JPH07153882A - Cooling structure of integrated circuit - Google Patents
Cooling structure of integrated circuitInfo
- Publication number
- JPH07153882A JPH07153882A JP5298810A JP29881093A JPH07153882A JP H07153882 A JPH07153882 A JP H07153882A JP 5298810 A JP5298810 A JP 5298810A JP 29881093 A JP29881093 A JP 29881093A JP H07153882 A JPH07153882 A JP H07153882A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- nozzle
- piston
- substrate
- pistons
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、集積回路の冷却構造に
関し、特に、半導体チップから発生する熱を機器外部へ
効率的に排出することができる集積回路の冷却構造に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an integrated circuit, and more particularly to a cooling structure for an integrated circuit capable of efficiently discharging heat generated from a semiconductor chip to the outside of the device.
【０００２】[0002]
【従来の技術】従来の集積回路の冷却構造では、集積回
路にコールドプレートを対向させ、コールドプレートの
底面へ集積回路と対応する位置にざぐり穴を設け、ざぐ
り穴へ冷媒の噴出ノズルと排出ノズルを各１本直向させ
ている（例えば特開平２―５４５１号公報）。2. Description of the Related Art In a conventional cooling structure for an integrated circuit, a cold plate is opposed to the integrated circuit, a counterbore is provided at a position corresponding to the integrated circuit on a bottom surface of the cold plate, and a nozzle for ejecting a refrigerant and a discharge nozzle for the refrigerant are provided in the counterbore. Are each directed straight (for example, Japanese Patent Laid-Open No. 2-5451).
【０００３】[0003]
【発明が解決しようとする課題】上述した従来の集積回
路の冷却構造では、集積回路と対向しているコールドプ
レートが集積回路全体を覆っているため、集積回路の改
造などにおいて一度コールドプレートを取り外すと、コ
ールドプレートと集積回路間の間隔を一定に保つために
特別な作業を要し、組立性に非常に問題がある。In the conventional cooling structure for an integrated circuit described above, since the cold plate facing the integrated circuit covers the entire integrated circuit, the cold plate is removed once when the integrated circuit is modified. In addition, special work is required to keep the distance between the cold plate and the integrated circuit constant, which is very problematic in assembling.
【０００４】[0004]
【課題を解決するための手段】本発明の集積回路の冷却
構造は、基板に実装された集積回路と、前記基板を保持
する基板枠と、前記集積回路の上面と対向し、底面が球
面で上部をバネで挿圧された複数個のピストンと、前記
ピストンを保持するように設けたパッキンを有する固定
枠と、冷媒を前記ピストンの底面へ直向させる吸入ノズ
ルと、前記ピストン間の冷媒の流路となる連結ノズル
と、冷媒を排出する排出ノズルとを具備することを特徴
とする。An integrated circuit cooling structure of the present invention has an integrated circuit mounted on a substrate, a substrate frame for holding the substrate, a top surface of the integrated circuit, and a bottom surface having a spherical surface. A plurality of pistons whose upper part is pressed by a spring, a fixed frame having a packing provided to hold the piston, a suction nozzle for directing the refrigerant directly to the bottom surface of the piston, and a refrigerant between the pistons. It is characterized by comprising a connecting nozzle serving as a flow path and a discharge nozzle for discharging the refrigerant.
【０００５】[0005]
【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【０００６】図１は本発明の一実施例の縦断面図であ
る。集積回路２は基板１に搭載される。基板１の外周縁
部は基板枠３に強固に固着されている。集積回路２の上
面には底面が球面で上部をバネ４で挿圧された複数個の
ピストン５を有している。ピストン５の周囲には、ピス
トンを保持するようにパッキン１１を有する固定枠９を
設けている。冷媒はピストン５の底面に直向させた吸入
ノズル６とピストン間の冷媒流路となる連結ノズル７を
通って排出ノズル８へ排出される。固定枠９の上部には
吸入ノズル６，連結ノズル７，排出ノズル８を保持し、
固定枠９全体を覆うカバー１０を設けている。ピストン
５は底面が球面でかつバネ４で集積回路２の上面を常時
挿圧しているため、集積回路２の傾きにも追従できるよ
うになっている。矢印は冷媒の流れを示す。FIG. 1 is a vertical sectional view of an embodiment of the present invention. The integrated circuit 2 is mounted on the substrate 1. The outer peripheral edge of the substrate 1 is firmly fixed to the substrate frame 3. The upper surface of the integrated circuit 2 has a plurality of pistons 5 whose bottom surface is spherical and whose upper portion is pressed by a spring 4. Around the piston 5, a fixed frame 9 having a packing 11 for holding the piston is provided. The refrigerant is discharged to the discharge nozzle 8 through a suction nozzle 6 that is directed directly to the bottom surface of the piston 5 and a connection nozzle 7 that serves as a refrigerant flow path between the pistons. The suction nozzle 6, the connection nozzle 7, and the discharge nozzle 8 are held on the upper part of the fixed frame 9,
A cover 10 is provided to cover the entire fixed frame 9. Since the piston 5 has a spherical bottom surface and the spring 4 constantly presses the upper surface of the integrated circuit 2, the tilt of the integrated circuit 2 can be followed. The arrow indicates the flow of the refrigerant.
【０００７】[0007]
【発明の効果】以上説明したように、本発明は、集積回
路の上面を底面が球面でバネで常時挿圧したピストンを
設けることにより、集積回路の傾きに追従でき、集積回
路の改造などにおいて、基板を取り外しても、再組立が
容易でピストンと集積回路間を密着でき、集積回路の組
立時による傾きに左右されず、集積回路と冷媒間の熱抵
抗を低く抑え、効率的に機器外部へ排出できる効果を奏
する。As described above, according to the present invention, by providing a piston having a spherical bottom surface on the upper surface of the integrated circuit and constantly pressing with a spring, it is possible to follow the inclination of the integrated circuit, and to remodel the integrated circuit. , Even if the board is removed, reassembly is easy and the piston and the integrated circuit can be in close contact with each other, and the thermal resistance between the integrated circuit and the refrigerant is kept low and the equipment is efficiently outside the equipment. The effect that can be discharged to.
