JPH07135037A - Coaxial cable connecting board and manufacture thereof - Google Patents

Coaxial cable connecting board and manufacture thereof

Info

Publication number
JPH07135037A
JPH07135037A JP27990393A JP27990393A JPH07135037A JP H07135037 A JPH07135037 A JP H07135037A JP 27990393 A JP27990393 A JP 27990393A JP 27990393 A JP27990393 A JP 27990393A JP H07135037 A JPH07135037 A JP H07135037A
Authority
JP
Japan
Prior art keywords
coaxial cable
conductor
groove
outer conductor
center conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27990393A
Other languages
Japanese (ja)
Inventor
Tadanori Ominato
忠則 大湊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP27990393A priority Critical patent/JPH07135037A/en
Publication of JPH07135037A publication Critical patent/JPH07135037A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Communication Cables (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PURPOSE:To connect a coaxial cable stably by positioning it accurately without enlarging the land parts. CONSTITUTION:A central conductor groove 11 having at least a part of a central conductor 4 of a coaxial cable 2 inside is formed in one land part 9, and an external conductor groove 12 having at least a part of an external conductor 5 of the coaxial cable 2 inside with a width and a depth larger than the central conductor groove 11 is formed in the other land part 10, so as to extend respectively in the arranging direction of the land parts 9 and 10. The central conductor 4 of the coaxial cable 2 is soldered in a condition where at least the part is arranged in the central conductor groove 11 of one land part 9, and the external conductor 5 is soldered in a condition where at least the part is arranged in the external conductor groove 12 of the other land part 10.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子計算機等の電子機
器に使用される同軸ケーブル接続用基板およびその製造
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for connecting a coaxial cable used in electronic equipment such as a computer and a method for manufacturing the same.

【0002】[0002]

【従来の技術】従来、同軸ケーブル接続用基板として、
図9に示す構成のものが採用されている。これは、中心
導体31と、該中心導体31と同軸をなして外側に設け
られた外部導体32とを有する同軸ケーブル33を接続
させるもので、中心導体31と外部導体32とを個別に
接続させるランド部35,36が相互に所定距離離間し
て配列されている。そして、特に最外径が1mm程度の
細線同軸ケーブルを接続させる場合は、コネクタの使用
が困難である等の理由から、中心導体31および外部導
体32を対応するランド部35,36に直接半田付けさ
せるようになっている。ここで、従来、ランド部35,
36の、中心導体31および外部導体32を接続させる
上面は平面状に形成されている。
2. Description of the Related Art Conventionally, as a substrate for connecting a coaxial cable,
The configuration shown in FIG. 9 is adopted. This connects a coaxial cable 33 having a center conductor 31 and an outer conductor 32 which is coaxial with the center conductor 31 and is provided on the outside. The center conductor 31 and the outer conductor 32 are individually connected. The land portions 35 and 36 are arranged at a predetermined distance from each other. In particular, when connecting a thin coaxial cable having an outermost diameter of about 1 mm, the center conductor 31 and the outer conductor 32 are directly soldered to the corresponding land portions 35 and 36 because the connector is difficult to use. It is designed to let you. Here, conventionally, the land portion 35,
An upper surface of 36, which connects the central conductor 31 and the outer conductor 32, is formed in a planar shape.

【0003】[0003]

【発明が解決しようとする課題】上記構成の同軸ケーブ
ル接続用基板では、ランド部の上面が平面状に形成され
ているため、断面円形状をなす中心導体および外部導体
は、ランド部の上面で転がりやすく、一定の位置に安定
して半田付けすることが難しいという問題があった。こ
のため、ランド部を大きくすることも可能であるが、こ
のようにすると、基板面積が増大してしまうという問題
があった。したがって、本発明の目的は、ランド部を大
きくすることなく、中心導体と外部導体とを有する同軸
ケーブルを正確に位置決めし安定して接続させることが
できる同軸ケーブル接続用基板およびその製造方法を提
供することである。
In the coaxial cable connecting substrate having the above-described structure, since the upper surface of the land portion is formed in a flat shape, the center conductor and the outer conductor having a circular cross section are formed on the upper surface of the land portion. There is a problem that it rolls easily, and it is difficult to stably solder at a fixed position. Therefore, it is possible to increase the size of the land portion, but this causes a problem that the substrate area increases. Therefore, an object of the present invention is to provide a coaxial cable connecting substrate and a manufacturing method thereof that can accurately position and stably connect a coaxial cable having a center conductor and an outer conductor without enlarging the land portion. It is to be.

【0004】[0004]

【課題を解決するための手段】上記目的を達成するた
め、本発明の同軸ケーブル接続用基板は、中心導体と、
該中心導体と同軸をなして外側に設けられた外部導体と
を有する同軸ケーブルの、前記中心導体と外部導体とを
個別に接続させるランド部が相互に所定距離離間して複
数配列されてなるものであって、一の前記ランド部に
は、内側に中心導体の少なくとも一部を配置させる中心
導体用溝が、他の前記ランド部には、内側に外部導体の
少なくとも一部を配置させる、前記中心導体用溝より幅
および深さの大きい外部導体用溝が、それぞれランド部
の配列方向に沿って延在形成されていることを特徴とし
ている。
In order to achieve the above object, a coaxial cable connecting substrate of the present invention comprises a center conductor,
A coaxial cable having an outer conductor coaxial with the central conductor and provided on the outside, in which a plurality of lands for individually connecting the central conductor and the outer conductor are arranged at a predetermined distance from each other. The one land portion has a center conductor groove for arranging at least a part of the center conductor inside, and the other land portion has at least a part of an outer conductor arranged inside. The outer conductor groove having a width and depth larger than that of the center conductor groove is formed so as to extend along the arrangement direction of the land portions.

