JPH0715029A - Optically coupled device - Google Patents

Optically coupled device

Info

Publication number
JPH0715029A
JPH0715029A JP15750593A JP15750593A JPH0715029A JP H0715029 A JPH0715029 A JP H0715029A JP 15750593 A JP15750593 A JP 15750593A JP 15750593 A JP15750593 A JP 15750593A JP H0715029 A JPH0715029 A JP H0715029A
Authority
JP
Japan
Prior art keywords
primary
mold resin
resin
optical coupling
optically coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15750593A
Other languages
Japanese (ja)
Other versions
JP2851991B2 (en
Inventor
Yasushi Fujii
康司 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP15750593A priority Critical patent/JP2851991B2/en
Publication of JPH0715029A publication Critical patent/JPH0715029A/en
Application granted granted Critical
Publication of JP2851991B2 publication Critical patent/JP2851991B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE:To realize low cost by improving productivity and yield in an optically coupled device having an almost island-shaped mounting segment. CONSTITUTION:In an optically coupled device wherein a light emitting element 1 and a photodetector 2 are arranged at the optical coupling position, these are doubly transfer-molded by primary mold resin 5 and secondary mold resin 6, and at least the photodetector 2 is mounted on a mounting segment 3 which is cut so as to constitute an approximate island shape, a recessed part 7 is formed in the vicinity of a protruding part of the mounting segment 3 in the sealing part of the primary mold resin 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、フォトカプラあるいは
ソリッドステートフォトリレー等の光結合素子に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device such as a photo coupler or a solid state photo relay.

【0002】[0002]

【従来の技術】従来、二重トランスファーモールド法で
樹脂封止される光結合素子でパッケージがディアルイン
ラインパッケージ(DIP)や面実装タイプのサーフィ
スマウンティングデバイス(SMD)では受光チップの
構造(ラテラル構造)上、出力は2端子と受光チップの
載置用が1端子で通常3端子である。
2. Description of the Related Art Conventionally, the structure of a light-receiving chip (lateral structure) is used in a dual in-line resin-sealed optical coupling element such as a dial-in-line package (DIP) or a surface mounting type surface mounting device (SMD). As for the output, two terminals and one terminal for mounting the light receiving chip are provided, and normally three terminals are provided.

【0003】図3はその従来例を示す図であり、同図
(a)は側面断面図であり、同図(b)は上面側からの
透視図である。
FIG. 3 is a view showing a conventional example thereof, FIG. 3 (a) is a side sectional view, and FIG. 3 (b) is a perspective view from the upper surface side.

【0004】1は発光素子であり、2は受光素子であ
り、3は載置用リード(載置片)であり、4は外部リー
ド端子であり、5は一次モールド樹脂であり、6は二次
モールド樹脂である。
Reference numeral 1 is a light emitting element, 2 is a light receiving element, 3 is a mounting lead (mounting piece), 4 is an external lead terminal, 5 is a primary mold resin, and 6 is a secondary mold resin. It is the next mold resin.

【0005】しかしながら、図3に示す従来例では、載
置用リード3が外部に露出しているため、誤配線,外来
ノイズ等の問題が生じた。そこで、これらを解決するも
のとして、図4に示すような光結合素子がある。
However, in the conventional example shown in FIG. 3, since the mounting leads 3 are exposed to the outside, problems such as erroneous wiring and external noise occur. Therefore, as a solution to these problems, there is an optical coupling element as shown in FIG.

【0006】図4は他の従来例を示す図であり、同図
(a)は側面断面図であり、同図(b)は上面側からの
透視図である。本従来例について、上記従来例と相違す
る点のみ説明する。
FIG. 4 is a view showing another conventional example, FIG. 4 (a) is a side sectional view, and FIG. 4 (b) is a perspective view from the upper surface side. This conventional example will be described only on the points different from the above conventional example.

【0007】本従来例の光結合素子は、図4の如く、載
置用リード3を一次モールド後にリードカットを行い、
その後これらを二次モールドにて封止し、前記載置用リ
ード3が外部に露出しないよう封止してなる構造であ
る。
In the optical coupling element of this conventional example, as shown in FIG. 4, the mounting lead 3 is subjected to lead cutting after primary molding,
After that, these are sealed with a secondary mold, and the mounting leads 3 are sealed so as not to be exposed to the outside.

