JPH07147305A - Test apparatus - Google Patents

Abstract

PURPOSE:To provide a test apparatus having a test head that can be positioned in six directions. CONSTITUTION:An apparatus for testing an object, such as semiconductor wafer W having semiconductor chips on its surface, comprises a tester body 2 and a test head 12, which is connected with X-axis positioning mechanism, Y-axis positioning mechanism 44, Z-axis positioning mechanism, thetaX-axis positioning mechanism 46, thetaY-axis positioning mechanism 40, and thetaZ-axis positioning mechanism 32. All or some of the positioning mechanisms are movable. In this manner, the test head can be automatically positioned in a plurality of directions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for testing an object to be inspected for inspecting a large number of integrated circuits formed on a semiconductor wafer.

[0002]

2. Description of the Related Art Generally, in a semiconductor device manufacturing process, in order to test electric characteristics of electronic circuits (chips) such as ICs and LSIs formed on a semiconductor wafer,
A probe needle, which is a contactor, is automatically brought into contact with the electrode pad of each chip, and an electric signal is input from an external tester to judge the quality of the product. An example of a conventional test device for performing this inspection is shown in FIG. 17 and FIG. 18. On the test device main body 2 side, a mounting device that is movable in the XY directions in the horizontal plane and the Z direction which is the vertical direction is provided. A mounting table 4 is provided, and a semiconductor wafer W is mounted as an object to be inspected on the upper surface. On the upper surface of this test device body 2,
A ring-shaped probe card 8 having a large number of probe needles 6 implanted therein and a probe card interface section 10 provided in contact with the upper surface of the ring-shaped probe card 8 are detachably fixed.

On the other hand, the test head portion 12 is rotatably supported on the side portion of the test device body 2 and is supported by the test device body 2.
It can be laid down on the upper surface of. On the lower surface of the test head portion 12, there is provided a contact ring 14 for making electrical contact with a large number of pogo pins provided on the probe card interface portion 10. Then, the wiring bundle 1 including a large number of wirings drawn from the test head unit 12
Reference numeral 6 is connected to a tester 18, which is used to inspect the electrical characteristics of the chip.

[0004]

By the way, when the position of the pad on the wafer to be inspected changes, it is necessary to replace the probe card 8, the contact ring 14 and the like, but at this time, the maximum is about 300 kg. The test head portion 12, which is a heavy object, is manually rotated to stand up for replacement work. Also, during maintenance of the contact ring 14, the probe card 8 and the like, the test head portion 12 must be similarly rotated to stand up. In such a case, since the operator manually tilts the test head portion 12 as described above, the work efficiency is not very good. Therefore, it is conceivable to adjust the position of the test head portion using a position adjusting mechanism using a balancer, but in this case, since the balancer is used, the apparatus itself becomes excessively complicated, which is not preferable. Further, since the operator manually adjusts the position, the work efficiency is not good.

The present invention focuses on the above problems,
It was created to solve this effectively. An object of the present invention is to provide a test device for an object to be inspected, in which the position of the test head can be adjusted over 6 axes.

[0006]

[Means for Solving the Problems] First defined in claim 1.
According to another aspect of the present invention, there is provided a test device main body having a probe card interface for transmitting an electric signal to and from an object to be inspected on an upper surface thereof, and a test head part provided so as to be contactable with and separable from the probe card interface part. In a test device for an inspection object, the test head unit adjusts a position in an X direction, which is one direction in a horizontal plane, and a position adjustment in a Y direction, which is orthogonal to the X direction in the horizontal plane. A Y-axis position adjusting mechanism, a Z-axis position adjusting mechanism for adjusting a position in a Z direction orthogonal to the horizontal plane, a θX-axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the X direction, and the Y A θY-axis position adjusting mechanism that adjusts the position in the rotational direction in a plane orthogonal to the direction, and a position adjustment in the rotational direction in the plane orthogonal to the Z direction. connected to the θZ axis position adjustment mechanism,
Among the shaft position adjusting mechanisms, some or all of the position adjusting mechanisms are made movable.

According to a second aspect of the present invention, a test apparatus main body having a probe card interface for transmitting an electric signal to and from an object to be inspected is provided on the upper surface, and the probe card interface section can be contacted and separated. In the test device for the object to be inspected, the test head unit has an X-axis position adjusting mechanism for adjusting the position in the X direction, which is one direction in the horizontal plane, and the test head unit in the horizontal plane. A Y-axis position adjusting mechanism for adjusting the position in the Y direction orthogonal to the X direction, and a Z orthogonal to the horizontal plane.
Z-axis position adjusting mechanism for adjusting the position in the direction X, and θX for adjusting the position in the rotational direction in the plane orthogonal to the X direction.
An axial position adjusting mechanism, a θY axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the Y direction, and a θZ axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the Z direction. Among the shaft position adjusting mechanisms connected, part or all of the position adjusting mechanisms are made movable, and the movable position adjusting mechanisms have stop positions when the movements in the respective directions are completed. Stop position locking means for holding is provided, and positioning means for performing positioning by fitting are formed on the upper surface of the test apparatus body and the corresponding lower surface of the test head portion, and the positioning means is fitted. Immediately before the operation, at least one of the stop position lock means is provided with an immediately before lock release means for releasing at least one of the stop position lock means.

According to a third aspect of the present invention, a test apparatus main body having a probe card interface for transmitting an electric signal to and from an object to be inspected is provided on the upper surface, and the probe card interface section can be contacted and separated. In the test device for the object to be inspected, the test head unit has an X-axis position adjusting mechanism for adjusting the position in the X direction, which is one direction in the horizontal plane, and the test head unit in the horizontal plane. A Y-axis position adjusting mechanism for adjusting the position in the Y direction orthogonal to the X direction, and a Z orthogonal to the horizontal plane.
Z-axis position adjusting mechanism for adjusting the position in the direction X, and θX for adjusting the position in the rotational direction in the plane orthogonal to the X direction.
An axial position adjusting mechanism, a θY axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the Y direction, and a θZ axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the Z direction. The Z-axis position adjusting mechanism is supported horizontally and can be moved up and down.
The Z-axis turning center has a horizontal arm portion located in the middle thereof, and during maintenance of the test head portion, the test head portion is positioned on the other end side of the horizontal arm portion to operate the θY-axis position adjusting mechanism. It is configured to drive.