【0005】本発明の同軸ケーブル接続用基板の製造方
法は、中心導体と、該中心導体と同軸をなして外側に設
けられた外部導体とを有する同軸ケーブルの、前記中心
導体と外部導体とを個別に接続させるランド部が相互に
所定距離離間して複数配列されてなる同軸ケーブル接続
用基板の製造方法であって、基板本体に設けられた導電
層上にレジスト層を設け、該レジスト層に異幅の開口部
を相互に所定距離離間させて直列に配置形成し、エッチ
ングを施すことを特徴としている。
A method of manufacturing a coaxial cable connecting substrate according to the present invention comprises a center conductor and an outer conductor of a coaxial cable having a center conductor and an outer conductor coaxially arranged with the center conductor. A method for manufacturing a coaxial cable connecting substrate, in which a plurality of individually connected land portions are arranged at a predetermined distance from each other, wherein a resist layer is provided on a conductive layer provided on the substrate body, and the resist layer is provided on the conductive layer. It is characterized in that openings having different widths are arranged in series at a predetermined distance from each other and etching is performed.

【0006】[0006]

【作用】本発明の同軸ケーブル接続用基板によれば、一
のランド部には、内側に中心導体の少なくとも一部を配
置させる中心導体用溝が、他のランド部には、内側に外
部導体の少なくとも一部を配置させる、中心導体用溝よ
り幅および深さの大きい外部導体用溝が、それぞれラン
ド部の配列方向に沿って延在形成されている。よって、
同軸ケーブルを半田付けする際には、該同軸ケーブルの
中心導体は一のランド部の中心導体用溝に少なくともそ
の一部が配置され、外部導体は他のランド部の外部導体
用溝に少なくともその一部が配置された状態で半田付け
されることになるため、ランド部を大きくすることなく
とも、中心導体と外部導体とを有する同軸ケーブルを正
確に位置決めし安定して接続させることができる。
According to the coaxial cable connecting substrate of the present invention, a central conductor groove for arranging at least a part of the central conductor therein is provided in one land portion, and an outer conductor is provided inside the other land portion. Outer conductor grooves having a width and a depth larger than those of the center conductor groove, in which at least a part of the above are arranged, are formed to extend along the arrangement direction of the land portions. Therefore,
When soldering a coaxial cable, at least a part of the center conductor of the coaxial cable is disposed in the center conductor groove of one land portion, and the outer conductor is at least part of the center conductor groove of the other land portion. Since a part of the coaxial cable is soldered in a state where it is arranged, the coaxial cable having the center conductor and the outer conductor can be accurately positioned and stably connected without increasing the size of the land portion.

【0007】本発明の同軸ケーブル接続用基板の製造方
法によれば、基板本体に設けられた導電層上にレジスト
層を設け、該レジスト層に異幅の開口部を相互に離間さ
せて直列に配置形成し、エッチングを施すことになり、
開口部の幅が異なることから、これら開口部に臨む導電
層はエッチング速度が異なることになり、導電層に形成
される溝は、幅および深さが異なることになる。すなわ
ち、幅の小さい開口部により幅および深さの小さい中心
導体用溝が、幅の大きい開口部により幅および深さの大
きい外部導体用溝が一度のエッチングで形成される。
According to the method for manufacturing a coaxial cable connecting substrate of the present invention, a resist layer is provided on the conductive layer provided on the substrate body, and openings of different widths are separated from each other in series in the resist layer. It will be arranged and formed, and etching will be applied,
Since the openings have different widths, the conductive layers facing these openings have different etching rates, and the grooves formed in the conductive layers have different widths and depths. That is, the central conductor groove having a small width and depth is formed by the opening having a small width, and the external conductor groove having a large width and depth is formed by the opening having a large width by one etching.

【0008】[0008]

