JPH0712949Y2 - Board-to-board connection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A board-to-board connecting device that achieves predetermined electrical connection between first to third printed wiring boards, in which a second board is a third board. By biasing in the direction of the first substrate and driving the third substrate in the direction of the second substrate, the electrical connection between the three substrates is achieved by only one driving source.

[Industrial application field]

The present invention relates to a board-to-board connecting apparatus for achieving electrical connection between three printed wiring boards, and particularly to a board-to-board connecting apparatus particularly useful in measuring or testing electrical characteristics of electronic components.

When measuring or testing the characteristics of electronic parts such as IC, LSI, HIC (Hybrid IC) for individual products, printing unique to the type of product equipped with sockets for inserting pins such as HIC This is because the wiring between both boards is arranged between the wiring board and the printed wiring board that is common to each product for connecting the measurement device or connecting the measurement circuit. , By electrically connecting the three. The present invention particularly refers to a board-to-board connecting device suitable for such an application.

[Problems to be solved by conventional techniques and devices]

FIG. 2 shows a conventional method for electrically connecting three printed wiring boards to each other. That is, the three printed wiring boards 30, 40, 50 are connected by connector pairs 200 and 202, 210 and 212 and 220 and 222, and cables 204, 214 and 224. In this method, for example, when it is adopted in the measurement of the electrical characteristics of the electronic component as described above, the connector has to be attached and detached by the operator's hand before and after the measurement, which is very small because it is a narrow place. It required difficult work.

As a method for solving such a problem, an elastic contact probe 60 having a spring 601 as shown in FIG. 3 is used, and a needle of the contact probe 60 is provided on a wiring pattern of a printed wiring board. There is also a method in which wiring is realized by contacting the tip 602. In this contact probe 60, wiring from the connection point of one substrate is applied to the portion 603, and it is fixedly arranged at a position corresponding to the connection point of the wiring pattern of the other side substrate, and either one of the substrates Drive the needle with a drive source such as an air cylinder.
The wiring between the two substrates is formed by pressing the wiring pattern with the wiring pattern. According to this method, fine and complicated work becomes unnecessary. However, in order to form the wiring between the three printed wiring boards, at least two drive sources are required, which is expensive and the structure is complicated.

Therefore, an object of the present invention is to propose a board-to-board connecting device capable of forming wiring between boards with a minimum number of driving sources without requiring fine and complicated work.

[Means for Solving the Problems]

The inter-substrate connecting device of the present invention which achieves the above object is
Electrically connecting the first plurality of connection points on the printed wiring board to the second plurality of connection points on the second printed wiring board, and connecting the third plurality of connections on the second printed wiring board. In an inter-board connecting device for electrically connecting a point to a fourth plurality of connection points on a third printed wiring board, holding each printed wiring board so that the surfaces of each printed wiring board are parallel to each other, And a holding means for restricting the movement between the substrates only in a direction perpendicular to the plane, and one of the first connecting portion and the second connecting portion are electrically connected mechanically and electrically, and A stretchable contact probe that is arranged at a position corresponding to the connection point and is electrically connected mechanically to either the third connection point or the fourth connection point and to the other connection point. Elastic at the corresponding position A second contact probe, biasing means for biasing the second printed wiring board in a direction away from the third printed wiring board, and a direction in which the first contact probe presses the other connection point; The printed wiring board 3 is provided with a driving means for driving the second contact probe in a direction in which the second contact probe is in pressure contact with the other connection portion.

[Action]

When the third printed wiring board 50 is driven by the action of the driving means, first, the action of the bias means causes the first contact probe to come into contact with the corresponding connection point. When it is still driven, the distance between the second printed wiring board and the first printed wiring board is reduced by the first contact probe, and the extension force in the first contact probe is the bias force of the bias means. The second printed wiring board stops when it is overcome or when some stopping means is actuated. When it is further driven, only the space between the third printed wiring board and the second printed wiring board becomes narrower, and finally the second contact probe comes into contact with the corresponding connection point and electrical wiring. Is formed.

〔Example〕

Fig. 1 shows the HIC (Hybrid I
It shows an example applied to a device for measuring electrical characteristics of electronic parts such as C), where column (1) is a plan view and column (2) is a front view.

