JPH07153668A - Positioning stage device and aligner using it - Google Patents

Abstract

PURPOSE:To effectively cool a mask, a substrate such as a wafer or the like and a holding plate holding them during an exposure by a method wherein the holding plate which is supported inside an exposure chamber by an elastic member integrated with a base plate, at least one cooling member which is brought close to the holding plate and a cooling means which cools it are provided. CONSTITUTION:A mask-temperature-regulating base 4 and a mask holding plate 6 are coupled integrally via a plurality of mask plate springs 5 as elastic members. Then, a mask cooling block 7 as a cooling member provided with annular face 7a which is faced with the outer circumferential face 6a of the mask holding plate 6 via a very small gap is arranged. Thereby, it is possible to realize a positioning stage device in which a mask, a substrate such as a wafer or the like and the holding plate supporting them during an exposure are cooled effectively and in which there is no fear that vibrations are given to them due to the flow of a temperature-regulating coolant.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning stage device for positioning a substrate such as a wafer or a mask in a semiconductor exposure device and an exposure device using the positioning stage device.

[0002]

2. Description of the Related Art In a semiconductor exposure apparatus, it is required to position a substrate such as a wafer to be exposed (hereinafter referred to as "substrate") with high precision with respect to a mask and exposure light.
A holding board for holding a substrate is supported via a leaf spring or the like on an XY stage that is roughly positioned by a generally known XY drive mechanism or the like, and an axis (orthogonal to the XY plane within a range permitted by the leaf spring). (Hereinafter referred to as "Z-axis"), the rotation angle around the Z-axis is adjusted by a fine driving device using a known piezoelectric element or the like, and the final substrate positioning is performed. Is configured to do. Similarly, the mask stage holding the mask is also supported by the mask frame via a leaf spring or the like, and is configured so that fine rotation adjustment about the Z axis can be freely performed.

FIG. 8 shows a charged particle storage ring synchrotron radiation (hereinafter,
It is called "SR-X-ray". ) As exposure light, a decompression chamber 101 controlled to a decompression atmosphere such as helium gas, a wafer stage frame 102a and a mask stage frame 102b fixed in the decompression chamber 101, respectively. An XY stage 103 supported by the wafer stage frame 102a,
A mask temperature control base 104 that is integrated with the mask stage frame 102b, a mask holding plate 106 that is integrally connected to the mask temperature control base 104 via a plurality of mask leaf springs 105, and a wafer held by the XY stage 103. The XY stage 103 includes a fine movement stage 108 and a wafer holding plate 109 supported by the fine movement stage 108. The XY stage 103 reciprocates in the Y-axis direction along a Y guide 103a that is integral with the wafer stage frame 102a by a driving device such as a double-acting cylinder. An X stage 103 that is reciprocated in the X-axis direction by a driving device such as a double-acting cylinder along a Y stage (not shown) that is moved and an X guide 103b that is integral with the Y stage.
The decompression chamber 101 has a bottom portion supported on the floor surface F ₀ via a vibration isolation base 101a.

The SR-X-ray L ₀ is introduced into the decompression chamber 101 from a beam duct (not shown) connected to the opening 101b of the decompression chamber 101, and the mask holding plate 106.
After passing through the mask M ₀ attracted by the magnetic attraction force, the wafer W ₀ attracted to the wafer holding plate 109 is irradiated.

Mask temperature control base 104 and mask holding board 1
As shown in FIG. 9, the mask leaf springs 105 provided between the mask holding plate 106 and the mask temperature control base 1 are connected to each other.
04 is a thin plate-like member integrally provided with the mask holding plate 106, has a predetermined elasticity only in the circumferential direction of the mask holding plate 106, and has a cut 104a provided in the mask temperature control base 104 and the mask holding plate 106. Within a range allowed by the annular gap 104b formed between the mask temperature control base 104 and the mask temperature control base 104, the mask holding plate 106 is controlled by a fine driving device such as a piezoelectric element not shown.
Is configured so that it can be finely adjusted with respect to the mask temperature control base 104. In addition, each mask leaf spring 105
The mask temperature control base 104 and the mask holding plate 106 are manufactured as an integral annular body, and then wire electric discharge machining is performed along each of the cuts 104a and the annular gap 104b to form the mask temperature adjusting base 104 and the mask holding plate. Although it is formed integrally with both the mask temperature control base 106 and the mask temperature control base 10,
4, a thin plate-shaped body manufactured separately from the mask holding board 106 may be joined to the mask temperature control base 104 and the mask holding board 106 by a known method.