【実施例】本発明の一実施例による同軸ケーブル接続用
基板について、図面を参照して以下に説明する。図1
中、符号1は本実施例の同軸ケーブル接続用基板、符号
2は該同軸ケーブル接続用基板1に接続される同軸ケー
ブルをそれぞれ示している。同軸ケーブル2は、最外直
径が1mm程度の細線タイプのもので、円柱状の中心導
体4と、該中心導体4を全周にわたって被覆する図示せ
ぬ円筒状の内部絶縁部と、該中心導体4と同軸をなして
内部絶縁部の外側に設けられた円筒状の外部導体5と、
該外部導体5の外側を被覆する外部絶縁部6とを有して
いる。そして、接続を行うため、軸線方向における端部
において、外部絶縁部6より外側に外部導体5および図
示せぬ内部絶縁部を所定の同長さ突出させ、これらより
外側に中心導体4を所定長さ突出させた状態とされてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A coaxial cable connecting board according to an embodiment of the present invention will be described below with reference to the drawings. Figure 1
In the figure, reference numeral 1 denotes a coaxial cable connecting substrate of this embodiment, and reference numeral 2 denotes a coaxial cable connected to the coaxial cable connecting substrate 1. The coaxial cable 2 is of a thin wire type having an outermost diameter of about 1 mm, and has a cylindrical central conductor 4, a cylindrical inner insulating portion (not shown) covering the central conductor 4 all around, and the central conductor. A cylindrical outer conductor 5 coaxial with 4 and provided outside the inner insulating portion,
And an outer insulating portion 6 that covers the outside of the outer conductor 5. Then, in order to perform the connection, the outer conductor 5 and the inner insulating portion (not shown) are projected to the outer side of the outer insulating portion 6 by the same length at the end portion in the axial direction, and the center conductor 4 is extended to the outer side by the predetermined length. It is in a projected state.

【0009】同軸ケーブル接続用基板1は、板状の基板
本体8を有しており、該基板本体8上には、銅箔等の導
電材料からなる、略同高さの中心導体用ランド部9およ
び外部導体用ランド部10と、これら中心導体用ランド
部9および外部導体用ランド部10に接続される銅箔等
の導電材料からなる図示せぬ回路部等が形成されてい
る。ここで、中心導体用ランド部9は、同軸ケーブル2
の中心導体4が半田付けにより接続される部分であり、
外部導体ランド部10は、同軸ケーブル2の外部導体5
が半田付けにより接続される部分であって、これら中心
導体用ランド部9および外部導体ランド部10は、相互
に所定距離離間して配列されている。なお、外部導体ラ
ンド部10は、例えばアース回路の一部を構成するもの
である。
The coaxial cable connecting substrate 1 has a plate-shaped substrate body 8 on which a land portion for a central conductor made of a conductive material such as copper foil and having substantially the same height is formed. 9 and the land portion 10 for the outer conductor, and a circuit portion (not shown) made of a conductive material such as copper foil connected to the land portion 9 for the center conductor and the land portion 10 for the outer conductor. Here, the land portion 9 for the central conductor is the coaxial cable 2
Is a portion to which the central conductor 4 of is connected by soldering,
The outer conductor land portion 10 is the outer conductor 5 of the coaxial cable 2.
Is a portion to be connected by soldering, and the center conductor land portion 9 and the outer conductor land portion 10 are arranged at a predetermined distance from each other. The outer conductor land portion 10 constitutes, for example, a part of an earth circuit.

【0010】そして、本実施例においては、図2に示す
ように、中心導体用ランド部9の上面に、中心導体用溝
11が、中心導体用ランド部9および外部導体用ランド
部10の配置方向に沿って延在するよう、幅方向(前記
配置方向に直交する方向)の中心位置に形成されてい
る。この中心導体用溝11は、延在方向に直交する方向
の断面形状が略半円状をなして凹んでいる。また、外部
導体用ランド部10の上面には、外部導体用溝12が、
中心導体用ランド部9および外部導体用ランド部10の
配置方向に沿って延在するよう、幅方向の略中心位置に
形成されている。この外部導体用溝12は、延在方向に
直交する方向の断面形状が略半円状をなしている。ここ
で、例えば、外部導体用溝12の径は、外部導体5の径
と略同径に形成され、中心導体用溝11の径は、外部導
体用溝12の径より所定量小径であって中心導体4の径
より若干大径に形成されており、これら中心導体用溝1
1および外部導体用溝12は略同軸をなすよう形成され
ている。そして、中心導体用ランド部9および外部導体
用ランド部10が略同高さをなすことから、外部導体用
溝12は、中心導体用溝11より、径、幅および深さが
大きくなっている。
In the present embodiment, as shown in FIG. 2, the center conductor groove 11 is provided on the upper surface of the center conductor land portion 9, and the center conductor land portion 9 and the outer conductor land portion 10 are arranged. It is formed at the center position in the width direction (direction orthogonal to the arrangement direction) so as to extend along the direction. The center conductor groove 11 has a substantially semicircular cross section in a direction orthogonal to the extending direction and is recessed. Further, the outer conductor groove 12 is formed on the upper surface of the outer conductor land portion 10.
It is formed at a substantially central position in the width direction so as to extend along the arrangement direction of the center conductor land portion 9 and the outer conductor land portion 10. The outer conductor groove 12 has a substantially semicircular cross section in a direction orthogonal to the extending direction. Here, for example, the diameter of the outer conductor groove 12 is formed to be substantially the same as the diameter of the outer conductor 5, and the diameter of the center conductor groove 11 is smaller than the diameter of the outer conductor groove 12 by a predetermined amount. The diameter of the center conductor 4 is slightly larger than that of the center conductor 4.
1 and the outer conductor groove 12 are formed to be substantially coaxial. Since the land portion 9 for the center conductor and the land portion 10 for the outer conductor have substantially the same height, the groove 12 for the outer conductor is larger in diameter, width and depth than the groove 11 for the center conductor. .

