JPH0714629A - Chip jumper and manufacture thereof - Google Patents
Chip jumper and manufacture thereofInfo
- Publication number
- JPH0714629A JPH0714629A JP564394A JP564394A JPH0714629A JP H0714629 A JPH0714629 A JP H0714629A JP 564394 A JP564394 A JP 564394A JP 564394 A JP564394 A JP 564394A JP H0714629 A JPH0714629 A JP H0714629A
- Authority
- JP
- Japan
- Prior art keywords
- conductor element
- groove
- protective film
- chip jumper
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ抵抗の中で抵抗値
が０Ωと表示され、プリント基板上のジャンパー接続の
ために使用されるチップジャンパーおよびその製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip jumper which has a resistance value of 0Ω among chip resistors and is used for connecting a jumper on a printed circuit board, and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】従来のこの種のチップジャンパーについ
て図面を用いて説明する。2. Description of the Related Art A conventional chip jumper of this type will be described with reference to the drawings.
【０００３】図１７は従来のチップジャンパーの構成を
示す断面図であり、アルミナ基板９１上に銀系電極９３
を塗布し、この上にガラス９２を印刷、焼成して絶縁被
膜形成を行い、さらに両電極部９４に銅下メッキ９５を
形成して後に錫あるいは半田メッキ９６を施し、電極半
田メッキ部９６ａをプリント基板のパターンに半田付け
することにより銀系電極９３を通して電気的に導通する
ことができるように構成されたものであった。FIG. 17 is a sectional view showing the structure of a conventional chip jumper, in which a silver-based electrode 93 is formed on an alumina substrate 91.
Is applied, and glass 92 is printed and baked on this to form an insulating coating, and further copper underplating 95 is formed on both electrode portions 94, and subsequently tin or solder plating 96 is applied to form the electrode solder plating portion 96a. It was configured to be electrically conductive through the silver-based electrode 93 by being soldered to the pattern of the printed board.
【０００４】また、この従来のチップジャンパーは、ア
ルミナ基板９１の表裏面に上記構成の説明に従って印
刷、焼成を複数回繰り返し、まずチップジャンパーの幅
相当に一次のスリット加工をし、さらに端面の電極を形
成するため印刷、焼成を行い、次に二次のスリット加工
を行ってチップジャンパーの形状にするという製造方法
で作られていた。Further, in this conventional chip jumper, printing and firing are repeated a plurality of times on the front and back surfaces of the alumina substrate 91 according to the above-described configuration, and first slit processing is performed to the width of the chip jumper, and the electrodes on the end faces are further processed. In order to form the chip, printing and firing are performed, and then secondary slit processing is performed to form the chip jumper.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記従来
のチップジャンパーおよびその製造方法は、アルミナ基
板９１を用いて印刷、焼成を繰り返して製造しているた
めに複雑な構造を有し、且つ多くの工程を有するために
コスト的に高くなるという課題があった。However, the above-mentioned conventional chip jumper and the manufacturing method thereof have a complicated structure because they are manufactured by repeating printing and firing using the alumina substrate 91, and many steps are required. Therefore, there is a problem in that the cost is high because of the above.
【０００６】本発明はこのような従来の課題を解決する
ものであり、簡単な構成で且つ工数が少なく、設備コス
ト、製品コストも安いチップジャンパーおよびその製造
方法を提供することを目的とするものである。SUMMARY OF THE INVENTION The present invention is intended to solve such a conventional problem, and an object of the present invention is to provide a chip jumper having a simple structure, a small number of steps, a low equipment cost and a low product cost, and a manufacturing method thereof. Is.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明のチップジャンパーおよびその製造方法は、チ
ップジャンパー本体を断面矩形状の鉄、銅、黄銅、ある
いはアルミなどの金属材料からなる導体素子で構成し、
その長さ方向の中央部に絶縁特性を有する耐熱性樹脂粘
着テープ、あるいは耐熱性熱収縮チューブ、あるいは耐
熱性樹脂等で保護膜を設けた構成としたものである。In order to solve the above problems, a chip jumper and a method for manufacturing the same according to the present invention have a chip jumper main body made of a metal material such as iron, copper, brass or aluminum having a rectangular cross section. Composed of elements,
A heat-resistant resin adhesive tape having insulating properties, a heat-resistant heat-shrinkable tube, a heat-resistant resin, or the like is provided on the central portion of the length direction of the protective film.
【０００８】[0008]
【作用】この構成により、断面矩形状の鉄、銅、黄銅、
あるいはアルミなどの金属材料からなる導体素子の両端
部を電極部として残し、中央部に絶縁特性を有する保護
膜を形成した極めて簡単な構成のチップジャンパーを得
ることができ、その製造方法も工数が少なく、製造設備
も簡略化することができ、大幅なコストダウンを図るこ
とができる。[Function] With this configuration, iron, copper, brass having a rectangular cross section,
Alternatively, it is possible to obtain a chip jumper having an extremely simple structure in which both end portions of a conductor element made of a metal material such as aluminum are left as electrode portions, and a protective film having an insulating property is formed in the central portion, and the manufacturing method is also easy. The number of manufacturing facilities can be simplified, and the cost can be significantly reduced.
【０００９】[0009]
【実施例】（実施例１）以下、本発明の第１の実施例に
ついて図面を参照しながら説明する。(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings.
【００１０】図１は同第１の実施例におけるチップジャ
ンパーの構成を示す斜視図であり、同図において１１は
長さ方向の両端に電極部１１ａを露出したチップジャン
パーの導体素子であり、断面形状が矩形状に形成された
鉄、銅、黄銅、あるいはアルミ材などの金属材料により
構成されている。１２は保護膜であり、絶縁特性を有す
る耐熱性樹脂粘着テープを用いて形成されている。FIG. 1 is a perspective view showing the structure of a chip jumper according to the first embodiment. In FIG. 1, reference numeral 11 is a conductor element of the chip jumper in which electrode portions 11a are exposed at both ends in the lengthwise direction, and a cross section thereof is shown. It is made of a metal material such as iron, copper, brass, or aluminum which is formed in a rectangular shape. Reference numeral 12 is a protective film, which is formed using a heat-resistant resin adhesive tape having insulating properties.
【００１１】図２（ａ）〜（ｇ）は上記同実施例による
チップジャンパーの製造方法を示す製造工程図であり、
まず図２（ａ）に示すようにボビン１３に巻かれた鉄、
銅、黄銅、あるいはアルミの線材１４を準備する。図２
（ｂ）はこの線材１４を拡大して図示したもので、図２
（ｃ）に示すように線材１４に定間隔で耐熱性樹脂粘着
テープ１２ａを貼付け、図２（ｄ）に示すように保護膜
１２を形成する。2A to 2G are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the above-mentioned embodiment,
First, as shown in FIG. 2A, the iron wound on the bobbin 13,
A wire rod 14 made of copper, brass, or aluminum is prepared. Figure 2
FIG. 2B is an enlarged view of this wire rod 14.
