JPH0715133A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JPH0715133A JPH0715133A JP14966193A JP14966193A JPH0715133A JP H0715133 A JPH0715133 A JP H0715133A JP 14966193 A JP14966193 A JP 14966193A JP 14966193 A JP14966193 A JP 14966193A JP H0715133 A JPH0715133 A JP H0715133A
- Authority
- JP
- Japan
- Prior art keywords
- conveyor
- printed circuit
- circuit board
- hot air
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリフロー半田付装置に関
し、特に電子回路基板の製造工程で、表面実装部品をプ
リント基板に半田付けするリフロー半田付装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering device, and more particularly to a reflow soldering device for soldering surface mount components to a printed circuit board in a process of manufacturing an electronic circuit board.
【０００２】[0002]
【従来の技術】従来のリフロー半田付装置について図面
を参照して説明する。2. Description of the Related Art A conventional reflow soldering apparatus will be described with reference to the drawings.
【０００３】図４は従来例を示す概略側面図である。FIG. 4 is a schematic side view showing a conventional example.
【０００４】図４において、従来例はプリント基板２を
搬送する基板搬送コンベア１１Ａと、プリント基板２を
加熱するため基板搬送コンベア１１Ａの上下に設けられ
たヒーター群１３Ａ，１３Ｂ，１３Ｃ，１４Ａ，１４
Ｂ，１４Ｃと、ヒーター群１３Ａ，１３Ｂ，１３Ｃ，１
４Ａ，１４Ｂ，１４Ｃにより加熱された雰囲気を循環さ
せる循環ファン群１５Ａ，１５Ｂ，１５Ｃ，１６Ａ，１
６Ｂ，１６Ｃと、雰囲気を適量排気する排気ダクト２４
Ａ，２４Ｂと、加熱温度を適切な値に制御する温度制御
ユニット２１Ａと、基板搬送コンベア１１Ａを駆動する
コンベア駆動モータ６１と、プリント基板２の搬送幅を
可変する幅変更モータ６２と、コンベア駆動モータ６１
及び幅変更モータ６２を制御するモータ駆動制御ユニッ
ト２２Ａとを有している。In FIG. 4, in the conventional example, a board carrying conveyor 11A for carrying the printed board 2 and heater groups 13A, 13B, 13C, 14A, 14 provided above and below the board carrying conveyor 11A for heating the printed board 2 are used.
B, 14C and heater groups 13A, 13B, 13C, 1
Circulation fan groups 15A, 15B, 15C, 16A, 1 for circulating the atmosphere heated by 4A, 14B, 14C
6B, 16C and an exhaust duct 24 for exhausting an appropriate amount of atmosphere
A, 24B, a temperature control unit 21A for controlling the heating temperature to an appropriate value, a conveyor drive motor 61 for driving the substrate transfer conveyor 11A, a width changing motor 62 for changing the transfer width of the printed circuit board 2, and a conveyor drive. Motor 61
And a motor drive control unit 22A for controlling the width changing motor 62.
【０００５】また、この従来のリフロー半田付装置は、
半田付時の急激な加熱による部品への熱ストレスの低減
や熱容量の異なるプリント基板１の半田付けに対応する
ため基板搬送コンベア１１Ａの長さが約５ｍ，コンベア
スピードを１ｍ／ｍｉｎ程度となっており、１枚のプリ
ント基板１が投入されてから排出されるまで約５分程度
の時間が必要となっている。Further, this conventional reflow soldering apparatus is
In order to reduce the thermal stress on the parts due to abrupt heating during soldering and to support the soldering of the printed circuit boards 1 having different heat capacities, the length of the board conveying conveyor 11A is about 5 m, and the conveyor speed is about 1 m / min. Therefore, it takes about 5 minutes from the time when one printed circuit board 1 is loaded to the time when it is discharged.
【０００６】[0006]
【発明が解決しようとする課題】この従来のリフロー半
田付装置では、プリント基板の機種変更に際して必要と
なる基板搬送コンベアの基板搬送幅の変更や基板搬送ス
ピードの変更といった段取り替えを行う場合、約５分
間、すなわち、基板搬送コンベア上の残留プリント基板
が全て排出されるまで段取り替えが行えないといった問
題点があった。In this conventional reflow soldering apparatus, when the setup change such as the change of the board transfer width of the board transfer conveyor or the change of the board transfer speed, which is necessary when the model of the printed board is changed, There was a problem that setup could not be performed for 5 minutes, that is, until all the residual printed circuit boards on the substrate transport conveyor were discharged.