[0009]

According to the first aspect of the invention, the test head portion includes the X-axis position adjusting mechanism, the Y-axis position adjusting mechanism, the Z-axis position adjusting mechanism, the θX-axis position adjusting mechanism, and the θY-axis position adjusting mechanism. ,
Since it is connected to the θZ axis position adjusting mechanism and some or all of these position adjusting mechanisms are made movable,
By operating each of the above position adjustment mechanisms, it is possible to automatically position and install the test head section on the test device body, and also to remove it from the test device body and automatically to the maintenance position. It is possible to move.

According to the second aspect of the invention, each position adjusting mechanism that is made movable as in the first aspect of the invention is provided with the stop position locking means, and when the movement of each position adjusting mechanism is completed, When this is detected, the stop position locking means is driven to hold the stop position. Immediately before the test head portion descends and the positioning means provided in the main body of the test apparatus is fitted to the test head portion, the immediately preceding lock releasing means operates to release a part or all of the stop position locking means. Put the head in a floating state. As a result, the test head portion is accurately positioned by the positioning means.

According to the third aspect of the invention, among the respective axis position adjusting mechanisms constructed as in the first aspect, the Z axis position adjusting mechanism has a horizontal arm portion which is horizontally supported and can be moved up and down. However, the turning center of the θZ axis is provided midway in the longitudinal direction of the horizontal arm portion. During maintenance of the test head, position it on the other end of the horizontal arm and
By driving the shaft position adjusting mechanism, the shaft position adjusting mechanism is inverted at a rotation angle of, for example, about 120 degrees, and its lower surface is directed obliquely upward so that maintenance work can be easily performed. In this case, the bundle of wires drawn out from the test head portion is located on the side of the end portion of the horizontal arm portion due to the rotation of the head portion, and it is possible to avoid these interferences.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a test device for an object to be inspected according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing a test apparatus for a device under test according to the present invention, FIG. 2 is a perspective view showing a manipulator portion of the test apparatus shown in FIG. 1, and FIG.
2 is a perspective view showing the manipulator portion shown in FIG. 2 from a different angle, FIG. 4 is an exploded perspective view showing a mounting state of the test head portion and the frame portion, and FIG. 5 is a plan view showing a mounting state of the test head portion and the frame portion. FIG. 6 is an explanatory view for explaining the position adjustment operation of the Y axis and the θX axis when the frame is attached to the test head part, FIG. 7 is a side view showing the test device excluding the test device body, and FIG. 8 is FIG. 9 is a bottom view showing the sleeve of the Z-axis lowering stop member, FIG. 10 is a side view showing the braking means provided on the Z-axis lowering stop member, and FIG. 11 is a test. FIG. 12 is a schematic side view showing the positioning means provided in the head portion and the test apparatus body, FIG. 12 is an operation explanatory view for explaining the operation of the positioning means shown in FIG. 11, and FIG. 13 is a test head provided in the test apparatus body. FIG. 14 is a side view showing a fixing clamp mechanism, FIG. 14 is a view showing a stop position locking means for locking the positioning in the X-axis direction, and FIG. 15 is an operation explanation for explaining the operation of the stop position locking means shown in FIG. Fig. 16
FIG. 7 is an explanatory diagram for explaining the movement of the test head unit during maintenance.

As shown in the figure, the test device for the object to be inspected has a substantially rectangular test device main body 2, a test head portion 12 provided on the upper surface thereof so as to be capable of contact and separation, and movement of the test head portion 12. And a manipulator unit 20 for positioning. In FIG. 5, the test head portion 12 is shown by a solid line, but in FIG. 1, it is shown by a dashed line to show the structure of the manipulator portion 20.

The test apparatus main body 2 and the test head unit 12 are constructed in the same manner as the conventional apparatus shown in FIGS. 17 and 18. The test apparatus main body 2 is mounted with a semiconductor wafer (not shown) which is an object to be processed. A mounting table that is placed and moves in the X, Y, and Z directions, a probe card having probe needles, and a probe card interface unit 10 are provided respectively, and the interface unit 10 includes the test head unit 1
The contact ring 14 provided on the lower surface of No. 2 comes into contact and separates (see FIGS. 17 and 18).

Since various test circuits are densely housed in the test head section 12, the maximum weight is about 300 kg, and the manipulator section 20 for controlling this movement has high rigidity. Will be required.
Then, a tester 18 is provided behind the test head unit 12.
A wiring bundle 16 composed of a large number of wirings connected to each other extends (see FIG. 16). Contact ring 1 of test head section 12
4 is required to be accurately positioned and contact the probe card interface unit 10, and therefore the manipulator unit 20 is required to have a position adjusting function in each direction.

Therefore, in the present embodiment, various position adjusting mechanisms are provided so that the manipulator section 20 can adjust in six axial directions. These 6 axes are
Two directions orthogonal to the horizontal plane are defined as an X direction and a Y direction, a vertical direction orthogonal to the horizontal plane is defined as a Z direction, and a direction rotating around each axial direction, that is, a plane orthogonal to each axial direction is defined. The directions of rotation are the θX direction, the θY direction, and the θZ direction, respectively.

First, the manipulator section 20 is provided with a horizontal support column 28 which is vertically movable via a Z-axis position adjusting mechanism 26 on a fixed support column 24 standing on a manipulator base 22.
A rotary support column 30 is erected at the tip of the horizontal support column 28 via a θZ axis position adjusting mechanism 32 so as to be rotatable in the θZ axis direction around the Z axis, and a horizontal arm portion 34 is provided at the upper end of the rotary support column 30. The slide block 38 is fixedly mounted on the horizontal arm 34 so as to be slidable via the X-axis position adjusting mechanism 36, and the frame portion 42 is attached to the slide block 38 via the θY-axis position adjusting mechanism 40.
The whole is composed. And this frame part 42
The Y-axis position adjusting mechanism 44 and the θX-axis position adjusting mechanism 46.
The test head portion 12 is fixedly attached via the above (see FIGS. 1 and 4).

In the present embodiment, as described above, the position adjustment in the Y-axis direction and the θX-axis direction is performed at the time of mounting the test head portion 12 and becomes a fixed state after the mounting, but in the other four axial directions. Then, the head portion 12 is moved and the head portion 12 is moved as necessary. Regarding this point, any axial direction can be fixed by design and any axial direction can be made movable, and the present invention is not limited to the above.