As shown in (c), the heat-resistant resin adhesive tape 12a is attached to the wire material 14 at regular intervals, and the protective film 12 is formed as shown in FIG. 2 (d).
【００１２】次に図２（ｅ）に示すように保護膜１２を
形成した線材１４を回転する１組のローラ１５ａ，１５
ｂの間を通すことにより、図２（ｆ）に示すような断面
矩形状の導体素子１１に圧延加工し、図２（ｇ）に示す
ように上記保護膜１２が長さ方向の中央部になるように
所定の長さに切断してチップジャンパーを得るものであ
る。Next, as shown in FIG. 2E, a pair of rollers 15a, 15 for rotating the wire 14 having the protective film 12 formed thereon.
By passing between b, the conductor element 11 having a rectangular cross section as shown in FIG. 2 (f) is rolled, and the protective film 12 is provided at the center in the longitudinal direction as shown in FIG. 2 (g). The chip jumper is obtained by cutting it into a predetermined length.
【００１３】なお、上記線材１４はあらかじめローラ１
５ａ，１５ｂにより断面矩形状の導体素子１１に圧延加
工して後に保護膜１２を形成しても良いことは言うまで
もない。The wire 14 is previously attached to the roller 1
It goes without saying that the protective film 12 may be formed by rolling the conductor element 11 having a rectangular cross section with 5a and 15b.
【００１４】以上のように本発明の第１の実施例による
チップジャンパーは、材料として鉄、銅、黄銅、あるい
はアルミの線材１４と耐熱性樹脂粘着テープ１２ａのみ
で構成されたものであり、その製造方法も上記図２
（ａ）〜（ｇ）で示すように線材１４に耐熱性樹脂粘着
テープ１２ａを巻き付け、これを断面矩形状に圧延加工
し、所定ピッチで切断するというように概略３工程で製
造することができ、簡単な構成で工数が少なく、設備、
製品コストともに安いチップジャンパーを実現すること
ができるものである。As described above, the chip jumper according to the first embodiment of the present invention is composed only of the wire material 14 of iron, copper, brass, or aluminum and the heat-resistant resin adhesive tape 12a. The manufacturing method is also shown in FIG.
As shown in (a) to (g), the wire material 14 is wrapped with a heat-resistant resin adhesive tape 12a, rolled into a rectangular cross section, and cut at a predetermined pitch. , Simple configuration, less man-hours, equipment,
It is possible to realize a chip jumper with low product cost.
【００１５】（実施例２）以下、本発明の第２の実施例
について図面を参照しながら説明する。(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.
【００１６】図３は本発明の第２の実施例におけるチッ
プジャンパーの構成を示す斜視図であり、同図において
２１は長さ方向の両端に電極部２１ａを露出したチップ
ジャンパーの導体素子であり、断面形状が矩形状に形成
された鉄、銅、黄銅、あるいはアルミ材により構成され
ている。２２は保護膜であり、絶縁特性を有する耐熱性
熱収縮チューブを用いて形成されている。FIG. 3 is a perspective view showing the structure of a chip jumper according to the second embodiment of the present invention, in which reference numeral 21 is a conductor element of the chip jumper in which electrode portions 21a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 22 denotes a protective film, which is formed using a heat-resistant heat-shrinkable tube having insulating properties.
【００１７】図４（ａ）〜（ｇ）は同実施例によるチッ
プジャンパーの製造方法を示す製造工程図であり、まず
図４（ａ）に示すようにボビン１３に巻かれた鉄、銅、
黄銅、もしくはアルミの線材１４を準備する。図４
（ｂ）はこの線材１４を拡大して図示したもので、図４
（ｃ）に示すように線材１４の外周に定間隔で耐熱性熱
収縮チューブ２２ａをかぶせ、図４（ｄ）に示すように
この耐熱性熱収縮チューブ２２ａを熱風２６により加熱
して収縮させて保護膜２２を形成する。FIGS. 4A to 4G are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the embodiment. First, as shown in FIG. 4A, iron, copper,
A brass or aluminum wire 14 is prepared. Figure 4
FIG. 4B is an enlarged view of the wire rod 14.
As shown in (c), the outer periphery of the wire 14 is covered with heat-resistant heat-shrinkable tubes 22a at regular intervals, and as shown in FIG. 4 (d), the heat-resistant heat-shrinkable tubes 22a are heated by hot air 26 to shrink them. The protective film 22 is formed.
【００１８】次に図４（ｅ）に示すように保護膜２２を
形成した線材１４を回転する１組のローラ１５ａ，１５
ｂの間を通すことにより、図４（ｆ）に示すような断面
矩形状の導体素子２１に圧延加工し、図４（ｇ）に示す
ように上記保護膜２２が長さ方向の中央部になるように
所定の長さに切断してチップジャンパーを得るものであ
る。Next, as shown in FIG. 4E, a pair of rollers 15a, 15 for rotating the wire 14 having the protective film 22 formed thereon.
By passing between b, the conductor element 21 having a rectangular cross section as shown in FIG. 4 (f) is rolled, and as shown in FIG. 4 (g), the protective film 22 is formed on the central portion in the longitudinal direction. The chip jumper is obtained by cutting it into a predetermined length.
【００１９】なお、上記線材１４はあらかじめローラ１
５ａ，１５ｂにより断面矩形状の導体素子２１に圧延加
工して後に保護膜２２を形成しても良いことは言うまで
もない。The wire 14 is previously attached to the roller 1
It goes without saying that the protective film 22 may be formed by rolling the conductor element 21 having a rectangular cross section with 5a and 15b.
【００２０】また、本実施例による効果は上記第１の実
施例による効果と同じであり、詳細な説明は省略する。Further, the effect of this embodiment is the same as the effect of the above-mentioned first embodiment, and detailed description thereof will be omitted.
【００２１】（実施例３）以下、本発明の第３の実施例
について図面を参照しながら説明する。(Third Embodiment) A third embodiment of the present invention will be described below with reference to the drawings.
【００２２】図５は本発明の第３の実施例におけるチッ
プジャンパーの構成を示す斜視図であり、同図において
３１は長さ方向の両端に電極部３１ａを露出したチップ
ジャンパーの導体素子であり、断面形状が矩形状に形成
された鉄、銅、黄銅、あるいはアルミ材により構成され
ている。３２は保護膜であり、絶縁特性を有する耐熱性
樹脂またはセラミックにより形成されている。FIG. 5 is a perspective view showing the structure of the chip jumper according to the third embodiment of the present invention. In FIG. 5, 31 is a conductor element of the chip jumper in which electrode portions 31a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 32 denotes a protective film, which is made of a heat-resistant resin or ceramic having insulating properties.