【図１】本発明の一実施例の縦断面図である。FIG. 1 is a vertical sectional view of an embodiment of the present invention.
１ 基板 ２ 集積回路 ３ 基板枠 ４ バネ ５ ピストン ６ 吸入ノズル ７ 連結ノズル ８ 排出ノズル ９ 固定枠 １０ カバー １１ パッキン 1 Substrate 2 Integrated Circuit 3 Substrate Frame 4 Spring 5 Piston 6 Suction Nozzle 7 Connection Nozzle 8 Discharge Nozzle 9 Fixed Frame 10 Cover 11 Packing
Claims (2)
を保持する基板枠と、前記集積回路の上面と対向し、底
面が球面で上部をバネで挿圧された複数個のピストン
と、前記ピストンを保持するように設けたパッキンを有
する固定枠と、冷媒を前記ピストンの底面へ直向させる
吸入ノズルと、前記ピストン間の冷媒の流路となる連結
ノズルと、冷媒を排出する排出ノズルとを具備すること
を特徴とする集積回路の冷却構造。1. An integrated circuit mounted on a substrate, a substrate frame for holding the substrate, a plurality of pistons facing the upper surface of the integrated circuit, the bottom surface of which is spherical, and the top of which is spring-loaded. A fixed frame having a packing provided to hold the piston, a suction nozzle for directing the refrigerant directly to the bottom surface of the piston, a connecting nozzle serving as a refrigerant flow path between the pistons, and a discharge nozzle for discharging the refrigerant. And a cooling structure for an integrated circuit.
排出ノズルを保持し、前記固定枠を覆うカバーを具備す
ることを特徴とする集積回路の冷却構造。2. A cooling structure for an integrated circuit, comprising a cover that holds the suction nozzle, the connection nozzle, and the discharge nozzle and covers the fixed frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5298810A JPH07153882A (en) | 1993-11-30 | 1993-11-30 | Cooling structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5298810A JPH07153882A (en) | 1993-11-30 | 1993-11-30 | Cooling structure of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07153882A true JPH07153882A (en) | 1995-06-16 |
Family
ID=17864519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5298810A Pending JPH07153882A (en) | 1993-11-30 | 1993-11-30 | Cooling structure of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07153882A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018214515A1 (en) * | 2017-05-23 | 2018-11-29 | 京东方科技集团股份有限公司 | Support plate for vapor deposition device and vapor deposition device thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109955A (en) * | 1991-05-21 | 1993-04-30 | Internatl Business Mach Corp <Ibm> | Integrated circuit chip cooler |
| JPH05121608A (en) * | 1991-10-25 | 1993-05-18 | Fujitsu Ltd | Conductive cooling structure |
| JPH06112384A (en) * | 1992-01-22 | 1994-04-22 | Nec Corp | Cooling system for integrated circuit |
| JPH0750375A (en) * | 1994-07-25 | 1995-02-21 | Hitachi Ltd | Cooling device |
-
1993
- 1993-11-30 JP JP5298810A patent/JPH07153882A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109955A (en) * | 1991-05-21 | 1993-04-30 | Internatl Business Mach Corp <Ibm> | Integrated circuit chip cooler |
| JPH05121608A (en) * | 1991-10-25 | 1993-05-18 | Fujitsu Ltd | Conductive cooling structure |
| JPH06112384A (en) * | 1992-01-22 | 1994-04-22 | Nec Corp | Cooling system for integrated circuit |
| JPH0750375A (en) * | 1994-07-25 | 1995-02-21 | Hitachi Ltd | Cooling device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018214515A1 (en) * | 2017-05-23 | 2018-11-29 | 京东方科技集团股份有限公司 | Support plate for vapor deposition device and vapor deposition device thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6219236B1 (en) | Cooling system for multichip module | |
| US5706169A (en) | Cooling apparatus for a computer central processing unit | |
| US7375962B2 (en) | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | |
| US7233494B2 (en) | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins | |
| JP3530151B2 (en) | Electronic device with built-in heating element and cooling device used for this electronic device | |
| EP1517602B1 (en) | Cooling structure of electronic element | |
| JPH09129790A (en) | Heat sink device | |
| WO2006121229A1 (en) | Cooling apparatus for a notebook computer | |
| JPH05304234A (en) | Cooling structure for integrated circuit | |
| JPH0846097A (en) | Mounting structure and fixture for heat sink | |
| JPH07153882A (en) | Cooling structure of integrated circuit | |
| JPH06196598A (en) | Mounting structure for semiconductor chip | |
| TWI809220B (en) | thermostat | |
| JPS6259888B2 (en) | ||
| JPH0426549B2 (en) | ||
| JPH0315982Y2 (en) | ||
| JPH0767021B2 (en) | Semiconductor element cooling structure | |
| JPS63221655A (en) | Cooling method for element | |
| JP3172138B2 (en) | Heating element cooling structure | |
| JP3908439B2 (en) | Fan integrated heat sink | |
| US20030070791A1 (en) | Heat sink module | |
| US20240322106A1 (en) | Heat dissipation module | |
| JPH05121604A (en) | Cooling system | |
| JPH08264693A (en) | Cooling device for electronic parts | |
| KR100323439B1 (en) | Thermoelectric semiconductor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980630 |