JP2570151Y2 - Semiconductor device inspection equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection device, and more particularly to a semiconductor device inspection device for inspecting electrical performance of a large number of semiconductor device circuits formed on a semiconductor wafer.

[0002]

2. Description of the Related Art A semiconductor element is manufactured by forming a plurality of required identical electric element circuits on a substantially disk-shaped thin plate of a predetermined size, called a wafer, which is aligned vertically and horizontally. These manufactured wafers are then inspected by a semiconductor device inspection apparatus called a wafer prober (indicated by reference numeral 10 in FIG. 3) to inspect the formation quality of an element circuit before dividing the elements into chips. )), The pass / fail of each element is determined and selected. The semiconductor device inspection apparatus 10 includes a table, a device control unit determination unit, and the like. The table mounts a wafer and performs horizontal movement in the X and Y directions and vertical movement in the Z direction according to the element arrangement when necessary. The device control unit determination unit is disposed above the table, and each of the devices is controlled via a tracing card that fixes and holds a tracing as a contact needle provided at a position corresponding to each electrode of the element to be inspected. The circuit of the element is sequentially inspected and determined.

[0003] By the way, there are several types of probe cards 12 corresponding to the types of semiconductor elements, and they are replaced as necessary. The measuring card 12 is provided with a special measuring card 12 for each type of element to be measured. The special measuring card 12 specifies the type and symbol of the element to be measured. Are in an arrangement state corresponding to each electrode of the semiconductor element. Therefore, every time the type of the element to be inspected is changed, it is necessary to attach the dedicated tracing card 12 to the socket of the device control unit determination unit.

When exchanging the probe card 12,
As shown in FIG. 3, the head stage 14 is rotated upward about the rotation shaft 16, and the probe card 12 is removed from the socket provided on the back surface of the head stage 14. Attach. In this case, the new probe card 12 is fixed to the socket of the head stage 14 with fixing screws 18.

[0005]

However, since the rotating shaft 16 of the head stage 14 is provided at the rear end of the main body of the semiconductor device inspection apparatus 10, the head stage 1
When the head 4 is rotated upward about the rotation shaft 16, the head stage 14 is disposed near the rear end of the main body. Therefore, since the distance L1 between the socket of the head stage 14 and the worker at the front end of the main body of the semiconductor device inspection apparatus 10 increases, there is a problem that it is difficult to replace the probe card 12.

Since the head stage 14 is positioned at a position where the socket of the head stage 14 faces downward, the fixing screws 18 for fixing the probe card 12 are tightened from below. Therefore, the fixing screws 18
When tightening from below, there is a problem that the fixing screw 18 is easily dropped. Furthermore, since the head stage 14 is relatively heavy, there is a problem that a gas spring (weight balance) 20 for offsetting the weight of the head stage 14 needs to be provided.

The present invention has been made in view of the above circumstances, and provides a semiconductor device inspection apparatus capable of easily replacing a probe card, easily fastening a fixing screw, and removing a weight balance. The purpose is to provide.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides a method for adsorbing a wafer on the surface of a suction table and forming each chip formed on the wafer by a plurality of probe needles provided on a probe card. In the semiconductor device inspection apparatus for inspecting the electrical characteristics of the above, there is provided a mounting portion for the probe card, a position where the probe can inspect the electrical characteristics of each chip, and a position where the probe card can be replaced. The electrical characteristics of each of the chips are inspected with a ring member rotatably supported by the apparatus main body at the center portions of both opposing sides so as to rotate between them, and the probe card attached to the ring member. At a possible position, or at a position at which the probe card can be replaced, a lock means for locking the ring member, and when the ring member rotates between the inspection position and the replacement position,
Moving means for moving the suction table to a position retracted from the ring member to prevent interference between the ring member and the suction table is provided.

[0009]

According to the present invention, the ring member is provided with a mounting portion for the probe card, and the central portions of the opposite side portions of the ring member are rotatably supported by the apparatus body. Further, the ring member rotates between a position where the electrical characteristics of each chip can be inspected by the probe card attached to the ring member and a replaceable position of the probe card. And the locking means is the inspection position,
Alternatively, the ring member is locked at the replacement position. Further, the moving means moves the suction table to a position retracted from the ring member when the ring member rotates between the inspection position and the replacement position.

Therefore, since the ring member rotates about the center of the opposing side portions, the center of rotation can be disposed substantially at the center of the main body of the semiconductor device inspection apparatus. Thus, the mounting portion of the probe card provided on the ring member can be disposed at a position near the operator at the front end of the main body of the semiconductor device inspection apparatus. In this case, the mounting portion of the probe card provided on the ring member is positioned facing upward. Furthermore, since the ring member rotates about the center of the opposing sides, the front half and the rear half of the ring member offset each other's weight.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device inspection apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a probe card and a suction table of a semiconductor device inspection apparatus according to the present invention, and FIG. 2 is an overall view of the semiconductor element inspection apparatus according to the present invention. The probe card 30 shown in FIG. 1 is provided in a semiconductor device inspection device 32 (see FIG. 2). Suction table 34
Are provided in the semiconductor device inspection device 32 so as to be movable in three axial directions (X, Y, Z directions), and the probe card 36 is provided with probe needles 36.

Therefore, after the suction table 34 is moved in the X and Y directions and positioned at a predetermined position, the probe needles 36, 3
6 contact the electrode pads (not shown) of the chips 38A, 38B... Of the wafer 38 sucked on the suction table 34 for suction to inspect the electrical characteristics of the chips 38A, 38B. You.

