JP2006006050A - Armature unit, electromagnetic actuator, stage device and exposing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an armature unit or the like which can reduce the temperature distribution of the inside and the surface of a jacket for cooling a coil to prevent deterioration of the detection accuracy of a laser interferometer. <P>SOLUTION: The electromagnetic actuator 1 comprises an armature unit 10 equipped with a coil 13 and a magnetic field generating body unit 20 equipped with magnets 22, 23. The armature unit 10 accommodates the coil 13 in a first jacket 11, and seals and accommodates refrigerant 14 with its boiling point set to a substantially ambient temperature in an air-liquid mixed condition to cool the coil 13 as well as in the first jacket 11. A second jacket 12 cools the refrigerant 14 in a gas condition in the first jacket 11 to liquidize it. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an armature unit including a coil, and an electromagnetic actuator, a stage apparatus, and an exposure apparatus including the armature unit.

  Devices such as semiconductor elements, liquid crystal display elements, imaging devices (CCD (Charge Coupled Device), etc.), thin film magnetic heads, etc., have a pattern formed on a mask placed on a substrate (such as a semiconductor wafer or glass plate coated with a resist). It is manufactured by a so-called lithography technique for transferring. In this lithography process, an exposure apparatus including a mask stage that holds a mask, a substrate stage that holds a substrate, and a projection optical system that projects an optical image of a pattern formed on the mask onto the substrate is used. In order to drive a mask stage, a substrate stage, and the like provided in the exposure apparatus, an electromagnetic actuator such as a linear motor or a voice coil motor is provided.

The electromagnetic actuator includes a stator and a mover configured to be movable relative to the stator. An armature unit is provided on one of the mover and the stator, and a magnet generator unit is provided on the other. Is provided. The armature unit includes a coil array in which coils are arranged along the moving direction of the mover, and the magnet generator unit includes a magnet array in which permanent magnets are arrayed along the moving direction of the mover. In order to drive the electric actuator, it is necessary to pass a current through the coils forming the coil array, but heat is generated when a current is passed through the coils. For this reason, the electromagnetic actuator accommodates a coil array, which is a heat generation source, in the jacket, introduces the refrigerant from the refrigerant introduction port into the jacket, discharges the refrigerant from the refrigerant discharge port, and circulates the refrigerant in the jacket so as to circulate the coil array. In many cases, the structure is cooled. For details of the conventional electromagnetic actuator, see, for example, Patent Documents 1 and 2 below.
JP 2000-1114034 A JP 2002-078314 A

  By the way, the refrigerant introduced into the jacket described above is heated by the coil as a heat generation source while flowing in the jacket, and the temperature rises. For this reason, a temperature difference arises between the temperature of the refrigerant | coolant in the refrigerant inlet provided in the jacket, and the temperature of the refrigerant | coolant in a refrigerant | coolant discharge port. In particular, the armature unit provided in the mask motor of the exposure apparatus or the linear motor device of the substrate stage is set to the same length as the movable range of the mask stage or the substrate stage. The amount heated by the coil while flowing in the jacket increases, and the difference between the temperature of the refrigerant at the refrigerant inlet and the temperature at the refrigerant outlet increases.

  When a temperature distribution occurs in the refrigerant in the jacket, the temperature distribution also appears on the surface of the jacket, and thus air fluctuation occurs on the jacket surface. Each of the mask stage or the substrate stage is provided with a laser interferometer that irradiates a moving mirror or the like provided on each stage with laser light to detect position information of each stage. When a jacket is arranged in the vicinity of the optical path of laser light emitted from the laser interferometer (for example, in the downward direction of the optical path), the mask stage or substrate stage by the laser interferometer is affected by the influence of air fluctuations generated on the jacket surface. There is a problem that the position detection accuracy of the lowering. In addition, if there is a temperature distribution, heat is transmitted to the members constituting each stage to cause dimensional changes, which may affect the measurement of the laser interferometer.

  The present invention has been made in view of the above circumstances, and an armature unit that can prevent deterioration in detection accuracy of a laser interferometer by reducing the temperature distribution inside and on the surface of a jacket that cools a coil, and An object of the present invention is to provide an electromagnetic actuator, a stage apparatus, and an exposure apparatus that include the armature unit.

In order to solve the above problems, an armature unit of the present invention is an armature unit (10, 30, 40, 50) including a coil (13), and has a refrigerant (boiling point) set at a substantially normal temperature ( 14, 34a, 34b) are hermetically housed in a gas-liquid mixed state, and the first cooling part (11, 31a, 31b) for cooling the coil, and the second cooling part for cooling and liquefying the gaseous refrigerant ( 12, 32, 41, 51, 52).
According to the present invention, the refrigerant hermetically accommodated in the first cooling unit is boiled by the heat generated from the coil, and the temperature of the coil is maintained near the boiling point. Further, the gaseous refrigerant is cooled by the second cooling unit to be in a liquid state. Thereby, the inside of the 1st cooling part is made into the state where the refrigerant of a gas state and the refrigerant of a liquid state exist.
An electromagnetic actuator according to the present invention includes the armature unit described above, and a magnetism generator unit (20) having a magnetism generator (22, 23) and relatively movable between the armature unit, and the armature. The unit includes a stator or a mover, and the magnet generator unit includes a mover or a stator.
A stage apparatus according to the present invention is a stage apparatus (100) including a stage (104) movable in a predetermined direction, and is characterized by including the above-described electromagnetic actuator as a drive means for the stage.
The stage apparatus of the present invention further includes a mask stage (RST) that holds a mask (R) and a substrate stage (WST) that holds a substrate (W), and a pattern formed on the mask is placed on the substrate. An exposure apparatus (200) for transferring to a substrate, wherein the stage apparatus is provided as at least one of the mask stage and the substrate stage.