【０００７】プリント基板の半田付工程の期間を短縮す
るためのリフロー半田付装置が実開平３−２８７７７号
公報に開示されている。この公報に開示されているリフ
ロー半田付装置は、図５に示すように、搬送方向に２分
割された予備加熱用の入口側コンベア３２ａと、本加熱
用の出口側コンベア３２ｂとを備え、それぞれのコンベ
アが独立に駆動されて、赤外線ヒータの温度設定の変更
と共に、例えば出口側コンベア３２ｂを入口側コンベア
３２ａに比べて搬送スピードを上げて半田付工程の期間
の短縮が図れる構成になっている。しかしこのリフロー
半田付装置においても、図４に示したリフロー半田付装
置と同様に、入口側及び出口側コンベア３２ａ，３２ｂ
上の残留基板が全て排出されるまで、次の異なったプリ
ント基板のための段取り替えができないという問題点が
ある。A reflow soldering device for shortening the period of the process for soldering a printed circuit board is disclosed in Japanese Utility Model Laid-Open No. 3-28777. As shown in FIG. 5, the reflow soldering device disclosed in this publication includes an inlet side conveyor 32a for preheating and an outlet side conveyor 32b for main heating, which are divided into two in the transport direction. Is independently driven to change the temperature setting of the infrared heater and, for example, the conveying speed of the exit side conveyor 32b is increased as compared with the entrance side conveyor 32a to shorten the period of the soldering process. . However, also in this reflow soldering apparatus, similar to the reflow soldering apparatus shown in FIG. 4, the inlet side and outlet side conveyors 32a, 32b are provided.
There is a problem that setup cannot be performed for the next different printed circuit board until all the above residual boards are discharged.
【０００８】[0008]
【課題を解決するための手段】本発明のリフロー半田付
装置は、複数の加熱手段と、クリーム半田が印刷された
面に電子部品が搭載された複数のプリント基板を搬送し
且つ熱風が通過できる構造を持った基板搬送手段と、前
記加熱手段からの熱風を循環させる熱風循環手段と、前
記基板搬送手段の最終工程で前記プリント基板を冷却さ
せる冷却手段とを備え、前記加熱手段に前記基板搬送手
段が通過すると前記加熱手段からの熱風作用によって前
記プリント基板上の前記クリーム半田が溶融し前記冷却
手段で凝固して前記プリント基板に前記電子部品を半田
付けするリフロー半田付装置において、前記基板搬送手
段は幅が可変できる第１のコンベアと、この第１のコン
ベアの上部に配置された幅が可変できる第２のコンベア
と、前記熱風循環手段は前記加熱手段からの熱風を前記
第１及び第２のコンベアの搬送面に対し上下方向に循環
させる複数の第１の循環ファンと、前記第１及び第２の
コンベアの搬送面に対し平行で移動に対し垂直方向に循
環させる複数の第２の循環ファンと、前記第１及び第２
のコンベアをそれぞれ独立に駆動させ且つ前記第１及び
第２のコンベアのそれぞれの前記幅を独立に変更させる
基板搬送駆動制御装置とを有している。A reflow soldering apparatus of the present invention conveys a plurality of heating means and a plurality of printed boards on which electronic components are mounted on a surface on which cream solder is printed and allows hot air to pass therethrough. The substrate transfer means has a structure, a hot air circulation means for circulating the hot air from the heating means, and a cooling means for cooling the printed circuit board in the final step of the substrate transfer means. In the reflow soldering device, the cream solder on the printed board is melted by the action of hot air from the heating means when the means passes and is solidified by the cooling means to solder the electronic component to the printed board. The means includes a first conveyor having a variable width, a second conveyor arranged above the first conveyor and having a variable width, and the hot air circulation. The stage is parallel to the transfer surfaces of the first and second conveyors, and a plurality of first circulation fans for circulating the hot air from the heating means in the vertical direction with respect to the transfer surfaces of the first and second conveyors. A plurality of second circulation fans that circulate in a direction perpendicular to the movement, and the first and second circulation fans.