【００２３】図６（ａ）〜（ｇ）は同実施例によるチッ
プジャンパーの製造方法を示す製造工程図であり、まず
図６（ａ）に示すようにボビン１３に巻かれた鉄、銅、
黄銅、あるいはアルミの線材１４を準備する。図６
（ｂ）はこの線材１４を拡大して図示したもので、図６
（ｃ）に示すように線材１４の外周に定間隔で耐熱性樹
脂３２ａをコーティングし、図６（ｄ）に示すようにこ
の耐熱性樹脂３２ａによる保護膜３２を形成する。FIGS. 6 (a) to 6 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the embodiment. First, as shown in FIG. 6 (a), iron, copper, and bobbin 13 wound around the bobbin 13 are used.
A brass or aluminum wire 14 is prepared. Figure 6
FIG. 6B is an enlarged view of this wire rod 14. FIG.
As shown in (c), the outer periphery of the wire 14 is coated with a heat resistant resin 32a at regular intervals, and as shown in FIG. 6 (d), a protective film 32 made of this heat resistant resin 32a is formed.
【００２４】次に図６（ｅ）に示すように保護膜３２を
形成した線材１４を回転する１組のローラ１５ａ，１５
ｂの間を通すことにより、図６（ｆ）に示すような断面
矩形状の導体素子３１に圧延加工し、図６（ｇ）に示す
ように上記保護膜３２が長さ方向の中央部になるように
所定の長さに切断してチップジャンパーを得るものであ
る。Next, as shown in FIG. 6E, a pair of rollers 15a, 15 for rotating the wire 14 having the protective film 32 formed thereon.
By passing between b, the conductor element 31 having a rectangular cross-section as shown in FIG. 6 (f) is rolled, and the protective film 32 is formed at the center in the longitudinal direction as shown in FIG. 6 (g). The chip jumper is obtained by cutting it into a predetermined length.
【００２５】なお、上記線材１４はあらかじめローラ１
５ａ，１５ｂにより断面矩形状の導体素子３１に圧延加
工して後に保護膜３２を形成しても良いことは言うまで
もない。The wire 14 is previously attached to the roller 1
It goes without saying that the protective film 32 may be formed by rolling the conductor element 31 having a rectangular cross section with 5a and 15b.
【００２６】また、本実施例による効果は上記第１の実
施例による効果と同じであり、詳細な説明は省略する。Further, the effect of this embodiment is the same as the effect of the above-mentioned first embodiment, and detailed description thereof will be omitted.
【００２７】（実施例４）以下、本発明の第４の実施例
について図面を参照しながら説明する。(Embodiment 4) A fourth embodiment of the present invention will be described below with reference to the drawings.
【００２８】図７は本発明の第４の実施例におけるチッ
プジャンパーの構成を示す斜視図であり、同図において
４１は長さ方向の両端に電極部４１ａを露出したチップ
ジャンパーの導体素子であり、断面形状が矩形状に形成
された鉄、銅、黄銅、あるいはアルミ材により構成され
ている。４２は保護膜であり、絶縁特性を有する耐熱性
樹脂により形成され、上記導体素子４１の幅方向の上下
面に溝部４１ｂを形成し、この溝部４１ｂに保護膜４２
を形成した構成としている。FIG. 7 is a perspective view showing the structure of a chip jumper according to the fourth embodiment of the present invention. In FIG. 7, reference numeral 41 is a conductor element of the chip jumper in which electrode portions 41a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 42 denotes a protective film, which is formed of a heat-resistant resin having an insulating property, forms groove portions 41b on the upper and lower surfaces of the conductor element 41 in the width direction, and the protective film 42 is formed on the groove portions 41b.
Is formed.
【００２９】図８（ａ）〜（ｇ）は同実施例によるチッ
プジャンパーの製造方法を示す製造工程図であり、まず
図８（ａ）に示すようにボビン１３に巻かれた鉄、銅、
黄銅、あるいはアルミの線材４４を準備する。図８
（ｂ）はこの線材４４を拡大して図示したもので、図８
（ｃ）に示すように外周面を断面凸型とした（図８
（ｇ）にその要部を拡大して図示している）回転する１
組のローラ４５ａ，４５ｂの間を通すことにより、図８
（ｄ）に示すような長さ方向の中央部上下面に連続した
溝部４１ｂを形成した断面矩形状の導体素子４１に圧延
加工する。FIGS. 8 (a) to 8 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the same embodiment. First, as shown in FIG. 8 (a), iron, copper,
A brass or aluminum wire rod 44 is prepared. Figure 8
FIG. 8B is an enlarged view of this wire rod 44.
As shown in (c), the outer peripheral surface has a convex cross section (see FIG. 8).
(G) shows the main part in an enlarged manner) Rotating 1
By passing it between the pair of rollers 45a and 45b, as shown in FIG.
As shown in (d), the conductor element 41 having a rectangular cross section is formed by rolling a continuous groove portion 41b on the upper and lower surfaces of the central portion in the length direction.
【００３０】次に、図８（ｅ）に示すように上記溝部４
１ｂに耐熱性樹脂４２ａをコーティングして保護膜４２
を形成した後、図８（ｆ）に示すように所定の長さに切
断してチップジャンパーを得るものである。Next, as shown in FIG. 8 (e), the groove 4 is formed.
1b is coated with heat resistant resin 42a to form a protective film 42
After forming, the chip jumper is obtained by cutting into a predetermined length as shown in FIG.
【００３１】また、本実施例による効果は上記第１の実
施例による効果（省略）の他に、保護膜４２が導体素子
４１と同一面に形成されるため、プリント基板へ実装す
る際に安定性が向上するという効果が得られるものであ
る。In addition to the effect (omitted) of the first embodiment, the effect of this embodiment is stable because the protective film 42 is formed on the same surface as the conductor element 41, so that it is stable when mounted on a printed circuit board. The effect that the property is improved is obtained.
【００３２】（実施例５）以下、本発明の第５の実施例
について図面を参照しながら説明する。(Fifth Embodiment) A fifth embodiment of the present invention will be described below with reference to the drawings.