【0008】[0008]

【発明が解決しようとする課題】ところが、図4に示す
従来例では、載置用リード3をカットする際に、カット
部分付近の一次モールド樹脂5に割れやカケが発生しな
いようにする必要があり、これは前記一次モールド樹脂
5より0.5mm程度残してカットすることが必要にな
る。
However, in the conventional example shown in FIG. 4, when the mounting lead 3 is cut, it is necessary to prevent the primary mold resin 5 near the cut portion from cracking or chipping. Yes, it is necessary to cut the primary mold resin 5 leaving about 0.5 mm.

【0009】これは、以下に示すような問題を生じる。This causes the following problems.

【0010】二次モールド樹脂6の厚みはDIPタイプ
で0.8mm程度であり、二次モールド金型によるズレ
が生じた場合カット面の載置用リード3が露出するとい
った懸念があった。
The thickness of the secondary molding resin 6 is about 0.8 mm in the DIP type, and there is a concern that the mounting lead 3 on the cut surface is exposed when the deviation occurs due to the secondary molding die.

【0011】さらに、SMDでは二次モールド樹脂6の
厚みは0.3mm程度であり、二次モールド樹脂6より
露出することになり、二次モールド樹脂6内に封止する
ことは困難であった。
Further, in the SMD, the thickness of the secondary molding resin 6 is about 0.3 mm, which is exposed from the secondary molding resin 6 and it is difficult to seal it in the secondary molding resin 6. .

【0012】尚、カッティング残りを少なくした際に
は、リードカットする金型の耐久性が下がったり、一次
モールド樹脂5をかんだりして上述したように一次モー
ルド樹脂5に割れやカケが発生する。また、二次モール
ド樹脂6の厚みを多くすることとし、一次モールド樹脂
5の厚みを小さくすることも考えられるが、レイアウト
上単に一次モールド樹脂5の厚みを小さくすることは困
難であった。
When the amount of cutting residue is reduced, the durability of the die for lead cutting is lowered, or the primary molding resin 5 is bitten to cause cracks or chips in the primary molding resin 5 as described above. . Further, it is conceivable to increase the thickness of the secondary mold resin 6 and decrease the thickness of the primary mold resin 5, but it is difficult to simply reduce the thickness of the primary mold resin 5 in view of the layout.

【0013】本発明は、上記問題点に鑑み、載置用リー
ドの外部への露出をなくし、生産性の向上及び歩留りア
ップが図れる光結合素子の提供を目的とするものであ
る。
In view of the above problems, it is an object of the present invention to provide an optical coupling element which eliminates the exposure of the mounting leads to the outside and improves the productivity and the yield.

【0014】[0014]

【課題を解決するための手段】本発明の光結合素子は、
発光素子と受光素子とが光学的に結合する位置に配置さ
れ、これらが一次モールド及び二次モールドされてなる
ものであって、少なくとも、前記受光素子が、一次モー
ルド後略アイランド状となるようカッティングされた載
置片に搭載されてなる光結合素子において、前記一次モ
ールド樹脂の封止部における前記載置片の突出部分近域
に凹部を設けてなることを特徴とするものである。
The optical coupling element of the present invention comprises:
The light emitting element and the light receiving element are arranged at positions where they are optically coupled to each other, and these are primary-molded and secondary-molded, and at least the light-receiving element is cut so as to have a substantially island shape after the primary molding. The optical coupling element mounted on the mounting piece is characterized in that a recess is provided in the sealing portion of the primary mold resin in the vicinity of the protruding portion of the mounting piece.

【0015】[0015]

【作用】上記構成によれば、本発明の光結合素子は、一
次モールド樹脂の封止部における前記載置片の突出部近
域に凹部を設けてなる構成なので、前記凹部にて前記載
置片をカットすることにより二次モールド樹脂の厚みと
の裕度をとることができる。
According to the above construction, since the optical coupling element of the present invention has a concave portion provided in the sealing portion of the primary mold resin in the vicinity of the projecting portion of the placing piece, the concave portion is placed in the concave portion. By cutting the piece, a margin with the thickness of the secondary molding resin can be obtained.

【0016】[0016]

【実施例】図1は本発明の一実施例を示す上面側からの
透視図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view from the upper surface side showing an embodiment of the present invention.