【0011】このような構成の同軸ケーブル接続用基板
1によれば、中心導体用ランド部9には、中心導体4用
の断面略半円状の中心導体用溝11が、中心導体用ラン
ド部9および外部導体用ランド部10の配列方向に沿っ
て延在形成されており、外部導体用ランド部10には、
外部導体5用の、断面略半円状であって中心導体用溝1
1より、径、幅および深さの大きい外部導体用溝12
が、中心導体用ランド部9および外部導体用ランド部1
0の配列方向に沿って延在形成されている。よって、同
軸ケーブル2を半田付けする際には、該同軸ケーブル2
の外部導体5は外部導体用ランド部10の外部導体用溝
12に略嵌合状態で載置され、中心導体4は、中心導体
用溝11内にその一部が配置されて半田付けされること
になる。したがって、中心導体用ランド部9および外部
導体用ランド部10を大きくすることなくとも、中心導
体4と外部導体5とを有する同軸ケーブル2を正確に位
置決めし安定して接続させることができる。したがっ
て、細線の同軸ケーブル2に適用しても、位置決め精度
が高く、高密度で信頼性の高い接続が実現できる。
According to the coaxial cable connecting substrate 1 having such a configuration, the central conductor land portion 9 is provided with the central conductor groove 11 for the central conductor 4 having a substantially semicircular cross section. 9 and the outer conductor land portion 10 are formed to extend along the arrangement direction, and the outer conductor land portion 10 includes:
Groove 1 for outer conductor 5 having a substantially semicircular cross section and having a center conductor
Groove 12 for outer conductor having a diameter, width and depth larger than 1
, The center conductor land portion 9 and the outer conductor land portion 1
It is formed so as to extend along the arrangement direction of 0. Therefore, when soldering the coaxial cable 2,
The outer conductor 5 is placed in the outer conductor groove 12 of the outer conductor land portion 10 in a substantially fitted state, and the central conductor 4 is partly arranged in the central conductor groove 11 and soldered. It will be. Therefore, the coaxial cable 2 having the center conductor 4 and the outer conductor 5 can be accurately positioned and stably connected without increasing the size of the center conductor land portion 9 and the outer conductor land portion 10. Therefore, even when applied to the thin coaxial cable 2, it is possible to realize a highly accurate connection with high positioning accuracy.

【0012】しかも、本実施例の同軸ケーブル接続用基
板1は、外部導体用溝12の径が外部導体5の径と略同
径に形成されており、中心導体用溝11の径が中心導体
4の径より若干大径に形成されていて、これら外部導体
用溝12および中心導体用溝11は略同軸をなしている
ため、同軸ケーブル2の外部導体5を外部導体用溝12
に無理なく嵌合状態に載置させ、これにより中心導体4
を中心導体用溝11内に位置させることができる。よっ
て、同軸ケーブル2の高精度の位置決めを容易に行うこ
とができる。
Moreover, in the coaxial cable connecting substrate 1 of this embodiment, the diameter of the outer conductor groove 12 is formed to be substantially the same as the diameter of the outer conductor 5, and the diameter of the center conductor groove 11 is set to the center conductor. Since the outer conductor groove 12 and the center conductor groove 11 are formed to have a diameter slightly larger than the diameter of 4, the outer conductor 5 of the coaxial cable 2 is connected to the outer conductor groove 12.
It is placed in the fitted state without difficulty in the
Can be located in the center conductor groove 11. Therefore, highly accurate positioning of the coaxial cable 2 can be easily performed.

【0013】なお、中心導体用溝11および外部導体用
溝12の断面形状は、略半円状でなくとも、例えば略円
弧状や略矩形状の形状を適用でき、略矩形状等の場合
は、外部導体用溝12が中心導体用溝11より幅および
深さが大きくなるよう設定すればよい。しかしながら、
中心導体4および外部導体5が断面円状をなすため、断
面形状は略半円状とするのがよい。また、外部導体用溝
12は、外部導体5を嵌合状態で載置させるようにした
が、高精度の位置決め等の目的を達成するためには、外
部導体5の少なくともその一部が外部導体用溝12に位
置し、中心導体4も少なくともその一部が中心導体用溝
11内に位置するようにすればよい。しかしながら、本
実施例の構成を採用した方がより位置決めが高精度にな
るため好ましい。加えて、中心導体用溝11の径を中心
導体4の径とほぼ同径としてこれらをも嵌合状態とする
ことも可能である。さらに、同軸ケーブル2が外部導体
5を複数、多重に有する場合には、増えた外部導体5に
合わせて外部導体用ランド部10および外部導体用溝1
2を増加させればよい。
The cross-sectional shapes of the center conductor groove 11 and the outer conductor groove 12 may be, for example, substantially arcuate or substantially rectangular, even if they are not substantially semicircular. The width and depth of the outer conductor groove 12 may be set to be larger than that of the center conductor groove 11. However,
Since the central conductor 4 and the outer conductor 5 have a circular cross section, the cross sectional shape is preferably substantially semicircular. Further, the outer conductor groove 12 is arranged to place the outer conductor 5 in a fitted state. However, at least a part of the outer conductor 5 is the outer conductor in order to achieve a purpose such as highly accurate positioning. It suffices that the center conductor 4 is located in the groove 12 for use and at least a part of the center conductor 4 is located in the groove 11 for use in the center conductor. However, it is preferable to adopt the configuration of this embodiment because the positioning becomes more accurate. In addition, the diameter of the center conductor groove 11 can be set to be substantially the same as the diameter of the center conductor 4, and these can also be fitted. Further, when the coaxial cable 2 has a plurality of outer conductors 5, the outer conductor land portion 10 and the outer conductor groove 1 are formed in accordance with the increased outer conductors 5.
You can increase 2.

