JP2791742B2 - Composite plating method for inner peripheral surface of hollow member - Google Patents
Composite plating method for inner peripheral surface of hollow memberInfo
- Publication number
- JP2791742B2 JP2791742B2 JP30424393A JP30424393A JP2791742B2 JP 2791742 B2 JP2791742 B2 JP 2791742B2 JP 30424393 A JP30424393 A JP 30424393A JP 30424393 A JP30424393 A JP 30424393A JP 2791742 B2 JP2791742 B2 JP 2791742B2
- Authority
- JP
- Japan
- Prior art keywords
- composite plating
- peripheral surface
- inner peripheral
- air
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cylinder Crankcases Of Internal Combustion Engines (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、エンジンのシリンダの
ような中空部材の内周面に、例えばニカジルメッキと呼
ばれる複合メッキを施す方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of applying a composite plating, for example, a nickel silyl plating, to an inner peripheral surface of a hollow member such as an engine cylinder.
【0002】[0002]
【従来の技術】例えばエンジンのシリンダは内部をピス
トンが摺動するため、特にシリンダブロックがアルミ合
金からなる場合にはシリンダの内周面の耐摩耗性を向上
させる必要がある。ところで、クランク掃気式の2サイ
クルエンジンのようにシリンダの内周面に開口部を設け
なければならない場合にはシリンダ内にスリーブを嵌着
させることが困難であり、この様な場合にシリンダの内
周面に複合メッキを施す場合がある。このような、シリ
ンダの内周面に複合メッキを施すものとしては、シリン
ダの内周面との間に隙間を存して電極を挿入し、該隙間
に硫酸ニッケル中に炭化珪素の微粒子を混入させた複合
メッキ液を流し、ニッケル中に炭化珪素の微粒子を包含
させた、いわゆるニカジルメッキを施すものが知られて
いる。2. Description of the Related Art For example, since a piston slides inside an engine cylinder, it is necessary to improve the wear resistance of the inner peripheral surface of the cylinder particularly when the cylinder block is made of an aluminum alloy. By the way, when an opening must be provided on the inner peripheral surface of a cylinder as in a crank scavenging two-stroke engine, it is difficult to fit a sleeve into the cylinder. Composite plating may be applied to the peripheral surface. In order to apply the composite plating to the inner peripheral surface of the cylinder, an electrode is inserted with a gap between the inner peripheral surface of the cylinder and fine particles of silicon carbide mixed in nickel sulfate in the gap. It is known to apply a so-called nicazil plating in which a mixed plating solution is caused to flow and nickel particles are included in nickel.
【0003】ところが、微粒子を複合メッキ層内に包含
させるためには複合メッキ液の流速をあまり速くするこ
とができず、このため隙間における複合メッキ液の流れ
が層流状態になる。すると、複合メッキ液の上流側では
炭化珪素等の微粒子が複合メッキ層内によく包含される
が、下流側では内周面近傍の複合メッキ液の微粒子の含
有量が減少しているため複合メッキ層内の微粒子の包含
量が減少し、上流側と下流側とで複合メッキ層が不均一
になるという不具合がある。However, the flow rate of the composite plating solution cannot be made too high in order to include the fine particles in the composite plating layer, so that the flow of the composite plating solution in the gap becomes laminar. Then, on the upstream side of the composite plating solution, fine particles such as silicon carbide are well contained in the composite plating layer, but on the downstream side, the content of the fine particles of the composite plating solution near the inner peripheral surface is reduced, so that the composite plating layer is reduced. There is a problem that the inclusion amount of the fine particles in the layer decreases, and the composite plating layer becomes non-uniform between the upstream side and the downstream side.