The fine wafer movement stage 108 is also supported by a leaf spring similar to the mask leaf spring 105 so as to be capable of fine rotation adjustment. After the rough positioning by the XY stage 103, the wafer W ₀ and the mask M are aligned by the alignment optical system. The minute position deviation between ₀ is detected, and the fine positioning device for the wafer fine movement stage 108 finally positions the wafer W ₀ .

[0007] During the exposure of the wafer W ₀ is, the wafer W ₀ and the mask M by the SR-X-ray L ₀ is an extremely high-energy
_{Since 0} may be heated to cause thermal deformation, the temperature control flow medium for cooling supplied by the temperature control line 104c or the like is used as the wafer fine movement stage 108 or the mask temperature control base 104.
The wafer holding plate 109, the mask holding plate 106, and the peripheral members thereof are made to flow through the inner pipe of the above, and the temperature rise of the mask M ₀ is prevented.

[0008]

However, according to the above-mentioned conventional technique, the mask holding plate and the mask temperature adjusting base are only connected to each other through a thin leaf spring, and in addition, the mask holding plate is not heated. Since the suction surface for adsorbing the mask is provided at the portion protruding from the adjustment base in the Z-axis direction, even if the temperature adjustment medium is flowed through the internal pipe of the mask temperature adjustment base and cooled, the mask is sufficiently cooled. I can't. As a result, the thermal distortion of the mask may deform the transfer pattern. It is also possible to directly cool the mask holding plate by providing an internal pipe on the mask holding plate and flowing the temperature adjusting flow medium through this, but this is because the mask is caused by vibration due to the flow of the temperature adjusting medium. There is a risk of misregistration in the sheet, which may cause transfer deviation, and therefore cannot be adopted. The same applies to the wafer holder.

The present invention has been made in view of the above problems of the prior art, and it effectively cools the substrate such as the mask or wafer during exposure and the holding plate for holding them, and controls the temperature of these. An object of the present invention is to provide a positioning stage device that does not give vibration due to the flow of a flowing medium and the like, and an exposure apparatus using the positioning stage device.

[0010]

In order to achieve the above object, a positioning stage device of the present invention is a holding plate supported in an exposure chamber by an elastic member which is integral with a table, and a holding plate close to the holding plate. Both are characterized by having one cooling member and cooling means for cooling the same.

It is preferable that the cooling member is integral with the base and the cooling means is an internal pipe provided on the base.

Further, the cooling means may be an internal pipe provided on the cooling member.

[0013]

A holding plate for holding a substrate such as a mask or a wafer is supported by an elastic member which is integrated with a base plate, and can be finely rotated and adjusted within the range of its elasticity. By cooling the surface of the holding plate with the cooling member, it is possible to effectively cool the holding plate and the substrates such as masks and wafers held by the holding plate, and prevent thermal strain and displacement from occurring in them. If the cooling means is a cooling member or an internal pipe provided on the base, there is no possibility that vibration due to the flow of the temperature control medium will be transmitted to the substrate such as the mask or wafer.

[0014]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows an exposure apparatus according to the first embodiment, which is a charged particle storage ring radiation (hereinafter referred to as "S").
R-X-ray ". ) As exposure light, and a decompression chamber 1 which is an exposure chamber controlled in a decompressed atmosphere such as helium gas, a wafer stage frame 2a and a mask stage frame 2b fixed in the decompression chamber 1 respectively. The XY stage 3 supported by the wafer stage frame 2a and the mask stage frame 2
Mask temperature control base 4 which is a base provided integrally with b
A mask holding plate 6 which is a holding plate integrally connected to the mask temperature adjusting base 4 via a mask leaf spring 5 which is a plurality of elastic members, and the outer peripheral surface 6a of the mask holding plate 6 has, for example, 5
A mask cooling block 7 as a cooling member having annular surfaces 7a facing each other with a minute gap of about μm, a wafer fine movement stage 8 held by an XY stage 3, and a wafer holding unit supported by the wafer holding block 7. It has a board 9, XY
The stage 3 includes a Y stage (not shown) that is reciprocally moved in the Y-axis direction by a driving device such as a double-acting cylinder along a Y guide 3a that is integral with the wafer stage frame 2 and an X guide 3b that is integral with the Y stage. A well-known XY drive mechanism including an X stage 3c reciprocally moved in the X-axis direction by a drive device such as a double-acting cylinder.
Further, the bottom of the decompression chamber ₁ is supported on the floor surface F ₁ via the vibration isolation table 1a.

