JPH07153883A - Electronic component cooling apparatus - Google Patents

Abstract

PURPOSE:To economically manufacture an electronic component cooling apparatus and improve a degree of freedom for arrangement into the apparatus by inserting a vessel into a cooling container under the condition that a rod member is engaged in direct with a through hole of a supporting member and then providing a fixed cooling liquid absorbing member into the cooling container. CONSTITUTION:When operation of a pump is started and a cooling liquid is circulated within a cooling liquid supply pipe, responsive to start of operation of a semiconductor integrated circuit 30, the cooling liquid is absorbed by a rod type body 22b consisting of a porous material and is then supplied to a cylindrical container 22a. The cooling liquid is vaporized through contactness with a cooling vessel 21 or a round net heated by the semiconductor integrated circuit 30. The vaporized cooling liquid is exhausted from a gas passage hole 22a1 of the cylindrical container 22a and enters the vapor exhaust pipes 41, 42 passing through an exhaust pipe 21c. Since the cooling liquid is efficiently and continuously supplied into the container with a porous cooling liquid absorbing member, the cooling container is effectively cooled by the vaporization effect of the cooling liquid and the cooling liquid supply and exhaust pipes can be arranged freely in a large size electronic apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component cooling device, and more particularly to an electronic component cooling device suitable for collectively cooling a large number of integrated circuit devices, high power semiconductor devices and the like.

[0002]

2. Description of the Related Art In a large computer, for example, which uses a large number of electronic components such as integrated circuit devices, it is necessary to provide an electronic component cooling device for efficiently processing a large amount of heat generated from the electronic components. Conventionally, as an electronic component cooling device of this type, as shown in, for example, Japanese Patent Publication No. 62-35593 and Japanese Utility Model Publication No. 61-41243, the inner surface of a flat plate-shaped container for fixing electronic components is called a so-called wick. There has been used a heat pipe having a capillary structure, having a low pressure inside by vacuum suction, and then enclosing a cooling liquid such as freon therein.

[0003]

However, since the above heat pipe needs to have a wick having a complicated structure inside, there is a problem that the manufacturing process becomes long and the manufacturing cost becomes high. Further, since it is necessary to extend the heat pipe from the electronic component mounting portion to the heat radiation portion, the heat pipe becomes very long, which increases the cost of the entire cooling system and limits the internal size and structure of the computer. In addition, there is a problem that it becomes difficult to process and arrange the heat pipe into an appropriate shape. The present invention is intended to solve the above problems, and an object of the present invention is to provide an electronic component cooling device which can be manufactured at low cost and has a high degree of freedom in arrangement in electronic devices.

[0004]

In order to achieve the above object, the structural feature of the invention according to claim 1 is that it has a hollow three-dimensional shape, one end surface of which is an electronic component fixing portion and the other end surface of which is It has a cooling container that has an insertion hole in part and an exhaust pipe connected to the steam discharge pipe on the side surface, and a fixing part that fixes the insertion hole at one end by providing a through hole in the center with a rod-shaped body. Then, at the other end, a connection support member having a connection part that connects to the side wall opening of the cooling liquid supply pipe, and a container part formed of a porous material and provided with gas flow holes in the side wall and a bottom outer wall of the container part. An integrally attached rod-shaped part is provided, and the container part is inserted into the cooling container with the rod-shaped part inserted into the through hole of the connection support member and fixed to the cooling container by the fixing part of the connection support member. The cooling liquid suction member is provided.

Further, the structural feature of the invention according to claim 2 is that it has a hollow three-dimensional shape, one end surface of which is formed integrally with an electronic component, and the other end surface of which has an insertion hole. A cooling container provided with an exhaust pipe connected to the steam discharge pipe, a rod-shaped body having a through hole at the center and a fixing portion fixed to the insertion hole at one end, and a cooling liquid supply pipe at the other end A connecting support member having a connecting portion for connecting to the side wall opening portion, a container portion formed of a porous material and having gas passage holes in the side wall, and a rod-shaped portion integrally attached to the bottom outer wall of the container portion. The container portion is inserted into the cooling container with the rod-shaped portion inserted into the through hole of the connection support member, and the cooling liquid suction member is fixed to the cooling container by the fixing portion of the connection support member. Especially.