First, the Z-axis position adjusting mechanism 26 will be described. As shown in FIGS. 3, 7, and 8 to 9, a pair of Z-axis guide rails extending in the vertical direction are provided on the side surfaces of the fixed support column 24. A slide frame 50 is provided so as to be slidable on the Z-axis via 48, and the base end portion of the horizontal column 28 is fixed to the frame 50. Below the slide frame 50, a horizontal base 54 is provided between the fixed column 24 and a side plate 52 provided at a position facing the fixed column 24.
Have been passed over. A ball screw 56 is vertically provided between the horizontal base 54 and the bottom plate 50A of the slide frame 50 so as to pass through the bottom plate 50A, and the lower end of the ball screw 56 is rotatable on the horizontal base 54 via a bearing or the like. And an upper end thereof is held by the fixed column 24 via an L-shaped angle 58 rotatably supported.

A belt 66 is stretched around a pulley 60 provided at the lower end of the ball screw 56 with a pulley 64 of a Z-axis motor 62 as a Z-axis drive source provided on the horizontal base 54. The ball screw 56 is configured to be able to rotate in the normal and reverse directions according to a command from the control unit 68.
The ball screw 56 is in contact with the bottom plate 50A of the slide frame via the sleeve 70 that moves up and down according to this rotation, and the slide frame 50 as a whole moves up and down in response to the up and down movement of the sleeve 70. . The sleeve 70 is loosely fitted in the ball screw hole of the bottom plate 50A, and the flange 70A of the sleeve 70 restricts the movement of the bottom plate 50A of the frame when the frame 70 moves upward as shown in FIG. 8A. As shown in FIG. 8 (B), the movement of the bottom plate 50A is regulated up to halfway during the descent, but after that, only the sleeve 70 can move independently.

A rod-shaped Z-axis descending stop member 72 is attached and fixed downward to the bottom plate 50A, and a cushion member 74 made of, for example, synthetic rubber is provided at the lower end thereof. The slide frame 50, that is, the test head portion 12 is stopped from being lowered and the positioning in the Z-axis direction can be performed.
That is, the movement in the Z-axis downward direction is mechanically stopped by the stop member 72. This stop member 7
The length of 2 is set to a length that determines the position when the lower surface of the test head portion 12 is substantially in contact with the upper surface of the test apparatus body 2, and the lowering of the slide frame 50 is stopped by the stop member 72. Even if the Z-axis motor 62 slightly rotates due to inertia later, only the sleeve 70 descends as shown in FIG. 8B.

A bottom plate 5 is provided on the side of the sleeve 70.
A sleeve rotation stopper 76 protruding from 0A is provided, and the rotation of the sleeve 70 is restricted by abutting a notch 78 formed by linearly cutting a part of the circular flange 70A of the sleeve on this side surface. While allowing this vertical movement. A proximity sensor 80 for detecting the lowering of the sleeve 70 is provided midway in the vertical direction of the sleeve rotation stopper 76. When the sensor 80 detects the lowering of the sleeve 70, the control unit 68 causes the Z-axis motor to move. The drive of 62 is stopped.

The Z-axis motor 62 and the ball screw 56 are provided with a braking means, for example, an electromagnetic force, for holding the stop position at that time when the drive energy supplied to the Z-axis motor 62 is stopped for some reason. Operated electromagnetic brakes 82 and 84 are provided, and a safety design is provided so that the test head portion 12, which is a heavy object, does not drop.

Next, the θZ-axis position adjusting mechanism 32 will be described. As shown in FIG. 3, the rotary column 30 rotates in the θZ direction via the θZ bearing 86 at the tip of the horizontal column 28 that moves in the vertical direction. The rotary strut 30 is movably supported, and is connected to a θZ-axis air cylinder 88 provided in the horizontal strut 28 via, for example, a crank mechanism (not shown), and is rotatable by, for example, 90 degrees (FIG. 1).
6).

Further, a θZ lock plate 90 which rotates integrally with the horizontal column 28 is attached to the horizontal column 28, and the horizontal column 28 corresponding to the stop position of the plate 90 collides with the plate 90 to cause a shock. A θZ shock absorber 92 having an absorbing elastic member is provided.

Next, the X-axis position adjusting mechanism 36 will be described. The horizontal arm portion 34 fixed to the upper end of the rotating column 30 is formed into a substantially rectangular cross section, and a pair of X-axis guide rails 94 is provided on one side surface thereof and one X-axis guide rail is provided on the opposite side surface thereof. 96 are provided along the length direction, respectively. On the pair of X-axis guide rails 94, the first slide block 3 is arranged so as to extend between them.
8 is slidably provided, on the other hand, one X-axis guide rail 96 is provided with a second slide block 100 which is slidable along the guide rail 96, and between these two blocks 38, 100. A joint plate 102 for connecting them is spanned (see FIGS. 1 and 2). Further, the mounting position of the rotary support column 30, which is the turning center O1 of the horizontal arm portion 34, is at least the slide block 3 above the end portion of the horizontal arm portion 34.
It is set at a position separated by a distance corresponding to the length of 8 and 100, and as will be described later, even when the test head portion 12 is rotated in the θY axis direction by, for example, about 120 degrees during maintenance, the test head portion 12 and It does not interfere with a bridge plate 104 described later. A rack 106 is formed on one side of the lower surface of the horizontal arm portion 34 along the longitudinal direction thereof, and an X-axis motor 108 as an X-axis drive source is fixed to the first slide block 38. The slide blocks 38, 100 are moved in the X-axis direction by engaging a pinion gear 110 attached to the rotating shaft of the motor 108 with the rack 106.

The horizontal arm portion 34 and the first slide block 38 are provided with X-axis stop position lock means 112 for performing positioning in the X-axis direction.
Specifically, as shown in FIG. 2 and FIGS. 14 to 15, the X-axis stop position lock means 112 includes the horizontal arm unit 3.
4 is formed mainly by a pair of X-axis lock plates 114A and 114B provided at both ends of the side surface and an X-axis lock pin 116 provided on the first slide block 38. Each lock plate 114A, 114B is X
After the axial movement is completed and the plates are mounted and fixed at the positions to be positioned, the positioning holes 118 of the plates 114A and 114B are tapered and formed in a conical recess shape. Naru lock pin 1
The tip of 16 is similarly formed in a tapered conical convex shape so as to come into close contact with the tapered surface of the positioning hole 118. The X-axis lock pin 116 is connected to the X-axis air cylinder 120 controlled by the control unit 68 so as to be retractable.