The SR-X-ray L ₁ is introduced into the decompression chamber from a beam duct (not shown) connected to the opening 1b of the decompression chamber _{1, and} passes through the mask M ₁ attracted to the mask holding plate 6 by the magnetic attraction force. The wafer W ₁ attracted to the wafer holding plate 9 is irradiated.

Each mask leaf spring 5 provided between the mask temperature control base 4 and the mask holding plate 6 is, as shown in FIG.
It is a thin plate-like body extending from the outer peripheral surface 6a of the mask holding plate 6 toward the inner peripheral surface of the mask temperature control base 4, and this is formed by a notch 4a provided in the inner peripheral surface of the mask temperature control base 4. It projects into the mask temperature control base 4. Each mask leaf spring 5 has a predetermined elasticity only in the circumferential direction of the mask holding plate 6, and the gap 4 between the mask holding plate 6 and the mask temperature control base 4 is provided.
b, and within the range allowed by each notch 4a of the mask temperature control base 4,
The mask holding plate 6 can be finely adjusted with respect to the mask temperature adjustment base 4 by a fine driving device such as a piezoelectric element (not shown). Each mask leaf spring 5 is manufactured by integrally manufacturing the mask temperature adjusting base 4 and the mask holding plate 6 and then performing wire electric discharge machining along each of the cuts 4a and the annular gap 4b. Although it is formed integrally with both the mask temperature control base 4 and the mask holding board 6, a thin plate-like body manufactured separately from the mask temperature control base 4 and the mask holding board 6 is manufactured by a known method. It may be combined with the mask temperature control base 4 and the mask holding board 6.

Further, the wafer holding plate 9 is also the mask leaf spring 5.
It is supported on the wafer fine movement stage 8 by a leaf spring similar to the above so as to be capable of fine rotation adjustment, and after the rough positioning by the XY stage 3, the wafer W is moved by the alignment optical system.
A minute positional deviation between ₁ and the mask M ₁ is detected, and the wafer W ₁ on the wafer holding plate 9 is finally positioned by a minute driving device (not shown) together with the wafer fine moving stage 8.

The mask cooling block 7 is made of a material having a high thermal conductivity, such as SUS, and its bottom surface is fixed to the surface of the mask temperature control base 4. The mask temperature control base 4 has an internal pipe which is a cooling means (not shown), and the temperature control flow medium is supplied to the internal pipe from one of the pair of temperature control lines 4c to cool the mask temperature control base 4. The temperature control flow medium flowing through the internal pipe of the mask temperature control base 4 is discharged from the other of the pair of temperature control lines 4c. Such masks temperature control base 4 which is cooled in the mainly efficiently cool the mask holding plate 6 and the mask M ₁ via a mask cooling block 7, the mask M ₁ in the exposure by the SR-X-ray L ₁ Prevents overheating and displacement.

According to this embodiment, in the mask positioning stage device including the mask temperature control base, the mask leaf spring, and the mask holding plate, the mask holding block and the mask held by the mask cooling block are cooled very effectively. Therefore, there is no risk that thermal distortion occurs in the mask during exposure and the transfer pattern is deformed due to this, and that the mask is displaced due to thermal distortion of the mask holding plate. Therefore, the accuracy of transfer and printing of the exposure device can be greatly improved. Further, by providing a cooling block similar to the mask cooling block around the wafer holding plate to effectively cool the wafer holding plate and the wafer, and prevent thermal distortion and positional deviation of the wafer, transfer of the exposure apparatus, The baking accuracy can be further improved.

As shown in FIG. 3, the mask bottom cooling block 1 is a cooling member similar to the mask cooling block 7.
0 is provided integrally with the bottom surface of the mask temperature control base 4, and the surface 10a of the mask bottom cooling block 10 is opposed to the bottom surface 6b of the mask holding board 6 with a minute gap of, for example, about 5 μm. Can be cooled further efficiently.

