JPH07131130A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To improve the moisture resistance, heat radiation and ease of assembly of a hybrid integrated circuit device for use in electric appliances, such as a washer that is used at a damp place or a place where water is handled. CONSTITUTION:The backside of a first board 11 is positioned close to the surface of sealing resin 25. An insert plate 12 is placed between printed board 13 and the first board 11. The plate makes it possible to hold leads, to prevent shortcircuits between the boards and to mount the circuit devices and other component on the printed board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device used for electric appliances such as washing machines having a lot of moisture and water.

[0002]

2. Description of the Related Art Generally, a hybrid integrated circuit device has a structure as shown in FIG. 4, and includes a support substrate (1) made of metal or insulating ceramics, a drive LSI chip (2), a bonding wire (3), and a seal. It consists of a resin (4), printed circuit boards (5), (6) and external parts such as capacitors and transformers.

For example, the support substrate (1) is, for example, an insulating Al substrate on which a predetermined conductive path is formed, and the chip (2) is mounted on the conductive path, and the chip pad and the The electrode of the Al substrate is directly or electrically connected to the metal thin wire (3). Further, the printed boards (5) and (6) are adhered and fixed to the end portion of the support board (1), and the electrical connection is achieved also directly or by the thin metal wire (3). Furthermore, considering moisture resistance, it is sealed with resin as shown in the figure.

[0004]

In the hybrid integrated circuit device as described above, the printed circuit boards (5) and (6) are exposed to the outside, so that the hybrid integrated circuit device can be used in an electric device such as a washing machine where there is much water or humidity. When mounted, there was a problem that a short circuit or the like occurred. Further, when the semiconductor chip handles a large current, the adhesive surface with the sealing resin (4) deteriorates. Furthermore, when fixing a printed circuit board and a supporting board with an adhesive, when handling a large current,
There is a problem that peeling occurs due to the difference in thermal conductivity between the two. Furthermore, since the printed circuit boards (5) and (6) are directly fixed to the electric device with screws or the like, the interface between the printed circuit board and the sealing resin and the adhesion between the supporting circuit board and the printed circuit board due to vibration of the motor or other external force. There was a problem that the surface etc. produced a thin profit. Therefore, the above-mentioned moisture and the like are more likely to be infiltrated, and there is a drawback that the short circuit and the malfunction of the circuit are promoted.

The present invention solves these problems, and at the same time solves the problems of difficulty in mounting the supporting substrate and reducing the mounting area of the printed circuit board.

[0006]

The present invention has been made in view of the above-mentioned problems, and the leads (19) of this substrate are held on the mounting surface of the first substrate (11). An insert plate (12) is provided, the lead and the printed board (13) are electrically connected, and the back surface of the first board (12) is filled with a sealing resin (25) in the case (26).
So as to be arranged near the surface of the first substrate (1
This is solved by sealing 1) and the printed circuit board (13) with a resin.

Further, through holes (24) in the insert plate
The through hole (23) of the printed circuit board (13) is solved by tapering the corner corresponding to the insertion surface of the lead (19). Furthermore, by providing the insert plate (12) between the first board (11) and the printed board (13), the circuit element of the circuit element is provided on the surface of the printed board (13) facing the first board (11). It is possible to implement.

[0008]

Operation: The insert plate (12) has the lead (1
9) is fixed to facilitate insertion of the printed circuit board (13) into the through holes (23) ... And the first circuit board (11) and the printed circuit board (13) are placed in a case (26). Since the case (26) and the electric device are mounted by being put in and integrated, it is possible to prevent the intrusion of moisture from the outside atmosphere, the deterioration of the electrical joint portion due to the vibration from the electric device and another external force. Furthermore, since the back surface of the first substrate (11) is in contact with the external atmosphere with the thin resin layer in between, the heat of the first substrate can be satisfactorily radiated.

Since the through holes (24) of the insert plate (12) and the through holes (23) of the printed circuit board (13) have a taper, the leads (19),
.. insertion becomes easier, and further, by using the insert plate (12) as an insulating material, the first substrate (11)
The conductive paths and the circuit elements of the printed circuit board (13) can ensure mutual insulation, and the circuit element can be mounted on the surface of the printed circuit board (13) facing the first substrate (11).

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a hybrid integrated circuit device mounted on a case (10), and FIG. 2 shows a first substrate (1
1), a cross-sectional view showing a specific configuration of the insert plate (12) and the printed circuit board (13), and FIG. 3 are plan views of the insert plate (12), which are mounted on a control panel of electric equipment such as a washing machine. It is something.

First, the first substrate (11) may be a metal substrate whose surface is subjected to an insulation treatment, on which a predetermined conductive path (14) and a semiconductor chip (15) are mounted. As a specific example, the first substrate (11) is an alumite-treated Al substrate, on which the resin (16) having excellent insulating properties is entirely coated, and formed on this by photoetching or the like. A conductive path (14) made of Cu is formed on which a semiconductor chip such as an LS for driving is formed.
I chip, Tr, diode, resistor, etc. are fixed,
The desired circuit is constructed. The semiconductor chip and the first
If necessary, the thin metal wires (17) are wire-bonded to the substrate of (1), and the terminal groups (18) ... Derived from the conductive paths and the like are provided on the two sides of the first substrate (11). L
The V-shaped leads (19) ... Are electrically connected by soldering or the like. In addition, the surface of the LSI chip has epoxy resin (2
0) etc. are potted.

