JPH07154047A - Spacer - Google Patents

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Info

Publication number
JPH07154047A
JPH07154047A JP32622093A JP32622093A JPH07154047A JP H07154047 A JPH07154047 A JP H07154047A JP 32622093 A JP32622093 A JP 32622093A JP 32622093 A JP32622093 A JP 32622093A JP H07154047 A JPH07154047 A JP H07154047A
Authority
JP
Japan
Prior art keywords
spacer
substrate
slit
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32622093A
Other languages
Japanese (ja)
Other versions
JP2605213B2 (en
Inventor
Hideki Ito
英樹 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Columbia Co Ltd
Original Assignee
Nippon Columbia Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Columbia Co Ltd filed Critical Nippon Columbia Co Ltd
Priority to JP5326220A priority Critical patent/JP2605213B2/en
Publication of JPH07154047A publication Critical patent/JPH07154047A/en
Application granted granted Critical
Publication of JP2605213B2 publication Critical patent/JP2605213B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

PURPOSE:To prevent an electronic device, e.g. a LED, from floating in an automatic soldering equipment by a structure wherein a spacer being fitted to a substrate is provided with a specific split and a guide part for holding the electronic device resiliently. CONSTITUTION:In an audio system, for example, a display window is formed by mounting a device 2, e.g. an LED, having multiple connecting terminals on a substrate 3 and then soldering the device 2 automatically thereto. A spacer 1 being fitted to the substrate 3 is provided with a slit 102 for receiving the terminals 201-n of the electronic device 2, and the slit 102 is provided with a part 103 for guiding insertion of the pin of a multi-pin device. Furthermore, slits 104, 105 are made on the opposite sides of the slit 102 along the row of the pins of electronic device 2 in order to hold the electronic device 2 resiliently. For example, the spacer 1 is provided with a tapered part 103 for guiding insertion of the terminals 201-n of a display LED 2 into the slit 102.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、オーディオ装置に係わ
り詳しくは表示窓に発光ダイオード等の多端子を使用し
て表示させる場合等、基板を自動はんだ付け装置で製作
する場合の発光ダイオード用スペーサの形状に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an audio device, and more particularly, to a spacer for a light emitting diode when a substrate is manufactured by an automatic soldering device, such as when displaying a display window using a multi-terminal such as a light emitting diode. Is related to the shape of.

【0002】[0002]

【従来の技術】図4(a)はオーディオ装置の発光ダイオ
ード用スペーサの従来例を示す斜視図である。図におい
てスペーサ1’は発光ダイオード2と表示用基板3との
間に配置され、はんだ付けされた状態にあり、発光ダイ
オード本体の発光により表示窓4を介して表示する。ま
た図4(b)は発光ダイオードとスペーサを基板に自動は
んだ付け装置によりはんだ付けする前の断面図を図示し
たものである。スペーサ1’の上面には、発光ダイオー
ド2が配置してあり、発光ダイオード2とスペーサ1’
は基板3の上に置かれ合計3層により基板ユニットが構
成されている。発光ダイオード2は本体20と複数の足
を有する接続端子201〜nで構成され基板からの信号は
端子201〜nを通り本体20に伝達して発光される。ス
ペーサ1’と基板3には穴30が空けられており端子2
01〜nはスペーサ1と基板3の穴を通り基板下面に出て
いる。以上の構成により基板ユニットとなり、自動はん
だ付け装置によりはんだ付けされる。
2. Description of the Related Art FIG. 4A is a perspective view showing a conventional example of a spacer for a light emitting diode of an audio device. In the figure, the spacer 1 ′ is arranged between the light emitting diode 2 and the display substrate 3 and is in a soldered state, and display is performed through the display window 4 by the light emission of the light emitting diode body. Further, FIG. 4 (b) is a cross-sectional view before soldering the light emitting diode and the spacer to the substrate by the automatic soldering device. The light emitting diode 2 is arranged on the upper surface of the spacer 1 ', and the light emitting diode 2 and the spacer 1'
Is placed on the substrate 3, and a total of three layers form a substrate unit. The light emitting diode 2 is composed of a main body 20 and connection terminals 201 to n having a plurality of legs, and signals from the substrate are transmitted to the main body 20 through the terminals 201 to n and emitted. A hole 30 is formed in the spacer 1'and the substrate 3 so that the terminal 2
01 to n pass through the holes of the spacer 1 and the substrate 3 and are exposed on the lower surface of the substrate. With the above-described configuration, the board unit is formed and soldered by the automatic soldering device.

