇し、吐出口11
aからシリンダWc内に吐出される。そして、上記隙間
G内を流れてシリンダブロックWの上面を押えている押
え部材3の空間31内に流出し、管路32を介して図外
のタンクへと還流される。そして、該タンク内にて抜気
された後、再びポンプにより管路12に送り出される。
Incidentally, the composite plating solution supply pipe 11 is connected to a pump for supplying a composite plating solution (not shown) through a pipe 12, and an air mixing path 1 is provided in the middle of the pipe 12.
3 are connected. A compressor (not shown) is connected to the air mixing path 13 so that a predetermined amount of air is mixed into the composite plating solution in the pipe 12. The air mixed in this way forms bubbles 14 and moves up the composite plating solution supply pipe 11 together with the composite plating solution, and
a is discharged into the cylinder Wc. Then, the gas flows through the gap G, flows out into the space 31 of the pressing member 3 pressing the upper surface of the cylinder block W, and is returned to the tank (not shown) via the pipe 32. Then, after being evacuated in the tank, it is again sent out to the pipeline 12 by the pump.

【0012】上記構成によれば、図2に示すように、D
>dに設定されているので、吐出口11aから吐出され
る複合メッキ液中の気泡14は全て電極2の先端に衝突
し電極2の表面に付着する。電極2の先端を略半球形に
形成したので、電極2の表面に付着した気泡14は剥離
することなく該表面に付着しながら上昇する。この時、
電極2の表面に付着している気泡14の上部Pに位置す
る十分に微粒子を含んだ複合メッキ液は、気泡が上昇す
ることにより内周面Wfに向って押しのけられる。気泡
14は電極2の表面に沿ってシリンダWcの上端に対応
する部分まで上昇するので、内周面Wfの全域にわたっ
て、電極2側から内周面Wfに向って微粒子を多く含ん
だ複合メッキ液が供給され、均一な複合メッキ層が得ら
れる。
According to the above configuration, as shown in FIG.
Since> d is set, all the bubbles 14 in the composite plating solution discharged from the discharge port 11a collide with the tip of the electrode 2 and adhere to the surface of the electrode 2. Since the tip of the electrode 2 is formed in a substantially hemispherical shape, the bubbles 14 attached to the surface of the electrode 2 rise while adhering to the surface without peeling. At this time,
The composite plating solution sufficiently containing fine particles, which is located at the upper part P of the bubble 14 attached to the surface of the electrode 2, is pushed away toward the inner peripheral surface Wf by the rise of the bubble. Since the bubbles 14 rise along the surface of the electrode 2 to a portion corresponding to the upper end of the cylinder Wc, the composite plating solution containing a large amount of fine particles from the electrode 2 side toward the inner peripheral surface Wf over the entire inner peripheral surface Wf. Is supplied to obtain a uniform composite plating layer.

【0013】尚、本実施例の場合、複合メッキ液として
水1リットル当たりに硫酸ニッケル400グラム・ほう
酸35グラム・炭化珪素の微粉末60グラムを添加し、
更にサッカリンナトリウムを2.5グラム加えて硬度調
整したpH=4のものを用い、炭化珪素の微粒子を包含
したニッケルが複合メッキされる、いわゆるニカジルメ
ッキと呼ばれる複合メッキを施すようにした。また複合
メッキ条件は、空気を混入しない場合における隙間Gで
の複合メッキ液流速が15cm/sで、複合メッキ液温度が
60℃で、陰極電流密度が28A/dm2である。また、吐
出口11aの内径dを電極2の直径Dより小さくした
が、両者を同一寸法に設定してもよく、その場合であっ
ても全ての気泡14を電極2の表面に付着させることが
できる。
In this embodiment, 400 g of nickel sulfate, 35 g of boric acid, and 60 g of fine powder of silicon carbide are added per liter of water as a composite plating solution.
Further, 2.5 g of saccharin sodium was added to adjust the hardness to pH = 4, and nickel-containing nickel fine particles containing silicon carbide particles were subjected to composite plating, that is, so-called nicazil plating was applied. The composite plating conditions are as follows: the flow rate of the composite plating solution in the gap G when air is not mixed is 15 cm / s, the temperature of the composite plating solution is 60 ° C., and the cathode current density is 28 A / dm 2 . Further, although the inner diameter d of the discharge port 11a is smaller than the diameter D of the electrode 2, both may be set to the same size. Even in such a case, all the bubbles 14 may adhere to the surface of the electrode 2. it can.