Both X-axis lock plates 114A, 1
14B includes, for example, an X-axis optical sensor 1 for detecting that the first slide block 38 has reached a predetermined position.
22A and 122B are provided respectively, and shutter members 124 provided on both sides of the X-axis air cylinder 120 are provided.
A and 124B are optical sensors 122A and 122B, respectively.
When it enters the inside and interrupts the optical path, the interrupt signal is input to the control unit 68, and the control unit 68 receiving this signal drives the X-axis air cylinder 120 so that the X-axis lock pin 116 is taken out. This makes it possible to hold this stop position while positioning the slide block in the X-axis direction. Among the above X-axis lock plates, a plate on the side where the block stop position needs to be changed, for example, a mounting portion of the X-axis lock plate 114B is provided with a long hole (not shown).
It can be adjusted within the length of the slot along the axial direction.

Further, as described later, the control section 68 immediately before the test head section 12 comes into contact with the upper surface of the test apparatus main body 2 and is positioned immediately before the X-axis positioning section 112 is unlocked. Is connected to the Z-axis proximity sensor 126 (see FIG. 12), and the X-axis lock pin 116 is detected when the approach of the test head unit 12 is detected.
Is designed to be unlocked.

Further, each X-axis lock plate 114 described above is used.
A and 114B are provided with X-axis shock absorbers 128 for absorbing shocks when the slide blocks 38 and 100 are stopped (see FIG. 3). The stop position locking means 112 as described above is a position adjusting mechanism in another movable state, for example, θZ of the θZ axis position adjusting mechanism 32.
The shaft lock plate 90 (see FIG. 3) and the like, as well as the θY axis position adjusting mechanism 40 described later, are provided in the same manner, and hold the stop position when the movement of each axis is completed.

Next, the θY axis position adjusting mechanism 40 will be described. As shown in FIGS. 1 to 3, a θY-axis motor 135 as a θY-axis drive source is attached to the first slide block 38, and the rotation axis of the motor 135 is a θY-axis bearing 136 (see FIG. 3). ), And is fastened to the U-shaped outer frame 138 of the frame portion 42 by a large number of screws 140, which can be turned about the θY axis by, for example, 180 degrees. On the outer surface of the outer frame 138, that is, the surface facing the first slide block 38, the θY-axis lock plate (not shown) that constitutes a part of the θY-axis stop position locking means is provided as described above. A θY-axis air cylinder 144 having a θY-axis lock pin 142 is fixedly mounted on the first slide block 38 so as to face it.

A bridge plate 104 extending in the horizontal direction via a joint bar 146 is fixedly provided at the center of the outer frame 138 so that the plate 104 does not interfere with the horizontal arm portion 34. The wiring bundle 16 is supported on the upper surface of the wiring bundle 16 by straddling it. Further, the bridge plate 104 is provided with a stopper 134 for holding the wiring bundle 16.

Next, the Y-axis position adjusting mechanism 44 and the θX-axis position adjusting mechanism 46 will be described. The frame portion 42
Is composed of the U-shaped outer frame 138 as described above and the two inner frames 138 provided on the tip side of the outer frame 138. When fixing the side surface of the test head portion 12 to both tips of the outer frame 138, Position adjustment in the Y-axis and θX-axis directions is performed (see FIG. 5). As shown in FIG. 4, the inner frame 1 is attached to the side surface of the test head portion 12.
48, outer frame 138 and square washer 15
Lastly, 6 screws 152
To fix these.

First, the inner frame 148 is formed with an inner elongated hole 154 extending in the Y-axis direction and six inner screw holes 156 arranged around the inner elongated hole 154. A mounting shaft 160 having a circular flange 158 at its end is inserted into the inner elongated hole 154 via a θX axis adjusting bearing 162. In this case, the shaft 160 is set to have a sufficiently long length, and the tip thereof is threaded so as to be screwed with the tightening nut 163, and the thickness of the bearing 162 is equal to or greater than the thickness of the inner frame 148. Is also set smaller, bearing 1
The reference numeral 62 is configured so as to be movable in the inner elongated hole 154 in the Y-axis direction, that is, in the horizontal direction.

The outer frame 138 has a shaft insertion hole 16 at a portion corresponding to the inner elongated hole 154.
4 are formed, and outer elongated holes 168 extending in the Y-axis direction are formed at portions corresponding to the six inner screw holes 156. As shown in FIG. 6, the length L1 of these outer elongated holes 168 is set to a sufficient length so that the position in the Y-axis direction can be adjusted, and the width L2 thereof is also larger than the diameter of the screw 152 inserted therethrough. Is also set to be several times larger, and is configured to be rotatable about the shaft insertion hole 164 in the θX direction within a predetermined angle α, for example, 10 degrees.

Further, the washer is provided with a washer elongated hole 170 extending in the Y-axis direction at a portion corresponding to the shaft insertion hole 164, and a peripheral portion of the washer elongated hole 170 is provided at a portion corresponding to the inner screw hole 156. Individual washer screw holes 172 are formed. Above washer slot 1
The length of 70 is formed to be long enough to be adjusted in the Y-axis direction, but its width is slightly larger than the diameter of the mounting shaft 160. It is designed to be inserted.

Therefore, with the θX axis adjustment bearing 162 fitted on the mounting shaft 160, the inner frame 14 is provided between the side surface of the test head portion 12 and the washer 150.
8 screws and outer frame 138 on top of each other for 6 screws 1
Temporarily tightening by 52, adjust the relative positions of the outer frame 138 and the test head portion 12 in the Y-axis direction and the θX-axis direction in this state, and further tighten the screw 152 and the tightening nut 163 to fix the outer frame 138 and the test head portion. It is possible to fix 12 in a state where the positions of the two axes are adjusted.

Here, in the case of finely adjusting in the θX axis direction, there may be a case where the test head portion 12 has to be rotated in the θX direction. However, since the shaft 162 has the bearing 162, this is not necessary. It can be easily rotated, and fine adjustment in the θX axis direction can be easily performed.

As described above, it is possible to adjust the positions of the six axes with respect to the test head portion 12. Although the accuracy of each of the 6-axis positioning or position adjusting mechanism described above is actually coarse to some extent and has a function as coarse adjustment, when the test head unit 12 is finally set on the test apparatus main body 2, it is fine. Coordinated positioning must be performed.

Therefore, as shown in FIGS. 11 and 12, positioning means 174 is provided on the upper surface of the test apparatus main body 2 and the corresponding lower surface of the frame portion 42 to perform positioning by fitting. Specifically, this positioning means 1
74 has the same structure and has at least two facing surfaces.
A rod-shaped fitting convex portion 176 formed at the upper surface of the test apparatus main body 2 and a fitting concave portion provided at the lower surface of the frame portion 42 and closely fitted to the fitting convex portion 176. And 178. The fitting convex portion 176 is threaded and two height adjusting nuts 180 are screwed into the fitting convex portion 176, and the upper surface of the fitting convex portion 176 receives the lower surface of the fitting concave portion 178. Therefore, the X and Y of the test head unit 12 are moved by the positioning means 174.
Not only the position adjustment in the axial direction but also the position fine adjustment in the θX axis direction and the θY axis direction can be performed.