【００３３】図９は本発明の第５の実施例におけるチッ
プジャンパーの構成を示す斜視図であり、同図において
５１は長さ方向の両端に電極部５１ａを露出したチップ
ジャンパーの導体素子であり、断面形状が矩形状に形成
された鉄、銅、黄銅、あるいはアルミ材により構成され
ている。５２は保護膜であり、絶縁特性を有する耐熱性
樹脂により形成され、上記導体素子５１の幅方向の上下
面及び両側面に溝部を形成し、この溝部に保護膜５２を
形成した構成としている。FIG. 9 is a perspective view showing the structure of a chip jumper according to the fifth embodiment of the present invention. In FIG. 9, 51 is a conductor element of the chip jumper in which electrode portions 51a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 52 denotes a protective film, which is formed of a heat-resistant resin having an insulating property, has groove portions formed on the upper and lower surfaces and both side surfaces of the conductor element 51 in the width direction, and the protective film 52 is formed on the groove portions.
【００３４】図１０（ａ）〜（ｈ）は同実施例によるチ
ップジャンパーの製造方法を示す製造工程図であり、ま
ず図１０（ａ）に示すようにボビン１３に巻かれた鉄、
銅、黄銅、あるいはアルミの線材５４を準備する。図１
０（ｂ）はこの線材５４を拡大して図示したもので、図
１０（ｃ）に示すように外周面を断面凸型とした（図１
０（ｈ）にその要部を拡大して図示している）回転する
１組のローラ４５ａ，４５ｂの間を通すことにより、図
１０（ｄ）に示すような長さ方向の中央部上下面に連続
した溝部５１ｂを形成した断面矩形状の導体素子５１に
圧延加工する。FIGS. 10 (a) to 10 (h) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the same embodiment. First, as shown in FIG. 10 (a), iron wound on the bobbin 13,
A wire rod 54 of copper, brass, or aluminum is prepared. Figure 1
0 (b) is an enlarged view of this wire 54, and the outer peripheral surface has a convex cross-section as shown in FIG. 10 (c) (see FIG. 1).
By passing between a pair of rotating rollers 45a and 45b, the upper and lower surfaces of the central portion as shown in FIG. 10 (d) are shown in FIG. 10 (d). Is rolled into a conductor element 51 having a rectangular cross section in which a continuous groove portion 51b is formed.
【００３５】次に、図１０（ｅ）に示すようにポンチ５
７により上記溝部５１ｂに定間隔で穴あけ加工を行って
穴５１ｃを設けて後に図１０（ｆ）に示すように上記溝
部５１ｂに耐熱性樹脂５２ａをコーティングして保護膜
５２を形成し、図１０（ｇ）に示すように上記穴５１ｃ
の中心間を所定の長さとして切断してチップジャンパー
を得るものである。Next, as shown in FIG. 10 (e), the punch 5 is used.
7, the groove 51b is perforated at regular intervals to form holes 51c, and then the groove 51b is coated with a heat resistant resin 52a to form a protective film 52 as shown in FIG. 10 (f). As shown in (g), the hole 51c
The chip jumper is obtained by cutting the center of the device to a predetermined length.
【００３６】また、本実施例による効果は上記第１の実
施例による効果（省略）の他に、保護膜５２が導体素子
５１と同一面に形成されるため、プリント基板へ実装す
る際に安定性が向上するという効果が得られるものであ
る。In addition to the effect (omitted) of the first embodiment, the effect of this embodiment is stable because the protective film 52 is formed on the same surface as the conductor element 51, so that it is stable when mounted on a printed circuit board. The effect that the property is improved is obtained.
【００３７】また、保護膜５２が上下および両側面の４
面に形成されるために絶縁性が向上するという効果も得
られるものである。Further, the protective film 52 is formed on the upper and lower sides and on both side surfaces.
Since it is formed on the surface, the effect of improving the insulating property is also obtained.
【００３８】（実施例６）以下、本発明の第６の実施例
について図面を参照しながら説明する。(Embodiment 6) A sixth embodiment of the present invention will be described below with reference to the drawings.
【００３９】図１１は本発明の第６の実施例におけるチ
ップジャンパーの構成を示す斜視図であり、同図におい
て６１は長さ方向の両端に電極部６１ａを露出したチッ
プジャンパーの導体素子であり、断面形状が矩形状に形
成された鉄、銅、黄銅、あるいはアルミ材により構成さ
れている。６２は保護膜であり、絶縁特性を有する耐熱
性樹脂により形成され、上記導体素子６１の幅方向の上
下面に溝部６１ｂを形成し、この溝部６１ｂに保護膜６
２を形成した構成としている。FIG. 11 is a perspective view showing the structure of a chip jumper according to the sixth embodiment of the present invention. In FIG. 11, reference numeral 61 is a conductor element of the chip jumper in which electrode portions 61a are exposed at both ends in the length direction. It is made of iron, copper, brass, or aluminum material having a rectangular cross section. Reference numeral 62 denotes a protective film, which is formed of a heat-resistant resin having insulating properties, forms groove portions 61b on the upper and lower surfaces of the conductor element 61 in the width direction, and the protective film 6 is formed in the groove portions 61b.
2 is formed.
【００４０】図１２（ａ）〜（ｇ）は同実施例によるチ
ップジャンパーの製造方法を示す製造工程図であり、ま
ず図１２（ａ）に示すようにボビン１３に巻かれた鉄、
銅、黄銅、あるいはアルミの線材６４を準備する。図１
２（ｂ）はこの線材６４を拡大して図示したもので、図
１２（ｃ）に示すように外周面に歯車状に複数の凸部を
設けた（図１２（ｇ）にその要部を拡大して図示してい
る）回転する１組のローラ６５ａ，６５ｂの間を通すこ
とにより、図１２（ｄ）に示すような長さ方向に定間隔
で複数の溝部６１ｂを形成した断面矩形状の導体素子６
１に圧延加工する。FIGS. 12 (a) to 12 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the same embodiment. First, as shown in FIG. 12 (a), iron wound on the bobbin 13,
A wire rod 64 of copper, brass, or aluminum is prepared. Figure 1
2 (b) is an enlarged view of the wire 64. As shown in FIG. 12 (c), a plurality of protrusions are provided in a gear shape on the outer peripheral surface (the main part thereof is shown in FIG. 12 (g)). By enlarging between a pair of rotating rollers 65a and 65b, a plurality of groove portions 61b are formed at regular intervals in the length direction as shown in FIG. 12 (d). Conductor element 6
Roll to 1.
【００４１】次に、図１２（ｅ）に示すように上記溝部
６１ｂに耐熱性樹脂６２ａをコーティングして保護膜６
２を形成した後、図１２（ｆ）に示すように上記溝部６
１ｂが長さ方向中央部となるような所定の長さに切断し
てチップジャンパーを得るものである。Next, as shown in FIG. 12 (e), the groove 61b is coated with a heat resistant resin 62a to form a protective film 6.
2 is formed, the groove 6 is formed as shown in FIG.
The chip jumper is obtained by cutting into a predetermined length such that 1b is the center in the length direction.