【0014】ところで、上記実施例では空気を単に混入
させたが、気泡の大きさを小さくする場合には、多孔質
素材を介して空気を混入させたり、吐出口より上流側で
複合メッキ液を攪拌して気泡を細分化するようにすれば
よい。また、上記実施例では、電極2の先端を略半球形
に形成したが、テーパ状やその他の形状であっても、先
端に向って漸次細くなる形状であればよい。更に、複合
メッキ液に空気を混入させたが、ヘリウムガス・アルゴ
ンガス・窒素ガス、その他の不活性ガスを混入させても
よい。
In the above embodiment, air is simply mixed. However, when the size of bubbles is reduced, air is mixed through a porous material, or the composite plating solution is mixed upstream of the discharge port. What is necessary is just to agitate and to fragment air bubbles. Further, in the above embodiment, the tip of the electrode 2 is formed in a substantially hemispherical shape. However, the electrode 2 may have a tapered shape or another shape as long as it gradually becomes thinner toward the tip. Furthermore, although air was mixed into the composite plating solution, helium gas, argon gas, nitrogen gas, and other inert gases may be mixed.

【0015】[0015]

【発明の効果】以上の説明から明らかなように、本発明
によれば、複合メッキ液に混入させた気泡を電極に沿わ
せて上昇させ電極表面付近の微粒子を多く含んだ複合メ
ッキ液を内周面全域に供給するようにしたので、該内周
面に均一な複合メッキを施すことができる。
As is apparent from the above description, according to the present invention, the bubbles mixed in the composite plating solution are raised along the electrode, and the composite plating solution containing a large amount of fine particles near the electrode surface is removed. Since supply is performed over the entire peripheral surface, uniform composite plating can be applied to the inner peripheral surface.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明を実施するための装置の構成を示す図FIG. 1 is a diagram showing a configuration of an apparatus for carrying out the present invention.

【図2】 電極表面に付着した気泡の詳細を示す部分拡
大図
FIG. 2 is a partially enlarged view showing details of bubbles attached to an electrode surface.

【符号の説明】[Explanation of symbols]

1 保持台 2 電極 3 押え部材 11a 吐出口 13 空気混入路 14 気泡 D 電極の直径 d 吐出口の内径 G 隙間 Wc シリンダ Wf 内周面 DESCRIPTION OF SYMBOLS 1 Holder 2 Electrode 3 Holding member 11a Discharge port 13 Air mixing path 14 Bubble D Electrode diameter d Internal diameter of discharge port G Gap Wc Cylinder Wf Inner peripheral surface

フロントページの続き (56)参考文献 特開 昭52−39535(JP,A) 特開 昭55−54598(JP,A) 特開 昭52−93636(JP,A) 特開 平7−118894(JP,A) 実開 昭52−111720(JP,U) (58)調査した分野(Int.Cl.6,DB名) C25D 7/00 - 7/12 C25D 15/02Continuation of the front page (56) References JP-A-52-39535 (JP, A) JP-A-55-54598 (JP, A) JP-A-52-93636 (JP, A) JP-A-7-118894 (JP) , A) Actual opening 52-111720 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) C25D 7/00-7/12 C25D 15/02

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 中空部材の内周面に複合メッキを施す装
置において、中空部材を内周面の母線が上下方向を向く
ように保持した状態で、該内周面との間に所定間隔の隙
間を存して挿入される電極と、挿入状態にある電極の下
方に対向する吐出口を有し該吐出口の内径が該電極の外
径寸法と同径もしくはそれより小径の複合メッキ液供給
管とを備え、該吐出口から上記隙間に、気泡を含んだ複
合メッキ液を供給するようにしたことを特徴とする複合
メッキ装置。
1. An apparatus for performing composite plating on an inner peripheral surface of a hollow member, wherein the hollow member is held at a predetermined distance from the inner peripheral surface in a state where the generatrix of the inner peripheral surface is oriented vertically. A composite plating solution having an electrode inserted with a gap therebetween and a discharge port facing below the electrode in the inserted state, wherein the inner diameter of the discharge port is equal to or smaller than the outer diameter of the electrode; A composite plating apparatus comprising: a tube; and supplying a composite plating solution containing air bubbles from the discharge port to the gap.
【請求項2】 上記電極の先端部を先端に向って漸次小
径に形成したことを特徴とする請求項1記載の複合メッ
キ装置。
2. The composite plating apparatus according to claim 1, wherein a tip portion of the electrode is formed to have a gradually decreasing diameter toward the tip.
JP30424193A 1993-10-22 1993-12-03 Composite plating equipment Expired - Fee Related JP2791740B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP30424193A JP2791740B2 (en) 1993-12-03 1993-12-03 Composite plating equipment
US08/326,372 US5516417A (en) 1993-10-22 1994-10-20 Method and apparatus for applying composite plating on hollow member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30424193A JP2791740B2 (en) 1993-12-03 1993-12-03 Composite plating equipment

Publications (2)

Publication Number Publication Date
JPH07157895A JPH07157895A (en) 1995-06-20
JP2791740B2 true JP2791740B2 (en) 1998-08-27

Family

ID=17930695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30424193A Expired - Fee Related JP2791740B2 (en) 1993-10-22 1993-12-03 Composite plating equipment

Country Status (1)

Country Link
JP (1) JP2791740B2 (en)

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