[0006]

In the invention according to claim 1 configured as described above, in the electronic component cooling device, the exhaust pipe of the cooling container is connected to the steam discharge pipe, and the connecting portion of the connection support member is the cooling liquid. The electronic component is connected to the supply pipe and is fixed to the electronic component fixing portion of the cooling container. Then, when the cooling liquid is returned to the cooling liquid supply pipe, the cooling liquid suction member formed of the porous material sucks the cooling liquid and supplies the cooling liquid to the container portion of the cooling liquid suction member. At this time, the container part is heated by heat generated from the electronic component fixed to the electronic component fixing part, and the cooling liquid supplied to the container part is vaporized in the high temperature container part to cool the cooling container. , The vapor flows out to the outside through the gas flow hole on the side wall of the container,
Further, it flows into the steam discharge pipe through the exhaust pipe. And
Since the cooling liquid is continuously and efficiently supplied into the container portion by the porous cooling liquid suction member, the cooling container is efficiently cooled by the vaporizing action of the cooling liquid.

As a result, the temperature of the electronic component can be efficiently reduced, and the reliability of the electronic component can be improved. Further, this cooling device is provided at a low cost because it has a simple structure that does not require wick formation or the like. Furthermore, since this cooling device can be used by simply attaching it to the cooling liquid supply pipe or the steam discharge pipe, it is convenient to handle and the cooling liquid supply and discharge pipe should be installed in a large electronic device. Since it can be freely performed, it is suitable for a cooling system for electronic devices.

In addition, in the invention according to claim 2 configured as described above, in addition to the function and effect of the invention according to claim 1, the cooling container is formed integrally with the electronic component, so that the electronic component It is possible to more directly transfer the heat radiation from the container to the container portion, and further improve the cooling efficiency by the cooling liquid.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 schematically shows an example in which the electronic component cooling device according to the embodiment is applied to a cooling system for an electronic device such as a large computer that uses a large number of semiconductor integrated circuits and generates a large amount of heat. This cooling system is provided with a cooling liquid tank 10 for storing the cooling liquid, and a cooling liquid supply pipe P1 is attached to the cooling liquid tank 10 at one end. The cooling liquid supply pipe P1 has two supply pipes P2 at the other end.
1, P22, and the supply pipes P21, P22 are provided with a large number of cooling device mounting boss portions 13a, as shown in FIG. Cooling device mounting boss 13
A has a flange portion 13a1 at the tip thereof, and a fixing member 13b having a cylindrical shape and provided with a thread groove on its inner side surface is rotatably inserted into the boss portion 13a.
It has been made non-removable by. Coolant supply pipe P2
1, P22 are again one cooling liquid supply pipe P3 at the other end side.
And the tip of the cooling liquid supply pipe P3 is connected to the cooling liquid tank 1
It is linked to 0. A cooling liquid circulation pump 11 is interposed in the cooling liquid supply pipe P1. Coolant circulation pump 11
Drives the electric motor (not shown) to drive the cooling liquid in the cooling liquid tank 10 to the cooling liquid supply pipes P1, P21, P2.
2 and P3 are circulated and supplied. As the cooling liquid, water is used in addition to organic solvents such as freon and alcohol.

Further, steam discharge pipes P41 and P42 are provided in parallel with the cooling liquid supply pipes P21 and P22. The steam discharge pipes P41, P42 are provided with a large number of cooling device mounting boss portions 14a, are sealed at one end, and are joined to one steam discharge pipe P5 at the other end. The end of the steam discharge pipe P5 is connected to the upper wall of the cooling liquid tank 10, and the cooling fin 12 is provided in a part thereof. As shown in FIG. 2, the cooling device mounting boss portion 14a is provided with a flange portion 14a1 at its tip, and the boss portion 14a includes
A fixing member 14b having a cylindrical shape and provided with a thread groove on its inner surface is rotatably inserted, and is not removable by the flange portion 14a1. Then, the cooling liquid supply pipe P21,
An electronic component cooling device 20 is provided between P22 and the steam discharge pipes P41 and P42.

As shown in FIG. 2, the electronic component cooling device 20 is provided with a cooling container 21, a cooling liquid suction member 22, and a connection support member 23. As shown in FIG. 3, the cooling container 21 has a size of 30 mm for bonding and fixing the semiconductor integrated circuit.
The fixing plate 21a having a shape of 30 mm × 1 mm is provided,
The surface is a 20mm x 20mm copper plate
A container portion 21b having a depth of 20 mm and a depth of 10 mm is integrally fixed, and a cooling space R is provided inside. Container part 2
The bottom surface of 1b is provided with an insertion hole 21b1 of 15 mmφ, and a thread groove is formed on the peripheral edge of the insertion hole 21b1. An exhaust pipe 21c having an outer diameter of 3 mmφ is integrally attached to the side surface of the container portion 21b so as to open in the cooling space R, and a vapor exhaust pipe P41,
A screw groove 21c1 for connecting to the cooling device mounting boss portion 14a of P42 is formed. Cooling container 21
Is made of copper or copper alloy, but other materials such as aluminum alloy having good thermal conductivity and good corrosion resistance can be used.