【0017】図中、1は発光素子であり、2は受光素子
であり、3は載置片であり、4は外部リード端子であ
り、5は一次モールド樹脂(透光性樹脂)であり、6は
二次モールド樹脂(遮光性樹脂)であり、7は凹部であ
る。
In the figure, 1 is a light emitting element, 2 is a light receiving element, 3 is a mounting piece, 4 is an external lead terminal, 5 is a primary mold resin (translucent resin), 6 is a secondary mold resin (light-shielding resin), and 7 is a recess.

【0018】図1の如く、本実施例の光結合素子は、発
光素子1と受光素子2とが相対向する位置に配置され、
これらが一次モールド樹脂5及び二次モールド樹脂6に
て二重トランスファーモールドされている。前記一次モ
ールド樹脂5の封止部における載置片3の突出部分近域
には凹部7が形成されており、該凹部7にて前記受光素
子2が搭載された前記載置片3が略アイランド状となる
ようカッティングされてなる構成である。
As shown in FIG. 1, in the optical coupling element of this embodiment, the light emitting element 1 and the light receiving element 2 are arranged at positions facing each other,
These are double-transfer molded with the primary molding resin 5 and the secondary molding resin 6. A recess 7 is formed in the sealing portion of the primary mold resin 5 in the vicinity of the projecting portion of the mounting piece 3, and the mounting piece 3 on which the light receiving element 2 is mounted is substantially island-shaped. It is configured to be cut into a shape.

【0019】以下に、製造方法を説明する。The manufacturing method will be described below.

【0020】まず、発光素子1と受光素子2とをそれぞ
れ所定の外部リード端子4と載置片3に搭載し、所望の
素子−端子間を接続する。次に、前記発光素子1と受光
素子2とを相対向する位置に配置し、一次モールド樹脂
5の一次トランスファモールドにて封止する。この時、
前記一次モールド樹脂5の封止部における前記載置片3
の突出部分近域に凹部7を形成する。その後、前記凹部
7にて、前記載置片3のカッティングをカッティング金
型(図示せず)にて行なう。次に、これらの外周を二次
モールド樹脂6の二次トランスファモールドにて完全樹
脂封止し、完成品とする。
First, the light emitting element 1 and the light receiving element 2 are mounted on predetermined external lead terminals 4 and mounting pieces 3, respectively, and desired element-terminal connections are made. Next, the light emitting element 1 and the light receiving element 2 are arranged at positions facing each other, and sealed by primary transfer molding of the primary molding resin 5. This time,
The above-mentioned mounting piece 3 in the sealing portion of the primary mold resin 5
The concave portion 7 is formed in the vicinity of the protruding portion. After that, in the concave portion 7, the placing piece 3 is cut with a cutting die (not shown). Next, the outer periphery of these is completely resin-sealed by secondary transfer molding of the secondary molding resin 6 to obtain a finished product.

【0021】このように、一次モールド樹脂5の封止部
における載置片3の突出部分近域に凹部7を設け、該凹
部7にて前記載置片3をカットすることにより、二次モ
ールド樹脂6の厚みとの裕度をとることができ、アセン
ブリ上のズレが発生したとしても、前記載置片3が外部
へ露出することなく、生産性の向上,歩留りアップとな
り、低コスト化が可能となる。
As described above, the concave portion 7 is provided in the sealing portion of the primary molding resin 5 in the vicinity of the projecting portion of the placing piece 3, and the placing piece 3 is cut by the concave portion 7 to form the secondary mold. The margin with respect to the thickness of the resin 6 can be taken, and even if a deviation occurs on the assembly, the above-mentioned mounting piece 3 is not exposed to the outside, productivity is improved, yield is increased, and cost is reduced. It will be possible.

【0022】加えて、上記実施例において、図2の如
く、一次モールド樹脂5の外周に複数の溝8を設けるこ
とにより、二次モールド樹脂6を薄くした際の一次モー
ルド樹脂5及び二次モールド樹脂6の密着性を向上で
き、さらに、沿面距離を長くできる。
In addition, in the above embodiment, as shown in FIG. 2, by providing a plurality of grooves 8 on the outer periphery of the primary molding resin 5, the primary molding resin 5 and the secondary molding resin 5 when the secondary molding resin 6 is thinned. The adhesion of the resin 6 can be improved and the creepage distance can be increased.