Substrate drive control device for independently driving each of the conveyors and independently changing the width of each of the first and second conveyors.
【０００９】また、本発明のリフロー半田付装置は、外
部から搬入されてきた前記プリント基板を前記第１のコ
ンベア又は第２のコンベアのそれぞれの入口へ搬送させ
るために上下に移動する第１のエレベータコンベアと、
前記第１のコンベア又は第２のコンベアから搬送されて
きた前記プリント基板を外部へ搬出させるべく上下に移
動する第２のエレベータコンベアとを有している。Further, the reflow soldering apparatus of the present invention is such that the printed circuit board carried in from the outside is moved up and down in order to convey it to the respective entrances of the first conveyor and the second conveyor. An elevator conveyor,
It has a 2nd elevator conveyor which moves up and down so that the above-mentioned printed circuit board conveyed from the 1st conveyor or the 2nd conveyor may be carried out outside.
【００１０】[0010]
【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.
【００１１】図１は本発明の一実施例を示す概略断面
図、図２は本実施例における上段コンベア及び下段コン
ベアの駆動系を示す模式図、図３は本実施例における上
段コンベアの幅を可変する機構を示す模式図である。FIG. 1 is a schematic sectional view showing an embodiment of the present invention, FIG. 2 is a schematic view showing a drive system for an upper conveyor and a lower conveyor in this embodiment, and FIG. 3 is a width of the upper conveyor in this embodiment. It is a schematic diagram which shows the mechanism to change.
【００１２】図１において、本実施例のリフロー半田付
装置１は、上部各熱ヒータ１３Ａ，１３Ｂ，１３Ｃと、
下部加熱ヒータ１４Ａ，１４Ｂ，１４Ｃと、クリーム半
田が印刷された面に電子部品が搭載された複数のプリン
ト基板２を搬送し且つ熱風が通過でき且つ幅が可変でき
るチェーン構造を持った下段コンベア１２と、下段コン
ベア１２と同じ構造を持ち下段コンベア１２の上部に配
置された上段コンベア１１と、上部加熱ヒータ１３Ａ，
１３Ｂ，１３Ｃからの熱風を循環させる上部循環ファン
１５Ａ，１５Ｂ，１５Ｃと、下部加熱ヒータ１４Ａ，１
４Ｂ，１４Ｃからの熱風を循環させる下部循環ファ１６
Ａ，１６Ｂ，１６Ｃと、上段コンベア１１，下段コンベ
ア１２の搬送面に対し平行で移動に対し垂直方向に熱風
を循環させる側部循環ファン１７Ａ，１７Ｂと、上段コ
ンベア１１及び下段コンベア１２の出口側の上部に取付
けられた冷却ファン１８と、上段コンベア１１及び下段
コンベア１２の入口側に設置されたエレベータコンベア
１９と、上段コンベア１１及び下段コンベア１２の出口
側に設置されたエレベータコンベア２０と、上部加熱ヒ
ータ１３Ａ，１３Ｂ，１３Ｃ及び下部加熱ヒータ１４
Ａ，１４Ｂ，１４Ｃの加熱温度を制御する温度制御装置
２１と、上段コンベア１１及び下段コンベア１２のそれ
ぞれの駆動及び搬送幅を制御するコンベア駆動制御装置
２２と、エレベータコンベア１９，２０の駆動を制御す
るエレベータコンベア駆動制御装置２３と、リフロー半
田付装置１の上部に取付けられた排気ダクト２４Ａ，２
４Ｂとを有して構成している。Referring to FIG. 1, the reflow soldering apparatus 1 of this embodiment includes upper heat heaters 13A, 13B and 13C,
Lower heaters 14A, 14B, 14C and a lower conveyor 12 having a chain structure capable of transporting a plurality of printed circuit boards 2 having electronic components mounted on the surface on which cream solder is printed and allowing hot air to pass therethrough and varying the width. An upper stage conveyor 11 having the same structure as the lower stage conveyor 12 and arranged above the lower stage conveyor 12, and an upper heater 13A,
Upper circulation fans 15A, 15B, 15C for circulating hot air from 13B, 13C, and lower heaters 14A, 1
Lower circulation fan 16 for circulating hot air from 4B and 14C
A, 16B, 16C, side circulation fans 17A, 17B that circulate hot air in a direction parallel to the transport surfaces of the upper conveyor 11 and the lower conveyor 12 and perpendicular to the movement, and outlet sides of the upper conveyor 11 and the lower conveyor 12 A cooling fan 18 attached to the upper part of the upper conveyor 11, an elevator conveyor 19 installed on the inlet side of the upper conveyor 11 and the lower conveyor 12, an elevator conveyor 20 installed on the outlet side of the upper conveyor 11 and the lower conveyor 12, Heaters 13A, 13B, 13C and lower heater 14
Temperature control device 21 for controlling the heating temperature of A, 14B, 14C, conveyor drive control device 22 for controlling the drive and transport width of each of upper conveyor 11 and lower conveyor 12, and drive of elevator conveyors 19, 20. Elevator conveyor drive control device 23 and exhaust ducts 24A, 2 mounted on top of the reflow soldering device 1
4B and is comprised.