【0004】このような場合には、かかる不具合を解消
するため、本出願人は特願平5−265082号によ
り、複合メッキ液中に空気を気泡状にして混入させ、隙
間内において気泡により複合メッキ液を撹拌し微粒子を
多く含んだ複合メッキ液を内周面側に押しのけて、内周
面全面に均一な複合メッキを施すことができるようにし
た方法を提案した。尚、空気以外にヘリウムガス・アル
ゴンガス・窒素ガス、その他の不活性ガスを混入させる
ことも考えられるが、空気を混入させる場合に比しコス
トが高くなる。In such a case, in order to solve such a problem, the present applicant disclosed in Japanese Patent Application No. 5-265082, air was mixed in the composite plating solution in the form of air bubbles, and air was mixed in the gaps with air bubbles. A method was proposed in which the plating solution was agitated, and the composite plating solution containing a large amount of fine particles was pushed to the inner peripheral surface side so that uniform composite plating could be applied to the entire inner peripheral surface. It is also conceivable to mix helium gas, argon gas, nitrogen gas and other inert gases in addition to air, but the cost is higher than when air is mixed.
【0005】[0005]
【発明が解決しようとする課題】ところで、複合メッキ
液に空気を混入させた場合、内周面に複合メッキ層が被
着する前に内周面に気泡が接触すると、気泡中に含まれ
ている酸素により内周面の一部に酸化皮膜が形成される
ことがある。この酸化皮膜が形成された部分にも最終的
に複合メッキ層が被着されるが、酸化皮膜と複合メッキ
層との密着性は酸化皮膜が形成されていない部分におけ
る密着性より低下し、このため、酸化皮膜が形成された
部分を起点にして複合メッキ層が剥離するという問題が
生じる。By the way, when air is mixed into the composite plating solution, if air bubbles come into contact with the inner peripheral surface before the composite plating layer is applied to the inner peripheral surface, the air is contained in the bubbles. Oxide film may be formed on a part of the inner peripheral surface due to oxygen present. The composite plating layer is finally applied to the portion where the oxide film is formed, but the adhesion between the oxide film and the composite plating layer is lower than the adhesion in the portion where the oxide film is not formed. Therefore, there is a problem that the composite plating layer is peeled off from the portion where the oxide film is formed.
【0006】そこで本発明は、上記の問題点に鑑み、複
合メッキ液に空気を混入させても内周面に酸化皮膜を形
成させず、内周面と複合メッキ層との密着性を良好にし
て複合メッキ層が剥離しない複合メッキ方法を提供する
ことを目的とする。In view of the above problems, the present invention does not form an oxide film on the inner peripheral surface even when air is mixed into the composite plating solution, and improves the adhesion between the inner peripheral surface and the composite plating layer. To provide a composite plating method in which the composite plating layer does not peel off.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、中空部材の内周面との間に隙間を存する
ように電極を挿入し、該隙間に複合メッキ液を流して該
内周面に複合メッキを施す方法において、複合メッキ液
のみを所定時間流し内周面の表面に薄層の複合メッキ層
を被着させた後、複合メッキ液中に気泡状の空気を混入
させ、複合メッキ層を所定の厚みに成長させるようにし
たことを特徴とする。In order to achieve the above-mentioned object, according to the present invention, an electrode is inserted so as to have a gap between itself and the inner peripheral surface of a hollow member, and a composite plating solution is caused to flow through the gap. In the method of applying the composite plating to the inner peripheral surface, only the composite plating solution is allowed to flow for a predetermined time to deposit a thin composite plating layer on the surface of the inner peripheral surface, and then air bubbles are mixed into the composite plating solution. And growing the composite plating layer to a predetermined thickness.
【0008】[0008]
【作用】シリンダ等の中空部材はアルミニウムや鉄等の
比較的酸化しやすい材料で形成されている場合が多い。
一方、複合メッキの母材となるニッケル等は比較的酸化
されにくい。従って、複合メッキ開始後所定時間は空気
を混入させずに複合メッキを行ない、複合メッキ層で内
周面をコーティングし、気泡が接触しても酸化皮膜が形
成されない状態にして、その後に空気を混入して均一な
複合メッキ層を形成する。尚、空気を混入させない状態
で形成される複合メッキ層は均一なものではないが、そ
の後形成される複合メッキ層は空気の混入により均一な
ものになるので何ら問題はない。In many cases, hollow members such as cylinders are formed of relatively easily oxidizable materials such as aluminum and iron.