  According to the present invention, since the liquid refrigerant and the gas refrigerant are always present in the first cooling section, the temperature inside the first cooling section is close to the boiling point of the refrigerant even if the coil generates heat. The surface temperature of the first cooling section is also substantially constant, being kept substantially constant. As a result, temperature distribution does not occur inside and on the surface of the first cooling unit, so that there is no effect of thermal influences such as air fluctuations on devices and members such as a laser interferometer provided around the first cooling unit. .

  Hereinafter, an armature unit, an electromagnetic actuator, a stage apparatus, and an exposure apparatus according to embodiments of the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view showing a schematic configuration of an electromagnetic actuator including an armature unit according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. In the following description, if necessary, an xyz orthogonal coordinate system is set in the figure, and the positional relationship of each member will be described with reference to the xyz orthogonal coordinate system. In the xyz orthogonal coordinate system, the y-axis is set to the relative movement direction of the armature unit 10 and the magnetic element unit 20, and the z-axis is set to the vertically upward direction. In FIG. 1, for simplicity, the armature unit 10 and the magnet generator unit 20 are shown to have the same length in the y direction. The armature unit 10 may be set longer than the magnetomotive unit 20.

  As shown in FIG. 1, the electromagnetic actuator 1 includes an armature unit 10 and a magnet generator unit 20 extending in the y direction, and the armature unit 10 moves relative to the magnet generator unit 20 in the y direction, or generates a power. The magnetic body unit 20 is configured to move relative to the armature unit 10 in the y direction. Here, the case where the armature unit 10 moves relative to the magnet generator unit 20 in the y direction will be described as an example. In this case, the armature unit 10 becomes a mover and the magnet generator unit 20 becomes a stator.

  First, as shown in FIG. 2, the armature unit 10 includes a first jacket 11, a second jacket 12, a plurality of coils 13 arranged along the y direction, and a refrigerant 14. Each of the coils 13 is formed by winding a copper round wire or a rectangular wire into a substantially rectangular shape a predetermined number of times (for example, several tens to several hundreds times), and the winding surface is substantially parallel to the yz plane. In other words, the direction of the magnetic field generated at the center of the coil 13 when a current is passed through the coil 13 is arranged to be substantially parallel to the x-axis. The material of the coil 13 is not limited to copper, and an aluminum wire may be used.

  The plurality of coils 13 are accommodated in a first jacket 11 serving as a first cooling unit. Each of the coils 13 is connected to a drive device (not shown) that drives the electromagnetic actuator 1 via a connection portion (not shown) provided on the first jacket 11. The first jacket 11 is a member having a rectangular annular cross section formed of a nonmagnetic SUS material having high thermal conductivity, and accommodates the coil 13 and the refrigerant 14 in a sealed state. The first jacket 11 is not limited to a nonmagnetic SUS material, and is preferably formed of a material that is nonmagnetic and has a Young's modulus equal to or higher than that of a SUS material. Further, it can be formed of CFRP (carbon fiber reinforced plastic), ceramics or the like in consideration of viscous resistance due to eddy current generation.

  The refrigerant 14 is a liquid having a good electrical insulation, and is hermetically accommodated in the first jacket 11 in a state where the boiling point is set to substantially normal temperature (25 ° C.) and in a gas-liquid mixed state. The reason why the refrigerant 14 is hermetically housed in the first jacket 11 in a gas-liquid mixed state is to cool the coil 13 by heat of vaporization and to keep the temperature inside and the surface of the first jacket 11 constant. The reason why the boiling point of the refrigerant 14 hermetically housed in the first jacket 11 is set to about room temperature is to keep the temperature of the inside and the surface of the first jacket 11 at room temperature when the coil 13 generates heat. 2 shows a state in which the coil 14 is immersed in the liquid state refrigerant 14. However, the coil 14 does not necessarily have to be immersed in the liquid state refrigerant 14, and the first jacket is not necessarily required. It is only necessary that the refrigerant 14 in a gas state and the refrigerant 14 in a liquid state exist in the inside of the gas generator 11.

  As the refrigerant 14, for example, water (pure water) or an organic solvent such as alcohol, ether, HFE (hydro-fluoro-ether), or fluorinate can be used. Here, when these water or organic solvents are used, when the boiling point is higher than the normal temperature, the inside of the first jacket 11 is reduced by reducing the pressure inside the first jacket 11 (by keeping the inside of the first jacket 11 at a negative pressure). The boiling point in can be brought to a substantially normal temperature and a gas-liquid mixed state can be obtained. Conversely, when the boiling point is lower than the normal temperature, pressurizing the inside of the first jacket 11 can bring the boiling point in the first jacket 11 to a substantially normal temperature and a gas-liquid mixed state. That is, the boiling point of the refrigerant 14 can be set to a desired value by adjusting the pressure in the first jacket 11. In particular, if a liquid having a boiling point higher than room temperature is used as the refrigerant 14, the inside of the first jacket 11 is maintained at a negative pressure, so there is no possibility that the first jacket expands and comes into contact with the magnetism generator unit 20.