As shown in FIG. 4, the cooling liquid suction member 22 is made of a porous material made of copper and has a diameter of 14 mm.
A cylindrical container portion 22a having a diameter of φ, a height of 7 mm, and a thickness of 1 mm, and a rod-shaped portion 22b of 3 mmφ × 30 mm vertically and integrally attached to the central portion outside the bottom of the cylindrical container portion 22a are provided. A pair of circular gas flow holes 22a1 are provided on the side wall of the cylindrical container portion 22a. However, the gas flow hole 22a1 is not limited to a circular shape and may have any shape.
You may make it provide a notch in the upper end of the cylindrical container part 22a. The cooling liquid suction member 22 is manufactured as follows. Copper powder having an average particle diameter of 100 μm is put into a rotating ball, stearic acid powder is added while heating the bottom of the ball, and stearic acid is applied to the surface of the copper powder. Next, the copper powder coated with stearic acid is molded into a predetermined shape by a rubber press molding method under a pressure of 1000 Kg / cm ² . By subjecting this molded product to lathe processing and drilling processing with a drill, a processed product having the above-mentioned shape can be obtained. By heat-treating this processed product in a hydrogen-nitrogen mixed gas (for example, an ammonia decomposition gas) at 600 ° C. for 30 minutes, stearic acid is burned to obtain a copper porous sintered body.

The connection support member 23 is a copper alloy rod-shaped body, and has a through hole 23a formed at the axial position for inserting the rod-shaped portion 22b of the cooling liquid suction member. Further, the connection support member 23 has a connecting portion 23b having a thread groove for screwing into the insertion hole 21b1 of the cooling container 21 at one end, and is connected to the cooling liquid supply pipes P21 and P22 at the other end. It has a coupling part 23c provided with a thread groove for making it.

The assembly of the electronic component cooling device 20 and the attachment to each pipe will be described. The rod-shaped portion 22b of the cooling liquid suction member 22 is inserted into the through hole 23a of the connection support member 23 and the tip of the cylindrical container portion 22a is inserted. A 100-mesh copper net 24 is put on. In this state, the cylindrical container portion 22a of the cooling liquid suction member 22 is inserted into the cooling container 21, and the coupling portion 23b of the connection support member 23 is screwed into the insertion hole 21b1 of the bottom plate of the cooling container 21 while the cylindrical container portion 22a.
Insert until the tip of touches 21a. The rod-shaped portion 22b of the cooling liquid suction member 22 is connected to the cooling liquid supply pipe P.
21 or P22, and the cooling liquid supply pipe P21 or P
The connection member 23 is attached to the cooling liquid supply pipe P21 or P22 by screwing the fixing member 13b provided on the boss portion 13a of 22 into the coupling portion 23c of the connection supporting member 23. Further, the exhaust pipe 21c is attached to the vapor exhaust pipe P41 or P42 by screwing the fixing member 14b provided on the boss portion 14a of the vapor exhaust pipe P41 or P42 to the tip portion 21c1 of the exhaust pipe 21c.

The operation of the embodiment configured as described above will be described. The semiconductor integrated circuit 30 is attached to the fixed plate 21a, and electricity is applied to the semiconductor integrated circuit 30 to operate the semiconductor integrated circuit 30 to generate heat. In response to the start of operation of the semiconductor integrated circuit 30, the pump 1
1, the cooling liquid is circulated in the cooling liquid supply pipes P1, P21, P22, P3 as shown by the arrow in FIG. This cooling liquid is sucked by the rod-shaped body 22b made of a porous body and supplied into the cylindrical container portion 22a. The cooling liquid comes into contact with the cooling container 21 or the round net 24 heated by the heat generation of the semiconductor integrated circuit 30 to be vaporized, flow out from the gas flow hole 22a1 of the cylindrical container portion 22a, and then reach the exhaust pipe 21c.
To flow into the steam discharge pipes 41 and 42. At this time,
The heat of the cooling container 21 is removed by vaporization of the cooling liquid, and moreover, new cooling liquid is continuously supplied to the cylindrical container portion 22a, so that the temperature of the cooling container 21 is efficiently lowered, and therefore the fixing plate is fixed. The temperature of the semiconductor integrated circuit 30 fixed to 21a also drops. Therefore, the semiconductor integrated circuit 30 is maintained at an appropriate temperature, so that its reliability is maintained. Steam exhaust pipe P
The steam of the cooling liquid that has flowed into the pipes 41 and P42 passes through the discharge pipe as shown by the dotted arrow in FIG. 1, and is cooled and liquefied by the cooling fins 12 provided on the outer wall of the steam discharge pipe P5.
It is collected in the cooling liquid tank 10.