On the other hand, nickel or the like which is a base material of the composite plating is relatively hard to be oxidized. Therefore, the composite plating is performed without mixing air for a predetermined time after the start of the composite plating, and the inner peripheral surface is coated with the composite plating layer so that an oxide film is not formed even when bubbles come in contact with the composite plating layer. Mixing to form a uniform composite plating layer. Although the composite plating layer formed without mixing air is not uniform, there is no problem since the composite plating layer formed thereafter becomes uniform by mixing air.
【0009】[0009]
【実施例】本発明を実施するための装置を図1を参照し
て説明する。Wはアルミ合金からなる2ストロークエン
ジンのシリンダブロックであり、上下方向に貫通するシ
リンダWcを備え、給気及び掃気用の空間Sが該シリン
ダWcに開口して設けられている。尚、該空間Sはキャ
ップCによって外部に対して密閉されている。該シリン
ダブロックWは保持台1上に載置され、該保持台1に設
けられた複合メッキ液通路11とシリンダWcとが一致
するように設定されている。また、該シリンダWcには
上方から電極2が挿入されており、該電極2とシリンダ
Wcの内周面Wfとの間には隙間Gが形成され、複合メ
ッキ液通路11から供給される複合メッキ液が該隙間G
内を流れるように設定されている。ところで、該複合メ
ッキ液通路11は管路12を介して複合メッキ液供給用
のポンプ6に接続されており、また該管路12の途中に
は空気混入路13が接続されている。該空気混入路13
にはコンプレッサ5が接続されており電磁比例弁51を
介して所定量の空気を管路12内の複合メッキ液中に混
入させるように構成されている。このように混入された
空気は気泡14となって複合メッキ液と共に絞り部11
aから吐出され上記隙間G内を流れて、シリンダブロッ
クWの上面を押えている押え部材3の空間31内に流出
し、管路32を介して図外のタンクへと還流され抜気さ
れた後、再びポンプ6により管路12に送り出される。DESCRIPTION OF THE PREFERRED EMBODIMENTS An apparatus for carrying out the present invention will be described with reference to FIG. W is a cylinder block of a two-stroke engine made of an aluminum alloy, provided with a cylinder Wc penetrating in a vertical direction, and a space S for air supply and scavenging is provided in the cylinder Wc so as to open. The space S is sealed off from the outside by a cap C. The cylinder block W is mounted on the holding base 1 and is set so that the composite plating solution passage 11 provided in the holding base 1 and the cylinder Wc coincide with each other. An electrode 2 is inserted into the cylinder Wc from above. A gap G is formed between the electrode 2 and the inner peripheral surface Wf of the cylinder Wc. When the liquid is in the gap G
It is set to flow inside. Incidentally, the composite plating solution passage 11 is connected to a pump 6 for supplying the composite plating solution via a conduit 12, and an air mixing passage 13 is connected in the middle of the conduit 12. The air mixing path 13
Is connected to a compressor 5 and is configured to mix a predetermined amount of air into the composite plating solution in the conduit 12 via the electromagnetic proportional valve 51. The air mixed in this way becomes bubbles 14 together with the composite plating solution.
a, flows through the gap G, flows out into the space 31 of the pressing member 3 pressing the upper surface of the cylinder block W, and is returned to the tank (not shown) through the pipe line 32 and is evacuated. Thereafter, the water is sent out to the pipe 12 again by the pump 6.
【0010】ところで、上記ワークWと電極2との間に
は電源41が接続されている。そして、電源41と電極
2との間には電流値を可変制御する電流制御回路42が
介設され、該電流制御回路42はコントローラ4により
制御される。また、該コントローラ4は上記電磁比例弁
51の開閉及びポンプ6の作動を制御するように構成さ
れている。A power supply 41 is connected between the work W and the electrode 2. A current control circuit 42 for variably controlling the current value is provided between the power supply 41 and the electrode 2, and the current control circuit 42 is controlled by the controller 4. The controller 4 is configured to control the opening and closing of the electromagnetic proportional valve 51 and the operation of the pump 6.