  The second jacket 12 is a member having a substantially rectangular annular cross section formed of SUS material, and is attached to the upper portion of the first jacket 11 so as to include the upper portion of the first jacket 11 therein. That is, the second jacket 12 is provided in contact with the upper portion of the first jacket 11. The second jacket 12 is for cooling the gaseous refrigerant 14 accommodated in the first jacket 11, into which refrigerant is introduced from a refrigerant inlet 15 shown in FIG. 16 is discharged and the refrigerant is circulated (flowed). In FIG. 1, the refrigerant introduction port 15 and the refrigerant discharge port 16 are illustrated as an example attached to the upper surface of the second jacket 12, but these are attached to the side surface of the second jacket 12. It may be done. As the refrigerant introduced into the second jacket 12, for example, an organic solvent such as alcohol, ether, HFE (hydrofluoroether), or fluorinate can be used. If sufficient insulation is ensured by the first jacket 11 and the refrigerant 14, it is not necessary to consider the insulation performance of the refrigerant introduced into the second jacket 12, so water with a large heat capacity can be used. .

  The second jacket 12 is preferably made of a SUS material in consideration of ease of processing, but is not necessarily limited to the SUS material described above, and is formed of a material having a Young's modulus equal to or higher than the SUS material. It is preferable. It can also be formed of CFRP (carbon fiber reinforced plastic) or ceramics. However, since the refrigerant circulating (flowing) in the second jacket 12 rises in temperature by cooling the gaseous refrigerant 14 accommodated in the first jacket 11, the refrigerant circulates inside and on the surface of the second jacket 12. A temperature distribution will result. For this reason, it is desirable to form the second jacket 12 using a material having high heat insulating properties. When the material of the second jacket 12 is inevitably low, it is desirable to provide a heat insulating material around the second jacket 12.

  Next, as shown in FIGS. 1 and 2, the magnetomotive unit 20 includes a U-shaped yoke 21, a plurality of magnets 22 attached to one of the inner surfaces of the yoke 21, and the other of the inner surfaces of the yoke 21. And a plurality of magnets 23 attached to each other. The plurality of magnets 22 attached to one of the inner side surfaces of the yoke 21 are arranged so as to be arranged at predetermined intervals along the y direction so that the magnetic poles of the adjacent magnets 22 are different from each other. Similarly, the plurality of magnets 23 attached to the other inner surface of the yoke 21 are arranged so as to be arranged at predetermined intervals along the y direction so that the magnetic poles of the adjacent magnets 23 are different from each other. The polarities of the magnet 22 and the magnet 23 arranged at the same position in the y direction are set so that different poles face each other. The armature unit 10 is arranged in the magnet generator unit 20 so that each of the coils 13 arranged in the y direction in the first jacket 11 is positioned between the magnet 22 and the magnet 23.

  Next, the operation of the electromagnetic actuator 1 including the armature unit 10 according to the first embodiment of the present invention having the above-described configuration will be described. Before driving the electromagnetic actuator 1, the refrigerant is introduced into the second jacket 12 from the refrigerant introduction port 15, and the refrigerant in the second jacket 12 is discharged from the refrigerant discharge port 16 so that the refrigerant is contained in the second jacket 12. Circulate (flow). In order to drive the electromagnetic actuator 1, for example, a three-phase alternating current is supplied to each of the coils 13 provided in the armature unit 10 from a driving device (not shown) at a predetermined timing.

  When the coil 13 to which the three-phase alternating current is supplied is placed in an alternating magnetic field along the y direction formed by the magnets 22 and 23 provided in the magnet generator unit 20, the coil 13 is placed between the magnet generator unit 20 and the coil 13. Since the Lorentz force acts on the armature unit 10, a thrust in the y direction is generated in the armature unit 10, and the armature unit 10 as the movable body moves relative to the magnet generator unit 20 as the stator. The direction of the generated thrust is determined according to the way of supplying the three-phase alternating current to the coil 13, and the magnitude thereof is determined according to the magnitude of the current supplied to the coil 13. Even when the armature unit 10 is a stator and the magnet generator unit 20 is a mover, the magnet generator unit 20 moves relative to the armature unit 10 by the same operation.

  Here, the boiling point of the refrigerant 14 accommodated in the first jacket 1 is T [° C.]. When a current is supplied to the coil 13 and the temperature of the coil 13 rises to near T [° C.], the refrigerant 14 starts to boil as shown in FIG. And coexist. In general, when a substance is boiling and the liquid state and gas state of the substance coexist, the substance is kept at a constant temperature until all the liquid is vaporized. That is, as long as all the refrigerant 14 is not vaporized, the temperature inside the first jacket 11 becomes a substantially constant temperature T [° C.].