Further, the electronic component cooling device is provided at a low cost because it has a simple structure without a wick having a complicated shape in the cooling container or the like. In addition, the electronic component cooling device can be used by simply attaching it to the cooling liquid supply pipe or the steam discharge pipe, which is convenient for handling and the arrangement of the cooling liquid supply pipe and the steam discharge pipe inside the electronic device. Since it can be installed freely, it is suitable for a cooling system for electronic devices.

Although the semiconductor integrated circuit is fixed to the fixing plate of the cooling container in the above embodiment, as a modification of the cooling container, as shown in FIG. A cooling container 30 such as a heat sink of the integrated circuit 30.
You may make it provide a integrally. This simplifies the configuration of the electronic component cooling device, and since the cooling liquid directly contacts the heat dissipation plate of the semiconductor integrated circuit, the cooling efficiency is further improved.

The porous body of the cooling liquid suction member in the above embodiment is not limited to copper, but porous ceramics, fibrous glass, polymer, natural fiber or the like may be used. Further, although the round net 24 in the above-mentioned embodiment is not always necessary, it is preferably used in order to promote vaporization of the cooling liquid and enhance cooling efficiency. At this time, instead of the net made of copper, a water absorbent material such as a fiber cloth may be used, or
It may be formed integrally with the cylindrical container portion 22a of the cooling liquid suction member 22. Further, the electronic component using the electronic component cooling device is not limited to a semiconductor integrated circuit, but can be applied to a large amount of cooling of electronic components having a large heat radiation amount in addition to a high output semiconductor device. Further, the shapes, materials and the like of the cooling container, the cooling liquid suction member, the connection support member and the like can be appropriately changed according to the purpose of use. Further, in each of the above-described embodiments, a wick may be provided on the inner wall of the cooling container, which increases the cost of the electronic component cooling device to some extent, but enhances its cooling capacity.

[Brief description of drawings]

FIG. 1 is a layout view schematically showing a semiconductor integrated circuit cooling system using an electronic component cooling device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the electronic component cooling device and its connection with a cooling liquid supply pipe and a steam discharge pipe.

FIG. 3 is a plan view showing a cooling container of the electronic component cooling device and a cross-sectional view taken along line III-III.

FIG. 4 is a cross-sectional view showing a state in which a cooling liquid suction member and a connection support member of the electronic component cooling device are combined.

FIG. 5 is a cross-sectional view showing a modified example of a cooling container of the electronic component cooling device.

[Explanation of symbols]

10; Coolant tank, 11; Coolant circulation pump, 13
a: cooling device mounting boss portion, 13b: fixing member, 14
a: cooling device mounting boss portion, 14b: fixing member, 2
0: electronic component cooling device, 21; cooling container, 21a; fixing plate, 21b; container part, 21b1; insertion hole, 21c; exhaust pipe, 22; cooling liquid suction member, 22a; cylindrical container part,
22a1; gas flow hole, 22b; rod-shaped part, 23; connection support member, 23a; through hole, 23b; coupling part, 23c; coupling part, P1, P21, P22, P3; cooling liquid supply pipe, P
41, P42, P5; steam exhaust pipe.

Claims (2)

[Claims] 1. A cooling container having a hollow three-dimensional shape, one end surface of which is an electronic component fixing portion, which has an insertion hole in a part of the other end surface, and which is provided with an exhaust pipe connected to a steam exhaust pipe on a side surface. A connecting support member having a through hole formed in the center of a rod-shaped body and having a fixing portion fixed to the insertion hole at one end, and a connecting portion connecting to the side wall opening of the cooling liquid supply pipe at the other end; A container part formed of a porous material and having a gas flow hole in its side wall and a rod-shaped part integrally attached to the bottom outer wall of the container part, and the rod-shaped part in the through hole of the connection support member. Electronic component cooling, characterized in that the container part is inserted into the cooling container with the part inserted and a cooling liquid suction member fixed to the cooling container by the fixing part of the connection support member is provided. apparatus. 2. A hollow three-dimensional shape, one end surface of which is integrally formed with an electronic component and which has an insertion hole in a part of the other end surface thereof.
A cooling container having an exhaust pipe connected to the steam discharge pipe on its side surface, a through hole formed in the center of a rod-shaped body, and a fixing portion fixed to the insertion hole at one end, and a cooling liquid at the other end. A connecting and supporting member having a connecting portion for connecting to the side wall opening portion of the supply pipe, and a rod-like member integrally formed on the outer wall of the bottom portion of the container portion formed of a porous material and having gas passage holes in the side wall. And the container portion is inserted into the cooling container in a state where the rod-shaped portion is inserted into the through hole of the connection support member, and is fixed to the cooling container by the fixing portion of the connection support member. An electronic component cooling device comprising a cooling liquid suction member.