【0014】次に、上記構成の同軸ケーブル接続用基板
1の製造方法について順を追って説明する。なお、以下
の説明においては、本発明にかかわる中心導体用ランド
部9および外部導体用ランド部10の形成を中心に説明
し、回路部等従来と同様に形成される部分についてはそ
の説明を略す。まず、図3に示すように、基板本体8上
に導電層として銅箔14が貼付された銅貼積層板15を
準備する。そして、銅貼積層板15の銅箔14上に感光
性のレジスト層16を形成する。
Next, a method of manufacturing the coaxial cable connecting substrate 1 having the above-described structure will be described step by step. In the following description, the formation of the central conductor land portion 9 and the outer conductor land portion 10 according to the present invention will be mainly described, and the description of the portions such as the circuit portion formed in the conventional manner will be omitted. . First, as shown in FIG. 3, a copper-clad laminate 15 in which a copper foil 14 is laminated as a conductive layer on the substrate body 8 is prepared. Then, a photosensitive resist layer 16 is formed on the copper foil 14 of the copper-clad laminate 15.

【0015】次に、マスクを使用して露光することによ
り、図4に示すように、レジスト層16の端縁部近傍
に、層厚方向に貫通する、所定幅で所定長の略長方形状
をなす大幅開口部17を形成し、該大幅開口部17より
所定距離の内方側のレジスト層16に、層厚方向に貫通
する、大幅開口部17より所定量小幅で所定長の略長方
形状をなす小幅開口部18を大径開口部17から所定距
離離間するよう形成する。ここで、これら大幅開口部1
7および小幅開口部18は、それぞれの幅方向を二等分
する中心線が略同一直線上に位置するよう直列に配置さ
れる。
Next, by exposing using a mask, as shown in FIG. 4, a substantially rectangular shape having a predetermined width and a predetermined length is formed in the vicinity of the edge of the resist layer 16 and penetrates in the layer thickness direction. A large opening 17 is formed, and a substantially rectangular shape having a predetermined width smaller than the large opening 17 and a predetermined length is penetrated through the resist layer 16 on the inner side at a predetermined distance from the large opening 17 in the layer thickness direction. The small width opening 18 is formed so as to be separated from the large diameter opening 17 by a predetermined distance. Where these large openings 1
7 and the narrow width opening 18 are arranged in series so that the center lines that divide the width direction into two equal parts are located substantially on the same straight line.

【0016】そして、エッチングを行う。ここで、エッ
チング液は粘性を有するものを用いる。すると、図5
(a),(b)に示すように、大幅開口部17および小
幅開口部18は幅が異なり、またエッチング液は粘性を
有するため、小幅開口部18ではエッチング液の循環が
悪くエッチング速度が遅いのに対し、大幅開口部17で
はエッチング液が十分に循環しエッチング速度が速くな
る。これにより、銅箔14の、小幅開口部18からエッ
チングされる部分には、径、幅および深さの小さい中心
導体用溝11が、銅箔14の、大幅開口部17からエッ
チングされる部分には径、幅および深さの大きい外部導
体用溝12が形成される。
Then, etching is performed. Here, as the etching liquid, one having viscosity is used. Then, as shown in FIG.
As shown in (a) and (b), the large opening 17 and the narrow opening 18 have different widths, and the etching solution has viscosity, so that the etching solution circulates poorly in the narrow opening 18 and the etching rate is slow. On the other hand, in the large opening 17, the etching solution is sufficiently circulated and the etching rate is increased. As a result, in the portion of the copper foil 14 that is etched from the narrow opening 18, the central conductor groove 11 having a small diameter, width, and depth is formed in the portion of the copper foil 14 that is largely etched from the opening 17. The outer conductor groove 12 having a large diameter, width and depth is formed.

【0017】このように、小幅開口部18および大幅開
口部17の幅の違いによりエッチング量をコントロール
でき、これにより、径、幅および深さの異なる中心導体
用溝11および外部導体用溝12を、同一基板上に一度
のエッチングで形成できる(図6参照)。ここで、中心
導体用溝11および外部導体用溝12のそれぞれの径
が、上述した径となるように、小幅開口部17および大
幅開口部18の幅は適宜設定されることになる。次に、
図6に示すように、上記レジスト層16を除去する。そ
して、図7に示すように、銅箔14上に再度、電着また
は液状のレジストを塗布し中心導体用溝11および外部
導体用溝12を含んで所定範囲を覆ったレジスト層20
を設ける。
As described above, the etching amount can be controlled by the difference in the widths of the small width opening 18 and the large opening 17, whereby the center conductor groove 11 and the outer conductor groove 12 having different diameters, widths and depths can be formed. , Can be formed on the same substrate by one etching (see FIG. 6). Here, the widths of the small width opening 17 and the large opening 18 are appropriately set so that the diameters of the center conductor groove 11 and the outer conductor groove 12 become the above-described diameters. next,
As shown in FIG. 6, the resist layer 16 is removed. Then, as shown in FIG. 7, a resist layer 20 is again coated with electrodeposition or liquid resist on the copper foil 14 and covers a predetermined range including the center conductor groove 11 and the outer conductor groove 12.
To provide.