  On the other hand, in the upper part of the first jacket 11, the vaporized refrigerant 14 is cooled by the refrigerant flowing in the second jacket 12, whereby the vaporized refrigerant 14 becomes liquid again and returns to the lower side of the first jacket 14. . Thereby, the liquid state refrigerant 14 is not lost in the first jacket 11. Therefore, the temperature inside the first jacket 11 is always kept at a substantially constant temperature T [° C.], and as a result, the surface temperature of the first jacket 11 also becomes a substantially constant temperature. Due to the above action, temperature distribution does not occur inside and on the surface of the first jacket 11, so there is no thermal influence such as air fluctuations on the devices and members provided around the first jacket 11.

[Second Embodiment]
FIG. 3 is a cross-sectional view of an electromagnetic actuator including an armature unit according to the second embodiment of the present invention. In FIG. 3, the same members as those shown in FIG. 2 are denoted by the same reference numerals. The electromagnetic actuator 2 shown in FIG. 3 includes an armature unit and a magnetism generator unit in the same manner as the electromagnetic actuator 1 shown in FIG. 2, but the configuration of the armature unit is different. As shown in FIG. 3, the armature unit 30 provided in the electromagnetic actuator 2 includes first jackets 31a and 31b, a second jacket 32, a plurality of coils 13 arranged along the y direction, and refrigerants 34a and 34b. It consists of The configuration and arrangement of the coil 13 provided in the armature unit 30 are the same as the configuration and arrangement of the coil 13 provided in the electromagnetic actuator 1 shown in FIG.

  In the present embodiment, the first jacket 31a is attached to one side surface of the plurality of coils 13, and the first jacket 31b is attached to the other side surface. Similarly to the first jacket 11 shown in FIG. 2, the first jackets 31a and 31b are members having a rectangular annular cross section formed of a nonmagnetic SUS material having high thermal conductivity. 34b is accommodated in a sealed state. The first jackets 31a and 31b are narrower than the first jacket 11 shown in FIG. The first jackets 31a and 31b are not limited to the nonmagnetic SUS material, but are preferably made of a nonmagnetic material having a Young's modulus comparable to or higher than that of the SUS material. Further, it can be formed of CFRP (carbon fiber reinforced plastic), ceramics or the like in consideration of viscous resistance due to eddy current generation.

  However, since the first jackets 31a and 31b are directly attached to the coil 13, they need to have insulating properties. For this reason, it is preferable to use the first jackets 31a and 31b formed using an insulating material such as ceramics. However, when the first jackets 31a and 31b and the coil 13 are attached, a thin insulating film is sandwiched between them, so that the first jackets 31a and 31b and the coil 13 are formed using a metal such as SUS having conductivity and high thermal conductivity. The first jackets 31a and 31b can be used.

  Similarly to the refrigerant 14 of the first embodiment, the refrigerants 34a and 34b are hermetically accommodated in the first jackets 31a and 31b in a state where the boiling point is set to substantially normal temperature (25 ° C.) and in a gas-liquid mixed state. The 3 shows a state in which the refrigerants 34a and 34b are accommodated in the first jackets 31a and 31b so that the interiors of the first jackets 31a and 31b are almost filled. There is no need to accommodate the refrigerants 34a and 34b, and it is sufficient that the refrigerants 34a and 34b in the gas state and the refrigerants 34a and 34b in the liquid state exist inside the first jackets 31a and 31b. As the refrigerants 34a and 34b, the same refrigerant as that described in the first embodiment can be used.

  The second jacket 32 is a member having a substantially rectangular annular cross section formed of SUS material, and abuts on the upper portions of the first jackets 31a and 31b so as to include the upper portions of the first jackets 31a and 31b. It is attached in the state. The second jacket 32 is provided with the same components as the refrigerant inlet 15 and the refrigerant outlet 16 shown in FIG. 1, and the refrigerant is circulated (flowed) therein. As the refrigerant introduced into the second jacket 32, the refrigerant having the same heat capacity as that of the refrigerant introduced into the second jacket 12 described in the first embodiment can be used. In addition, about the 2nd jacket 32, it is desirable to form using the material which has heat insulation similarly to 1st Embodiment, or to give heat insulation with a heat insulating material etc.

  In the electromagnetic actuator 2 of the present embodiment, when a current is supplied to the coil 13 and the coil 13 generates heat, the heat generated from the coil 13 is transmitted to the first jackets 31 a and 31 b attached to the coil 13. Each of the refrigerants 34a and 34b accommodated in 31b is heated. When the refrigerants 34a and 34b accommodated in the first jackets 34a and 34b are heated to near the boiling point, the refrigerants 34a and 34b start to boil as shown in FIG. The refrigerants 34a and 34b in the gaseous state are cooled by the refrigerant flowing in the second jacket 32 at the upper portions of the first jackets 34a and 34b, respectively, whereby the refrigerants 34a and 34b in the vaporized state are again in a liquid state and become the first jacket. Return below 31a and 31b. As a result, the internal temperature of the first jackets 31a and 31b is always kept at substantially normal temperature, and as a result, the surface temperature of the first jackets 31a and 31b is also substantially constant. Due to the above action, temperature distribution does not occur inside and on the surface of the first jacket 11, so there is no thermal influence such as air fluctuations on the devices and members provided around the first jacket 11.

