JPH0713218Y2 - 半導体の樹脂封止装置 - Google Patents
半導体の樹脂封止装置Info
- Publication number
- JPH0713218Y2 JPH0713218Y2 JP5040790U JP5040790U JPH0713218Y2 JP H0713218 Y2 JPH0713218 Y2 JP H0713218Y2 JP 5040790 U JP5040790 U JP 5040790U JP 5040790 U JP5040790 U JP 5040790U JP H0713218 Y2 JPH0713218 Y2 JP H0713218Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- nozzle
- sealing
- resin
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims description 38
- 239000011347 resin Substances 0.000 title claims description 22
- 229920005989 resin Polymers 0.000 title claims description 22
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 39
- 238000005538 encapsulation Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 229920006254 polymer film Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5040790U JPH0713218Y2 (ja) | 1990-05-15 | 1990-05-15 | 半導体の樹脂封止装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5040790U JPH0713218Y2 (ja) | 1990-05-15 | 1990-05-15 | 半導体の樹脂封止装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0410336U JPH0410336U (enExample) | 1992-01-29 |
| JPH0713218Y2 true JPH0713218Y2 (ja) | 1995-03-29 |
Family
ID=31568924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5040790U Expired - Lifetime JPH0713218Y2 (ja) | 1990-05-15 | 1990-05-15 | 半導体の樹脂封止装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713218Y2 (enExample) |
-
1990
- 1990-05-15 JP JP5040790U patent/JPH0713218Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410336U (enExample) | 1992-01-29 |
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