The tracing card 30 configured as above is
Ring member (hereinafter, referred to as “ring stage”) 41
Is attached to a socket (not shown) provided on the back surface side. The ring stage 41 has a pair of rotating shafts 42 implanted in the central portions on both sides facing each other, and the pair of rotating shafts 42 is rotatably supported by the main body 44 of the semiconductor device inspection device 32. Therefore, the ring stage 41 rotates around the pair of rotation shafts 42.

The main body 44 of the semiconductor device inspection apparatus 32
A cylinder 46 is provided above the rear end of the ring stage 41. When the rod portion 46A of the cylinder 46 extends, it is fitted into the concave portion 41A of the ring stage 41. Thus, the ring stage 41 can inspect the electrical characteristics of each of the chips 38A, 38B... At a position flush with the surface of the main body 44 of the semiconductor element inspection device 32 (ie, with the probe card 30 attached to the ring stage 41). Locked in position).

When the ring stage 41 is rotated about 160 ° counterclockwise from the inspection position, the ring stage 41 is positioned at the replacement position of the probe card 30. In this case, for example, a pin (not shown) is provided on the main body 44 of the semiconductor device inspection apparatus 32.
And the like. These pins are positioned so as to come into contact with the ring stage 41 when the ring stage 41 is positioned at the replacement position of the probe card 30. Accordingly, the ring stage 41 has
Locked to the 0 exchange position. The pin and the cylinder 46 constitute locking means.

A suction table 34 is provided in a main body 44 of the semiconductor device inspection apparatus 32.
A block 52 is fixed to the supporting member 50. A screw shaft 54 extending in a direction perpendicular to the plane of FIG. 2 is screw-connected to the block 52, and an X-axis motor (not shown) is connected to the screw shaft 54 so as to be able to transmit rotational power. ing. Therefore, when the X-axis motor is driven, the guides 51, 51 of the support 50 move in the X-axis direction (that is, the direction perpendicular to the plane of FIG. 2) along the pair of rails 56.

The guides 60 are provided on the plate 58 to which the pair of rails 56 are fixed, and the guides 60 can move in the Y-axis direction along one of the rails 62. It is supported by. Therefore, Y
When the shaft motor 64 is driven, the screw shaft 66 rotates, and the block 68 screwed to the screw shaft 66 is moved in the Y-axis direction (that is, in the left-right direction in FIG. 2).
As a result, the suction table 34 moves in the Y-axis direction.

Further, a table moving means (not shown) in the Z-axis direction is provided in the support 50. When the ring stage 41 is rotated from the inspection position to the replacement position of the probe card 30 by the moving means in the X, Y, and Z axis directions, the suction table 34 is moved to the ring stage 41.
Can be retracted to a position where it does not interfere with The operation of the semiconductor device inspection apparatus according to the present invention will be described.

When replacing the probe card 30, the rod portion 46A of the cylinder 46 is contracted to
The ring stage 41 is rotated counterclockwise about the rotation shaft 42 by about 160 °. When the ring stage 41 rotates about 160 °, the ring stage 41 comes into contact with a locking pin and is locked at the replacement position of the probe card 30. As a result, the back side of the ring stage 41 is positioned upward.

Next, the probe card 30 is removed from the socket provided on the back surface of the ring stage 41, and a new probe card 30 is attached. In this case, the new probe card 30 is attached to the ring stage 41 with the fixing screws 74.
Fixed to the socket. As described above, since the ring stage 41 rotates about the center portions on both sides facing each other, the center of rotation can be disposed substantially at the center portion of the main body 44 of the semiconductor device inspection device 32. Therefore, the device body 44
The distance L between the operator 76 at the front end and the mounting portion of the probe card 30 can be set short. In this case, since the ring stage 41 rotates around the center of the opposing sides, the front half and the rear half of the ring stage 41 cancel each other's weight.

[0021]

As described above, according to the semiconductor device inspection apparatus according to the present invention, the ring member rotates about the center of the opposing sides, so that the center of rotation of the semiconductor device inspection apparatus is adjusted. It can be arranged substantially at the center of the main body.
Thus, the mounting portion of the probe card provided on the ring member can be disposed at a position near the operator at the front end of the main body of the semiconductor device inspection apparatus. In this case, the mounting portion of the probe card provided on the ring member is positioned facing upward. In addition, since the ring member rotates around the center of the opposing sides, the front half and the rear half of the ring member offset each other's weight.

Therefore, replacement of the probe card and fastening of the fixing screw are easy, and the weight balance can be eliminated.

[Brief description of the drawings]

FIG. 1 is a perspective view of a probe card and a suction table used in a semiconductor device inspection apparatus according to the present invention.

FIG. 2 is an overall schematic view of the semiconductor device inspection apparatus according to the present invention.

FIG. 3 is an overall schematic diagram of a conventional semiconductor device inspection apparatus.

[Explanation of Symbols] 30 ... Measuring card 32 ... Semiconductor element inspection device 34 ... Suction table 38A, 38B ... Chip 41 ... Ring stage 44 ... Device main body 46 ... Cylinder 54, 66 ... Screw shaft

Claims (1)

(57) [Scope of request for utility model registration] 1. A semiconductor element inspection apparatus for adsorbing a wafer on a surface of an adsorption table and inspecting electrical characteristics of each chip formed on the wafer with a plurality of probe needles provided on the probe card. The center part of both opposing side parts is rotated so as to rotate between a position where the electrical characteristics of each chip can be inspected by the probe card and a position where the probe card can be replaced. A ring member rotatably supported by the apparatus main body, and a position where the electrical characteristics of each of the chips can be inspected by the probe card attached to the ring member, or a position where the probe card can be replaced. A lock unit for locking the ring member, and when the ring member rotates between the inspection position and the replacement position, the suction table is moved to a position retracted from the ring member, A moving device for preventing interference between the ring member and the suction table;