  Since the armature unit 30 provided in the electromagnetic actuator 2 of the present embodiment has a configuration in which the first jackets 31a and 31b are attached to the respective side surfaces of the coil 13, the interior of the first jacket 11 described in the first embodiment. Compared to the armature unit 10 in which the coil 13 is housed, the structure is simple. For this reason, the armature unit 30 can be easily manufactured, and the manufacturing cost can be reduced.

[Third Embodiment]
4 and 5 are cross-sectional views of an electromagnetic actuator including an armature unit according to a third embodiment of the present invention. 4 and 5, the same members as those shown in FIG. 2 are denoted by the same reference numerals. The electromagnetic actuator 3 shown in FIGS. 4 and 5 includes an armature unit and a magnetic generator unit, similarly to the electromagnetic actuator 1 shown in FIG. 2, but the configuration of the armature unit is different. The armature unit 40 provided in the electromagnetic actuator 3 shown in FIG. 4 and the armature unit 50 provided in the electromagnetic actuator 4 shown in FIG. 5 include the coil 13 and the refrigerant arranged in the y direction as in the first embodiment. The first jacket 11 that accommodates 14 is provided, but the second jacket 12 provided on the top of the first jacket 11 is omitted.

  The armature unit 40 shown in FIG. 4 is provided with a second jacket 41 inside the first jacket 11 instead of the omitted second jacket 12, and the armature unit 50 shown in FIG. 5 is omitted. Instead of the second jacket 12, second jackets 51 and 52 are provided inside the first jacket 11. The second jackets 41, 51, 52 are members formed from an annular SUS material or the like, and are attached so as to penetrate the first jacket 11 in the y direction. In the armature unit 40 shown in FIG. 4, the second jacket 41 is disposed so as to extend in the y direction along the side surface of the coil 13. In the armature unit 50 shown in FIG. 5, the second jackets 51 and 52 are It is arranged so as to extend in the y direction at the upper side and the lower side, respectively. In the example shown in FIGS. 4 and 5, the second jackets 41 and 52 are arranged so as to be in direct contact with the liquid state refrigerant 14, and the second jacket 51 is arranged so as to be in direct contact with the gaseous state refrigerant 14.

  Also in this embodiment, since the refrigerant 14 needs to be hermetically housed in the first jacket 11, the second jackets 41, 51, 52 are located at portions where the first jacket 11 passes through a plane parallel to the zx plane. Sealing is applied. These second jackets 41, 51, 52 are provided outside the first jacket 11 with the same refrigerant inlet 15 and refrigerant outlet 16 as shown in FIG. (Flow). As the refrigerant introduced into the second jackets 41, 51, 52, the refrigerant having the same heat capacity as that of the refrigerant introduced into the second jacket 12 described in the first embodiment can be used. The second jackets 41, 51, and 52 are preferably made of a material having high thermal conductivity in order to cool the refrigerant 14 in direct contact with the refrigerant 14.

  In the electromagnetic actuators 3 and 4 of the present embodiment, when a current is supplied to the coil 13 and the coil 13 generates heat, the refrigerant 14 is heated by the heat generated from the coil 13. When the refrigerant 14 is heated to near the boiling point, it begins to boil. In the electromagnetic actuator 3 shown in FIG. 4, the liquid state refrigerant 14 sealed in the first jacket 11 is cooled by the second jacket 41. On the other hand, in the electromagnetic actuator 4 shown in FIG. 5, the liquid state refrigerant 14 hermetically accommodated in the first jacket 11 is cooled by the second jacket 52, and the expected state refrigerant in the first jacket 11 is cooled by the second jacket 51. 14 is cooled. As a result, the vaporized refrigerant 14 is again in a liquid state, and the temperature inside the first jacket 11 is always kept at a substantially normal temperature. As a result, the surface temperature of the first jacket 11 also becomes a substantially constant temperature. Due to the above action, temperature distribution does not occur inside and on the surface of the first jacket 11, so there is no thermal influence such as air fluctuations on the devices and members provided around the first jacket 11.

  In FIG. 5, the case where the second jackets 51 and 52 are disposed above and below the coil 13 in the armature unit 50 has been described as an example, but only one of the second jackets 51 and 52 is described. The provided structure may be sufficient. In the example shown in FIGS. 4 and 5, the coil 13 and the refrigerant 14 are hermetically housed in the first jacket 11, and the second jackets 41, 51, 52 are provided inside the first jacket 11. However, as in the second embodiment shown in FIG. 3, the first jacket in which the refrigerant is hermetically sealed is brought into contact with the coil 13, and the second jackets 41, 51, The structure provided with the same thing as 52 may be sufficient.

  In the first to third embodiments described above, the coils 12 and the magnets 22 and 23 are arranged in the y direction, and the relative direction between the armature units 10 and 30 and the magnet generator unit 20 is set in the y direction. However, if the arrangement direction of the coil 12 and the magnets 22 and 23 is set to the z direction, the relative direction of the armature units 10 and 30 and the magnet generator unit 20 can be set to the z direction. In the first and second embodiments, the second jacket 12 is provided outside the first jackets 11, 31a, 31b in order to cool the refrigerants 14, 34a, 34b accommodated in the first jackets 11, 31a, 31b. 32 are brought into contact with each other, and the refrigerant is circulated in the second jackets 12 and 32. However, instead of the second jackets 12, 32, Peltier elements may be attached to the first jackets 11, 31a, 31b to cool the refrigerants 14, 34a, 34b accommodated in the first jackets 11, 31a, 31b. .