As an electronic component whose electrical characteristics are measured, a HIC 10 in which pins are arranged in a line is shown and mounted in a socket 20. The socket 20 is mounted on the printed wiring board 30, and the printed wiring board 30 is screwed to the housing 160. The printed wiring board 40 is inserted into the groove of the insertion guide 70 integrated with the mounting plate 120. The printed wiring board 50 is fixed to the mounting plate 130 with screws. The four shafts 80, which are integrated into the housing 160, penetrate through the four holes provided in each of the mounting plates 120 and 130.
Four compression coil springs 100 are inserted between 0 and 130. The shaft of the air cylinder 150 is connected to the mounting plate 130 via the cylinder mounting plate 140, and the shaft of the air cylinder 150 moves up and down as well as up and down. The other end of the wiring provided on the legs of the socket 20 is connected to the contact probe 60 described in detail in FIG. 3, and the contact probe 60 is arranged at a position corresponding to the connection point of the printed wiring board 40 and is mounted on the housing 160. It is fixed. The contact probe 61 is fixed to a predetermined position on the printed wiring board 50 and, at the same time, electrically connected to a connection point on the printed wiring board 50. The connection point on the printed wiring board 40 to be connected to the printed wiring board 50 is arranged above the corresponding contact probe 61. When the mounting plate 120 rises due to the driving force of the cylinder 150 transmitted through the compression coil spring 110, the stopper 110 limits the rise at a certain position so that the distance between the contact probe 60 and the printed wiring board 40 increases. It is provided in the housing 160 in order to keep the pressure contact force appropriate.

Next, the operation of the inter-substrate connecting device shown in FIG. 1 will be described. Air cylinder 150 from the position shown in the figure
When the shaft of is raised, both mounting plates 120 and 130 are raised. When the upper surface of the printed wiring board 40 comes into contact with the needle tip of the contact probe 60, the extension force in the contact probe 60 and the bias force of the compression coil spring 100 are balanced while the needle tip and the upper surface of the printed wiring board 40 are pressed against each other. Ascend in position. When the end of the mounting plate 120 contacts the stopper 110, the mounting plate 120 stops rising, and the contact probe 60 and the wiring pattern provided on the upper surface of the printed wiring board 40 come into contact with each other under an appropriate pressure contact force. It is formed. When the axis of the air cylinder 150 further rises, the needle tip of the contact probe 61 and the lower surface of the printed wiring board 40 come into contact with each other, and when the axis of the air cylinder 150 further rises to a predetermined position, the contact probe 61 is pressed under an appropriate pressure contact force. And a contact is formed with the wiring pattern provided on the lower surface of the printed wiring board 40. When the axis of the air cylinder 150 descends, the connection is released by following the procedure reverse to the above.

[Effect of device]

As described above, according to the present invention, it is possible to easily form an electrical connection between three printed wiring boards by a single drive source, which is suitable for measuring the electrical characteristics of electronic components. An inter-board connection device is provided.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing connection between substrates by a connector in a conventional method, and FIG. 3 is a diagram showing a contact probe. In the figure, 30, 40, 50 ... Printed wiring board, 60, 61 ... Contact probe, 100 ... Compression coil spring, 150 ... Air cylinder.

Claims (1)

[Scope of utility model registration request] 1. A first plurality of connection points on a first printed wiring board (30) are electrically connected to a second plurality of connection points on a second printed wiring board (40). In the inter-board connecting device for electrically connecting the third plurality of connection points on the second printed wiring board (40) to the fourth plurality of connection points on the third printed wiring board (50), Hold each printed wiring board (30, 40, 50) so that the surfaces of the wiring boards (30, 40, 50) are parallel to each other, and regulate the movement between the boards only in the direction perpendicular to the surfaces. The holding means (70, 80, 120, 130, 160) and the first connection point or the second connection point are mechanically integrated with one another and electrically connected and arranged at a position corresponding to the other connection point. Of the first contact probe (60), which has a property, and the third connection point or the fourth connection point. A second contact probe (61), which is mechanically integrated with one of them and electrically connected to the other, and which is arranged at a position corresponding to the other connection point and has elasticity, and the second printed wiring board (40). A biasing means (100) for biasing (1) in a direction away from the third printed wiring board (50) and in a direction in which the first contact probe (60) is in pressure contact with the other connection point; And a drive means (150) for driving the printed wiring board (50) in the direction in which the second contact probe (61) is in pressure contact with the other connection point.