The upper end of the fitting protrusion 176 is formed into a conical shape and a fitting recess 178 for receiving the conical portion.
Also, the tip end portion of the is expanded in a conical shape, and by contacting these, the position can be corrected when the test head portion 12 approaches. Such a test head unit 1
In the case of performing the position correction of No. 2, since the respective stop position locking means operate in each shaft position adjusting mechanism to lock the stop position, the fitting convex portion 176 and the fitting concave portion 1 are provided.
The locked state must be released immediately before 78 is fitted. Therefore, on the upper surface of the test apparatus main body 2,
As described above, the Z-axis proximity sensor 126 is provided as the immediately preceding lock releasing means for detecting the approach of the test head unit 12, and the detection signal of this sensor 126 is sent to the control unit 68. . Upon receipt of this detection signal, the control unit 68 sends a lock release signal to at least one of the X-axis, θZ-axis, and θY-axis stop position locking means.
The test head unit 12 is put in a floating state by outputting the lock head to the two lock means and releasing the lock state. This Z-axis proximity sensor 126 is
It is preferable to set such that the approach of the test head portion 12 is detected when the tip of the fitting convex portion 176 slightly enters the tip of the fitting concave portion 178. In the present embodiment, the distance L3 is set. For example, it is set to about 25 mm. The fitting protrusion 176, the fitting recess 178, and the Z-axis proximity sensor 126
Needless to say, the mounting positions may be upside down, and the Z-axis proximity sensor 126 is installed at a place that the operator does not approach during normal operation in order to prevent malfunction due to approach of the operator. Is preferred.

Further, as shown in FIG. 13, on the upper surface side portion of the test apparatus main body 2 on the side opposite to the position of the fitting convex portion 176, the finally positioned test head portion 12 is prevented from rising. Therefore, for example, a clamp mechanism 182 that can be tilted up and down is provided, and the test head unit 1
The L-shaped angle 184 provided on the side portion of the No. 2 can be engaged manually or automatically. The mount 185 of the clamp mechanism holds the side of the test head unit 12.

Further, as shown in FIG.
An operation handle 186 to be gripped by an operator is hung between the tips of the two inner frames 148 of No. 2 and the operation handle 186 has a part or all of the stop position locking means. A θY-axis lock release button 188 is provided as a lock state release means for manually releasing the lock as required. In the present embodiment, θY
Although the case where only the lock of the shaft is released has been described, the locked state of other shafts may be released.

By operating this button 188,
θY axis air cylinder 144 of θY axis stop position locking means
(See FIG. 3) is switched to the air pressure weak system, which is not shown in the figure, of the air pressure strong / weak system, and the biasing force of the lock pin 142 is weakened, so that the test head unit 12 is manually operated. Can be rotated in the θY axis direction. Note that the lock release button 188 can be operated as shown in FIG.
Is required to completely swivel 90 degrees and go out of the area of the test apparatus main body, which prevents a collision with the test apparatus main body 2.

The manipulator unit 2 thus configured
As shown in FIGS. 2 and 3, the part of the Z-axis position adjusting mechanism 26 of 0 is covered by the top cover 190 and the front cover 192 on the side, and the side plate 52 standing upright from the manipulator base 22 is attached to the side plate 52. Is a plurality of bolt holes 194
(See FIG. 3) is formed, and the side plate 52 is tightened and fixed to the test apparatus main body 2 with a bolt to prevent the manipulator portion 20 from falling. 196 in the figure
Is a monitor for displaying the operation status of the entire apparatus.

Next, the operation of this embodiment configured as described above will be described. In the present embodiment, as described above, the position adjustment of the test head portion 12 in the Y-axis and θX-axis directions is performed and fixed during device assembly, and the other four axis directions, that is, the X-axis, Z-axis, θY-axis. And, the θZ axis direction is made movable and positioned by the respective axis position adjusting mechanisms.

First, a case will be described in which the test head portion 12, which is a heavy load, is attached and fixed to the frame portion 42 composed of the outer frame 138 and the inner frame 148.
First, as shown in FIG. 4, the inner frame 148, the outer frame 138, and the washer 1 are provided on the sides of the test head portion 12.
The mounting shaft 160 in which 50 is arranged and the θX-axis adjusting bearing 162 is inserted, is attached to the inner long hole 154 of the inner frame 148 and the shaft insertion hole 1 of the outer frame 138.
64 and the washer elongated hole 170 of the washer 150 and loosely tightened by the tightening nut 163, and the six screws 152 are inserted through the washer screw hole 172, the elongated hole 168 of the outer frame 138 and the screw hole 156 of the inner frame 148, respectively. Similarly loosely tighten on the side of the test head and temporarily fix. After the frame portion 42 is attached in this manner, the frame portion 42 is attached to the θY-axis position adjusting mechanism 40 provided on the first slide block 38 with the screw 140.
(See Fig. 2).

Next, the test head unit 12 is moved onto the test apparatus body 2 (see FIG. 15). In this state, the Y-axis position adjusting mechanism 44 provided on the frame portion 42,
The θX-axis position adjusting mechanism 46 and the θY-axis position adjusting mechanism 40 are used to perform positioning in the Y-axis, θX-axis, and θY-axis directions. Specifically, the inner frame 148 and the washer 150 can be positionally adjusted in the Y-axis direction within the length range of the elongated holes 154 and 170 around the mounting shaft 160. Further, as shown in FIG. 6, the outer frame 140 can be positionally adjusted in the θX axis direction about the shaft 160 within an angle α, for example, within a range of 10 degrees at the maximum. In addition, the θY-axis adjustment mechanism 40 includes the θY-axis lock pin 14
By releasing 2, the position can be adjusted in the θY axis direction. Therefore, the fitting concave portion 178 of the positioning means 174 provided on the lower surface of the frame portion 42 and the fitting convex portion 176 provided on the upper surface of the test apparatus body 2 are fitted together.
By adjusting the Y-axis position, highly accurate positioning can be performed.