【0003】[0003]

【発明が解決しようとする課題】しかしながら上記従来
技術では自動はんだ付け装置により基板ユニットをはん
だ付けする場合、装置内下方からのはんだを基板下面に
付着させるための熱風により、基板の上面に置かれた発
光ダイオードとスペーサが上方に浮き上がり、そのまま
はんだ付け処理され発光ダイオードと基板との間に隙間
があいてしまう欠点があった。
However, in the above-mentioned prior art, when the board unit is soldered by the automatic soldering apparatus, it is placed on the upper surface of the board by the hot air for adhering the solder from the lower inside of the apparatus to the lower surface of the board. Another problem is that the light emitting diode and the spacer are lifted up and soldered as it is, leaving a gap between the light emitting diode and the substrate.

【0004】[0004]

【課題を解決するための手段】本発明では、発光ダイオ
ードと基板の間にあるスペーサ1を成型品の持つ弾性力
を利用した端子ストッパー付きスペーサで発光ダイオー
ドの端子を弾性保持し発光ダイオードの浮きを防止する
ことを特徴としたものである。
According to the present invention, the spacer 1 provided between the light emitting diode and the substrate is elastically held at the terminal of the light emitting diode by a spacer with a terminal stopper utilizing the elastic force of the molded product to float the light emitting diode. It is characterized by preventing.

【0005】[0005]

【作用】従って発光ダイオードと基板の間のスペーサ構
造を成型部品の持つ弾性力により発光ダイオード端子を
保持し自動はんだ付け装置内での発光ダイオード等の電
子部品の浮きを防止することができる。
Therefore, the spacer structure between the light emitting diode and the substrate can hold the light emitting diode terminal by the elastic force of the molded component and prevent the floating of electronic components such as the light emitting diode in the automatic soldering apparatus.

【0006】[0006]

【実施例】本発明の一実施例を図面により説明する。図
1は本発明の一実施例を示すスペーサ表面図、図2はそ
の断面図で、図3は基板上に載置したときの断面図を示
す。
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a surface view of a spacer showing an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a sectional view when it is mounted on a substrate.

【0007】本発明のスペーサ1は電子部品例えば多連
の表示用発光ダイオード2の接続用端子201〜nを挿入
し、スペース間隔t1 を有し発光ダイオード2の本体2
0を接置する表面の保持部101に端子201〜nをスリ
ット102に挿入するのを案内するテーパー部103を
有し、スリット102は端子201〜nの外径よりスリッ
ト幅を狭くしている。
The spacer 1 according to the present invention has electronic terminals, for example, connecting terminals 201 to n of a plurality of display light emitting diodes 2 inserted therein, and has a space interval t1 and a main body 2 of the light emitting diode 2.
The holding portion 101 on the surface where 0 is placed has a taper portion 103 for guiding insertion of the terminals 201 to n into the slit 102, and the slit 102 has a slit width narrower than the outer diameter of the terminals 201 to n. .

【0008】そのために、スリット102の両側にはス
リット104,105を設け、弾性保持部106,10
7が幅t2,t3を有する弾性を片として少なくとも発光
ダイオード2の端子201〜nのうち201及び20nを保
持する力を有するようになっている。
Therefore, slits 104 and 105 are provided on both sides of the slit 102, and the elastic holding portions 106 and 10 are provided.
7 is a piece of elasticity having widths t2 and t3 and has a force for holding at least 201 and 20n of the terminals 201 to n of the light emitting diode 2.