[Actuator device]
FIG. 6 is a schematic diagram illustrating an actuator device including an electromagnetic actuator according to an embodiment of the present invention. The actuator device 60 shown in FIG. 6 includes a support portion 61, magnetic devices 62 and 63, a voice coil motor (VCM) 64, and a table 65. The support 66 provided on the support 61 is provided with a leaf spring 67 as a guide to support the table 65 and to move the table 65 only in the vertical direction and not in the horizontal direction.

  The table 65 is driven by the VCM 64. As the VCM 64, the electromagnetic actuators 1 to 4 described above are used. In FIG. 6, a case where the electromagnetic actuator 1 is used as the VCM 64 is illustrated as an example. The VCM 64 includes an armature unit 68 having a first jacket for hermetically containing a coil and a refrigerant and a second jacket provided on the upper portion of the first jacket, and a magnet generator unit provided with a magnet sandwiching the armature unit 68. 69. In the example shown in FIG. 6, the armature unit 68 is set as a mover, and the magnet generator unit 69 is set as a stator. In FIG. 6, the magnets provided in the generator unit 69 are arranged in the direction of the arrow indicated by the symbol ST in the figure, and the armature unit 68 as the mover moves in the direction of the arrow ST. To do. The arrow ST direction is the vertical direction, and the table 65 is disposed on the support portion 61.

  The position of the table 65 in the vertical direction (arrow ST direction) can be controlled by adjusting the current flowing through the coil provided in the armature unit 68 of the VCM 64. If the weight of the table 65 is to be supported only by the driving force of the VCM 64, a large current must always flow through the VCM 64, and the amount of heat generated by the coil increases and the power consumption increases. For this reason, the actuator device 60 shown in FIG. 6 cancels the weight of the table 65 and cancels the elastic force of the leaf spring 67 generated along with the movement of the table 65. The self-weight correction part comprised including is provided.

  The magnetic device 62 is roughly divided into a fixed portion 71 attached on the support portion 61 and a movable portion 72 attached to the back surface of the table 65. The fixed portion 71 includes annular first and second magnet units arranged in the vertical direction, and the movable portion 72 is a disc-shaped center disposed between the first and second magnet units of the fixed portion 71. It has a yoke. The magnetic device 63 has the same configuration as the magnetic device 62. The magnetic force generated by the magnetic devices 62 and 63 configured as described above and the elastic force of the coil spring B cancel the dead weight of the stage 65 and the elastic force of the leaf spring 67, and the VCM 64 does not have to compensate for these forces in a steady state. It is configured to be good.

[Stage device]
FIG. 7 is a perspective view showing a stage apparatus according to an embodiment of the present invention. Note that the stage apparatus shown in FIG. 7 is a stage apparatus configured to be movable while holding a semiconductor wafer that is a type of photosensitive substrate. In the stage apparatus 100 illustrated in FIG. 7, the actuator apparatus 60 illustrated in FIG. 6 is disposed between the Y stage 100 </ b> Y and the wafer table 104.

  The stage apparatus 100 is a two-axis X-Y stage apparatus with an X axis and a Y axis. The main components are a Y stage 100Y driven in the direction indicated by Y), a wafer table (sample stage) 104, and an actuator device (not shown) for adjusting the shift amount between the Y stage 100Y and the wafer table 104. It is said.

  Here, the wafer table 104 is disposed on the Y stage 100Y, and a wafer W, which is a type of photosensitive substrate, is mounted on the wafer table 104 via a wafer holder (not shown). An irradiation unit (not shown) is arranged above the wafer W, and a resist (not shown) previously applied on the wafer W by exposure light irradiated from the irradiation unit through a mask (both not shown). In addition, the circuit pattern on the mask is transferred.

  The amount of movement of the X stage 100X and the Y stage 100Y in the stage apparatus 100 is such that the movable mirrors 105X and 105Y fixed to the end portion in the X direction and the end portion in the Y direction of the wafer table 104 face each other. The laser interferometers 106X and 106Y fixed to the base unit 102 are used for measurement. A main control device (not shown) controls the movement of the wafer table 104 to a desired position on the base unit 102 based on the measurement result.

  The X stage 100X and the Y stage 100Y of the stage apparatus 100 include a linear motor 110 including a stator 111 and a mover 112, and a linear motor 120 including a stator 121 and a mover 122. The base unit 102 is driven in the X direction and the Y direction, respectively. As the linear motors 110 and 120, the electromagnetic actuators 1 to 4 described above are used. Here, the stators 111 of the two linear motors 110 are both fixed on the base portion 102, and the mover 112 is fixed to the X stage 100 </ b> X via the fixed plate 107.