At this time, the position adjustment of the test head portion 12 in the θX axis direction and the θY axis direction is performed by adjusting the height adjusting nut 180 screwed into the fitting convex portion 176 and the clamp mechanism mounting base 185.
It is done by adjusting the height of. If the positions of the three axes are adjusted in this way, the tightening nut 163
Then, the screws 152 are firmly tightened to fix the frame portion 42 and the test head portion 12.

Next, position adjustment in the X-axis direction, which moves along the horizontal arm portion 34, will be described with reference to FIGS. 14 and 15. First, by driving the X-axis motor 108 of the X-axis position adjusting mechanism 36, the first and second slide blocks 38, 1 for supporting the test head portion 12 in a cantilever manner.
00 moves on the horizontal arm portion 34 along the X-axis guide rails 94 and 96.

Here, one X-axis lock plate of the X-axis stop position lock means 112 provided with the first slide block 38 at both ends of the horizontal arm portion 34, for example, the plate 1
14A, the shutter member 114A provided on the 14A
Enters the X-axis optical sensor 122A and detects the approach of the block 38 (FIG. 15 (A)). Then, the control unit 68 sets X
By driving the axial air cylinder 120, the X-axis lock pin 116 is made to protrude, and this is fixed to the X-axis lock plate 11.
It is fitted into the positioning hole 118 of 4A (see FIG. 15).
(B)).

As a result, the first slide block 38
Is locked and locked in place on the horizontal rail,
It will be positioned. In this case, since the tip of the X-axis lock pin 116 is formed in a conical shape, even if a slight positional deviation occurs, the positional deviation is corrected and locked. Such an operation is similarly performed on the other X-axis lock plate 114B side.
The second slide blocks 38 and 100 stop at substantially both ends of the horizontal arm portion 34. Also,
During this movement in the X-axis direction, the wiring bundle 16 extending from the test head portion 12 is supported and fixed by the stoppers 134 on the bridge plate 104, so that the wiring bundle 16 moves without interfering with the horizontal arm portion 34. Become.

Next, position adjustment in the Z-axis direction which moves along the fixed column 24 will be described with reference to FIGS. 7 to 10. First, by driving the Z-axis motor 62 of the Z-axis position adjusting mechanism 26, the ball screw 56 that supports the slide frame 50 is rotated, and thereby the slide frame 50 is moved up and down. For example, taking the case of descending as an example, when the ball screw 56 rotates, the sleeve 70 that is screwed into the ball screw 56 descends, so that the slide frame 50 also descends along the Z-axis guide rail 48. Then, the Z-axis descent stop member 7 provided on the bottom plate 50A of the slide frame
When the lower end of 2 reaches the horizontal base 54 as shown in FIG. 8A, the lowering of the slide frame 50 is stopped and the lower end of the test head portion 12 in the Z-axis direction is positioned.
Since the Z-axis motor 62 continues to rotate even when the frame 50 is stopped from descending, only the sleeve 70 loosely fitted to the bottom plate 50A of the slide frame further descends, and this descending is caused by the proximity sensor 80 provided on the sleeve rotation stopper 76. Detected by. Then, the control unit 68 issues a command to the Z-axis motor 62 to stop this rotation. As described above, since the sleeve 70 is loosely fitted to the frame bottom plate 50A, no load is applied to the slide frame 50.

The position of the Z-axis descending stop member 72 can be adjusted in the Z-axis direction, and the position of the test head can be adjusted in the Z-axis direction by adjusting the position of the Z-axis descending stop member 72. Becomes Further, in order to raise the test head unit 12, the slide frame 50 is raised by rotating the Z-axis motor 62 in the direction opposite to the above-mentioned direction. That is, when the Z-axis motor 62 is rotated in the reverse direction, only the sleeve 70 rises in FIG. 8B, and
When the flange 70A comes into contact with the bottom plate 50A of the slide frame (FIG. 8 (A)), the slide frame 50 starts to move up to a predetermined position.
As a result, positioning in the Z-axis direction is performed.

By the way, since the load of the test head portion 12 applied to the slide frame 50 is about 300 kg at the maximum, the Z force is increased for some reason while the frame is being moved up and down.
If the power supply to the shaft motor 62 is stopped, there is a risk that the slide frame 50 will drop at once due to the weight of the head portion 12. However, in this embodiment, the Z-axis motor 62 and the ball screw 56 are respectively provided with electromagnetic brakes 82 and 84 as braking means, and for example, at the time of power failure, the rotation shaft of the motor and the rotation shaft of the ball screw 56 are located at that position. Since it is held, the slide frame 50, that is, the test head unit 12 can be prevented from falling.

Next, the position adjusting mechanism in the θZ axis direction will be described with reference to FIGS. 1 to 3. This operation is to rotate the horizontal arm portion 34 by, for example, 90 degrees around the rotation center O1 of the rotating column 30, and for that purpose, the θZ-axis air cylinder 88 of the θZ-axis position adjusting mechanism 32 is used.
Driving the rotating column 30 via a crank mechanism (not shown) to rotate the test head unit 1.
2 is rotated 90 degrees around the rotating column 30 (see FIG. 16), and the position adjustment in the θZ direction is performed.

Next, the position adjustment in the θY axis direction will be described. First, θY provided on the first slide block 38
When the θY-axis motor 135 of the shaft position adjusting mechanism 40 is driven, the frame portion 42 connected to this rotating shaft turns in the θY direction by a predetermined angle, for example, 180 degrees, so that the test head portion 12 fixed thereto is also integrated. Therefore, the vehicle is turned to, and the positioning in the θY direction is performed. At this time, the stop position of the test head portion 12 in the θY direction is locked by the action of the θY axis lock pin 142.

As described above, positioning in each axial direction is performed by the 6-axis position adjusting mechanism. The movable position adjusting mechanism is programmed so that two or more position adjusting mechanisms do not operate simultaneously to prevent malfunction. The test head section 12 is moved by operating the combination of the position adjusting mechanisms as described above. The case where the test head section 12 is brought into contact with the upper surface of the test apparatus body 2 will be described with reference to FIGS. 11 and 12. The test head portion 12 located above the device body 2
Drive the Z-axis position adjusting mechanism to gradually lower it. At this point, the position adjustment of the test head portion 12 in the X-axis, θY-axis, and θZ-axis directions is somewhat rough.