【００１３】図２において、上段コンベア１１及び下段
コンベア１２のそれぞれの駆動は独立に上段コンベア駆
動モータ２５Ａ及び下段コンベア駆動モータ２５Ｂを介
して図１に示すコンベア駆動制御装置２２によって制御
される。In FIG. 2, the drive of each of the upper conveyor 11 and the lower conveyor 12 is independently controlled by the conveyor drive control device 22 shown in FIG. 1 via the upper conveyor drive motor 25A and the lower conveyor drive motor 25B.
【００１４】図３において、上段コンベア１１は固定側
のコンベアレール２７Ａと移動側のコンベアレール２７
Ｂとの間に挟まれた状態で設置され、上段コンベアの幅
可変モータ２６Ａの回転方向に従って、チェーン２９に
よって伝達された回転力がスパイラルシャフト２８Ａ，
２８Ｂを回転し、スパイラルシャフト２８Ａ，２８Ｂの
回転方向に従ってコンベアレール２７Ｂが移動し、その
結果、上段コンベア１１は幅が広くなったり、狭くなっ
たりする。In FIG. 3, the upper conveyor 11 includes a fixed-side conveyor rail 27A and a movable-side conveyor rail 27.
Installed in a state of being sandwiched between B and B, the rotational force transmitted by the chain 29 follows the spiral shaft 28A, in accordance with the rotation direction of the variable width motor 26A of the upper conveyor.
28B is rotated, and the conveyor rail 27B moves according to the rotation direction of the spiral shafts 28A and 28B, and as a result, the upper conveyor 11 becomes wider or narrower.
【００１５】下段コンベア１２の幅についても、図３に
示す上段コンベア１１の場合と同様な機構で制御され
る。尚、幅可変モータ２６Ａ，２６Ｂは共にコンベア駆
動制御装置２２によって制御される。The width of the lower conveyor 12 is also controlled by the same mechanism as that of the upper conveyor 11 shown in FIG. The variable width motors 26A and 26B are both controlled by the conveyor drive control device 22.
【００１６】次に、本実施例の動作について図１，図２
及び図３を参照して説明する。Next, the operation of this embodiment will be described with reference to FIGS.
And FIG. 3 will be described.
【００１７】プリント基板の大きさに従って、上段コン
ベア１１及び下段コンベア１２の搬送速度がコンベア駆
動制御装置２２によって制御される。例えば、基板幅Ｄ
1 の複数のプリント基板２が最初、搬送速度Ｔ1 の上段
コンベア１１に搬送されるとする。そのときの加熱温度
は予め温度制御装置２１によって設定されているものと
する。According to the size of the printed circuit board, the convey speed of the upper conveyor 11 and the lower conveyor 12 is controlled by the conveyor drive controller 22. For example, substrate width D
A plurality of printed circuit board 2 in 1 initially, is transported to the upper conveyor 11 of the transport speed T 1. The heating temperature at that time is set in advance by the temperature control device 21.