【0018】マスクを使用して露光することにより、図
7および図8(a),(b)に示すように、中心導体用
溝11を覆うレジスト層20aと、該レジスト層20a
から離間した、外部導体用溝12を覆うレジスト層20
bとを残存させ、他のレジスト層を除去する。ここで、
レジスト層20aは、中心導体用溝11の長手方向にお
いては該中心導体用溝11と略重ねられ、中心導体用溝
11の幅方向においては幅方向の二等分線が中心導体用
溝11の幅方向の二等分線に略重ねられている。同様
に、レジスト層20bは、外部導体用溝12の長手方向
においては該外部導体用溝12と重ねられ、外部導体用
溝12の幅方向においては幅方向の二等分線が外部導体
用溝12の幅方向の二等分線に重ねられている。そし
て、エッチングを行い、その後、レジスト層20a,2
0bを除去する。これにより、中心導体用溝11を有す
る中心導体用ランド部9、および外部導体用溝12を有
する外部導体用ランド部10が形成されることになる。
さらに、中心導体用ランド部9および外部導体用ランド
部10に、必要に応じて半田メッキ等を施す。
By exposing using a mask, as shown in FIGS. 7 and 8A and 8B, a resist layer 20a covering the center conductor groove 11 and the resist layer 20a.
Layer 20 covering the outer conductor groove 12 separated from the
b and remain, and other resist layers are removed. here,
The resist layer 20a is substantially overlapped with the center conductor groove 11 in the longitudinal direction of the center conductor groove 11, and in the width direction of the center conductor groove 11, the bisector in the width direction is the center conductor groove 11 of the center conductor groove 11. It is almost overlapped with the bisector in the width direction. Similarly, the resist layer 20b is overlapped with the outer conductor groove 12 in the longitudinal direction of the outer conductor groove 12, and in the width direction of the outer conductor groove 12, the bisector in the width direction is the outer conductor groove. Twelve widthwise bisectors are overlapped. Then, etching is performed, and thereafter, the resist layers 20a, 2
Remove 0b. As a result, the center conductor land portion 9 having the center conductor groove 11 and the outer conductor land portion 10 having the outer conductor groove 12 are formed.
Further, the center conductor land portion 9 and the outer conductor land portion 10 are subjected to solder plating or the like, if necessary.

【0019】以上により、図2に示す上述した構成の同
軸ケーブル接続用基板1が形成されることになる。そし
て、図1に示すように、外部導体5を外部導体用ランド
部10の外部導体用溝12に嵌合状態で載置させ、中心
導体4を中心導体用ランド部9の中心導体用溝11内に
配置した状態で、これらを半田付けする。以上の製造方
法によれば、小幅開口部18によって、径、幅および深
さの小さい中心導体用溝11を、大幅開口部17によっ
て、中心導体用溝11より径、幅および深さの大きい外
部導体用溝12を、一度のエッチングで形成することが
できる。なお、上記実施例においては、中心導体用溝1
1および外部導体用溝12を形成するためのエッチング
を先行して行い、後に、中心導体用ランド部9および外
部導体用ランド部10を形成するためのエッチングを行
うように設定したが、これらを一度のエッチングで同時
に行うことも可能である。しかしながら、本実施例のよ
うに別々にエッチングを行う方が、中心導体用溝11、
外部導体用溝12、中心導体用ランド部9および外部導
体用ランド部10を精度よく形成できるため有利であ
る。
As described above, the coaxial cable connecting substrate 1 having the above-described structure shown in FIG. 2 is formed. Then, as shown in FIG. 1, the outer conductor 5 is placed in the outer conductor groove 12 of the outer conductor land portion 10 in a fitted state, and the center conductor 4 is placed in the center conductor groove 11 of the center conductor land portion 9. These are soldered while being placed inside. According to the above manufacturing method, the small-width opening 18 allows the center conductor groove 11 having a small diameter, width, and depth to be formed, and the large opening 17 allows the center conductor groove 11 to have an outside diameter, width, and depth larger than that of the center conductor. The conductor groove 12 can be formed by one etching. In the above embodiment, the center conductor groove 1
1 and the etching for forming the outer conductor groove 12 are performed in advance, and after that, the etching for forming the center conductor land portion 9 and the outer conductor land portion 10 is performed. It is also possible to perform the etching at the same time at the same time. However, when the etching is performed separately as in the present embodiment, the center conductor groove 11,
This is advantageous because the outer conductor groove 12, the center conductor land portion 9, and the outer conductor land portion 10 can be accurately formed.