Further, the test head portion 12 descends, and the tip of the fitting convex portion 176 of the positioning means 174 provided on the upper surface of the test apparatus main body 2 becomes the fitting concave portion 178 provided on the lower surface of the test head portion 12. When the two come close enough to enter the tip opening, the Z-axis proximity sensor 126 causes the test head unit 1 to move.
2, the control unit 68 outputs a lock release signal to all or part of the position where the stop position locking means is operating, for example, the X-axis stop position locking means as shown in FIG. 15 (C). Then, the test head portion 12 is sent to 112, the locked state is released, and the test head portion 12 is brought into a floating state. In this case, the unlocked state is the same as in the other locking means, but the air pressure of the X-axis air cylinder 120 from which the lock pin 116 is projected is weakened instead of retracting the X-axis lock pin 116. The pressure is switched to the pressure, and as shown in FIG. 15C, this causes the lock pin 116 to sink with a slight repulsive force.

When the test head portion 12 is further lowered while the test head portion 12 is in the floating state, the fitting convex portion 176 and the fitting concave portion 178 are closely fitted to each other as shown in FIG. 12B. It At this time, the positional deviation error of the test head portion 12 in the X and θZ axis directions is corrected, and at the same time, the position of the θY axis direction is determined by the action of the height adjusting nut 180 provided on the fitting convex portion 176. Becomes
The contact ring of the test head unit 12 and the probe card interface unit 10 of the test apparatus body 2 (see FIGS. 17 and 1).
(See 8) is accurately aligned. At this time, in order to prevent the test head portion 12 from rising and the like, as shown in FIG. 13, the end portion of the head portion 12 is fixed manually or automatically by the clamp mechanism 182.

Further, when performing maintenance on the test head portion 12 and the probe card, as shown in FIG. 16A, the test head portion 12 is placed above the test apparatus main body 2 and then the state shown in FIG. As shown in B), the X-axis position adjusting mechanism is driven to move the test head portion 12 along the horizontal arm portion 34, and the test head portion 12 is positioned at the other end on the opposite side beyond the turning center O1.

Next, as shown in FIG. 16C, the horizontal arm portion 34 is turned 90 degrees about the turning center O1,
Further, as shown in FIG. 16 (D), by driving the θY axis position adjusting mechanism, the test head portion 12 is inverted by, for example, about 120 degrees so that the contact ring 14 is directed substantially upward to facilitate the maintenance operation. In this case, since the wiring bundle 16 from the test head portion 12 is located outside the end portion of the horizontal arm portion 34, it is possible to prevent them from interfering with each other. Further, since the test head portion 12 is moved to the turning center O1 side in this way to turn the horizontal arm portion by 90 degrees, the test head portion 12 is moved to the turning center O1.
The length of the wiring bundle 16 up to the tester 18 can be shortened by, for example, about 1.5 m as compared with the case where the horizontal arm portion is swung by 90 degrees without being moved to the 1 side. Since the delay time can be shortened, an inspection signal with a higher frequency can be used, and inspection efficiency can be improved.

Furthermore, the amount of swing of the wiring bundle 16 that is swung along with the turning of the horizontal arm portion 34 is reduced, and accidents such as disconnection can be reduced. Further, when the test head unit 12 is inverted by 120 degrees, the θY-axis position adjusting mechanism is driven, but the θY-axis stop button 188 provided on the operation handle 186 is operated by the operator without using this mechanism to stop the θY-axis. Alternatively, the position locking means may be released in the same manner as described above and manually rotated by 120 degrees.
As described above, according to the present embodiment, the 6-axis position adjustment can be performed manually or automatically with respect to the test head portion without excessively complicating the structure, so that the operability of the entire apparatus is significantly improved. You can

Further, as described above, since the test head portion 12 supported horizontally by the horizontal arm portion 34 is raised and lowered to approach the main body of the test apparatus, the test head portion 12 is placed on this upper surface. It is possible to make contact while maintaining the horizontal state, and therefore, as shown in FIGS.
The contact pressure of the contact ring can be made uniform over the surface as compared with the case where the test head unit is raised and lowered as in the conventional device shown in FIG. In the above-mentioned embodiment, the case where the semiconductor wafer is used as the object to be inspected has been described, but the present invention is not limited to this, and it is needless to say that the present invention can be applied to an inspection apparatus such as a liquid crystal substrate.

[0065]

As described above, the test device for an object to be inspected according to the present invention can exhibit the following excellent operational effects. According to the first aspect of the invention, since the mechanism capable of adjusting the positions in the six axis directions is provided without using the balancer, the test head portion can be automatically positioned. Therefore, the operability of the entire apparatus can be significantly improved. According to the second invention, the locked state of the stop position locking means of the other movable position adjusting mechanism is released immediately before the positioning means for accurately positioning the test apparatus main body and the test head portion are fitted together. Therefore, the test head portion is set in a floating state, and then the positioning means is fitted thereto, so that the positioning can be performed with high accuracy. According to the third invention, by arranging the center of rotation of the horizontal arm in the middle thereof, the test head can be positioned at the other end of the horizontal arm beyond the center of rotation during maintenance of the test head. The test head can be turned over to perform maintenance. Therefore, it is possible to prevent the wiring bundle from the test head portion from being located outside the end portion of the horizontal arm portion and interfering with the horizontal arm portion when the head portion is reversed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a test apparatus for a device under test according to the present invention.

FIG. 2 is a perspective view showing a manipulator unit of the test apparatus shown in FIG.

FIG. 3 is a perspective view showing the manipulator unit shown in FIG. 2 from a different angle.

FIG. 4 is an exploded perspective view showing a mounting state of a test head unit and a frame unit.

FIG. 5 is a plan view showing a mounting state of a test head portion and a frame portion.

FIG. 6 is an explanatory diagram for explaining a Y-axis and θX-axis position adjustment operation when the frame is attached to the test head unit.

FIG. 7 is a side view showing the test apparatus excluding the test apparatus body.

FIG. 8 is an operation explanatory view showing the operation of the Z-axis descent stop member.

FIG. 9 is a bottom view showing the sleeve of the Z-axis descent stop member.

FIG. 10 is a side view showing brake means provided on a Z-axis descent stop member.

FIG. 11 is a schematic side view showing the positioning means provided on the test head unit and the test apparatus body.

12 is an operation explanatory view for explaining the operation of the positioning means shown in FIG.

FIG. 13 is a side view showing a clamp mechanism for fixing a test head portion provided in the test apparatus body.

FIG. 14 is a diagram showing a stop position locking means for locking the positioning in the X-axis direction.

FIG. 15 is an operation explanatory view for explaining the operation of the stop position locking means shown in FIG.

FIG. 16 is an explanatory diagram for explaining the movement of the test head unit during maintenance.

FIG. 17 is a perspective view showing a conventional test device for an object to be inspected.

18 is a side view of the test apparatus shown in FIG.