【００１８】複数のプリント基板２は、上部加熱ヒータ
１３Ａ，１３Ｂ，１３Ｃ及び下部加熱ヒータ１４Ａ，１
４Ｂ，１４Ｃによって加熱されたエアーが、上部循環フ
ァン１５Ａ，１５Ｂ，１５Ｃ，下部循環ファン１６Ａ，
１６Ｂ，１６Ｃ及び側部循環ファン１７Ａ，１７Ｂにて
循環された雰囲気の中を、上段コンベア１１が搬送する
ことによりプリント基板２上のソルダーペーストが溶融
し、冷却ファン１８にて室温冷却されてリフロー半田付
が行なわれる。The plurality of printed circuit boards 2 include upper heaters 13A, 13B and 13C and lower heaters 14A and 1A.
The air heated by 4B, 14C is supplied to the upper circulation fans 15A, 15B, 15C, the lower circulation fan 16A,
The solder paste on the printed circuit board 2 is melted by the upper conveyor 11 conveying the atmosphere circulated by the 16B and 16C and the side circulation fans 17A and 17B, and is cooled to room temperature by the cooling fan 18 and reflowed. Soldering is performed.
【００１９】ここで、最初のプリント基板２が全てリフ
ロー半田付が完了しないで上段コンベア１１に残ってい
る状態で、例えば、基板幅Ｄ1 より幅広い基板幅Ｄ
2 （Ｄ2〉Ｄ1 ）の新プリント基板のリフロー半田付が
発生したとする。コンベア駆動制御装置２２によって下
段コンベア駆動モータ２５Ｂを制御して下段コンベア１
２の搬送速度Ｔ2 をＴ1 より遅くなるように設定し、下
段コンベアの幅可変モータ２６Ｂを制御して下段コンベ
ア１２の幅を基板幅Ｄ2 が搬送できるように制御する。Here, in a state where the first printed circuit board 2 is not completely reflow soldered and remains on the upper conveyor 11, for example, a circuit board width D wider than the circuit board width D 1.
It is assumed that reflow soldering of a new printed circuit board of 2 (D 2 > D 1 ) occurs. The lower conveyor 1 is controlled by controlling the lower conveyor drive motor 25B by the conveyor drive controller 22.
The conveyance speed T 2 of No. 2 is set to be slower than T 1 , and the width variable motor 26B of the lower conveyor is controlled to control the width of the lower conveyor 12 so that the board width D 2 can be conveyed.
【００２０】次に、外部から搬送された新プリント基板
を下段コンベア１２に搬送できるように、又、下段コン
ベア１２から外部へ搬送できるように、エレベータコン
ベア１９，２０を制御するエレベータコンベア駆動制御
装置２３を稼働させる。このように各制御装置が稼働す
ると、外部からの新プリント基板はエレベータコンベア
１９によって下段コンベア１２の入口に降ろされた後に
下段コンベア１２に搭載される。Next, an elevator conveyor drive controller for controlling the elevator conveyors 19 and 20 so that the new printed circuit board conveyed from the outside can be conveyed to the lower conveyor 12 and can be conveyed from the lower conveyor 12 to the outside. 23 is activated. When each control device operates in this way, a new printed circuit board from the outside is unloaded to the entrance of the lower conveyor 12 by the elevator conveyor 19 and then mounted on the lower conveyor 12.
【００２１】下段コンベア１２に搭載された新プリント
基板は上述の最初のプリント基板２の場合と同様にリフ
ロー半田付けされる。次に、エレベータコンベア２０に
よって、新プリント基板は上昇されて外部へ搬送され
る。The new printed circuit board mounted on the lower conveyor 12 is reflow-soldered as in the case of the first printed circuit board 2 described above. Next, the new printed circuit board is lifted by the elevator conveyor 20 and conveyed to the outside.
【００２２】この新プリント基板が下段コンベア１２に
残留している状態で、次の新らしいプリント基板のリフ
ロー半田付を行う場合には、新らしいプリント基板の基
板幅に従って上段コンベアの搬送速度及び基板幅を変え
るべくコンベア駆動制御装置２２が稼働し、エレベータ
コンベア１９，２０を停止すべくエレベータコンベア駆
動制御装置２３が制御する。When the next new printed circuit board is reflow-soldered with the new printed circuit board remaining on the lower conveyor 12, the transfer speed of the upper conveyor and the board according to the board width of the new printed circuit board. The conveyor drive control device 22 operates to change the width, and the elevator conveyor drive control device 23 controls to stop the elevator conveyors 19 and 20.