【0009】またスペーサ1と基板3とはスペーサの突
起108及び係合片109で基板3の孔に挿入され、所
定の位置に位置決めされる。この時、スペーサのスリッ
ト102を介し基板の接続用孔301〜nと相対位置にあ
り発光ダイオード2の端子201〜nとが相対し接続され
るべき配続回路の孔に対応して載置される。自動で半田
付けされる場合、発光ダイオードのごとき軽量の本体に
接続端子が多数半田ディップされると浮き上がる方向の
力を受けるがスペーサ1が基板3と係合し、スペーサ1
の弾性保持部が発光ダイオードの端子を弾性保持するの
で浮きに対抗する力が働き、保持される。またスリット
104,105から接続された端子の位置を目で確かめ
ることができ、手作業で挿入する場合等では作業性が良
くなる。
Further, the spacer 1 and the substrate 3 are inserted into the holes of the substrate 3 by the protrusions 108 and the engaging pieces 109 of the spacer and positioned at a predetermined position. At this time, via the slit 102 of the spacer, the terminals 201 to n of the light emitting diode 2 are placed at positions relative to the connection holes 301 to n of the substrate, and the terminals 201 to n of the light emitting diode 2 are placed corresponding to the holes of the distribution circuit to be connected. It In the case of automatic soldering, when a large number of connection terminals are solder-dipped into a light-weight body such as a light emitting diode, the spacer 1 receives a force in a floating direction, but the spacer 1 engages with the substrate 3 and the spacer 1
Since the elastic holding portion elastically holds the terminal of the light emitting diode, a force against the floating works and is held. Further, the positions of the terminals connected from the slits 104 and 105 can be visually confirmed, and the workability is improved when the terminals are manually inserted.

【0010】[0010]

【発明の効果】以上説明したように、オーディオ装置等
で表示窓を発光ダイオード等を使用して表示させるた
め、基板に発光ダイオードを自動はんだ付け装置で、は
んだ付けする場合、基板と発光ダイオードの間に成型品
の弾性ストッパー付きスペーサにおいて、自動はんだ付
け装置内での発光ダイオードの浮きを防止することがで
きる。
As described above, in order to display a display window using a light emitting diode or the like in an audio device or the like, when the light emitting diode is soldered to the board by an automatic soldering device, the board and the light emitting diode are In the meantime, the spacer with the elastic stopper of the molded product can prevent the light emitting diode from floating in the automatic soldering device.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す正面図。FIG. 1 is a front view showing an embodiment of the present invention.

【図2】断面図。FIG. 2 is a sectional view.

【図3】断面図。FIG. 3 is a sectional view.

【図4】(a)、(b)は従来例を示す図。4A and 4B are views showing a conventional example.

【符号の説明】[Explanation of symbols]

1 スペーサ 101 保持部 102,104,105 スリット 106,107 弾性保持部 108 突起 109 係合片 2 発光ダイオード 201〜n 端子 3 基板 301〜n 孔 4 表示窓 1 Spacer 101 Holding part 102, 104, 105 Slit 106, 107 Elastic holding part 108 Protrusion 109 Engagement piece 2 Light emitting diode 201-n terminal 3 Substrate 301-n hole 4 Display window

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 オーディオ装置等で表示窓を発光ダイオ
ード等多くの接続端を有する多端子部品を基板に載置し
自動はんだ付けする装置に於いて、基板と嵌合するスペ
ーサと、スペーサに設け電子部品の端子を挿入するスリ
ットと、上記スリットに多足部品の足を挿入する案内部
と、上記電子部品の足列に沿って設け弾性保持するため
上記スリットの両側に設けたスリットとを具備し上記電
子部品を上記スペーサに弾性保持することを特徴とする
スペーサ。
1. In a device for mounting a multi-terminal component having many connection ends such as a light emitting diode on a substrate and automatically soldering a display window in an audio device or the like, a spacer fitted to the substrate and provided on the spacer. A slit for inserting a terminal of an electronic component, a guide portion for inserting a leg of a multi-leg component into the slit, and a slit provided on both sides of the slit for elastically holding along a row of legs of the electronic component are provided. A spacer characterized in that the electronic component is elastically held by the spacer.
JP5326220A 1993-11-30 1993-11-30 Spacer Expired - Lifetime JP2605213B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5326220A JP2605213B2 (en) 1993-11-30 1993-11-30 Spacer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5326220A JP2605213B2 (en) 1993-11-30 1993-11-30 Spacer

Publications (2)

Publication Number Publication Date
JPH07154047A true JPH07154047A (en) 1995-06-16
JP2605213B2 JP2605213B2 (en) 1997-04-30

Family

ID=18185335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5326220A Expired - Lifetime JP2605213B2 (en) 1993-11-30 1993-11-30 Spacer

Country Status (1)

Country Link
JP (1) JP2605213B2 (en)

Also Published As

Publication number Publication date
JP2605213B2 (en) 1997-04-30

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Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 19961029