[Explanation of symbols]

2 Test device body 8 Probe card 10 Probe card interface part 12 Test head part 14 Contact ring 16 Wiring bundle 18 Tester 20 Manipulator part 22 Manipulator base 24 Fixed column 26 Z-axis position adjusting mechanism 28 Horizontal column 30 Rotating column 32 θZ-axis position Adjustment mechanism 34 Horizontal arm portion 36 X-axis position adjustment mechanism 38 Slide block 40 θ Y-axis position adjustment mechanism 42 Frame portion 44 Y-axis position adjustment mechanism 46 θ X-axis position adjustment mechanism 48 Z-axis guide rail 50 Slide frame 52 Side plate 54 Horizontal base 56 ball screw 58 L-shaped angle 60, 64 pulley 62 Z-axis motor (Z-axis drive source) 66 belt 68 control unit 70 sleeve 72 Z-axis descent stop member 76 sleeve rotation stop 78 sleeve cutout 80 proximity sensor 82, 84 Electromagnetic brake (brake means) 86 θZ bearing 88 θZ-axis air cylinder (θZ-axis drive source) 90 θZ lock plate 92 θZ shock absorber 94, 96 X-axis guide rail 100 slide block 102 joint plate 104 bridge plate 106 rack 108 X-axis motor (X-axis drive source) 110 Pinion gear 112 X-axis stop position lock means 114 X-axis lock plate 116 X-axis lock pin 118 X-axis positioning hole 120 X-axis air cylinder 122 X-axis optical sensor 124 X-axis shutter 126 Z-axis proximity sensor ( Previous lock release means) 128 X-axis shock absorber 134 Wiring bundle stopper 135 θY-axis motor (θY-axis drive source) 136 θY-axis bearing 138 Outer frame 140 Connection screw 142 θY-axis lock pin 1 4 θ Y-axis air cylinder 146 Joint bar 148 Inner frame 150 Washer 152 Frame fixing screw 154 Y-axis long hole 156 Inner screw hole 158 Flange 160 Shaft 162 θX-axis bearing 163 Nut 164 Shaft insertion hole 168 Outer screw hole 170 Washer long hole 172 Washer screw Hole 174 Positioning means 176 Fitting convex part 178 Fitting concave part 182 Clamping mechanism 184 L-shaped angle 185 Clamping mechanism mounting base 186 Operation handle 188 θY axis unlocking button (locking state releasing means) 190 Top cover 192 Front cover 194 Bolt hole 196 Shutter O1 Rotation center W Semiconductor wafer (inspection object)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuto Yokomori 1 2381 Kitashitajo Kitashitajo, Fujii-cho, Nirasaki-shi, Yamanashi Tokyo Electron Yamanashi Co., Ltd.

Claims (4)

[Claims] 1. A test apparatus main body having a probe card interface for transmitting an electric signal to and from an object to be inspected provided on an upper surface thereof, and a test head section provided so as to be contactable with and separable from the probe card interface section. In a test device for an object to be inspected, the test head unit has an X-axis position adjusting mechanism that adjusts the position of the test head unit in an X direction which is one direction in a horizontal plane, and a position in a Y direction that is orthogonal to the X direction in the horizontal plane. A Y-axis position adjusting mechanism for adjusting, a Z-axis position adjusting mechanism for adjusting a position in a Z direction orthogonal to the horizontal plane, a θX-axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the X direction, A θY-axis position adjusting mechanism that adjusts the position in the rotational direction in the plane orthogonal to the Y direction, and a position adjustment in the rotational direction in the plane orthogonal to the Z direction. That is connected to the θZ axis position adjusting mechanism, wherein among the axis position adjustment mechanism, the position adjusting mechanism of some or all test equipment of the device under test, characterized by being made movable. 2. The Z-axis position adjusting mechanism has a horizontal arm portion that is horizontally supported and can be moved up and down, and is configured to move up and down while maintaining the test head portion in a horizontal state. The test device for an object to be inspected according to claim 1. 3. A test apparatus main body having a probe card interface for transmitting an electric signal to and from an object to be inspected provided on an upper surface thereof, and a test head section provided so as to be contactable with and separable from the probe card interface section. In a test device for an object to be inspected, the test head unit has an X-axis position adjusting mechanism that adjusts the position of the test head unit in an X direction which is one direction in a horizontal plane, and a position in a Y direction that is orthogonal to the X direction in the horizontal plane. A Y-axis position adjusting mechanism for adjusting, a Z-axis position adjusting mechanism for adjusting a position in a Z direction orthogonal to the horizontal plane, a θX-axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the X direction, A θY-axis position adjusting mechanism that adjusts the position in the rotational direction in the plane orthogonal to the Y direction, and a position adjustment in the rotational direction in the plane orthogonal to the Z direction. Is connected to a θZ axis position adjusting mechanism, and some or all of the position adjusting mechanisms of the respective axis position adjusting mechanisms are movable, and the movable position adjusting mechanisms have different directions. Stop position locking means for holding the stop position when the movement is completed is provided, and the upper surface of the test apparatus main body and the corresponding lower surface of the test head portion are provided with positioning means for positioning by fitting. The device for testing an object to be inspected is provided with an immediately-before lock releasing means for releasing at least one of the stop position locking means immediately before the positioning means is fitted. 4. A test apparatus main body having a probe card interface for transmitting an electric signal to and from an object to be inspected provided on an upper surface thereof, and a test head section provided so as to be contactable with and separable from the probe card interface section. In a test device for an object to be inspected, the test head unit has an X-axis position adjusting mechanism that adjusts the position of the test head unit in an X direction which is one direction in a horizontal plane, and a position in a Y direction that is orthogonal to the X direction in the horizontal plane. A Y-axis position adjusting mechanism for adjusting, a Z-axis position adjusting mechanism for adjusting a position in a Z direction orthogonal to the horizontal plane, a θX-axis position adjusting mechanism for adjusting a position in a rotational direction in a plane orthogonal to the X direction, A θY-axis position adjusting mechanism that adjusts the position in the rotational direction in the plane orthogonal to the Y direction, and a position adjustment in the rotational direction in the plane orthogonal to the Z direction. The Z-axis position adjusting mechanism, the Z-axis position adjusting mechanism includes a horizontal arm portion that is horizontally supported and can be moved up and down, and a turning center of the θZ axis is located in the middle thereof. A test apparatus for an object to be inspected, wherein the test head portion is positioned at the other end of the horizontal arm portion to drive the θY-axis position adjusting mechanism during maintenance of the test head portion.