【0011】上記構成による装置の作動を図2を参照し
て説明する。複合メッキを開始すると、まず、ポンプ6
を作動させ、複合メッキ液の流量を845cm3/s(隙間
Gでの流速48cm/sに相当)にし、流量が落ち着いた時
点で電流制御回路42を介して36A(陰極電流密度1
4A/dm2に相当)の電流を流し複合メッキを行なう。こ
の状態を約60秒間継続すると、内周面Wfの表面には
2μm〜3μmの厚みの複合メッキ層が被着される。但
し隙間Gでの流速が速く、かつ電流が少ないので、この
時に被着される複合メッキ層にはほとんど炭化珪素の微
粒子は包含されず、ニッケルのみがメッキされ、その後
は気泡が接触しても酸化皮膜が形成されることはない。
次に、複合メッキ液の流量を264cm3/s(隙間Gでの
流速15cm/sに相当)まで減少させると共に電流を72
A(陰極電流密度28A/dm2に相当)まで増加させる。
そして複合メッキ液の流速が落ち着いた時点で電磁比例
弁51を開成し、空気の混入を開始する。この空気の混
入量は複合メッキ液の流量に対して12%〜95%(共
に体積%)であればよいが、本実施例では158cm3/s
(略60%)の空気を混入させた。そして複合メッキ層
の厚みが120μm程度になるまでこの状態を継続した
後、ポンプ6を停止すると共に電磁比例弁51を閉成
し、更に電流制御回路42で電流を遮断し、複合メッキ
工程を終了する。尚、本実施例の場合、複合メッキ液と
して水1リットル当たりに硫酸ニッケル400グラム・
ほう酸35グラム・炭化珪素の微粉末60グラムを添加
し、更にサッカリンナトリウムを2.5グラム加えて硬
度調整したpH=4のものを用いた。The operation of the apparatus having the above configuration will be described with reference to FIG. When the composite plating is started, first, the pump 6
To make the flow rate of the composite plating solution 845 cm 3 / s (corresponding to the flow rate of 48 cm / s in the gap G).
(Equivalent to 4 A / dm 2 ) is applied to perform composite plating. When this state is continued for about 60 seconds, a composite plating layer having a thickness of 2 μm to 3 μm is applied to the surface of the inner peripheral surface Wf. However, since the flow velocity in the gap G is high and the current is small, the composite plating layer deposited at this time hardly contains fine particles of silicon carbide, and only nickel is plated. No oxide film is formed.
Next, the flow rate of the composite plating solution was reduced to 264 cm 3 / s (corresponding to a flow rate of 15 cm / s in the gap G) and the current was reduced to 72 cm 3 / s.
A (corresponding to a cathode current density of 28 A / dm 2 ).
Then, when the flow rate of the composite plating solution has settled, the electromagnetic proportional valve 51 is opened to start mixing air. The mixing amount of the air may be 12% to 95% (both volume%) with respect to the flow rate of the composite plating solution, but in this embodiment, 158 cm 3 / s
(Approximately 60%) of air. After this state is continued until the thickness of the composite plating layer becomes about 120 μm, the pump 6 is stopped, the electromagnetic proportional valve 51 is closed, the current is cut off by the current control circuit 42, and the composite plating process is completed. I do. In the case of this embodiment, 400 g of nickel sulfate per liter of water was used as a composite plating solution.
35 g of boric acid and 60 g of silicon carbide fine powder were added, and 2.5 g of saccharin sodium was further added to adjust the hardness to pH = 4.