FIG. 4 shows a mask positioning stage apparatus according to the second embodiment, which is used for horizontally positioning the mask in a known stepper or the like, and is a rectangular frame-shaped mask temperature which is a second table. Tone base 14 and 4 firsts
X fine movement stage 16a which is a base integrally provided with the mask temperature control base 14 via the mask leaf spring 15a
From the y fine movement stage 16b provided integrally with the x fine movement stage 16a via the second mask leaf springs 15b which are four elastic members, and the mask holding plate 16c which is a holding plate integrated with the y fine movement stage 16b. Therefore, the first and second mask leaf springs 15a and 15b are similar to the mask leaf spring 5 of the first embodiment in that the mask temperature control base 14 and the x fine movement stage 16a and y.
After forming a rectangular block in which the fine movement stage 16b is integrated, a groove 16d for separating the mask temperature adjustment base 14, the x fine movement stage 16a, and the y fine movement stage 16b from each other is formed by wire electric discharge machining, and each groove 16d is formed. By further cutting in the predetermined direction, the mask leaf springs 15a, 15
b is formed. In addition, mask temperature control base 1
4 is provided with an internal pipe which is a cooling means similar to the mask temperature control base 4 of the first embodiment, and is connected with a temperature control line 14c similar to the temperature control line 4c.

The mask holding board 16c is a mask temperature control base 1
4 and the x fine movement stage 16a are projected upward from the upper surface, and a mask (not shown) is attracted to the upper surface.

The mask temperature control base 14 has a pair of mask fixed cooling blocks 17a, and the x fine movement stage 16a is
Each mask fixing cooling block 17a has a mask x cooling block 17b, which is a pair of cooling members facing each other with a minute gap like the first embodiment, and y fine movement stage 1
6b, each end face has each mask x cooling block 17
b has a mask y cooling block 17c, which is a pair of cooling members facing each other with a minute gap similar to that described above, and includes a mask fixed cooling block 17a and a mask x cooling block 17b.
And the mask y cooling block 17c is the mask temperature control base 14
And the x fine movement stage 16a and the y fine movement stage 16b are integrally provided respectively, and the central portions of the respective mask x cooling blocks 17b and the respective side surfaces of the respective mask y cooling blocks 17c have the same minute gaps as described above. The four sides of the mask holding plate 16c are opposed to each other via the.

In the positioning stage apparatus of the present embodiment, the x fine movement stage 16a and the y fine movement stage 16b are each mask leaf spring 15 by a driving device such as a piezoelectric element (not shown).
By finely adjusting the fine movement within the range of a and 15b, fine movement positioning of the mask holding board 16c in the X-axis direction and the Y-axis direction is performed. The mask holding plate 16c and the mask held by the mask holding plate 16c are cooled by heat transfer from the mask temperature control base 14 having internal pipes.
Since it is efficiently cooled by the method, there is no risk that the mask will be displaced during exposure and that it will be deformed by thermal strain.

FIG. 5 shows a positioning stage apparatus according to the third embodiment, which is for horizontally positioning a wafer in a known stepper or the like, and is on a Y stage 23 of a known XY stage mechanism. It is elastically supported on the wafer fine movement stage 28, which is a pedestal, via the first wafer leaf springs 25a, which are a plurality of elastic members, and is moved in the Z-axis direction by the wafer fine driving device 23a, which is a holding plate driving means such as a piezoelectric element. The wafer cooling block 27 is a wafer holding plate 29 which is a reciprocating holding plate and a wafer cooling block 27 which is a cooling member having a cooling surface 27a facing the bottom surface thereof with a minute gap of, for example, about 5 μm. Is connected to the Y stage 23 via the plurality of second wafer leaf springs 25b.
Is elastically supported by a support body 24 that is integrally provided with. On the lower surface of the Y stage 23, the wafer fine driving device 2
3a is provided with a pair of drive cylinders 23b, which are cooling member drive means, and each drive cylinder 23 is driven.
In b, the wafer cooling block 27 is finely moved in the vertical direction in synchronization with the wafer holding plate 29 by moving the wedge-shaped member 23c forward and backward so that the gap between the wafer cooling block 27 and the wafer holding plate 29 is always constant. It is designed to be held to size.

In this embodiment, the wafer cooling block 27 is provided with an internal pipe 27b as a cooling means, and the temperature control flow medium supplied from the temperature control line 27c is caused to flow through the internal pipe 27b to cool the upper surface of the wafer cooling block 27. Then, the wafer holding plate 9 facing the wafer holding plate 9 and the wafer held by the wafer holding plate 9 are effectively cooled to prevent the wafer from being displaced during the exposure, thermal distortion and the like. As a result, highly accurate transfer and printing can be performed.