【００２３】このように、本実施例ではコンベア駆動制
御装置２２によって上段コンベア１１及び下段コンベア
１２の搬送速度及び幅を独立に制御する構成となってい
るので、上段コンベア１１（又は下段コンベア１２）上
にプリント基板が残留していても下段コンベア１２（又
は上段コンベア１１）で新プリント基板を搬送できるの
で、プリント基板の幅の変更に伴って発生するコンベア
の速度変更、コンベア幅の変更の設定作業のロス時間が
発生しても全体のリフロー半田付作業の時間を従来より
短縮することができる。As described above, in this embodiment, the conveyor drive control device 22 independently controls the conveying speed and width of the upper conveyor 11 and the lower conveyor 12, so that the upper conveyor 11 (or the lower conveyor 12) is controlled. Even if the printed circuit board remains on the upper side, the new printed circuit board can be conveyed by the lower conveyor 12 (or the upper conveyor 11), so that the speed change of the conveyor and the change of the conveyor width that occur with the change of the width of the printed circuit board can be set. Even if a work loss time occurs, the time for the entire reflow soldering work can be shortened as compared with the conventional case.
【００２４】[0024]
【発明の効果】以上説明したように本発明は、基板搬送
コンベアを上下の２段にし基板搬送コンベアの入口及び
出口にあるエレベータコンベアにて基板搬送コンベアの
選択を行い、また各基板搬送コンベアにおいて基板搬送
幅及び基板搬送スピードを独立に可変させる独立した基
板搬送駆動制御装置を備えているため、現在搬送中のプ
リント基板とプリント基板幅や搬送スピードを変更する
必要が生じた場合に、現在駆動中の基板搬送コンベアを
停滞することなく生産を継続することが出来る。又、そ
の結果、全体のリフロー半田付作業の時間を従来より短
縮することが出来るという効果がある。As described above, according to the present invention, the substrate carrying conveyor is arranged in two stages, that is, the upper and lower stages, and the elevators at the entrance and the exit of the substrate carrying conveyor are used to select the substrate carrying conveyor. Since it is equipped with an independent board transfer drive control device that allows the board transfer width and board transfer speed to be changed independently, it is possible to drive the current board when it is necessary to change the printed board currently being transferred and the board width or transfer speed. It is possible to continue production without stagnation of the board transfer conveyor inside. Further, as a result, there is an effect that the time for the entire reflow soldering work can be shortened as compared with the conventional case.
【図１】本発明の一実施例を示す概略断面図である。FIG. 1 is a schematic sectional view showing an embodiment of the present invention.
【図２】実施例における上段コンベア及び下段コンベア
の駆動系を示す模式図である。FIG. 2 is a schematic diagram showing a drive system of an upper conveyor and a lower conveyor in an example.
【図３】実施例における上段コンベアの幅を可変する機
構を示す模式図である。FIG. 3 is a schematic diagram showing a mechanism for changing the width of the upper conveyor in the embodiment.
【図４】第１の従来例を示す概略断面図である。FIG. 4 is a schematic sectional view showing a first conventional example.
【図５】第２の従来例を示す概略断面図である。FIG. 5 is a schematic sectional view showing a second conventional example.