【0020】[0020]

【発明の効果】本発明の同軸ケーブル接続用基板によれ
ば、一のランド部には、内側に中心導体の少なくとも一
部を配置させる中心導体用溝が、他のランド部には、内
側に外部導体の少なくとも一部を配置させる、中心導体
用溝より幅および深さの大きい外部導体用溝が、それぞ
れランド部の配列方向に沿って延在形成されている。よ
って、同軸ケーブルを半田付けする際には、該同軸ケー
ブルの中心導体は一のランド部の中心導体用溝に少なく
ともその一部が配置され、外部導体は他のランド部の外
部導体用溝に少なくともその一部が配置された状態で半
田付けされることになるため、ランド部を大きくするこ
となくとも、中心導体と外部導体とを有する同軸ケーブ
ルを正確に位置決めし安定して接続させることができ
る。したがって、細線の同軸ケーブルに適用しても、位
置決め精度が高く、高密度で信頼性の高い接続が実現で
きる。
According to the coaxial cable connecting substrate of the present invention, the center conductor groove for arranging at least a part of the center conductor inside is formed in one land portion, and the other land portion is formed inside. Outer conductor grooves having a width and a depth larger than those of the center conductor groove, in which at least a part of the outer conductors are arranged, are formed so as to extend along the arrangement direction of the lands. Therefore, when soldering a coaxial cable, at least a part of the center conductor of the coaxial cable is arranged in the groove for the central conductor of one land portion, and the outer conductor is arranged in the groove for the outer conductor of the other land portion. Since at least a part of the coaxial cable will be soldered in the arranged state, the coaxial cable having the center conductor and the outer conductor can be accurately positioned and stably connected without increasing the size of the land portion. it can. Therefore, even if it is applied to a thin coaxial cable, it is possible to realize a highly accurate connection with high positioning accuracy.

【0021】本発明の同軸ケーブル接続用基板の製造方
法によれば、基板本体に設けられた導電層上にレジスト
層を設け、該レジスト層に異幅の開口部を相互に所定距
離離間させて直列に配置形成し、エッチングを施すこと
になり、開口部の幅が異なることから、これら開口部に
臨む導電層はエッチング速度が異なることになり、導電
層に形成される溝は、幅および深さが異なる。すなわ
ち、幅の小さい開口部により、幅および深さの小さい中
心導体用溝を、幅の大きい開口部により、幅および深さ
の大きい外部導体用溝を一度のエッチングで形成するこ
とができる。
According to the method of manufacturing the coaxial cable connecting substrate of the present invention, the resist layer is provided on the conductive layer provided on the substrate body, and openings of different widths are separated from each other by a predetermined distance in the resist layer. Since the openings are arranged and formed in series and the widths of the openings are different, the etching rates of the conductive layers facing these openings are different, and the grooves formed in the conductive layers have a width and a depth of But different. That is, it is possible to form the central conductor groove having a small width and depth by the opening having a small width, and the external conductor groove having a large width and depth by the etching having a large width by one etching.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の一実施例による同軸ケーブル接続用
基板に同軸ケーブルを接続した半田付け前の状態を示す
斜視図である。
FIG. 1 is a perspective view showing a state before soldering in which a coaxial cable is connected to a coaxial cable connecting substrate according to an embodiment of the present invention.

【図2】 本発明の一実施例による同軸ケーブル接続用
基板のランド部形成後の状態を示す斜視図である。
FIG. 2 is a perspective view showing a state after formation of a land portion of the coaxial cable connecting substrate according to the embodiment of the present invention.

【図3】 本発明の一実施例による同軸ケーブル接続用
基板の銅貼積層板を示す斜視図である。
FIG. 3 is a perspective view showing a copper-clad laminate of a substrate for connecting a coaxial cable according to an embodiment of the present invention.

【図4】 本発明の一実施例による同軸ケーブル接続用
基板の、銅貼積層板に形成されたレジスト層に幅の異な
る開口部を設けた状態を示す斜視図である。
FIG. 4 is a perspective view showing a coaxial cable connecting substrate according to an embodiment of the present invention in which a resist layer formed on a copper-clad laminate is provided with openings having different widths.

【図5】 本発明の一実施例による同軸ケーブル接続用
基板の、銅貼積層板に幅の異なる開口部からエッチング
を施した状態を示す断面図であり、(a)は小幅開口部
側を、(b)は大幅開口部側を示すものである。
FIG. 5 is a cross-sectional view showing a state in which a copper-clad laminate is etched from openings having different widths, in the coaxial cable connecting substrate according to one embodiment of the present invention, and FIG. , (B) show a large opening side.

【図6】 本発明の一実施例による同軸ケーブル接続用
基板の、銅貼積層板にエッチングにより溝を形成した状
態を示す斜視図である。
FIG. 6 is a perspective view showing a state in which a groove is formed in a copper-clad laminate by etching in a coaxial cable connecting substrate according to an embodiment of the present invention.

【図7】 本発明の一実施例による同軸ケーブル接続用
基板の、銅貼積層板にレジスト層を形成した状態を示す
斜視図である。
FIG. 7 is a perspective view showing a state in which a resist layer is formed on the copper-clad laminate of the coaxial cable connecting substrate according to the embodiment of the present invention.