【００４２】また、本実施例による効果は上記第１の実
施例による効果（省略）の他に、保護膜６２が導体素子
６１と同一面に形成されるため、プリント基板へ実装す
る際に安定性が向上するという効果が得られるものであ
る。In addition to the effect (omitted) of the first embodiment, the effect of the present embodiment is stable because the protective film 62 is formed on the same surface as the conductor element 61, so that it is stable when mounted on a printed circuit board. The effect that the property is improved is obtained.
【００４３】（実施例７）以下、本発明の第７の実施例
について図面を参照しながら説明する。(Embodiment 7) A seventh embodiment of the present invention will be described below with reference to the drawings.
【００４４】図１３は同第７の実施例におけるチップジ
ャンパーの構成を示す斜視図であり、同図において７１
は長さ方向の両端に半田メッキ処理を施した電極部７１
ａを露出したチップジャンパーの導体素子であり、断面
形状が矩形状に加工された鉄、銅、黄銅、あるいはアル
ミにより構成されている。７２は保護膜であり、絶縁特
性を有する耐熱性樹脂を用いて形成されている。FIG. 13 is a perspective view showing the structure of the chip jumper in the seventh embodiment. In FIG.
Is an electrode portion 71 whose both ends in the length direction are plated with solder.
It is a conductor element of a chip jumper with a exposed, and is made of iron, copper, brass, or aluminum processed into a rectangular cross-section. Reference numeral 72 denotes a protective film, which is formed using a heat resistant resin having insulating properties.
【００４５】図１４（ａ）〜（ｅ）は上記同実施例によ
るチップジャンパーの製造方法を示す製造工程図であ
り、まず図１４（ａ）に示すようにボビン１３に巻かれ
た半田メッキ鉄線、半田メッキ角銅線、半田メッキ角黄
銅線、あるいは半田メッキアルミ線などからなる線材７
４を準備する。ここで、線材７４が丸線の場合はロール
もしくはダイスなどにて角線化する。図１４（ｂ）はこ
の線材７４を拡大して図示したものである。図２（ｃ）
に示すように線材７４の長手方向ほぼセンターにカッタ
ー７５ａ，７５ｂなどを用いて切削溝７４ａを片面もし
くは両面に加工する。これは断面矩形状にし溝面の半田
メッキを取り去り導体素子の素材面とするためである。FIGS. 14 (a) to 14 (e) are manufacturing process diagrams showing the method of manufacturing the chip jumper according to the above-mentioned embodiment. First, as shown in FIG. 14 (a), the solder-plated iron wire wound around the bobbin 13 is used. Wire rod 7 made of solder-plated square copper wire, solder-plated square brass wire, or solder-plated aluminum wire 7
Prepare 4. Here, when the wire rod 74 is a round wire, it is made into a square wire by a roll or a die. FIG. 14B is an enlarged view of the wire rod 74. Figure 2 (c)
As shown in FIG. 3, the cutting groove 74a is formed on one side or both sides of the wire rod 74 substantially at the center in the longitudinal direction by using the cutters 75a and 75b. This is because the cross section is made rectangular and the solder plating on the groove surface is removed to be the material surface of the conductor element.
【００４６】次に、図１４（ｄ）に示すように上記切削
溝７４ａに耐熱性樹脂７２ａをコーティングして保護膜
７２を形成し、図１４（ｅ）に示すように所定の長さに
切断してチップジャンパーを得るものである。Next, as shown in FIG. 14 (d), the cutting groove 74a is coated with a heat resistant resin 72a to form a protective film 72, which is cut into a predetermined length as shown in FIG. 14 (e). And get a chip jumper.
【００４７】以上のように本発明の第７の実施例による
チップジャンパーは、材料として半田メッキされた鉄、
銅、黄銅、あるいはアルミの線材７４と耐熱性樹脂７２
ａのみで構成されたものであり、その製造方法も上記図
１４（ａ）〜（ｅ）で示すように簡単な構成で工数が少
なく、材料投入から製品取り出しまで一貫した設備で構
造することが可能となり、製品コストも安いチップジャ
ンパーを実現することができるものである。As described above, the chip jumper according to the seventh embodiment of the present invention is made of solder-plated iron as a material,
Copper, brass, or aluminum wire 74 and heat-resistant resin 72
Since it is configured only by a, its manufacturing method is simple as shown in FIGS. 14 (a) to 14 (e), has a small number of steps, and can be constructed by a consistent facility from material input to product removal. It is possible to realize a chip jumper that is possible and has a low product cost.
【００４８】（実施例８）以下、本発明の第８の実施例
について図面を参照しながら説明する。(Embodiment 8) An eighth embodiment of the present invention will be described below with reference to the drawings.
【００４９】図１５は同第８の実施例におけるチップジ
ャンパーの構成を示す斜視図であり、同図において８１
は長さ方向の両端に半田メッキ処理を施した電極部８１
ａを露出したチップジャンパーの導体素子であり、断面
形状が矩形状に加工された鉄、銅、黄銅、あるいはアル
ミにより構成されている。８２は保護膜であり、絶縁特
性を有する耐熱性樹脂を用いて形成されている。FIG. 15 is a perspective view showing the structure of the chip jumper according to the eighth embodiment of the present invention.
Is an electrode portion 81 whose both ends in the length direction are plated with solder.
It is a conductor element of a chip jumper with a exposed, and is made of iron, copper, brass, or aluminum processed into a rectangular cross-section. Reference numeral 82 denotes a protective film, which is formed using a heat resistant resin having insulating properties.
【００５０】図１６（ａ）〜（ｇ）は上記同実施例によ
るチップジャンパーの製造方法を示す製造工程図であ
り、まず図１６（ａ）に示すようにボビン１３に巻かれ
た裸角銅線もしくは裸角黄銅線の線材８４を準備する。
ここで、線材８４が丸線の場合はロールもしくはダイス
などにて角線化する。図１６（ｂ）はこの線材８４を拡
大して図示したものである。図１６（ｃ）に示すように
線材８４の長手方向ほぼセンターにローラもしくはダイ
スなどにて断面凹形状の溝加工８４ａを片面もしくは両
面に行う。FIGS. 16 (a) to 16 (g) are manufacturing process diagrams showing a method of manufacturing the chip jumper according to the above-described embodiment. First, as shown in FIG. 16 (a), a bare copper plate wound around a bobbin 13 is first shown. A wire or a bare-angle brass wire 84 is prepared.
Here, when the wire rod 84 is a round wire, it is made into a square wire by a roll or a die. FIG. 16B is an enlarged view of the wire rod 84. As shown in FIG. 16C, a groove 84a having a concave cross-section is formed on one side or both sides of the wire 84 approximately at the center in the longitudinal direction by a roller or a die.