１ リフロー半田付装置 ２ プリント基板 １１ 上段コンベア １２ 下段コンベア １３Ａ，１３Ｂ，１３Ｃ 上部加熱ヒータ １４Ａ，１４Ｂ，１４Ｃ 下部加熱ヒータ １５Ａ，１５Ｂ，１５Ｃ 上部循環ファン １６Ａ，１６Ｂ，１６Ｃ 下部循環ファン １７Ａ，１７Ｂ 側部循環ファン １８ 冷却ファン １９，２０ エレベータコンベア ２１ 温度制御装置 ２２ コンベア駆動制御装置 ２３ エレベータコンベア駆動制御装置 ２４Ａ，２４Ｂ 排気ダクト ２５Ａ 上段コンベア駆動モータ ２５Ｂ 下段コンベア駆動モータ ２６Ａ 上段コンベアの幅可変モータ ２６Ｂ 下段コンベアの幅可変モータ ２７Ａ，２７Ｂ コンベアレール ２８Ａ，２８Ｂ スパイラルシャフト ２９ チェーン 1 Reflow Soldering Device 2 Printed Circuit Board 11 Upper Conveyor 12 Lower Conveyor 13A, 13B, 13C Upper Heater 14A, 14B, 14C Lower Heater 15A, 15B, 15C Upper Circulation Fan 16A, 16B, 16C Lower Circulation Fan 17A, 17B Side Part circulation fan 18 Cooling fan 19,20 Elevator conveyor 21 Temperature controller 22 Conveyor drive controller 23 Elevator conveyor drive controller 24A, 24B Exhaust duct 25A Upper stage conveyor drive motor 25B Lower stage conveyor drive motor 26A Upper stage variable width motor 26B Lower stage Conveyor width variable motor 27A, 27B Conveyor rail 28A, 28B Spiral shaft 29 Chain
Claims (2)
された面に電子部品が搭載された複数のプリント基板を
搬送し且つ熱風が通過できる構造を持った基板搬送手段
と、前記加熱手段からの熱風を循環させる熱風循環手段
と、前記基板搬送手段の最終工程で前記プリント基板を
冷却させる冷却手段とを備え、前記加熱手段に前記基板
搬送手段が通過すると前記加熱手段からの熱風作用によ
って前記プリント基板上の前記クリーム半田が溶融し前
記冷却手段で凝固して前記プリント基板に前記電子部品
を半田付けするリフロー半田付装置において、 前記基板搬送手段は幅が可変できる第１のコンベアと、
この第１のコンベアの上部に配置された幅が可変できる
第２のコンベアと、前記熱風循環手段は前記加熱手段か
らの熱風を前記第１及び第２のコンベアの搬送面に対し
上下方向に循環させる複数の第１の循環ファンと、前記
第１及び第２のコンベアの搬送面に対し平行で移動に対
し垂直方向に循環させる複数の第２の循環ファンと、前
記第１及び第２のコンベアをそれぞれ独立に駆動させ且
つ前記第１及び第２のコンベアのそれぞれの前記幅を独
立に変更させる基板搬送駆動制御装置とを有することを
特徴とするリフロー半田付装置。1. A plurality of heating means, a board carrying means having a structure for carrying a plurality of printed boards on which electronic parts are mounted on a surface on which cream solder is printed and allowing hot air to pass, and the heating means. Hot air circulation means for circulating the hot air and cooling means for cooling the printed circuit board in the final step of the board transfer means, and when the board transfer means passes through the heating means, the hot air action from the heating means causes In a reflow soldering device in which the cream solder on a printed circuit board is melted and solidified by the cooling means to solder the electronic component to the printed circuit board, the substrate transfer means is a first conveyor having a variable width,
A second conveyor arranged above the first conveyor and having a variable width, and the hot air circulating means circulates the hot air from the heating means in a vertical direction with respect to the transfer surfaces of the first and second conveyors. A plurality of first circulation fans, a plurality of second circulation fans that circulate in parallel to the transport surfaces of the first and second conveyors and in a direction perpendicular to the movement, and the first and second conveyors And a board transfer drive control device that independently drives each of the first and second conveyors and independently changes the width of each of the first and second conveyors.