  Further, the stator 121 of the linear motor 120 is fixed to the X stage 100X, and the mover 122 (only one is shown) is fixed to the Y stage 100Y. Each of the movers 112 and 122 is cooled by a temperature adjusting cooling medium that flows in a flow path (the above-described second jacket) provided in the movable elements. Adjusted. The movers 112 and 122 and the temperature controller 131 are connected by a discharge pipe 132, a pipe 133, and the like. It is desirable that the discharge pipe 132 and the pipe 133 have flexibility so as not to hinder the movement of the movers 112 and 122. In FIG. 7, the discharge pipe 132 and the pipe 133 are shown in a simplified manner in order to avoid complication of the drawing. Further, the stage apparatus 100 is provided with an air guide 140 and a static pressure gas bearing (not shown), and a static pressure air bearing type stage is constituted by the air blowing port 141 and the air suction port 142.

[Exposure equipment]
Next, an exposure apparatus provided with the stage apparatus described above will be described. FIG. 8 is a view showing a schematic configuration of the exposure apparatus. The exposure apparatus 200 of the present embodiment is a so-called step-and-scan exposure type scanning exposure apparatus. As shown in FIG. 8, the exposure apparatus 200 includes an illumination system ILS, a reticle stage RST that holds a reticle (photomask) R, a projection optical system PL, and a wafer (photosensitive substrate) W in an XY plane. It includes wafer stage WST as a stage device that drives in a two-dimensional direction of direction -Y direction, and main controller MCS that controls these. The illumination system ILS performs shaping of exposure light emitted from a light source unit (not shown) (for example, a laser light source such as an ultra-high pressure halogen lamp or an excimer laser) and makes the illuminance distribution uniform, thereby making a rectangular (or circular) on the reticle R. An arcuate illumination area IAR is irradiated with uniform illuminance.

  In reticle stage RST, stage movable unit 201 moves along a predetermined scanning direction at a predetermined scanning speed on a reticle base (not shown). The reticle R is held on the upper surface of the stage movable unit 201 by, for example, vacuum suction. Further, an exposure light passage hole (not shown) is formed below the reticle R of the stage movable unit 201.

  A reflecting mirror 202 is disposed at the end of the stage movable unit 201, and the position of the stage movable unit 201 is detected by the laser interferometer 203 measuring the position of the reflecting mirror 202. The detection result of the laser interferometer 203 is output to the stage control system SCS. The stage control system SCS drives the stage movable unit 201 based on the detection result of the laser interferometer 203 and a control signal from the main controller MCS based on the moving position of the movable unit 201.

  The projection optical system PL is a reduction optical system having a reduction magnification of α (α is, for example, 4 or 5), for example, and is disposed below the reticle stage RST, and the direction of the optical axis AX is set to the Z-axis direction. ing. Here, a refracting optical system comprising a plurality of lens elements arranged at a predetermined interval along the optical axis AX direction is used so as to provide a telecentric optical arrangement. An appropriate lens element is selected according to the wavelength of light emitted from the light source unit. When the illumination area IAR of the reticle R is illuminated by the illumination system ILS, a reduced image (partial inverted image) of the circuit pattern in the illumination area IAR of the reticle R is an exposure area IA conjugate to the illumination area IAR on the wafer W. Formed.

  Wafer stage WST has base 212 (corresponding to base 102 in FIG. 7) and table 211 provided above the upper surface of base 212 (corresponding to wafer table 104 in FIG. 7). The table 211 is driven in a two-dimensional direction in the XY plane. The actuator device shown in FIG. 6 is incorporated in the table 211, and the table 211 is driven in the tilt direction. Further, stage apparatus 100 shown in FIG. 7 is incorporated in wafer stage WST in order to move table 211 in the XY plane. Here, a wafer (substrate) W is held on the upper surface of the table 211 by, for example, vacuum suction during the exposure process. In place of the stage apparatus 100 shown in FIG. 7, a base part 212, a table 211 that floats above the upper surface of the base part 212 with a clearance of about several μm, and a plane on which the table 211 is moved. A stage device having a configuration including a motor can also be used.

  A movable mirror 213 is fixed to one end of the table 211, and a laser beam is irradiated from the laser interferometer 214 to the movable mirror 213, and the movement position of the table 211 in the XY plane is detected. Information on the movement position of the table 211 detected by the laser interferometer 214 is sent to the main controller MCS via the stage control system SCS. Then, stage control system SCS moves table 211 to a desired position in the XY plane according to an instruction from main controller MCS based on this information.

  The table 211 is supported at three different points by the actuator shown in FIG. 6 (not shown in FIG. 8). Therefore, the table 211 can be driven not only in the X direction and the Y direction, but also tilted with respect to the XY plane by an actuator or driven in the Z axis direction (upward).

  In the exposure apparatus 200 including the table 211 having such a configuration, exposure processing is generally performed in the following procedure. First, the reticle R is loaded on the reticle stage RST, and the wafer W is loaded on the table 211, and then reticle alignment, baseline measurement, alignment measurement, and the like are executed. When the alignment measurement is completed, a step-and-scan exposure operation is performed.

  In the exposure operation, main controller MCS issues a command to stage control system SCS based on the position information of reticle R by laser interferometer 203 and the position information of wafer W by laser interferometer 214, and the electromagnetic actuator of reticle stage RST and The reticle R is moved at a constant speed by a linear motor (both not shown), and the wafer W is moved at a constant speed (1 / α of the movement speed of the reticle). As a result, the reticle R and the wafer W are moved synchronously to perform desired scanning exposure.