【００５１】次に全面に半田メッキを施し図１６（ｄ）
の半田メッキ線８４ｂとする。これは上記裸角銅線もし
くは裸角黄銅線が半田メッキ角銅線もしくは半田メッキ
角黄銅線に該断面凹形状の溝加工を行うことによっても
同様の結果が得られることは容易に推測できる。さらに
図１６（ｅ）のように断面凹形状の溝部のみ半田付け可
能な表面処理層を取り除く切削加工を行い切削溝８４ｃ
とする。これは溝面の表面処理層を取り去り、導体素子
の素材面とするためである。Next, solder plating is applied to the entire surface, as shown in FIG. 16 (d).
Of the solder plated wire 84b. It can be easily inferred that the same result can be obtained by subjecting the above-mentioned bare copper wire or the bare brass wire to the solder-plated copper wire or the solder-plated brass wire to have the groove having the concave cross-section. Further, as shown in FIG. 16 (e), a cutting process is performed to remove the solderable surface treatment layer only in the groove having a concave cross section
And This is because the surface treatment layer on the groove surface is removed and used as the material surface of the conductor element.
【００５２】次に、図１６（ｆ）に示すように上記切削
溝８４ｃに耐熱性樹脂８２ａをコーティングして保護膜
８２を形成し、図１６（ｇ）に示すように所定の長さに
切断してチップジャンパーを得るものである。Next, as shown in FIG. 16 (f), the cutting groove 84c is coated with a heat resistant resin 82a to form a protective film 82, which is cut into a predetermined length as shown in FIG. 16 (g). And get a chip jumper.
【００５３】以上のように本発明の第８の実施例による
チップジャンパーは、材料として鉄、銅、黄銅、あるい
はアルミの角線材８４と耐熱性樹脂８２ａのみで構成さ
れたものであり、その製造方法も工数が少なく、製品コ
スト、設備コストとも安いチップジャンパーを実現する
ことができるものである。As described above, the chip jumper according to the eighth embodiment of the present invention is made of only the iron, copper, brass, or aluminum square wire rod 84 and the heat-resistant resin 82a, and is manufactured. The method requires a small number of man-hours and can realize a chip jumper that is low in product cost and equipment cost.
【００５４】なお、上記第１〜第８の実施例では導体素
子は鉄、銅、黄銅、あるいはアルミなどの金属材料と
し、保護膜は絶縁特性を有する耐熱性樹脂粘着テープ、
耐熱性熱収縮チューブ、耐熱性樹脂、セラミックとした
が、本発明はこれに限定されるものではなく、導電性を
有した金属材料であれば導体素子として何でも使用で
き、絶縁と耐熱特性を有したものであれば保護膜用の材
料として使用できることは言うまでもない。In the first to eighth embodiments, the conductor element is made of a metal material such as iron, copper, brass, or aluminum, and the protective film is a heat-resistant resin adhesive tape having insulating properties.
Although the heat-resistant heat-shrinkable tube, the heat-resistant resin, and the ceramic are used, the present invention is not limited to this, and any conductive metallic material can be used as a conductor element, and has insulation and heat-resistant properties. It goes without saying that any of the above can be used as a material for the protective film.
【００５５】また同様に、上記実施例では導体素子の両
面に溝部を設ける例を示したが、本発明はこれに限定さ
れるものではなく、導体素子の少なくとも片面に溝部を
設ければ目的を達成するものであることは言うまでもな
い。Similarly, in the above embodiment, an example in which the groove portions are provided on both surfaces of the conductor element has been shown, but the present invention is not limited to this, and the purpose is to provide the groove portions on at least one surface of the conductor element. It goes without saying that it will be achieved.
【００５６】[0056]
【発明の効果】以上のように本発明によるチップジャン
パーおよびその製造方法は、断面矩形状の鉄、銅、黄
銅、あるいはアルミナなどの金属材料からなる導体素子
の両端部を電極部として残し、中央部に絶縁特性を有す
る耐熱性樹脂粘着テープ、耐熱性熱収縮チューブ、耐熱
性樹脂、セラミックのいずれかからなる保護膜を形成し
た極めて簡単な構成のチップジャンパーを得ることがで
きる。As described above, according to the chip jumper and the method for manufacturing the same of the present invention, both ends of a conductor element made of a metal material having a rectangular cross section, such as iron, copper, brass, or alumina, are left as electrode portions and the center portion is left. It is possible to obtain a chip jumper having an extremely simple structure in which a protective film made of any one of a heat-resistant resin adhesive tape having an insulating property, a heat-resistant heat-shrinkable tube, a heat-resistant resin, and a ceramic is formed on a part.
【００５７】また、その製造方法も工数が少なく、製造
設備も簡略化することができ、材料費、工数共に大幅な
コストダウンを図ることができるものである。Further, the number of man-hours for the manufacturing method is small, the manufacturing equipment can be simplified, and the material cost and the man-hour can be greatly reduced.
【図１】本発明の第１の実施例におけるチップジャンパ
ーを示す斜視図FIG. 1 is a perspective view showing a chip jumper according to a first embodiment of the present invention.
【図２】同実施例によるチップジャンパーの製造工程図FIG. 2 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図３】本発明の第２の実施例におけるチップジャンパ
ーを示す斜視図FIG. 3 is a perspective view showing a chip jumper according to a second embodiment of the present invention.
【図４】同実施例によるチップジャンパーの製造工程図FIG. 4 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図５】本発明の第３の実施例におけるチップジャンパ
ーを示す斜視図FIG. 5 is a perspective view showing a chip jumper according to a third embodiment of the present invention.
【図６】同実施例によるチップジャンパーの製造工程図FIG. 6 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図７】本発明の第４の実施例におけるチップジャンパ
ーを示す斜視図FIG. 7 is a perspective view showing a chip jumper according to a fourth embodiment of the present invention.
【図８】同実施例によるチップジャンパーの製造工程図FIG. 8 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図９】本発明の第５の実施例におけるチップジャンパ
ーを示す一部切欠斜視図FIG. 9 is a partially cutaway perspective view showing a chip jumper according to a fifth embodiment of the present invention.
【図１０】同実施例によるチップジャンパーの製造工程
図FIG. 10 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図１１】本発明の第６の実施例におけるチップジャン
パーを示す斜視図FIG. 11 is a perspective view showing a chip jumper according to a sixth embodiment of the present invention.
【図１２】同実施例によるチップジャンパーの製造工程
図FIG. 12 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図１３】本発明の第７の実施例におけるチップジャン
パーを示す斜視図FIG. 13 is a perspective view showing a chip jumper according to a seventh embodiment of the present invention.