Next, the printed circuit board (13) is a transformer,
External components such as a buzzer and an electrolytic capacitor are mounted and electrically connected to a conductive path formed on the front surface or the back surface of the substrate and electrode pads (21) and (22) extending from the conductive path, or The lead (19) is electrically connected in the through hole (23). Here, this printed circuit board is made of epoxy resin or the like, but may be, for example, a ceramic substrate or the like. If necessary, a connecting means S such as a connecting cable for connecting to an external circuit is provided on the side of the printed board (13).

Further, the insert plate (12) has, for example, a shape as shown in FIG. 3, and is provided with through holes (24) ... Into which the leads (19) are inserted. The material is made of glass fiber reinforced polyethylene terephthalate or the like called FR-PET and has a thickness of, for example, about 2 mm. Further, in order to increase the strength, a frame in the shape of a dove is formed in the center, but it may be omitted in particular. Further, a through hole for alignment is provided in this frame, and a through hole or an alignment mark is formed in the printed circuit board (13) in correspondence with the through hole so that when the two are aligned, the lead (19)
... is the through hole (24) of the insert plate (12)
It also has the advantage of being able to be placed accurately.

The above components, the first substrate (11), the insert plate (12) and the printed circuit board (13).
Is implemented in the case (10), but FIG.
As described above, the printed circuit board (13) is arranged with the mounting surface upward, and the first substrate (11) is arranged such that the back surface thereof is as close as possible to the sealing resin surface (the surface in contact with the external atmosphere). Is made to be done. In addition, the sealing resin (2
The material 5) is made of urethane resin, and the material is not particularly selected as long as it is a resin having excellent hydrophobicity, heat dissipation and heat resistance as another material. The integrated case (10) is provided with a mounting means (26) for mounting on an electric device, and is attached to the main body of the electric device via the mounting means. Here, a screw stop hole is provided.

As described above, the first feature of the present invention is that the back surface of the first substrate (11) is arranged near the sealing resin. This substrate is made of metal, and a urethane resin having excellent thermal conductivity is thinly formed on the back surface of the substrate. Therefore, even if the semiconductor chip is driven by a large current and heat is generated, it can radiate well. . Second, since the insert plate (12) holds the leads (19), electrodes or through holes (23) on the printed circuit board side are provided.
The feature is that the alignment with can be achieved with high accuracy. Further, since this plate has an insulating property, it also has a merit that it is possible to prevent a short circuit between the semiconductor chip mounted on the first substrate, the thin metal wire (17) and the like and external parts of the printed board (13) and the like. Furthermore, by separating the insert plate (12) and the printed circuit board (13) by this insulating effect, an external component can be mounted on the printed circuit board which is the lower surface of the insert plate.

Thirdly, since the first substrate and the printed circuit board are not directly mounted on the electric equipment, the external force from the electric equipment is applied only to the case, and therefore the resin does not peel off due to the external force. Therefore, it is possible to prevent a defect of the device due to infiltration of moisture. Next, a method of assembling this hybrid integrated circuit device will be briefly described. First, a metal substrate (1) made of Al having an insulating treatment and a conductive pattern formed on the surface thereof (1
1) A resistor or a semiconductor chip (15) is mounted on the surface, leads (19) ... Are fixed and potting of a resin (20) is performed to form a general hybrid IC. Here, it is convenient to perform soldering with a metal substrate in a state where the leads (19) ... Are attached to the insert plate (12) in advance, since it is possible to solder at once.

Subsequently, the leads are attached to the insert plate (12) and the process is transferred to the printed board mounting step. On this mounting process side, finally, an automatic component mounting device mounts external components and this hybrid IC on the printed circuit board (13), and the solder reflow furnace solders the printed circuit board (13) and these components. Attached.

[0018]

As described above, since the first substrate on which the semiconductor chip that generates a large amount of current and the printed circuit board are resin-sealed in the case, short circuit due to water or moisture, defects, and It is possible to prevent changes over time. Further, since the back surface of the first substrate is arranged close to the surface of the sealing resin, it is possible to satisfactorily dissipate heat even if the semiconductor chip generates heat.

Further, by adopting the insert plate, the fixing of the lead can be achieved and the soldering or the like can be simplified. Further, by forming a taper in the insertion direction of the through hole or the through hole, the lead can be inserted more easily.
Further, since the insert plate is an insulating pair, external parts can be mounted on the printed circuit board under the insert plate, and the printed circuit board can be downsized or the mounting density can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a hybrid integrated circuit device that is an embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a main part of the present invention.

FIG. 3 is a plan view of an insert plate.

FIG. 4 is a cross-sectional view of a conventional hybrid integrated circuit device.

[Explanation of symbols]

 10 Case 11 First Substrate 12 Insert Plate 13 Printed Circuit Board 15 Semiconductor Chip 19 Lead 23 Through Hole 24 Through Hole 25 Sealing Resin 26 Attachment Means

Claims (3)

[Claims] 1. A metal-made first substrate on which a semiconductor chip relating to drive control is mounted, and a printed circuit board on which a predetermined circuit relating to the semiconductor chip is formed. In a hybrid integrated circuit device in which a printed circuit board is housed in a case and sealed with a resin, the first circuit board has a plurality of leads extending above the circuit board on at least two opposite sides. With the insert plate having the through holes for holding the leads attached, the back surface of the first substrate is arranged in close proximity to the resin surface sealed in the case, and the first metal substrate A hybrid integrated circuit device comprising a lead and a circuit of the printed circuit board electrically connected to each other. 2. The lead is mounted in a through hole of the printed circuit board, and the through hole of the insert plate and the through hole have a tapered portion corresponding to an insertion surface of the lead. A hybrid integrated circuit device as described. 3. The hybrid integrated circuit device according to claim 1, wherein the printed circuit board region facing the first substrate has the circuit component mounted thereon.