  When the transfer of the reticle pattern for one shot area is thus completed, the table 211 is stepped by one shot area, and scanning exposure is performed for the next shot area. This stepping and scanning exposure are sequentially repeated, and a pattern having the required number of shots is transferred onto the wafer W.

  A micro device manufacturing method using the exposure apparatus 200 described above in the lithography process will be described. FIG. 9 is a flowchart showing an example of a manufacturing process of a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.). As shown in FIG. 9, first, in step S10 (design step), a function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and a pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

  Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

  FIG. 10 is a diagram showing an example of a detailed flow of step S13 of FIG. 9 in the case of a semiconductor device. In FIG. 10, in step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pretreatment process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.

  At each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), the exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  As mentioned above, although embodiment of this invention was described, this invention is not restrict | limited to the said embodiment, It can change freely within the scope of the present invention. For example, the step-and-scan type exposure apparatus has been described above as an example, but the present invention can also be applied to a step-and-repeat type exposure apparatus. Furthermore, it can be applied to an exposure apparatus such as a mirror projection system, a proximity system, or a contact system. In the above embodiment, the stage apparatus 100 shown in FIG. 7 is provided on the wafer stage WST. However, the stage apparatus 100 may be provided only on the reticle stage RST or on both the wafer stage WST and the reticle stage RST. it can.

  In addition, the case where a semiconductor element is manufactured has been described above as an example, but of course, not only an exposure apparatus used for manufacturing a semiconductor element but also a device pattern used for manufacturing a display including a liquid crystal display element or the like. The present invention is also applied to an exposure apparatus for transferring onto a glass substrate, an exposure apparatus for transferring a device pattern onto a ceramic wafer used for manufacturing a thin film magnetic head, and an exposure apparatus used for manufacturing an image sensor such as a CCD. can do. Furthermore, in order to manufacture reticles or masks used not only in microdevices such as semiconductor elements but also in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., from mother reticles to glass substrates The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a silicon wafer or the like.

It is a perspective view which shows schematic structure of an electromagnetic actuator provided with the armature unit by 1st Embodiment of this invention. It is a cross-sectional arrow view of the AA line in FIG. It is a section arrow view of an electromagnetic actuator provided with an armature unit by a 2nd embodiment of the present invention. It is a section arrow figure of an electromagnetic actuator provided with an armature unit by a 3rd embodiment of the present invention. It is a section arrow figure of an electromagnetic actuator provided with an armature unit by a 3rd embodiment of the present invention. It is a schematic diagram showing an actuator device provided with an electromagnetic actuator by an embodiment of the present invention. It is a perspective view which shows the stage apparatus by one Embodiment of this invention. It is a figure which shows schematic structure of exposure apparatus. It is a flowchart which shows an example of the manufacturing process of a microdevice. It is a figure which shows an example of the detailed flow of step S13 of FIG. 9 in the case of a semiconductor device.

Explanation of symbols

10 Armature unit 11 1st jacket (1st cooling part)
12 Second jacket (second cooling section)
13 Coil 14 Refrigerant 20 Magnet generator unit 22, 23 Magnet (magnet generator)
30 Armature unit 31a, 31b 1st jacket (1st cooling part)
32 Second jacket (second cooling section)
34a, 34b Refrigerant 40 Armature unit 41 Second jacket (second cooling section)
50 Armature unit 51, 52 Second jacket (second cooling section)
100 Stage device 104 Wafer table 200 Exposure device R Reticle (mask)
RST reticle stage (mask stage)
W wafer (substrate)
WST wafer stage (substrate stage)

Claims (10)

An armature unit comprising a coil,
A first cooling unit that hermetically accommodates a refrigerant having a boiling point set to substantially normal temperature in a gas-liquid mixed state and cools the coil;
An armature unit, comprising: a second cooling unit that cools and liquefies the gaseous refrigerant.   2. The armature unit according to claim 1, wherein the first cooling unit has a negative pressure in a space in which the refrigerant is hermetically accommodated.   The armature unit according to claim 1, wherein the first cooling unit houses the coil together with the refrigerant.   The armature unit according to claim 1, wherein the first cooling unit is attached in a state of being in contact with the coil.   The armature unit according to any one of claims 1 to 4, wherein the second cooling unit is provided in contact with the outside of the first cooling unit.   The armature unit according to any one of claims 1 to 3, wherein the second cooling unit is provided inside the first cooling unit and disposed in a gas portion of the refrigerant.   The armature unit according to any one of claims 1 to 6, wherein a second refrigerant different from the refrigerant flows through the second cooling unit. The armature unit according to any one of claims 1 to 7,
A magnetism generator unit, and a magnetism generator unit movable relative to the armature unit;
An electromagnetic actuator, wherein a stator or a mover is constituted by the armature unit, and a mover or a stator is constituted by the magnet generator unit. A stage device including a stage movable in a predetermined direction,
A stage apparatus comprising the electromagnetic actuator according to claim 8 as a drive means for the stage. An exposure apparatus comprising a mask stage for holding a mask and a substrate stage for holding a substrate, and transferring a pattern formed on the mask onto the substrate,
An exposure apparatus comprising the stage apparatus according to claim 9 as at least one of the mask stage and the substrate stage.

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