【0012】[0012]
【発明の効果】以上の説明から明らかなように、本発明
によれば、複合メッキの初期の段階で空気を混入させる
ことなく内周面の表面に複合メッキ層を被着させるの
で、その後に均一な複合メッキを行なうため複合メッキ
液中に空気を混入させても内周面が酸化されず、従っ
て、複合メッキ層の内周面に対する密着性が低下しな
い。As is apparent from the above description, according to the present invention, the composite plating layer is applied to the inner peripheral surface without mixing air at the initial stage of the composite plating. Even when air is mixed in the composite plating solution, the inner peripheral surface is not oxidized to perform uniform composite plating, and therefore, the adhesion of the composite plating layer to the inner peripheral surface does not decrease.
【図1】 本発明を実施するための装置の構成を示す図FIG. 1 is a diagram showing a configuration of an apparatus for carrying out the present invention.
【図2】 該装置の作動を示すタイミング図FIG. 2 is a timing chart showing the operation of the device.
1 保持台 2 電極 3 押え部材 4 コントローラ 5 コンプレッサ 6 ポンプ 41 電源 42 電流制御回路 51 電磁比例弁 13 空気混入路 14 気泡 G 隙間 Wc シリンダ WF 内周面 DESCRIPTION OF SYMBOLS 1 Holder 2 Electrode 3 Holding member 4 Controller 5 Compressor 6 Pump 41 Power supply 42 Current control circuit 51 Electromagnetic proportional valve 13 Air mixing path 14 Bubble G Gap Wc Cylinder WF Inner peripheral surface
フロントページの続き (56)参考文献 特開 昭52−39535(JP,A) 特開 昭55−54598(JP,A) 特開 昭52−93636(JP,A) 特開 平7−118894(JP,A) 実開 昭52−111720(JP,U) (58)調査した分野(Int.Cl.6,DB名) C25D 7/00 - 7/12 C25D 15/02Continuation of the front page (56) References JP-A-52-39535 (JP, A) JP-A-55-54598 (JP, A) JP-A-52-93636 (JP, A) JP-A-7-118894 (JP) , A) Actual opening 52-111720 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) C25D 7/00-7/12 C25D 15/02
Claims (1)
ように電極を挿入し、該隙間に複合メッキ液を流して該
内周面に複合メッキを施す方法において、複合メッキ液
のみを所定時間流し内周面の表面に薄層の複合メッキ層
を被着させた後、複合メッキ液中に気泡状の空気を混入
させ、複合メッキ層を所定の厚みに成長させるようにし
たことを特徴とする中空部材の内周面の複合メッキ方
法。1. A method of inserting an electrode so as to leave a gap between itself and an inner peripheral surface of a hollow member, flowing a composite plating solution through the gap, and performing composite plating on the inner peripheral surface, comprising: After flowing for a predetermined time, applying a thin composite plating layer to the surface of the inner peripheral surface, then mixing air bubbles in the composite plating solution to grow the composite plating layer to a predetermined thickness. A composite plating method for an inner peripheral surface of a hollow member.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30424393A JP2791742B2 (en) | 1993-12-03 | 1993-12-03 | Composite plating method for inner peripheral surface of hollow member |
US08/326,372 US5516417A (en) | 1993-10-22 | 1994-10-20 | Method and apparatus for applying composite plating on hollow member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30424393A JP2791742B2 (en) | 1993-12-03 | 1993-12-03 | Composite plating method for inner peripheral surface of hollow member |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07157897A JPH07157897A (en) | 1995-06-20 |
JP2791742B2 true JP2791742B2 (en) | 1998-08-27 |
Family
ID=17930717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30424393A Expired - Fee Related JP2791742B2 (en) | 1993-10-22 | 1993-12-03 | Composite plating method for inner peripheral surface of hollow member |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2791742B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7867368B2 (en) | 2004-06-16 | 2011-01-11 | Honda Motor Co., Ltd. | Plating apparatus |
CN105506696B (en) * | 2016-01-25 | 2017-12-12 | 黄曦雨 | One kind is used for aperture electro plating device and method on CRDM part |
-
1993
- 1993-12-03 JP JP30424393A patent/JP2791742B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07157897A (en) | 1995-06-20 |
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