【図１４】同実施例によるチップジャンパーの製造工程
図FIG. 14 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図１５】本発明の第８の実施例におけるチップジャン
パーを示す斜視図FIG. 15 is a perspective view showing a chip jumper according to an eighth embodiment of the present invention.
【図１６】同実施例によるチップジャンパーの製造工程
図FIG. 16 is a manufacturing process diagram of the chip jumper according to the embodiment.
【図１７】従来のチップジャンパーを示す断面図FIG. 17 is a sectional view showing a conventional chip jumper.
１１ チップジャンパーの導体素子 １１ａ 電極部 １２ 保護膜 １２ａ 耐熱性樹脂粘着テープ １３ ボビン １４ 線材 １５ａ，１５ｂ ローラ ２１ チップジャンパーの導体素子 ２１ａ 電極部 ２２ 保護膜 ２２ａ 耐熱性熱収縮チューブ ２６ 熱風 ３１ チップジャンパーの導体素子 ３１ａ 電極部 ３２ 保護膜 ３２ａ 耐熱性樹脂 ４１ チップジャンパーの導体素子 ４１ａ 電極部 ４１ｂ 溝部 ４２ 保護膜 ４２ａ 耐熱性樹脂 ４４ 線材 ４５ａ，４５ｂ ローラ ５１ チップジャンパーの導体素子 ５１ａ 電極部 ５１ｂ 溝部 ５１ｃ 穴 ５２ 保護膜 ５２ａ 耐熱性樹脂 ５４ 線材 ５７ ポンチ ６１ チップジャンパーの導体素子 ６１ａ 電極部 ６１ｂ 溝部 ６２ 保護膜 ６２ａ 耐熱性樹脂 ６４ 線材 ６５ａ，６５ｂ ローラ ７１ チップジャンパーの導体素子 ７１ａ 電極部 ７２ 保護膜 ７２ａ 耐熱性樹脂 ７４ 線材 ７４ａ 切削溝 ７５ａ，７５ｂ カッター ８１ チップジャンパーの導体素子 ８１ａ 電極部 ８２ 保護膜 ８２ａ 耐熱性樹脂 ８４ 線材 ８４ａ 加工溝 ８４ｂ 半田メッキ線 ８４ｃ 切削溝 11 Chip Jumper Conductor Element 11a Electrode Part 12 Protective Film 12a Heat Resistant Resin Adhesive Tape 13 Bobbin 14 Wires 15a, 15b Roller 21 Chip Jumper Conductor Element 21a Electrode Part 22 Protective Film 22a Heat Resistant Heat Shrink Tube 26 Hot Air 31 Chip Jumper Conductor element 31a Electrode section 32 Protective film 32a Heat resistant resin 41 Chip jumper conductor element 41a Electrode section 41b Groove section 42 Protective film 42a Heat resistant resin 44 Wire material 45a, 45b Roller 51 Chip jumper conductor element 51a Electrode section 51b Groove section 51c hole 52 Protective film 52a Heat resistant resin 54 Wire material 57 Punch 61 Chip jumper conductor element 61a Electrode part 61b Groove part 62 Protective film 62a Heat resistant resin 64 Wire material 65a, 65b Roller 71 Chip jumper conductor element 71a electrode 72 protective film 72a heat-resistant resin 74 wire material 74a cut grooves 75a, 75b cutter 81 tip conductor element 81a electrode 82 protective film 82a heat-resistant resin 84 wire rod 84a machined groove 84b solder plated wire 84c cut groove jumper
フロントページの続き (72)発明者 芳中 毅 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 正本 敞 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Front page continuation (72) Inventor Takeshi Yoshinaka 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor, Masamoto 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (10)
ルミなどの金属材料からなる導体素子の長さ方向の中央
部に絶縁特性を有する耐熱性樹脂粘着テープ、耐熱性熱
収縮チューブ、耐熱性樹脂、セラミックのいずれかから
なる保護膜を形成したチップジャンパー。1. A heat-resistant resin pressure-sensitive adhesive tape, a heat-resistant heat-shrinkable tube, and a heat-resistant adhesive tape, which has an insulating property in the central portion in the length direction of a conductor element made of a metal material such as iron, copper, brass, or aluminum having a rectangular cross section. Chip jumper with a protective film made of either conductive resin or ceramic.
ルミなどの金属材料からなる導体素子の少なくとも１つ
の面に溝部を設け、この溝部に保護膜を形成した請求項
１記載のチップジャンパー。2. The chip jumper according to claim 1, wherein a groove is provided on at least one surface of a conductor element made of a metal material such as iron, copper, brass, or aluminum having a rectangular cross section, and a protective film is formed on the groove. .
属線に定間隔で保護膜を形成し、これを回転する１組の
ローラ間を通し断面矩形状の導体素子に圧延加工して
後、上記保護膜が中央部になるように所定の長さに切断
する請求項１記載のチップジャンパーの製造方法。3. A protective film is formed on a metal wire such as iron, copper, brass, or aluminum at regular intervals and is rolled into a conductor element having a rectangular cross section through a pair of rotating rollers. 2. The method of manufacturing a chip jumper according to claim 1, wherein the protective film is cut into a predetermined length so that the protective film is located at the center.
属線を少なくとも一方の外周面を断面凸型とした回転す
る１組のローラ間を通し長さ方向に連続した溝部を設け
た断面矩形状の導体素子に圧延加工し、この溝部に保護
膜を形成して後、所定の長さに切断する請求項２記載の
チップジャンパーの製造方法。4. A rectangular cross section in which a metal wire made of iron, copper, brass, aluminum, or the like is provided between a pair of rotating rollers having at least one outer peripheral surface having a convex cross section so as to be continuous in the lengthwise direction. 3. The method for manufacturing a chip jumper according to claim 2, wherein the conductor element having a shape is rolled, a protective film is formed in the groove portion, and then the conductor element is cut into a predetermined length.
属線を少なくとも一方の外周面を断面凸型とした回転す
る１組のローラ間を通し長さ方向に連続した溝部を設け
た断面矩形状の導体素子に圧延加工し、この溝部の長さ
方向に定間隔で穴加工を施して後、この溝部に保護膜を
形成して上記穴の中心間を所定長さとして切断する請求
項２記載のチップジャンパーの製造方法。5. A rectangular cross section in which a metal wire such as iron, copper, brass, or aluminum is provided between a pair of rotating rollers having at least one outer peripheral surface having a convex cross section so as to be continuous in the longitudinal direction through a pair of rotating rollers. 3. A conductor element having a shape is rolled, and holes are formed at regular intervals in the longitudinal direction of the groove, and then a protective film is formed in the groove to cut the center of the hole to a predetermined length. Manufacturing method of the described chip jumper.