【0023】本発明は、上記実施例に限らず、少なくと
も、一次モールド樹脂5の封止部における受光素子2を
搭載した載置片3の突出部分近域に凹部7を設け、該凹
部7にて、前記載置片3がカットされたものであれば何
でもよい。
The present invention is not limited to the above embodiment, but at least a concave portion 7 is provided in the sealing portion of the primary molding resin 5 in the vicinity of the protruding portion of the mounting piece 3 on which the light receiving element 2 is mounted, and the concave portion 7 is provided. Any material may be used as long as the piece 3 is cut.

【0024】例えば、上記実施例では、発光素子1と受
光素子2とを相対向する位置に配置したが、略同一平面
上に配置しても良い。
For example, in the above-mentioned embodiment, the light emitting element 1 and the light receiving element 2 are arranged at positions facing each other, but they may be arranged on substantially the same plane.

【0025】[0025]

【発明の効果】以上のように、本発明の光結合素子によ
れば、載置片が外部へ露出することがなくなり、生産性
の向上,歩留りアップとなり、低コスト化が図れる光結
合素子が得られる。
As described above, according to the optical coupling element of the present invention, the mounting piece is not exposed to the outside, the productivity is improved, the yield is increased, and the cost is reduced. can get.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す上面側からの透視図で
ある。
FIG. 1 is a perspective view from the upper surface side showing an embodiment of the present invention.

【図2】本発明の他の実施例を示す側面断面図である。FIG. 2 is a side sectional view showing another embodiment of the present invention.

【図3】従来例を示す図であり、図(a)は側面断面図
であり、図(b)は上面側からの透視図である。
3A and 3B are views showing a conventional example, FIG. 3A is a side sectional view, and FIG. 3B is a perspective view from the upper surface side.

【図4】他の従来例を示す図であり、図(a)は側面断
面図であり、図(b)は上面側からの透視図である。
4A and 4B are views showing another conventional example, in which FIG. 4A is a side sectional view and FIG. 4B is a perspective view from the upper surface side.

【符号の説明】[Explanation of symbols]

1 発光素子 2 受光素子 3 載置片 5 一次モールド樹脂 6 二次モールド樹脂 7 凹部 DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Light receiving element 3 Mounting piece 5 Primary molding resin 6 Secondary molding resin 7 Recess

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 発光素子と受光素子とが光学的に結合す
る位置に配置され、これらが一次モールド及び二次モー
ルドされてなるものであって、少なくとも、前記受光素
子が、一次モールド後略アイランド状となるようカッテ
ィングされた載置片に搭載されてなる光結合素子におい
て、前記一次モールド樹脂の封止部における前記載置片
の突出部分近域に凹部を設けてなることを特徴とする光
結合素子。
1. A light-emitting element and a light-receiving element are arranged at positions where they are optically coupled to each other, and these are primary-molded and secondary-molded. At least the light-receiving element has a substantially island shape after the primary molding. In an optical coupling element mounted on a mounting piece that has been cut so that an optical coupling element is provided, a concave portion is provided near a protruding portion of the mounting piece in the sealing portion of the primary mold resin. element.
JP15750593A 1993-06-28 1993-06-28 Optical coupling device Expired - Fee Related JP2851991B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15750593A JP2851991B2 (en) 1993-06-28 1993-06-28 Optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15750593A JP2851991B2 (en) 1993-06-28 1993-06-28 Optical coupling device

Publications (2)

Publication Number Publication Date
JPH0715029A true JPH0715029A (en) 1995-01-17
JP2851991B2 JP2851991B2 (en) 1999-01-27

Family

ID=15651156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15750593A Expired - Fee Related JP2851991B2 (en) 1993-06-28 1993-06-28 Optical coupling device

Country Status (1)

Country Link
JP (1) JP2851991B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7705077B2 (en) 2004-10-27 2010-04-27 Sumitomo Rubber Industries, Ltd. Rubber composition for steel cord and steel cord coated thereby

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7705077B2 (en) 2004-10-27 2010-04-27 Sumitomo Rubber Industries, Ltd. Rubber composition for steel cord and steel cord coated thereby

Also Published As

Publication number Publication date
JP2851991B2 (en) 1999-01-27

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