板を前記第１のコンベア又は第２のコンベアのそれぞれ
の入口へ搬送させるために上下に移動する第１のエレベ
ータコンベアと、前記第１のコンベア又は第２のコンベ
アから搬送されてきた前記プリント基板を外部へ搬出さ
せるべく上下に移動する第２のエレベータコンベアとを
有することを特徴とする請求項１記載のリフロー半田付
装置。2. A first elevator conveyor that moves up and down to convey the printed circuit board loaded from the outside to respective entrances of the first conveyor or the second conveyor, and the first conveyor. 2. The reflow soldering device according to claim 1, further comprising a second elevator conveyor that moves up and down to carry out the printed circuit board conveyed from the second conveyor to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5149661A JP2519013B2 (en) | 1993-06-22 | 1993-06-22 | Reflow soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5149661A JP2519013B2 (en) | 1993-06-22 | 1993-06-22 | Reflow soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0715133A true JPH0715133A (en) | 1995-01-17 |
| JP2519013B2 JP2519013B2 (en) | 1996-07-31 |
Family
ID=15480092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5149661A Expired - Fee Related JP2519013B2 (en) | 1993-06-22 | 1993-06-22 | Reflow soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519013B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6524100B2 (en) | 2000-06-30 | 2003-02-25 | Ersa Gmbh | Facility for the thermal treatment of workpieces |
| KR20030046797A (en) * | 2001-12-06 | 2003-06-18 | 권희경 | a device for printing and drying of a PCB and method thereof |
| JP2010153674A (en) * | 2008-12-26 | 2010-07-08 | Fujitsu Ltd | Reflow device |
| JP2011119466A (en) * | 2009-12-03 | 2011-06-16 | Panasonic Corp | Heating condition determination method and program for reflow device |
| JP2011119465A (en) * | 2009-12-03 | 2011-06-16 | Panasonic Corp | Heating condition determination method and program for reflow device |
| JP2015035615A (en) * | 2008-11-19 | 2015-02-19 | イリノイ トゥール ワークス インコーポレイティド | Vertically separated pass through conveyor system and method in surface-mount technology process equipment |
| WO2016035193A1 (en) * | 2014-09-04 | 2016-03-10 | ヤマハ発動機株式会社 | Component mounting device and component mounting system |
| US11453075B2 (en) | 2016-09-30 | 2022-09-27 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting line control system |
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| JPS62234658A (en) * | 1986-04-02 | 1987-10-14 | Matsushita Electric Ind Co Ltd | Vapor processing device |
| JPH01174891A (en) * | 1987-12-28 | 1989-07-11 | Yamatake Honeywell Co Ltd | Heating article transferring device of heating furnace |
| JPH04356348A (en) * | 1991-02-08 | 1992-12-10 | Sony Corp | Reflow soldering device |
| JP3101359U (en) * | 2003-10-31 | 2004-06-10 | 正樹 小谷 | Game card for learning assistance |
-
1993
- 1993-06-22 JP JP5149661A patent/JP2519013B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62234658A (en) * | 1986-04-02 | 1987-10-14 | Matsushita Electric Ind Co Ltd | Vapor processing device |
| JPH01174891A (en) * | 1987-12-28 | 1989-07-11 | Yamatake Honeywell Co Ltd | Heating article transferring device of heating furnace |
| JPH04356348A (en) * | 1991-02-08 | 1992-12-10 | Sony Corp | Reflow soldering device |
| JP3101359U (en) * | 2003-10-31 | 2004-06-10 | 正樹 小谷 | Game card for learning assistance |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6524100B2 (en) | 2000-06-30 | 2003-02-25 | Ersa Gmbh | Facility for the thermal treatment of workpieces |
| KR20030046797A (en) * | 2001-12-06 | 2003-06-18 | 권희경 | a device for printing and drying of a PCB and method thereof |
| JP2015035615A (en) * | 2008-11-19 | 2015-02-19 | イリノイ トゥール ワークス インコーポレイティド | Vertically separated pass through conveyor system and method in surface-mount technology process equipment |
| US9345147B2 (en) | 2008-11-19 | 2016-05-17 | Illinois Tool Works, Inc. | Vertically separated pass through conveyor system and method in surface mount technology process equipment |
| JP2010153674A (en) * | 2008-12-26 | 2010-07-08 | Fujitsu Ltd | Reflow device |
| JP2011119466A (en) * | 2009-12-03 | 2011-06-16 | Panasonic Corp | Heating condition determination method and program for reflow device |
| JP2011119465A (en) * | 2009-12-03 | 2011-06-16 | Panasonic Corp | Heating condition determination method and program for reflow device |
| WO2016035193A1 (en) * | 2014-09-04 | 2016-03-10 | ヤマハ発動機株式会社 | Component mounting device and component mounting system |
| JPWO2016035193A1 (en) * | 2014-09-04 | 2017-04-27 | ヤマハ発動機株式会社 | Component mounting apparatus and component mounting system |
| US11453075B2 (en) | 2016-09-30 | 2022-09-27 | Panasonic Intellectual Property Management Co., Ltd. | Component mounting line control system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519013B2 (en) | 1996-07-31 |
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