Next, an embodiment of a method of manufacturing a semiconductor device using the above exposure apparatus will be described. FIG. 6 shows microdevices (semiconductor chips such as IC and LSI, liquid crystal panels, C
A flow of manufacturing a CD, a thin film magnetic head, a micromachine, etc. is shown. In step S1 (circuit design), a semiconductor device circuit is designed. In step S2 (mask manufacturing), a mask having the designed circuit pattern is manufactured.
On the other hand, in step S3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step S5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer manufactured in step S4, such as an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. including. Step S6 (inspection)
Then, inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step S5 are performed. Through these steps, the semiconductor device is completed and shipped (step S7).

FIG. 7 shows a detailed flow of the wafer process. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the wafer surface. In step S13 (electrode formation), electrodes are formed on the wafer by vapor deposition. Step S14
In (ion implantation), ions are implanted in the wafer. In step S15 (resist process), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step S17 (development), the exposed wafer is developed. In step S18 (etching), parts other than the developed resist image are scraped off. In step S19 (resist peeling), the unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device, which has been difficult to manufacture in the past.

[0030]

Since the present invention is configured as described above, it has the following effects.

It is possible to realize a positioning stage device that effectively cools a substrate such as a mask or wafer during exposure and a holding plate that holds the substrate, and that does not give vibration to them due to the flow of the temperature control medium. As a result, it is possible to prevent transfer distortion due to thermal distortion, positional deviation, or vibration of the substrate such as a mask or wafer during exposure, and to realize highly accurate transfer and printing.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an exposure apparatus according to a first embodiment.

FIG. 2 shows a main part of a mask positioning stage device of the apparatus of FIG. 1, in which (a) is a mask cooling block,
(B) is a perspective view showing a mask holding board, respectively.

FIG. 3 is a schematic cross-sectional view showing a modification of the positioning stage device according to the first embodiment.

FIG. 4 is a perspective view showing a mask positioning stage device according to a second embodiment.

FIG. 5 is a schematic sectional view showing a wafer positioning stage device according to a third embodiment.

FIG. 6 is a sequence diagram illustrating a semiconductor device manufacturing process.

FIG. 7 is a sequence diagram illustrating a wafer process.

FIG. 8 is a schematic sectional view showing an exposure apparatus according to a conventional example.

9 is a perspective view showing a main part of a mask positioning stage device of the apparatus of FIG. 8;

[Explanation of symbols]

 1 Decompression chamber 3 XY stage 4,14 Mask temperature control base 5,15a, 15b Mask leaf spring 6,16c Mask holding plate 7 Mask cooling block 8,28 Wafer fine movement stage 9,29 Wafer holding plate 10 Mask bottom cooling block 16a x Fine movement stage 16b y Fine movement stage 17a Mask fixed cooling block 17b Mask x cooling block 17c Mask y cooling block 23 Y stage 23b Drive cylinders 25a, 25b Wafer leaf spring 27 Wafer cooling block 27b Internal piping

Claims (8)

[Claims] 1. A holding plate supported in an exposure chamber by an elastic member integrated with a base, at least one cooling member adjacent to the holding plate, and cooling means for cooling the holding plate. Positioning stage device. 2. The positioning stage device according to claim 1, wherein the cooling member is integral with the base, and the cooling means is an internal pipe provided on the base. 3. The positioning stage apparatus according to claim 1, wherein the cooling means comprises an internal pipe provided in the cooling member. 4. The positioning stage according to claim 1, wherein the cooling member is integral with the base, and the cooling means is an internal pipe provided on a second base that supports the base. apparatus. 5. A holding plate driving means for moving the holding plate within a range permitted by the elastic member, and a cooling member driving means for moving the cooling member together with the holding plate. Positioning stage device. 6. The positioning stage apparatus according to claim 1, wherein the size of the gap between the holding plate and the cooling member is about 5 μm. 7. An exposure apparatus, comprising: the positioning stage apparatus according to claim 1; and exposure means for exposing a substrate held by the positioning stage apparatus. 8. A positioning stage device according to claim 1, a mask held by the positioning stage device, a substrate holding means for holding the substrate, and the exposure light irradiated through the mask to move the substrate. An exposure apparatus comprising an exposure means for exposing.