【図8】 本発明の一実施例による同軸ケーブル接続用
基板の、銅貼積層板に溝を含んでレジスト層を残存させ
た状態を示す断面図であり、(a)は中心導体用溝側
を、(b)は外部導体用溝側を示すものである。
FIG. 8 is a cross-sectional view showing a state in which a resist layer including a groove is left in a copper-clad laminate of a coaxial cable connecting substrate according to an embodiment of the present invention, and (a) is a center conductor groove side. (B) shows the outer conductor groove side.

【図9】 従来の同軸ケーブル接続用基板に同軸ケーブ
ルを半田付けする直前の状態を示す斜視図である。
FIG. 9 is a perspective view showing a state immediately before soldering a coaxial cable to a conventional coaxial cable connecting substrate.

【符号の説明】[Explanation of symbols]

1…同軸ケーブル接続用基板、2…同軸ケーブル、4…
中心導体、5…外部導体、8…基板本体、9,10…ラ
ンド部、11…中心導体用溝、12…外部導体用溝、1
4…銅箔(導電層)、16,20…レジスト層
1 ... Coaxial cable connection substrate, 2 ... Coaxial cable, 4 ...
Central conductor, 5 ... External conductor, 8 ... Substrate body, 9, 10 ... Land portion, 11 ... Central conductor groove, 12 ... External conductor groove, 1
4 ... Copper foil (conductive layer), 16, 20 ... Resist layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 中心導体(4)と、該中心導体(4)と同軸を
なして外側に設けられた外部導体(5)とを有する同軸ケ
ーブル(2)の、前記中心導体(4)と外部導体(5)とを個別
に接続させるランド部(9,10)が相互に所定距離離間して
複数配列されてなる同軸ケーブル接続用基板において、 一の前記ランド部(9)には、内側に中心導体(4)の少なく
とも一部を配置させる中心導体用溝(11)が、他の前記ラ
ンド部(10)には、内側に外部導体(5)の少なくとも一部
を配置させる、前記中心導体用溝(11)より幅および深さ
の大きい外部導体用溝(12)が、それぞれランド部(9,10)
の配列方向に沿って延在形成されていることを特徴とす
る同軸ケーブル接続用基板。
1. A center conductor (4) of a coaxial cable (2) having a center conductor (4) and an outer conductor (5) provided coaxially with the center conductor (4) and provided outside the center conductor (4). In a coaxial cable connecting board in which a plurality of lands (9, 10) for individually connecting to the outer conductor (5) are arranged at a predetermined distance from each other, one land part (9) has an inner side. The center conductor groove (11) for disposing at least a part of the center conductor (4) in the other land part (10) disposes at least a part of the outer conductor (5) inside, The outer conductor groove (12), which is wider and deeper than the conductor groove (11), is the land part (9, 10).
A coaxial cable connecting substrate, which is formed so as to extend along the arrangement direction of.
【請求項2】 中心導体(4)と、該中心導体(4)と同軸を
なして外側に設けられた外部導体(5)とを有する同軸ケ
ーブル(2)の、前記中心導体(4)と外部導体(5)とを個別
に接続させるランド部(9,10)が相互に所定距離離間して
複数配列されてなる同軸ケーブル接続用基板の製造方法
であって、 基板本体(8)に設けられた導電層(14)上にレジスト層(1
6)を設け、該レジスト層(16)に異幅の開口部(17,18)を
相互に所定距離離間させて直列に配置形成し、エッチン
グを施すことを特徴とする同軸ケーブル接続用基板の製
造方法。
2. The center conductor (4) of a coaxial cable (2) having a center conductor (4) and an outer conductor (5) provided coaxially with the center conductor (4) and provided on the outside. A method for manufacturing a coaxial cable connecting board, comprising a plurality of lands (9, 10) which are individually connected to an outer conductor (5) and are spaced apart from each other by a predetermined distance. The resist layer (1
6) is provided, openings (17, 18) of different widths are arranged in series in the resist layer (16) at a predetermined distance from each other, and are etched, and a coaxial cable connecting substrate is characterized by being etched. Production method.
JP27990393A 1993-11-09 1993-11-09 Coaxial cable connecting board and manufacture thereof Pending JPH07135037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27990393A JPH07135037A (en) 1993-11-09 1993-11-09 Coaxial cable connecting board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27990393A JPH07135037A (en) 1993-11-09 1993-11-09 Coaxial cable connecting board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH07135037A true JPH07135037A (en) 1995-05-23

Family

ID=17617526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27990393A Pending JPH07135037A (en) 1993-11-09 1993-11-09 Coaxial cable connecting board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH07135037A (en)

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JP2010288402A (en) * 2009-06-12 2010-12-24 Hitachi Cable Ltd Small diameter coaxial cable array and method of manufacturing the same
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US8889996B2 (en) 2011-02-22 2014-11-18 Olympus Corporation Cable connection structure and cable connection method
US11258222B2 (en) 2018-10-15 2022-02-22 Olympus Corporation Cable connection structure, endoscope, and method of manufacturing cable connection structure
JP2020124011A (en) * 2019-01-29 2020-08-13 日立金属株式会社 Cable alignment tool and cable alignment method

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