属線を少なくとも一方に歯車状に複数の凸部を設けた回
転する１組のローラ間を通し定間隔で溝部を設けた断面
矩形状の導体素子に圧延加工し、上記溝部に保護膜を形
成して後、溝部が長さ方向中央部となるように切断する
請求項２記載のチップジャンパーの製造方法。6. A rectangular cross section in which a groove is provided at a constant interval through a pair of rotating rollers having a plurality of metal-made wires such as iron, copper, brass, or aluminum provided with a plurality of protrusions in a gear shape on at least one side. 3. The method of manufacturing a chip jumper according to claim 2, wherein the conductor element is rolled, a protective film is formed on the groove, and then the groove is cut so as to become the center in the length direction.
なくとも片面に備えると共に、この溝部を除く全面に半
田メッキ処理を施した断面矩形状の鉄、銅、黄銅、ある
いはアルミなどの金属材料からなる導体素子と、この導
体素子の上記溝部に形成された絶縁特性を有する耐熱性
樹脂粘着テープ、耐熱性樹脂、セラミックのいずれかか
らなる保護膜により構成されたチップジャンパー。7. A metal such as iron, copper, brass, or aluminum having a rectangular cross section, which is provided with a groove having a concave cross section on at least one surface at the center in the lengthwise direction and which is subjected to solder plating on the entire surface excluding this groove. A chip jumper composed of a conductor element made of a material and a protective film made of any one of a heat-resistant resin adhesive tape having insulating properties, a heat-resistant resin, and a ceramic formed in the groove of the conductor element.
状の金属材料からなる導体素子にあらかじめ半田付け可
能な表面処理を行い、この導体素子の少なくとも片面に
線方向に断面凹形状の溝加工を行うと共に上記表面処理
層を除去し、この溝部に絶縁特性を有する耐熱性樹脂粘
着テープ、耐熱性樹脂、セラミックのいずれかからなる
保護膜を形成した後、この線状の導体素子を所定の長さ
寸法に切断してチップジャンパーを得る請求項７記載の
チップジャンパーの製造方法。8. A groove having a concave cross-section in the linear direction on at least one surface of the conductor element, which has been subjected to surface treatment capable of being soldered in advance on the conductor element made of a linear metal material such as iron, copper, brass, or aluminum. After processing and removing the surface treatment layer, a protective film made of a heat-resistant resin adhesive tape having an insulating property, a heat-resistant resin, or a ceramic is formed in the groove, and then the linear conductor element is formed into a predetermined shape. 8. The method for manufacturing a chip jumper according to claim 7, wherein the chip jumper is obtained by cutting the chip jumper into the length dimension.
状の金属材料からなる導体素子にあらかじめ半田付け可
能な表面処理を行い、この導体素子の少なくとも片面に
線方向にローラまたはプレスなどで断面凹形状の溝加工
を行い、この溝部の表面処理層を除去した後、この溝部
に絶縁特性を有する耐熱性樹脂粘着テープ、耐熱性樹
脂、セラミックのいずれかからなる保護膜を形成し、こ
の線状の導体素子を所定の長さ寸法に切断してチップジ
ャンパーを得る請求項７記載のチップジャンパーの製造
方法。9. A conductor element made of a linear metal material such as iron, copper, brass, or aluminum is preliminarily subjected to surface treatment capable of being soldered, and at least one surface of the conductor element is linearly rolled or pressed by a roller or a press. After making a groove with a concave cross-section and removing the surface treatment layer of this groove, a protective film made of a heat-resistant resin adhesive tape having insulating properties, a heat-resistant resin, or a ceramic is formed in this groove, 8. The method of manufacturing a chip jumper according to claim 7, wherein a linear conductor element is cut into a predetermined length dimension to obtain a chip jumper.
線状の金属材料からなる導体素子の少なくとも片面に線
方向にローラまたはプレスなどで断面凹形状の溝加工を
行った後、この導体素子に半田付け可能な表面処理を行
ってから上記溝部のみ表面処理層を除去する加工を行う
か、もしくは溝部を除いた導体素子に半田付け可能な表
面処理を行って後、上記溝部に絶縁特性を有する耐熱性
樹脂粘着テープ、耐熱性樹脂、セラミックのいずれかか
らなる保護膜を形成し、この線状の導体素子を所定の長
さ寸法に切断してチップジャンパーを得る請求項７記載
のチップジャンパーの製造方法。10. A conductor element made of a linear metal material such as iron, copper, brass, or aluminum is formed on at least one surface thereof in a linear direction by a groove having a concave cross-section by a roller or a press, and then the conductor element is formed. The surface treatment layer is removed only on the groove after performing a solderable surface treatment, or the conductor element excluding the groove is subjected to a solderable surface treatment, and then the groove is provided with an insulating property. The chip jumper according to claim 7, wherein a protective film made of any one of the heat-resistant resin adhesive tape, the heat-resistant resin, and the ceramic is formed, and the linear conductor element is cut into a predetermined length dimension to obtain a chip jumper. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00564394A JP3326948B2 (en) | 1993-04-27 | 1994-01-24 | Chip jumper manufacturing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10091393 | 1993-04-27 | ||
| JP5-100913 | 1993-04-27 | ||
| JP00564394A JP3326948B2 (en) | 1993-04-27 | 1994-01-24 | Chip jumper manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0714629A true JPH0714629A (en) | 1995-01-17 |
| JP3326948B2 JP3326948B2 (en) | 2002-09-24 |
Family
ID=26339616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00564394A Expired - Fee Related JP3326948B2 (en) | 1993-04-27 | 1994-01-24 | Chip jumper manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3326948B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118701A (en) * | 1999-10-19 | 2001-04-27 | Koa Corp | Low-resistance resistor for detecting current and its manufacturing method |
| KR100831385B1 (en) * | 2006-03-16 | 2008-05-21 | 스미다 코포레이션 가부시키가이샤 | Inductor |
| JP2012028540A (en) * | 2010-07-23 | 2012-02-09 | Koa Corp | Jumper chip component |
-
1994
- 1994-01-24 JP JP00564394A patent/JP3326948B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118701A (en) * | 1999-10-19 | 2001-04-27 | Koa Corp | Low-resistance resistor for detecting current and its manufacturing method |
| JP4503122B2 (en) * | 1999-10-19 | 2010-07-14 | コーア株式会社 | Low resistor for current detection and method for manufacturing the same |
| KR100831385B1 (en) * | 2006-03-16 | 2008-05-21 | 스미다 코포레이션 가부시키가이샤 | Inductor |
| JP2012028540A (en) * | 2010-07-23 | 2012-02-09 | Koa Corp | Jumper chip component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3326948B2 (en) | 2002-09-24 |
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